Quectel Wireless Solutions 201906EG21G User Manual

EG21-G MINIPCIE

Hardware Design

LTE Module Series

Rev. EG21-G_MINIPCIE_Hardware_Design_V1.0
Date: 2019-03-11
Status: Released

www.quectel.com

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 1 / 48

Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: [phone]
Email: [e-mail]

Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm
Or email to: [e-mail]

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.

COPYRIGHT

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF
DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR
REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 2 / 48

About the Document

History

Revision

Date

Author

Description

1.0

2019-01-03

Lorry XU/
Ethan SHAN

Initial

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 3 / 48

Contents

About the Document ................................................................................................................................ 2

Contents .................................................................................................................................................... 3

Table Index ............................................................................................................................................... 5

Figure Index .............................................................................................................................................. 6

1 Introduction ....................................................................................................................................... 7

1.1. Safety Information ................................................................................................................... 8

2 Product Concept ............................................................................................................................... 9

2.1. General Description ................................................................................................................ 9

2.2. Module Description ............................................................................................................... 10

2.3. Key Features ......................................................................................................................... 10

2.4. Functional Diagram ................................ ................................................................ ............... 13

3 Application Interfaces ..................................................................................................................... 14

3.1. Pin Assignment ..................................................................................................................... 14

3.2. Pin Description ...................................................................................................................... 15

3.3. Power Supply ........................................................................................................................ 18

3.4. (U)SIM Interface .................................................................................................................... 19

3.5. USB Interface ........................................................................................................................ 21

3.6. UART Interface ..................................................................................................................... 22

3.7. PCM and I2C Interfaces ........................................................................................................ 23

3.8. Control and Indicator Signals ................................................................................................ 25

3.8.1. RI Signal ...................................................................................................................... 26

3.8.2. DTR Signal .................................................................................................................. 26

3.8.3. W_DISABLE# Signal ................................................................................................... 26

3.8.4. PERST# Signal ............................................................................................................ 27

3.8.5. LED_WWAN# Signal ................................................................................................... 27

3.8.6. WAKE# Signal ............................................................................................................. 28

3.9. Antenna Interfaces ................................................................................................................ 29

3.9.1. Antenna Requirements ................................................................................................ 29

3.9.2. Recommended RF Connector for Antenna Installation ................................................ 30

4 Electrical, Reliability and Radio Characteristics .......................................................................... 32

4.1. General Description .............................................................................................................. 32

4.2. Power Supply Requirements ................................................................................................. 32

4.3. I/O Requirements .................................................................................................................. 33

4.4. RF Characteristics ................................................................................................................ 33

4.5. GNSS Receiver ..................................................................................................................... 35

4.6. ESD Characteristics .............................................................................................................. 36

4.7. Thermal Consideration .......................................................................................................... 36

4.8. Current Consumption ............................................................................................................ 37

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 4 / 48

5 Dimensions and Packaging ............................................................................................................ 43

5.1. General Description .............................................................................................................. 43

5.2. Mechanical Dimensions of EG21-G MINIPCIE ..................................................................... 43

5.3. Standard Dimensions of Mini PCI Express ............................................................................ 44

5.4. Packaging ............................................................................................................................. 45

6 Appendix References ..................................................................................................................... 46

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 5 / 48

Table Index

TABLE 1: DESCRIPTION OF EG21-G MINIPCIE ............................................................................................ 10

TABLE 2: KEY FEATURES OF EG21-G MINIPCIE .......................................................................................... 10

TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15

TABLE 5: DEFINITION OF VCC_3V3 AND GND PINS .................................................................................... 18

TABLE 6: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 19

TABLE 7: PIN DEFINITION OF USB INTERFACE ........................................................................................... 21

TABLE 8: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 22

TABLE 9: PIN DEFINITION OF PCM AND I2C INTERFACES ......................................................................... 23

TABLE 10: PIN DEFINITION OF CONTROL AND INDICATOR SIGNALS ....................................................... 25

TABLE 11: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD ..................................................... 26

TABLE 12: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD ..................................................... 27

TABLE 12: INDICATIONS OF NETWORK STATUS (AT+QCFG=“LEDMODE”,0, DEFAULT SETTING) ......... 28

TABLE 13: INDICATIONS OF NETWORK STATUS (AT+QCFG=“LEDMODE”,2) ........................................... 28

TABLE 14: ANTENNA REQUIREMENTS .......................................................................................................... 29

TABLE 15: POWER SUPPLY REQUIREMENTS .............................................................................................. 32

TABLE 16: I/O REQUIREMENTS ...................................................................................................................... 33

TABLE 17: EG21-G MINIPCIE CONDUCTED RF OUTPUT POWER .............................................................. 33

TABLE 18: EG21-G MINIPCIE CONDUCTED RF RECEIVING SENSITIVITY ................................................ 34

TABLE 19: ESD CHARACTERISTICS OF EG21-G MINIPCIE ......................................................................... 36

TABLE 20: CURRENT CONSUMPTION OF EG21-G MINIPCIE ..................................................................... 37

TABLE 22: GNSS CURRENT CONSUMPTION OF EG21-G MINIPCIE .......................................................... 41

TABLE 22: RELATED DOCUMENTS ................................................................................................................ 46

TABLE 23: TERMS AND ABBREVIATIONS ...................................................................................................... 46

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 6 / 48

Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13

FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14

FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 18

FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 19
FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ... 20

FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 21

FIGURE 7: TIMING IN PRIMARY MODE .......................................................................................................... 24

FIGURE 8: TIMING IN AUXILIARY MODE ....................................................................................................... 24

FIGURE 9: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ...................................... 25

FIGURE 10: RI BEHAVIOR ............................................................................................................................... 26

FIGURE 11: TIMING OF RESETTING MODULE .............................................................................................. 27

FIGURE 12: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 27

FIGURE 13: WAKE# BEHAVIOR ...................................................................................................................... 29

FIGURE 14: DIMENSIONS OF THE RF CONNECTORS (UNIT: MM) ............................................................. 30

FIGURE 15: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 30

FIGURE 16: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 31

FIGURE 17: REFERENCED HEATSINK DESIGN ........................................................................................... 37

FIGURE 18: MECHANICAL DIMENSIONS OF EG21-G MINIPCIE ................................................................. 43

FIGURE 19: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 44

FIGURE 20: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 45

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 7 / 48

1 Introduction

This document defines EG21-G MINIPCIE module, and describes its air interfaces and hardware
interfaces which are connected with customers’ applications.

This document can help customers quickly understand module interface specifications, electrical and
mechanical details as well as other related information of EG21-G MINIPCIE module. To facilitate its
application in different fields, relevant reference design is also provided for customers’ reference.
Associated with application note and user guide, customers can use the module to design and set up
mobile applications easily.

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 8 / 48

1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EG21-G MINIPCIE module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 9 / 48

2 Product Concept

2.1. General Description

EG21-G MINIPCIE module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+,
HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface.
It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio,
high-speed data transmission and GNSS functionalities for customers’ applications.

EG21-G MINIPCIE module can be applied in the following fields:

 PDA and Laptop Computer
 Remote Monitor System
 Vehicle System
 Wireless POS System
 Intelligent Meter Reading System
 Wireless Router and Switch
 Other Wireless Terminal Devices

This chapter generally introduces the following aspects of EG21-G MINIPCIE module:

 Product Series
 Key Features
 Functional Diagram



EG21-G MINIPCIE contains Telematics version and Data-only version. Telematics version supports
voice and data functions, while Data-only version only supports data function.

NOTE

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 10 / 48

2.2. Module Description

The following table shows the description of EG21-G MINIPCIE module.

Table 1: Description of EG21-G MINIPCIE

1.

1)

GNSS function is optional.

2.

2)

Digital audio (PCM) function is only supported on Telematics version.

2.3. Key Features

The following table describes the detailed features of EG21-G MINIPCIE module.

Table 2: Key Features of EG21-G MINIPCIE

Module

Description

EG21-G MINIPCIE

Support LTE-FDD:
B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28
Support LTE-TDD: B38/B39/B40/B41
Support WCDMA: B1/B2/B4/B5/B6/B8/B19
Support GSM: 850/900/1800/1900MHz
Support GPS, GLONASS, BeiDou/Compass, Galileo, QZSS 1)
Support digital audio 2)

Feature

Details

Function Interface

PCI Express Mini Card 1.2 Standard Interface

Power Supply

Supply voltage: 3.0V~3.6V
Typical supply voltage: 3.3V

Transmitting Power

Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK

NOTES

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 11 / 48

Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE FDD bands
Class 3 (23dBm±2dB) for LTE TDD bands

LTE Features

Support up to non-CA Cat 1 FDD and TDD
Support 1.4MHz~20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL)
LTE-TDD: Max 8.96Mbps (DL), Max 3.1Mbps (UL)

UMTS Features

Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK,16-QAM and 64-QAM modulation
DC-HSDPA: Max 7.2Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)

GSM Features

GPRS:

Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL), Max 85.6Kbps (UL)

EDGE:

Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL), Max 236.8Kbps (UL)

Internet Protocol Features

Support
TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/SMTP/CMUX*/HTTPS*/
/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections

SMS

Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default

(U)SIM Interface

Support USIM/SIM card: 1.8V, 3.0V
Support a built in USIM card connector without card detection function.

UART Interface

Support RTS and CTS hardware flow control
Baud rate can reach up to 230400bps, 115200bps by default
Used for AT command communication and data transmission

Audio Features

Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 12 / 48

1. 1) Within operation temperature range, the module is 3GPP compliant.

2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P

out

might reduce in their value and exceed the specified tolerances. When the temperature

returns to normal operation temperature levels, the module will meet 3GPP specifications again.

3. “*” means under development.

LTE: AMR/AMR-WB
Support echo cancellation and noise suppression

PCM Interface

Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization

USB Interface

Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging, firmware upgrade and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE

5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc.

Antenna Interfaces

Including main antenna, diversity antenna and GNSS antenna

Rx-diversity

Support LTE/WCDMA Rx-diversity

GNSS Features

Gen8C Lite of Qualcomm
Protocol: NMEA 0183

AT Commands

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands

Physical Characteristics

Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm
Weight: approx. 9.8g

Temperature Range

Operation temperature range: -35°C ~ +75°C 1)
Extended temperature range: -40°C ~ +80°C 2)
Storage temperature range: -40°C ~ +90°C

Firmware Upgrade

Upgrade via USB interface or DFOTA*

RoHS

All hardware components are fully compliant with EU RoHS directive

NOTES

EG21-G MINIPCIE Hardware Design

EG25 Module

PCM&I2C

Mini PCI Express Interface

USB

W_DISABLE#
PERST#

LED_WWAN#

Main

Antenna

Interface

VCC

Main

Antenna

VBAT

GNSS

Antenna

Interface

GNSS

Antenna

Boost

Circuit

Diversity
Antenna

Interface

Diversity
Antenna

WAKE#

UART

DTR

RI

(U)SIM

(U)SIM Card

Connector

EG21-G MINIPCIE support a built in (U)SIM card connector which share the same (U)SIM interface with
the one that connected to Mini PCI Express Interface. The built in (U)SIM card connector support no card
detection function, and cannot be simultaneously used with external USIM card. When unused, the built in
(U)SIM card connector has no any effect to the external USIM card.

NOTES

2.4. Functional Diagram

The following figure shows the block diagram of EG21-G MINIPCIE.

LTE Module Series

Figure 1: Functional Diagram

EG21-G_MINIPCIE_Hardware_Design 13 / 48

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 14 / 48

3 Application Interfaces

The physical connections and signal levels of EG21-G MINIPCIE PCIe comply with PCI Express Mini
CEM specifications. This chapter mainly describes the definition and application of the following
interfaces for EG21-G MINIPCIE:

 Power supply
 (U)SIM interface
 USB interface
 UART interface
 PCM&I2C interfaces
 Control and Indicator signals
 Antenna interfaces

3.1. Pin Assignment

The following figure shows the pin assignment of EG21-G MINIPCIE module. The top side contains
EG21-G module and antenna connectors.

PIN2

PIN52

BOT

PIN1

PIN51

TOP

Pin Name

Pin No.

WAKE#

1
3
5
7

9
11
13
15

17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

RESERVED
RESERVED
RESERVED

GND
UART_RX
UART_TX

GND

RI

RESERVED

GND

UART_CTS

UART_RTS

GND
GND
DTR

RESERVED

GND

GND
VCC_3V3
VCC_3V3

GND

PCM_CLK

PCM_DOUT

PCM_DI

PCM_SYNC

Pin Name

Pin No.

2
4
6

8
10
12
14
16

18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52

VCC_3V3

GND

NC

USIM_VDD

USIM_DATA

USIM_CLK
USIM_RST

RESERVED

GND

W_DISABLE#

PERST#

RESERVED

GND

NC

I2C_SCL

I2C_SDA

GND
USB_DM
USB_DP

GND

LED_WWAN#

USIM_PRESENCE

RESERVED

NC

GND

VCC_3V3

Figure 2: Pin Assignment

LTE Module Series

EG21-G MINIPCIE Hardware Design

EG21-G_MINIPCIE_Hardware_Design 15 / 48

3.2. Pin Description

The following tables show the pin definition and description of EG21-G MINIPCIE on the 52-pin
application.

Table 3: I/O Parameters Definition

Table 4: Pin Description

Type

Description

DI

Digital Input

DO

Digital Output

IO

Bidirectional

OC

Open Collector

PI

Power Input

PO

Power Output

Pin No.

Mini PCI Express
Standard Name

EG21-G MINIPCIE
Pin Name

I/O

Description

Comment

1

WAKE#

WAKE#

OC

Output signal to wake up
the host.

2

3.3Vaux

VCC_3V3

PI

3.3V DC supply

3

RESERVED

RESERVED2)

Reserved

4 GND

GND

Mini card ground

5 RESERVED

RESERVED2)

Reserved

6 1.5V

NC Not connected

7 CLKREQ#

RESERVED

Reserved

8

UIM_PWR

USIM_VDD

PO

Power source for the
(U)SIM card

9

GND

GND

Mini card ground

10

UIM_DATA

USIM_DATA

IO

Data signal of (U)SIM card

11

REFCLK-

UART_RX

DI

UART receive data

Connect to