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201907EC25MX
Users Manual
127 pgs2.71 Mb0

Quectel Wireless Solutions 201907EC25MX Users Manual

EC25 Hardware Design
LTE Standard Module Series
Rev. EC25_Hardware_Design_V2.0
Date: 2019-04-30
Status: Released
www.quectel.com
EC25 Hardware Design
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GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
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COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
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REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
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EC25 Hardware Design
About the Document
History
Revision Date Author Description
1.0 2016-04-01 Woody WU Initial
1.1 2016-09-22
1.2 2016-11-04
Lyndon LIU/
Frank WANG
Lyndon LIU/
Michael ZHANG
1. Updated EC25 series frequency bands in Table 1.
2. Updated transmitting power, supported maximum
baud rate of main UART/internal protocols/USB
drivers of USB interface, firmware upgrade and
temperature range in Table 2.
3. Updated timing of turning on module in Figure 12.
4. Updated timing of turning off module in Figure 13.
5. Updated timing of resetting module in Figure 16.
6. Updated supported baud rates of main UART in
Chapter 3.11.
7. Added notes for ADC interface in Chapter 3.13.
8. Updated GNSS performance in Table 21.
9. Updated operating frequencies of module in Table 23.
10. Added current consumption in Chapter 6.4.
11. Updated RF output power in Chapter 6.5.
12. Added RF receiving sensitivity in Chapter 6.6.
1. Added SGMII and WLAN interfaces in Table 2.
2. Updated function diagram in Figure 1.
3. Updated pin assignment (Top View) in Figure 2.
4. Added description of SGMII and WLAN interfaces in
Table 4.
5. Added SGMII interface in Chapter 3.17.
6. Added WLAN interface in Chapter 3.18.
7. Added USB_BOOT interface in Chapter 3.19.
8. Added reference design of RF layout in Chapter 5.1.4.
9. Added note about SIMO in Chapter 6.6.
1.3 2017-01-24
EC25_Hardware_Design 2 / 112
Lyndon LIU/
Frank WANG
1. Updated function diagram in Figure 1.
2. Updated pin assignment (top view) in Figure 2.
EC25 Hardware Design
AnniceZHANG/
1.4 2018-03-05
Lyndon LIU/
Frank WANG
3. Added BT interface in Chapter 3.18.2.
4. Updated GNSS performance in Table 24.
5. Updated reference circuit of wireless connectivity
interfaces with FC20 module in Figure 29.
6. Updated current consumption of EC25-E module in
Table 33.
7. Updated EC25-A conducted RF receiving sensitivity
in Table 38.
8. Added EC25-J conducted RF receiving sensitivity in
Table 40.
1. Updated functional diagram in Figure 1.
2. Updated LTE, UMTS and GSM features in Table 2.
3. Updated description of pin 40/136/137/138.
4. Updated PWRKEY pulled down time to 500ms in
Chapter 3.7.1 and reference circuit in Figure 10.
5. Updated reference circuit of (U)SIM interface in
Figure 17&18.
6. Updated reference circuit of USB interface in Figure
19.
7. Updated PCM mode in Chapter 3.12.
8. Added SD card interface in Chapter 3.13.
9. Updated USB_BOOT reference circuit in Chapter
3.20.
10. Updated module operating frequencies in Table 26.
11. Updated antenna requirements in Table 30.
12. Updated EC25 series module current consumption in
Chapter 6.4.
13. Updated EC25 series module conducted RF receiving
sensitivity in Chapter 6.6.
14. Added thermal consideration description in Chapter
6.8.
15. Added dimension tolerance information in Chapter 7.
16. Added storage temperature range in Table 2 and
Chapter 6.3.
17. Updated RF output power in Table 41.
18. Updated GPRS multi-slot classes in Table 53.
19. Updated storage information in Chapter 8.1.
1. Added information of EC25-AF in Table 1.
2. Updated module operating frequencies in Table 27.
3. Added current consumption of EC25-AF module in
1.5 2018-04-20 Kinsey ZHANG
Table 40.
4. Changed GNSS current consumption of EC25 series
module into Table 41.
5. Added EC25-AF conducted RF receiving sensitivity in
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EC25 Hardware Design
Nathan LIU/
2.0 2019-04-30
Frank WANG/
Ward WANG/
Ethan SHAN
Table 50.
1. Added new variants EC25-EU/-EC/-EUX/-MX and
related information.
2. Updated functional diagram in Figure 1.
3. Updated star structure of the power supply in Figure 8.
4. Updated power-on scenario of module in Figure 12.
5. Updated reference circuit with translator chip in Figure
20.
6. Added timing sequence for entering into emergency
download mode of USB_BOOT interface in Figure 32.
7. Updated general description in Table 1.
8. Updated module operating frequencies in Table 27.
9. Updated GNSS frequency in Table 29.
10. Updated antenna requirements in Table 30.
11. Updated EC25-V current consumption in Table 36.
12. Added EC25-EU current consumption in Table 41
13. Added EC25-EC current consumption in Table 42.
14. Added EC25-EUX current consumption in Table 43.
15. Added EC25-MX current consumption in Table 44.
16. Updated EC25-E conducted RF receiving sensitivity in
Table 47.
17. Updated EC25-A conducted RF receiving sensitivity in
Table 48.
18. Updated EC25-V conducted RF receiving sensitivity in
Table 49.
19. Updated EC25-AUT conducted RF receiving
sensitivity in Table 52.
20. Updated EC25-AUTL conducted RF receiving
sensitivity in Table 53.
21. Added EC25-EU conducted RF receiving sensitivity in
Table 55.
22. Added EC25-EC conducted RF receiving sensitivity in
Table 56.
23. Added EC25-EUX conducted RF receiving sensitivity
in Table 57.
24. Added EC25-MX conducted RF receiving sensitivity in
Table 58.
25. Updated recommended stencil thickness as
0.18mm~0.20mm and reflow soldering thermal profile
in Chapter 8.2.
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Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 5
Table Index ............................................................................................................................................... 8
Figure Index ............................................................................................................................................ 10
1 Introduction ..................................................................................................................................... 12
1.1. Safety Information ................................................................................................................. 13
2 Product Concept ............................................................................................................................. 17
2.1. General Description .............................................................................................................. 17
2.2. Key Features ......................................................................................................................... 18
2.3. Functional Diagram ............................................................................................................... 21
2.4. Evaluation Board ................................................................................................................... 22
3 Application Interfaces ..................................................................................................................... 23
3.1. General Description .............................................................................................................. 23
3.2. Pin Assignment ..................................................................................................................... 24
3.3. Pin Description ...................................................................................................................... 25
3.4. Operating Modes .................................................................................................................. 37
3.5. Power Saving ........................................................................................................................ 37
3.5.1.
Sleep Mode.................................................................................................................. 37
3.5.1.1. UART Application .............................................................................................. 37
3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 38
3.5.1.3. USB Application with USB Suspend/Resume and RI Function.......................... 39
3.5.1.4. USB Application without USB Suspend Function .............................................. 40
3.5.2. Airplane Mode .............................................................................................................. 40
3.6. Power Supply ........................................................................................................................ 41
3.6.1. Power Supply Pins ....................................................................................................... 41
3.6.2. Decrease Voltage Drop ............................................................................................... 42
3.6.3. Reference Design for Power Supply ............................................................................ 43
3.6.4. Monitor the Power Supply ............................................................................................ 43
3.7. Power-on and off Scenarios .................................................................................................. 44
3.7.1. Turn on Module Using the PWRKEY ........................................................................... 44
3.7.2. Turn off Module ............................................................................................................ 46
3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 46
3.7.2.2. Turn off Module Using AT Command ................................................................ 46
3.8. Reset Module ........................................................................................................................ 47
3.9.
(U)SIM Interface .................................................................................................................... 48
3.10. USB Interface ........................................................................................................................ 50
3.11. UART Interfaces ................................................................................................................... 52
3.12. PCM and I2C Interfaces ........................................................................................................ 55
3.13. SD Card Interface ................................................................................................................. 57
3.14. ADC Interfaces ...................................................................................................................... 59
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3.15. Network Status Indication ..................................................................................................... 60
3.16. STATUS ................................................................................................................................ 61
3.17. Behaviors of RI ..................................................................................................................... 62
3.18. SGMII Interface ..................................................................................................................... 62
3.19. Wireless Connectivity Interfaces ........................................................................................... 64
3.19.1. WLAN Interface ........................................................................................................... 67
3.19.2. BT Interface* ................................................................................................................ 67
3.20. USB_BOOT Interface............................................................................................................ 67
4 GNSS Receiver ................................................................................................................................ 70
4.1. General Description .............................................................................................................. 70
4.2. GNSS Performance .............................................................................................................. 70
4.3. Layout Guidelines ................................................................................................................. 71
5 Antenna Interfaces .......................................................................................................................... 72
5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 72
5.1.1. Pin Definition ................................................................................................................ 72
5.1.2. Operating Frequency ................................................................................................... 72
5.1.3. Reference Design of RF Antenna Interface ................................................................. 74
5.1.4. Reference Design of RF Layout ................................................................................... 74
5.2. GNSS Antenna Interface ....................................................................................................... 76
5.3. Antenna Installation .............................................................................................................. 78
5.3.1. Antenna Requirement .................................................................................................. 78
5.3.2. Recommended RF Connector for Antenna Installation ................................................ 79
6 Electrical, Reliability and Radio Characteristics .......................................................................... 81
6.1. Absolute Maximum Ratings .................................................................................................. 81
6.2. Power Supply Ratings ........................................................................................................... 82
6.3. Operation and Storage Temperatures .................................................................................. 82
6.4. Current Consumption ............................................................................................................ 83
6.5. RF Output Power ................................................................................................................ 101
6.6. RF Receiving Sensitivity ..................................................................................................... 102
6.7. Electrostatic Discharge ....................................................................................................... 108
6.8. Thermal Consideration ........................................................................................................ 109
7 Mechanical Dimensions................................................................................................................ 111
7.1. Mechanical Dimensions of the Module................................................................................ 111
7.2.
Recommended Footprint ..................................................................................................... 113
7.3. Design Effect Drawings of the Module ................................................................................ 114
8 Storage, Manufacturing and Packaging ...................................................................................... 115
8.1. Storage ............................................................................................................................... 115
8.2. Manufacturing and Soldering .............................................................................................. 116
8.3. Packaging ........................................................................................................................... 117
9 Appendix A References ................................................................................................................ 119
10 Appendix B GPRS Coding Schemes ........................................................................................... 123
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EC25 Hardware Design
11 Appendix C GPRS Multi-slot Classes .......................................................................................... 124
12 Appendix D EDGE Modulation and Coding Schemes ................................................................ 126
EC25_Hardware_Design 7 / 112
EC25 Hardware Design
Table Index
TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 17
TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 18
TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 25
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 25
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 37
TABLE 6: VBAT AND GND PINS ...................................................................................................................... 41
TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 44
TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 47
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 49
TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 51
TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 52
TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 53
TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 53
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ...................................................................... 56
TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 57
TABLE 16: PIN DEFINITION OF ADC INTERFACES ...................................................................................... 59
TABLE 17: CHARACTERISTIC OF ADC .......................................................................................................... 59
TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 60
TABLE 19: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................. 60
TABLE 20: PIN DEFINITION OF STATUS ....................................................................................................... 61
TABLE 21: BEHAVIORS OF RI ......................................................................................................................... 62
TABLE 22: PIN DEFINITION OF SGMII INTERFACE ...................................................................................... 63
TABLE 23: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ............................................... 65
TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 68
TABLE 25: GNSS PERFORMANCE ................................................................................................................. 70
TABLE 26: PIN DEFINITION OF RF ANTENNAS ............................................................................................ 72
TABLE 27: MODULE OPERATING FREQUENCIES ....................................................................................... 72
TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 76
TABLE 29: GNSS FREQUENCY ...................................................................................................................... 77
TABLE 30: ANTENNA REQUIREMENTS ......................................................................................................... 78
TABLE 31: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 81
TABLE 32: POWER SUPPLY RATINGS .......................................................................................................... 82
TABLE 33: OPERATION AND STORAGE TEMPERATURES ......................................................................... 82
TABLE 34: EC25-E CURRENT CONSUMPTION ............................................................................................. 83
TABLE 35: EC25-A CURRENT CONSUMPTION ............................................................................................. 85
TABLE 36: EC25-V CURRENT CONSUMPTION ............................................................................................. 86
TABLE 37: EC25-J CURRENT CONSUMPTION ............................................................................................. 87
TABLE 38: EC25-AU CURRENT CONSUMPTION .......................................................................................... 88
TABLE 39: EC25-AUT CURRENT CONSUMPTION ........................................................................................ 91
TABLE 40: EC25-AF CURRENT CONSUMPTION ........................................................................................... 92
TABLE 41: EC25-EU CURRENT CONSUMPTION .......................................................................................... 93
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TABLE 42: EC25-EC CURRENT CONSUMPTION .......................................................................................... 95
TABLE 43: EC25-EUX CURRENT CONSUMPTION ........................................................................................ 97
TABLE 44: EC25-MX CURRENT CONSUMPTION ........................................................................................ 100
TABLE 45: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE .............................................. 101
TABLE 46: RF OUTPUT POWER ................................................................................................................... 101
TABLE 47: EC25-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 102
TABLE 48: EC25-A CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 103
TABLE 49: EC25-V CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 103
TABLE 50: EC25-J CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 103
TABLE 51: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 104
TABLE 52: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 105
TABLE 53: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY ......................................................... 105
TABLE 54: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 105
TABLE 55: EC25-EU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 106
TABLE 56: EC25-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 106
TABLE 57: EC25-EUX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 107
TABLE 58: EC25-MX CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 108
TABLE 59: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ... 108
TABLE 60: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................ 116
TABLE 61: RELATED DOCUMENTS ............................................................................................................. 119
TABLE 62: TERMS AND ABBREVIATIONS ................................................................................................... 119
TABLE 63: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 123
TABLE 64: GPRS MULTI-SLOT CLASSES .................................................................................................... 124
TABLE 65: EDGE MODULATION AND CODING SCHEMES ........................................................................ 126
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 22
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 24
FIGURE 3: SLEEP MODE APPLICATION VIA UART ...................................................................................... 38
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 39
FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 39
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 40
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ..................................................... 42
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ........................................................................... 42
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 43
FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 44
FIGURE 11: TURN ON THE MODULE BY USING KEYSTROKE ................................................................... 45
FIGURE 12: POWER-ON SCENARIO OF MODULE ....................................................................................... 45
FIGURE 13: POWER-OFF SCENARIO OF MODULE ...................................................................................... 46
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 47
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 48
FIGURE 16: RESET SCENARIO OF MODULE ................................................................................................ 48
FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 49
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 50
FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 51
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 54
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 54
FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 55
FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 56
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 57
FIGURE 25: REFERENCE CIRCUIT OF SD CARD INTERFACE ................................................................... 58
FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 61
FIGURE 27: REFERENCE CIRCUITS OF STATUS ........................................................................................ 61
FIGURE 28: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 63
FIGURE 29: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................ 64
FIGURE 30: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE
................................................................................................................................................................... 66
FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 68
FIGURE 32: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 68
FIGURE 33: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 74
FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB .............................................................................. 75
FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB .......................................................... 75
FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 75
FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 76
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FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 77
FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 79
FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 79
FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 80
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ............... 109
FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................. 110
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 111
FIGURE 45: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 112
FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 113
FIGURE 47: TOP VIEW OF THE MODULE .................................................................................................... 114
FIGURE 48: BOTTOM VIEW OF THE MODULE ............................................................................................ 114
FIGURE 49: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 116
FIGURE 50: TAPE AND REEL SPECIFICATIONS ........................................................................................ 118
EC25_Hardware_Design 11 / 112
EC25 Hardware Design
1 Introduction
This document defines the EC25 module and describes its air interface and hardware interfaces which
are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EC25 module. To facilitate its application in
different fields, relevant reference design is also provided for customers’ reference. Associated with
application note and user guide, customers can use EC25 module to design and set up mobile
applications easily.
EC25_Hardware_Design 12 / 112
EC25 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
EC25_Hardware_Design 13 / 112
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1.2. FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements
of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR201907EC25MX.
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒ WCDMA Band2:≤9.000dBi
❒ WCDMA Band4:≤6.000dBi
❒WCDMA Band5:≤10.416dBi
❒ LTE Band2:≤10.000dBi
❒ LTE Band5:≤11.255dBi
❒ LTE Band4/7/66:≤7.000dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
EC25_Hardware_Design 14 / 112
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For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions
explaining to the OEM the labeling requirements, options and OEM user manual instructions that are
required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:“Contains Transmitter Module
FCC ID: XMR201907EC25MX” or “Contains FCC ID: XMR201907EC25MX” must be used. The host
OEM user manual must also contain clear instructions on how end users can find and/or access the
module and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria
for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the
user that changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment. In cases where the manual is provided only in
a form other than paper, such as on a computer disk or over the Internet, the information required by
EC25_Hardware_Design 15 / 112
EC25 Hardware Design
this section may be included in the manual in that alternative form, provided the user can reasonably be
expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Declaration of Conformity procedure without a
transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that
the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements
FCC RF Exposure Requirements
This device complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter and must be installed to provide a separation distance of at least 20cm from all
persons.
FCC Regulations
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications.
EC25_Hardware_Design 16 / 112
EC25 Hardware Design
2 Product Concept
2.1. General Description
EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive
diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,
WCDMA, EDGE and GPRS networks. It also provides GNSS
specific applications. EC25 contains 12 variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU,
EC25-AUT, EC25-AF, EC25-EU, EC25-EC, EC25-EUX
choose a dedicated type based on the region or operator. The following table shows the frequency bands
of EC25 series module.
3)
1)
and voice functionality2) for customers’
, EC25-AUTL and EC25-MX3). Customers can
Table 1: Frequency Bands of EC25 Series Module
Modules2) LTE Bands
EC25-E
EC25-A
EC25-V
EC25-J
EC25-AU4)
EC25-AUT
EC25-AF
EC25-EU
FDD: B1/B3/B5/B7/B8/B20
TDD: B38/B40/B41
FDD: B2/B4/B12 B2/B4/B5 N Y
FDD: B4/B13 N N Y
FDD: B1/B3/B8/B18/B19/
B26
TDD: B41
FDD: B1/B2/B3/B4/B5/B7/
B8/B28
TDD: B40
FDD: B1/B3//B5/B7/B28 B1/B5 N Y
FDD: B2/B4//B5/B12/B13/
B14/B66/B71
FDD: B1/B3/B7/B8/B20/
B28A
TDD: B38/B40/B41
WCDMA Bands
B1/B5/B8 900/1800MHz Y
B1/B6/B8/B19 N Y
B1/B2/B5/B8
B2/B4/B5 N Y
B1/B8 900/1800MHz Y
GSM Bands
850/900/
1800/1900MHz
Rx­diversity
Y
GNSS1)
GPS,
GLONASS,
BeiDou/
Compass,
Galileo,
QZSS
EC25_Hardware_Design 17 / 112
EC25 Hardware Design
EC25-EC
FDD: B1/B3/B7/B8/B20/
B28A
B1/B8 900/1800MHz Y
FDD: B1/B3/B7/B8/B20/
EC25-EUX
B28A
B1/B8 900/1800MHz Y
TDD: B38/B40/B41
EC25-AUTL
EC25-MX
FDD: B3/B7/B28 N N Y N
FDD: B2/B4//B5/B7/B28/
B66
B2/B4/B5 N Y N
NOTES
1)
1.
GNSS function is optional.
2)
2.
EC25 series module contains Telematics version and Data-only version. Telematics version
supports voice and data functions, while Data-only version only supports data function.
3)
3.
EC25-EUX and EC25-MX are based on ThreadX OS.
4)
4.
B2 band on EC25-AU module does not support Rx-diversity.
5. Y = Supported. N = Not supported.
With a compact profile of 29.0mm × 32.0mm × 2.4mm, EC25 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EC25 is an SMD type module which can be embedded into applications through its 144-pin pads,
including 80 LCC signal pads and 64 LGA pads.
2.2. Key Features
The following table describes the detailed features of EC25 module.
Table 2: Key Features of EC25 Module
Features Details
Power Supply
Transmitting Power
EC25_Hardware_Design 18 / 112
Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
LTE Features
UMTS Features
EC25 Hardware Design
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
Support up to non-CA Cat 4 FDD and TDD
Support 1.4MHz~20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
GSM Features
Internet Protocol Features
SMS
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL)/Max 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/Max 236.8Kbps (UL)
Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/
SMTP/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
EC25_Hardware_Design 19 / 112
PCM Interface
USB Interface
UART Interfaces
EC25 Hardware Design
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
Compliant with USB 2.0 specification (slave only); the data transfer rate can
reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging, firmware upgrade and voice over USB
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE
5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.
Main UART:
Used for AT command communication and data transmission
Baud rates reach up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
SD Card Interface Support SD 3.0 protocol
SGMII Interface
Wireless Connectivity
Interfaces
Support 10M/100M/1000M Ethernet work mode
Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network
Support a low-power SDIO 3.0 interface for WLAN and UART/PCM
interface for Bluetooth*
Rx-diversity Support LTE/WCDMA Rx-diversity
GNSS Features
AT Commands
Network Indication
Antenna Interfaces
Physical Characteristics
Gen8C Lite of Qualcomm
Protocol: NMEA 0183
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Size: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mm
Weight: approx. 4.9g
Operation temperature range: -35°C ~ +75°C
Temperature Range
Extended temperature range: -40°C ~ +85°C
Storage temperature range: -40°C~ +90°C
1)
2)
Firmware Upgrade USB interface or DFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive
EC25_Hardware_Design 20 / 112
EC25 Hardware Design
NOTES
1)
1.
Within operation temperature range, the module is 3GPP compliant.
2)
2.
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
might reduce in their value and exceed the specified tolerances. When the temperature returns to
out
normal operation temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EC25 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
EC25_Hardware_Design 21 / 112
EC25 Hardware Design
ANT_MAIN ANT_DIVANT_GNSS
VBAT_RF
VBAT_BB
PWRKEY
RESET_N
ADCs
STATUS
APT
PMIC
VDD_EXT
SAW
Tx
Control
19.2 M
PAM
Duplex
PA
PRx DRx
Transceiver
IQ Cont rol
XO
USB (U)SIM PCM UARTsI2C
SAW
LNA
Switch
SAW
SDRAM
Baseband
SGMII
NAND DDR2
WLAN SDBT*
GPIOs
Figure 1: Functional Diagram
NOTE
“*” means under development.
2.4. Evaluation Board
In order to help customers develop applications with EC25, Quectel supplies an evaluation board (EVB),
USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.
EC25_Hardware_Design 22 / 112
EC25 Hardware Design
3 Application Interfaces
3.1. General Description
EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application
platform. Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply
(U)SIM interface
USB interface
UART interfaces
PCM and I2C interfaces
SD card interface
ADC interfaces
Status indication
SGMII interface
Wireless connectivity interfaces
USB_BOOT interface
EC25_Hardware_Design 23 / 112
EC25 Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of EC25 module.
Figure 2: Pin Assignment (Top View)
NOTES
1)
1.
means that these pins cannot be pulled up before startup.
2)
2.
PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
3)
3.
means these interface functions are only supported on Telematics version.
4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads
118, 127 and 129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT
function is under development.
5. Pads 119~126 and 128 are used for SGMII interface.
EC25_Hardware_Design 24 / 112
EC25 Hardware Design
6. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on the BT
module.
7. Keep all RESERVED pins and unused pins unconnected.
8. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not
be designed in schematic and PCB decal, and these pins should be served as a keepout area.
9. “*” means under development.
3.3. Pin Description
The following tables show the pin definition of EC25 module.
Table 3: I/O Parameters Definition
Type Description
AI Analog input
AO Analog output
DI Digital input
DO Digital output
IO Bidirectional
OD Open drain
PI Power input
PO Power output
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
VBAT_BB 59, 60 PI
VBAT_RF 57, 58 PI
Power supply for
module’s baseband
part
Power supply for
module’s RF part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
Vmax=4.3V
Vmin=3.3V
It must be able to
provide sufficient
current up to 0.8A.
It must be able to
provide sufficient
EC25_Hardware_Design 25 / 112
EC25 Hardware Design
Vnorm=3.8V current up to 1.8A in a
burst transmission.
Power supply for
VDD_EXT 7 PO
Provide 1.8V for
external circuit
Vnorm=1.8V
I
max=50mA
O
external GPIO’s pull-up
circuits.
If unused, keep it open.
8, 9, 19,
22, 36, 46,
GND
48, 50~54,
Ground
56, 72,
85~112
Turn on/off
Pin Name Pin No. I/O Description DC Characteristics Comment
The output voltage is
PWRKEY 21 DI
Turn on/off the
module
V
H
=0.8V
0.8V because of the
diode drop in the
Qualcomm chipset.
V
max=2.1V
IH
V
min=1.3V
IH
V
max=0.5V
IL
If unused, keep it
open.
RESET_N 20 DI
Reset signal of the
module
Status Indication
Pin Name Pin No. I/O Description DC Characteristics Comment
An external pull-up
resistor is required.
If unused, keep it
open.
STATUS 61 OD
Indicate the module
operating status
The drive current
should be less than
0.9mA.
1.8V power domain.
It cannot be pulled up
before startup.
If unused, keep it
NET_MODE 5 DO
Indicate the
module’s network
registration mode
V
min=1.35V
OH
V
max=0.45V
OL
open.
NET_
STATUS
Indicate the
6 DO
module’s network
activity status
V
min=1.35V
OH
V
max=0.45V
OL
1.8V power domain.
If unused, keep it
open.
USB Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
USB_VBUS 71 PI
USB power supply,
used for USB
detection
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
Typical: 5.0V
If unused, keep it
open.
EC25_Hardware_Design 26 / 112
EC25 Hardware Design
Require differential
impedance of 90Ω.
If unused, keep it
open.
Require differential
impedance of 90Ω.
If unused, keep it
open.
USB_DP 69 IO
USB_DM 70 IO
USB differential data
bus (+)
USB differential data
bus (-)
Compliant with USB
2.0 standard
specification.
Compliant with USB
2.0 standard
specification.
(U)SIM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
USIM_GND 10
USIM_
PRESENCE
13 DI
Specified ground for
(U)SIM card
(U)SIM card
insertion detection
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
For 1.8V(U)SIM:
Vmax=1.9V
Vmin=1.7V
USIM_VDD 14 PO
Power supply for
(U)SIM card
For 3.0V(U)SIM:
Vmax=3.05V
Either 1.8V or 3.0V is
supported by the
module automatically.
Vmin=2.7V
I
max=50mA
O
For 1.8V (U)SIM:
V
max=0.6V
IL
V
min=1.2V
IH
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=1.0V
V
IL
V
min=1.95V
IH
V
max=0.45V
OL
V
min=2.55V
OH
USIM_DATA 15 IO
Data signal of
(U)SIM card
For 1.8V (U)SIM:
V
max=0.45V
OL
USIM_CLK 16 DO
Clock signal of
(U)SIM card
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
EC25_Hardware_Design 27 / 112
EC25 Hardware Design
VOHmin=2.55V
For 1.8V (U)SIM:
max=0.45V
V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
V
min=2.55V
OH
USIM_RST 17 DO
Reset signal of
(U)SIM card
Main UART Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
V
RI 62 DO Ring indicator
DCD 63 DO
Data carrier
detection
CTS 64 DO Clear to send
RTS 65 DI Request to send
DTR 66 DI
Data terminal ready,
sleep mode control
OL
V
OH
V
OL
V
OH
V
OL
V
OH
V
IL
V
IL
V
IH
V
IH
V
IL
V
IL
V
IH
V
IH
max=0.45V
min=1.35V
max=0.45V
min=1.35V
max=0.45V
min=1.35V
min=-0.3V
max=0.6V
min=1.2V
max=2.0V
min=-0.3V
max=0.6V
min=1.2V
max=2.0V
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
Pulled up by default.
Low level wakes up
the module.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
TXD 67 DO Transmit data
RXD 68 DI Receive data
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
Debug UART Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
DBG_TXD 12 DO Transmit data
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
V
EC25_Hardware_Design 28 / 112
EC25 Hardware Design
open.
V
min=-0.3V
DBG_RXD 11 DI Receive data
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
ADC Interfaces
Pin Name Pin No. I/O Description DC Characteristics Comment
General purpose
ADC0 45 AI
analog to digital
converter
General purpose
ADC1 44 AI
analog to digital
converter
Voltage range:
0.3V to VBAT_BB
Voltage range:
0.3V to VBAT_BB
If unused, keep it
open.
If unused, keep it
open.
PCM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
V
min=-0.3V
PCM_IN 24 DI PCM data input
PCM_OUT 25 DO PCM data output
PCM data frame
PCM_SYNC 26 IO
synchronization
signal
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
VOLmax=0.45V
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
PCM_CLK 27 IO PCM clock
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
I2C Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
EC25_Hardware_Design 29 / 112
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