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EG91_H
2019-0
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www.que
tel.com
LTE Module Series
EG91 Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm
Or email to: support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALLINFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
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REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
EG91_Hardware_Design 1 / 93
EG91 Hardware Design
About the Document
History
Revision Date Author Description
Felix YIN/
1.0 2017-03-22
Yeoman CHEN/
Jackie WANG
Initial
LTE Module Series
1.1 2018-01-23
1.2 2018-03-14
Felix YIN/
Rex WANG
Felix YIN/
Rex WANG
1. Added band B28A.
2. Updated the description of UMTS and GSM
features in Table 2.
3. Updated the functional diagram in Figure 1.
4. Updated module operating frequencies in
Table 21.
5. Updated current consumption in Table 26.
6. Updated RF output power in Table 27.
7. Updated the conducted RF receiving
sensitivity in Table 28.
8. Updated the GPRS multi-slot classes in
Table 33.
9. Added thermal consideration in Chapter 5.8
10. Added a GND pad in each of the four corners
of the module’s footprint in Chapter 6.2.
11. Updated storage information in Chapter 7.1.
12. Added packaging information in Chapter 7.3.
1. Added the description of EG91-NA.
2. Updated the functional diagram in Figure 1.
3. Updated pin assignment in Figure 2.
4. Updated GNSS function in Table 1.
5. Updated GNSS Features in Table 2.
6. Updated reference circuit of USB interface
in Figure 21.
7. Added description of GNSS receiver in
Chapter 4.
EG91_Hardware_Design 2 / 93
EG91 Hardware Design
Ward WANG/
1.3 2019-02-03
Nathan LIU/
Rex WANG
LTE Module Series
8. Updated pin definition of RF antenna in
Table 21.
9. Updated module operating frequencies in
Table 22.
10. Added description of GNSS antenna
interface in Chapter 5.2.
11. Updated antenna requirements in Table 25.
12. Updated RF output power in Table 32.
1. Added new variants EG91-NS, EG91-V,
EG91-EC and related contents.
2. Opened pin 24 as ADC0 and added related
contents.
3. Updated functional diagram (Figure 1)
4. Updated pin assignment (Figure 2)
5. Updated GNSS features (Table 2)
6. Added USB_BOOT interface information
(Chapter 3.18)
7. Updated storage information (Chapter 8.1)
8. Updated module operating frequencies
(Table 23)
9. Updatedantenna requirements (Table26)
10. Added current consumption of EG91-NS,
EG91-V and EG91-EC (Table 32, 33 and 34)
11. Added conducted RF receiving sensitivityof
EG91-NS, EG91-V and EG91-EC (Table 39,
40 and 41)
EG91_Hardware_Design 3 / 93
LTE Module Series
EG91 Hardware Design
Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 4
Table Index ............................................................................................................................................... 7
Figure Index .............................................................................................................................................. 9
1 Introduction ..................................................................................................................................... 11
1.1. Safety Information ................................................................................................................. 12
1.2. FCC/ISED Regulatory notices ............................................................................................... 13
2 Product Concept ............................................................................................................................. 16
2.1. General Description .............................................................................................................. 16
2.2. Key Features ......................................................................................................................... 17
2.3. Functional Diagram ............................................................................................................... 19
2.4. Evaluation Board ................................................................................................................... 20
3 Application Interfaces ..................................................................................................................... 21
3.1. General Description .............................................................................................................. 21
3.2. Pin Assignment ..................................................................................................................... 22
3.3. Pin Description ...................................................................................................................... 23
3.4. Operating Modes .................................................................................................................. 30
3.5.
Power Saving ........................................................................................................................ 31
3.5.1. Sleep Mode.................................................................................................................. 31
3.5.1.1. UART Application ............................................................................................... 31
3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 32
3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 32
3.5.1.4. USB Application without USB Suspend Function ............................................... 33
3.5.2. Airplane Mode .............................................................................................................. 34
3.6. Power Supply ........................................................................................................................ 34
3.6.1. Power Supply Pins ....................................................................................................... 34
3.6.2. Decrease Voltage Drop ................................................................................................ 35
3.6.3. Reference Design for Power Supply ............................................................................ 36
3.6.4. Monitor the Power Supply ............................................................................................ 37
3.7. Power-on/off Scenarios ......................................................................................................... 37
3.7.1. Turn on Module Using the PWRKEY ........................................................................... 37
3.7.2. Turn off Module ............................................................................................................ 39
3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 39
3.7.2.2. Turn off Module Using AT Command ................................................................. 39
3.8. Reset the Module .................................................................................................................. 40
3.9. (U)SIM Interfaces .................................................................................................................. 41
3.10. USB Interface ........................................................................................................................ 44
3.11. UART Interfaces ................................................................................................................... 46
EG91_Hardware_Design 4 / 93
LTE Module Series
EG91 Hardware Design
3.12. PCM and I2C Interfaces ........................................................................................................ 48
3.13. SPI Interface ......................................................................................................................... 51
3.14. Network Status Indication ..................................................................................................... 51
3.15. STATUS ................................................................................................................................ 52
3.16. ADC Interface ....................................................................................................................... 53
3.17. Behaviors of RI ..................................................................................................................... 54
3.18. USB_BOOT Interface............................................................................................................ 55
4 GNSS Receiver ................................................................................................................................ 57
4.1. General Description .............................................................................................................. 57
4.2. GNSS Performance .............................................................................................................. 57
4.3. Layout Guidelines ................................................................................................................. 58
5 Antenna Interfaces .......................................................................................................................... 59
5.1. Main/Rx-diversityAntenna Interfaces..................................................................................... 59
5.1.1. Pin Definition ................................................................................................................ 59
5.1.2. Operating Frequency ................................................................................................... 59
5.1.3. Reference Design of RF Antenna Interface ................................................................. 60
5.1.4. Reference Design of RF Layout ................................................................................... 61
5.2. GNSS Antenna Interface ....................................................................................................... 63
5.3. Antenna Installation .............................................................................................................. 64
5.3.1. Antenna Requirement .................................................................................................. 64
5.3.2. Recommended RF Connector for Antenna Installation ................................................ 65
6 Electrical, Reliability and RadioCharacteristics ........................................................................... 67
6.1. Absolute Maximum Ratings .................................................................................................. 67
6.2. Power Supply Ratings ........................................................................................................... 67
6.3. Operation and Storage Temperatures .................................................................................. 68
6.4. Current Consumption ............................................................................................................ 69
6.5. RF Output Power .................................................................................................................. 76
6.6. RF Receiving Sensitivity ....................................................................................................... 77
6.7. Electrostatic Discharge ......................................................................................................... 79
6.8. Thermal Consideration .......................................................................................................... 79
7 Mechanical Dimensions.................................................................................................................. 82
7.1. Mechanical Dimensions of the Module.................................................................................. 82
7.2. Recommended Footprint ....................................................................................................... 84
7.3.
Design Effect Drawings of the Module .................................................................................. 85
8 Storage, Manufacturing and Packaging ........................................................................................ 8 6
8.1. Storage ................................................................................................................................. 86
8.2. Manufacturing and Soldering ................................................................................................ 87
8.3. Packaging ............................................................................................................................. 88
9 Appendix A References .................................................................................................................. 90
10 Appendix B GPRS Coding Schemes ............................................................................................. 94
EG91_Hardware_Design 5 / 93
LTE Module Series
EG91 Hardware Design
11 Appendix C GPRS Multi-slot Classes ............................................................................................ 95
12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 97
EG91_Hardware_Design 6 / 93
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Table Index
TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ....................................................................... 16
TABLE 2: KEY FEATURES OF EG91 MODULE ............................................................................................... 17
TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 23
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 23
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 30
TABLE 6: PIN DEFINITION OF VBAT AND GND ............................................................................................. 35
TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 37
TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 40
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 42
TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 44
TABLE 11: PIN DEFINITION OF MAIN UART INTERFACES ........................................................................... 46
TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 46
TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 47
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 50
TABLE 15: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 51
TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 52
TABLE 17: WORKING STATE OF NETWORK STATUS INDICATOR .............................................................. 52
TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 53
TABLE 19: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 53
TABLE 20: CHARACTERISTICS OF ADC INTERFACE ................................................................................... 54
TABLE 21: DEFAULT BEHAVIORS OF RI ........................................................................................................ 54
TABLE 22: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 55
TABLE 23: GNSS PERFORMANCE ................................................................................................................. 57
TABLE 24: PIN DEFINITION OF RF ANTENNA ............................................................................................... 59
TABLE 25: MODULE OPERATING FREQUENCIES ........................................................................................ 59
TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 63
TABLE 27: GNSS FREQUENCY ....................................................................................................................... 63
TABLE 28: ANTENNA REQUIREMENTS .......................................................................................................... 64
TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 67
TABLE 30: POWER SUPPLY RATINGS ........................................................................................................... 67
TABLE 31: OPERATION AND STORAGE TEMPERATURES .......................................................................... 68
TABLE 32: EG91-E CURRENT CONSUMPTION ............................................................................................. 69
TABLE 33: EG91-NA CURRENT CONSUMPTION ........................................................................................... 71
TABLE 34: EG91-NS CURRENT CONSUMPTION .......................................................................................... 72
TABLE 35: EG91-V CURRENT CONSUMPTION ............................................................................................. 73
TABLE 36: EG91-EC CURRENT CONSUMPTION .......................................................................................... 74
TABLE 37: GNSS CURRENT CONSUMPTION OF EG91 ............................................................................... 76
TABLE 38: RF OUTPUT POWER ..................................................................................................................... 76
TABLE 39: EG91-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77
TABLE 40: EG91-NA CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 77
TABLE 41: EG91-NS CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 78
TABLE 42: EG91-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 78
EG91_Hardware_Design 7 / 93
LTE Module Series
EG91 Hardware Design
TABLE 43: EG91-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 78
TABLE 44: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 79
TABLE 45: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 87
TABLE 46: RELATED DOCUMENTS ................................................................................................................ 90
TABLE 47: TERMS AND ABBREVIATIONS ...................................................................................................... 90
TABLE 48: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 94
TABLE 49: GPRS MULTI-SLOT CLASSES ...................................................................................................... 95
TABLE 50: EDGE MODULATION AND CODING SCHEMES ........................................................................... 97
EG91_Hardware_Design 8 / 93
LTE Module Series
EG91 Hardware Design
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 20
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 22
FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 31
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 32
FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 33
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 34
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 35
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 36
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 36
FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 37
FIGURE 11: TURN ON THE MODULE USING BUTTON ................................................................................. 38
FIGURE 12: POWER-ON SCENARIO .............................................................................................................. 38
FIGURE 13: POWER-OFF SCENARIO ............................................................................................................ 39
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 40
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 41
FIGURE 16: RESET SCENARIO ...................................................................................................................... 41
FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 43
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 43
FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 45
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 47
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 48
FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 49
FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 49
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 50
FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ......................................... 51
FIGURE 26: REFERENCE CIRCUIT OF NETWORK STATUS INDICATOR ................................................... 52
FIGURE 27: REFERENCE CIRCUIT OF STATUS ........................................................................................... 53
FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 55
FIGURE 29: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 56
FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61
FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62
FIGURE 32: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 62
FIGURE 33: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 62
FIGURE 34: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 62
FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64
FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 65
FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 66
FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 66
EG91_Hardware_Design 9 / 93
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EG91 Hardware Design
FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 80
FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 81
FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 82
FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 83
FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 84
FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 85
FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 85
FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 87
FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 88
FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 89
FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................... 89
EG91_Hardware_Design 10 / 93
LTE Module Series
EG91 Hardware Design
1 Introduction
This document defines the EG91module and describes its air interface and hardware interface which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical
andmechanical details, as well as other related information of EG91 module. Associated with application
note and user guide, customers can use EG91 module to design and set up mobile applications easily.
EG91_Hardware_Design 11 / 93
LTE Module Series
EG91 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EG91module. Manufacturers of the cellular terminal
should send the following safety information to users and operating personnel, and incorporate these
guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’
failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals,clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
EG91_Hardware_Design 12 / 93
LTE Module Series
EG91 Hardware Design
1.2. FCC/ISED Regulatory notices
Modification statement
Quectel has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s
authority to operate the equipment.
Quectel n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou
modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
RF exposure
This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The
antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna
gain must be below:
Antenna Gain
❒ WCDAM II :≤ 9.000dBi
❒ WCDAM V :≤ 6.000dBi
❒ WCDAM VIII :≤ 10.416dBi
❒ LTE Band2:≤ 8.500dBi
❒ LTE Band4:≤ 5.500dBi
❒ LTE Band5:≤ 9.916dBi
❒ LTE Band12:≤9.234dBi
❒ LTE Band13:≤9.673dBi
❒ L TE Band25:≤8.500dBi
❒ L TE Band25:≤9.837dBi
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
The host end product must include a user manual that clearly defines operating requirements and conditions that must be
observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to above, a separate approval is required to satisfy the SAR requirements of FCC Part
2.1093.
If the device is used for other equipment that separate approval is required for all other operating configurations, including
portable configurations with respect to 2.1093 and different antenna configurations.
Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé.
L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et
votre corps. Gain de l'antenne doit être ci-dessous:
Gain de l‘antenne
EG91_Hardware_Design 13 / 93
LTE Module Series
EG91 Hardware Design
❒ WCDAM II :≤ 9.00dBi
❒ WCDAM V :≤ 6.00dBi
❒ WCDAM VIII :≤ 7.15dBi
❒ LTE Band2:≤8.50dBi
❒ LTE Band4:≤5.50dBi
❒ LTE Band5:≤6.64dBi
❒ LTE Band12:≤6.15dBi
❒ LTE Band13:≤6.44dBi
❒ L TE Band25:≤8.50dBi
❒ L TE Band25:≤6.63dBi
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The certification label of the
module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to
display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains",
or similar wording expressing the same meaning, as follows:
Contains FCC ID:XMR201903EG91NS
Contains IC: 10224A-20193EG91NS
The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and
the FCC ID and ISED.
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de
certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence
d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et l’ISED du module, précédé des mots « Contient un
module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit :
Contient FCC ID:XMR201903EG91NS
Contient IC: 10224A-20193EG91NS
Le manuel d'utilisation OEM de l'hôte doit également contenir des instructions claires sur la manière dont les utilisateurs
finaux peuvent trouver et / ou accéder au module et à l'ID FCC et l’ISED .
EG91_Hardware_Design 14 / 93
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EG91 Hardware Design
CAN ICES-3 (B) / NMB-3 (B)
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
Installation Guidance
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional
radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or
modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the
Internet, the information required by this section may be included in the manual in that alternative form, provided the user
can reasonably be expected to have the capability to access information in that form.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with
the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator
under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host
manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be
compliant with the Part 15B unintentional radiator requirements.
EG91_Hardware_Design 15 / 93
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2 Product Concept
2.1. General Description
EG91module is an embedded 4G wireless communication module with receive diversity. It
supportsLTE-FDD/WCDMA/GSM wireless communication, andprovides data connectivity on
LTE-FDD,DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It can also provide
voice functionality
frequency bands of EG91series module.
1)
to meet customers’ specific application demands. The following table shows the
Table 1: Frequency Bands of EG91Series Module
Module
EG91-E
EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 Not supported
EG91-NS
EG91-V FDD: B4/B13 Not supported Not supported
EG91-EC
LTE Bands
(with Rx-diversity)
FDD:
B1/B3/B7/B8/B20/B28A
FDD:
B2/B4/B5/B12/B13/B25/
B26
FDD:
B1/B3/B7/B8/B20/B28
WCDMA
(with Rx-diversity)
B1/B8 900/1800MHz Not supported
B2/B4/B5 Not supported
B1/B8 900/1800MHz
GSM GNSS2)
GPS, GLONASS,
BeiDou/Compass,G
alileo, QZSS
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
NOTES
1)
1.
EG91contains Telematics version and Data-only version. Telematics version supports voice and
datafunctions, while Data-only version only supports data function.
2)
2.
GNSS function is optional.
EG91_Hardware_Design 16 / 93
LTE Module Series
EG91 Hardware Design
With a compact profile of 29.0mm ×25.0mm ×2.3mm, EG91 can meet almost all requirements for M2M
applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads.
EG91 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have
been developed for customers to use these internet service protocols easily.
2.2. Key Features
The following table describes the detailed features of EG91 module.
Table 2: Key Features of EG91 Module
Feature Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Transmitting Power
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Support up to non-CA Cat 1 FDD
LTE Features
Support 1.4MHz~20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL)
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
UMTS Features
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)
R99:
CSD: 9.6kbps
GPRS:
GSMFeatures
Support GPRS multi-slot class 33(33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL), Max 85.6Kbps (UL)
EDGE:
EG91_Hardware_Design 17 / 93
EG91 Hardware Design
Internet Protocol Features
SMS
LTE Module Series
Support EDGE multi-slot class 33(33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/Max 236.8Kbps (UL)
SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/
SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
Text and PDU modes
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIMInterfaces Support 1.8V and 3.0V (U)SIM cards
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
Used for audio function with external codec
Support 16-bit linear data format
PCM Interface
Support long frame synchronization and short frame synchronization
Support master and slave mode, but must be the master in long frame
synchronization
Compliant with USB 2.0 specification (slave only);the data transfer rate can
reach up to 480Mbps
Used for AT command communication, data transmission,GNSS NMEA
USB Interface
sentences output, software debugging, firmware upgrade and voice over
USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE
5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc.
Main UART:
Used for AT command communication and data transmission
Baud rates reach up to 921600bps, 115200bps by default
UART Interface
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
Rx-diversity Support LTE/WCDMA Rx-diversity
GNSS Features Gen8C Lite of Qualcomm
EG91_Hardware_Design 18 / 93
LTE Module Series
EG91 Hardware Design
Protocol: NMEA 0183
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Network Indication NETLIGHTpin for network activitystatusindication
Antenna Interfaces
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
1)
(ANT_DIV) interface and GNSS antenna interface(ANT_GNSS)
Size: (29.0±0.15)mm × (25.0±0.15)mm × (2.3±0.2)mm
Physical Characteristics
Package: LGA
Weight: approx. 3.8g
2)
3)
Temperature Range
Operation temperature range: -35°C ~ +75°C
Extended temperature range: -40°C ~ +85°C
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade USB interface orDFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1. 1)GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC.
2. 2) Within operationtemperature range, the module is 3GPP compliant.
3. 3) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P
might reduce in their value and exceed the specified tolerances. When the temperature
out
returns to normal operationtemperature levels, the module will meet 3GPP specificationsagain.
4. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EG91 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
EG91_Hardware_Design 19 / 93
LTE Module Series
EG91 Hardware Design
VBAT_RF
VBAT_BB
PWRKEY
RESET_N
STATUS
PMIC
Tx
Control
ANT_MAIN ANT_DIV
PAM
Duplexer
PA
PRx DRx
ANT_GNSS
GPS
1)
SAW
LNA
SAW
Transceiver
IQ C ontrol
Baseband
Switch
SAW
NAND
DDR2
SDRAM
19.2M
XO
VDD_EXT
(U)SIM1
USB PCM UART I2C
(U)SIM2
SPI
GPIOs
Figure 1: Functional Diagram
NOTE
1)
GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC.
2.4. Evaluation Board
Quectel provides a complete set of evaluation tools to facilitate the use and testing ofEG91 module. The
evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna
and other peripherals.
EG91_Hardware_Design 20 / 93
LTE Module Series
EG91 Hardware Design
3 Application Interfaces
3.1. General Description
EG91is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be
connected to customers’ cellular application platforms. Sub-interfaces included in these pads are
described in detail in the following chapters:
Power supply
(U)SIMinterfaces
USB interface
UART interfaces
PCMand I2C interfaces
SPI interface
Statusindication
USB_BOOT interface
EG91_Hardware_Design 21 / 93
EG91 Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of EG91 module.
RESERVED (Pin 49 on EG91-E)
ANT_DIV (EG91-NA/-NS/-V/-EC)
LTE Module Series
NC
NC
GND
PCM _C LK
PCM _SY N C
PCM _D IN
PCM_DOUT
USB_VBUS
USB_DP
USB_DM
NC
NC
NC
NC
PW RKEY
NC
RESET_N
RESERVED
ANT _M AIN
GND
103
62
GND
61
60
GND
59
GND
58
NC
57
56
GND
55
1
2
82 81
80 79
3
4
5
6
7
63
64
10 2 10 1
USIM2_PRESENCE
83
84
USIM2_CLK
10 0
99
8
65
85
9
USIM2_RST
10
66
86
USIM2_DATA
11
12
13
67
68
USIM2_VDD
87
88
14
1)
15
16
89 90
69
91 92
71
70
72
17
18
19
20
21
22
23
24
25
26
104
54
VB AT_ RF
VB AT_ RF
GND
53
98
97
96
95
94
93
28
27
52
51
78
77
76
75
74
73
29
GND
NC
50
USB_BOOT
30
31
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
106
ANT_GNSS (EG91-NA/-NS/-V/-EC)
ANT _DI V (EG 91-E)
GND
USIM_GND
USIM1_CLK
USIM1_DATA
USIM1_RST
USIM1_VDD
USIM1_PRESENCE
I2C_SDA
I2C_SCL
RI
DCD
RTS
CTS
TXD
RXD
VB AT_ BB
VB AT_ BB
105
DBG_RXD
PCM
ADC 0
DBG_TXD
RESERVED
SP I
PO WER USB UART
AP _R EAD Y
(U)SIM
ST ATU S
NETLIGHT
Figure 2:Pin Assignment (Top View)
EG91_Hardware_Design 22 / 93
DTR
GND
SP I_C LK
SP I_ MOSI
VDD _EX T
SP I_ MIS O
ANT
GND
NC
RESERVED
OTHE RS
LTE Module Series
EG91 Hardware Design
NOTES
1. 1)PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
2. Keep all RESERVEDpins and unused pins unconnected.
3. GND pads should be connected to ground in the design.
4. Definition of pin 49 and 56 are different amongEG91-E/-NS/-V/-EC and EG91-NA.For more details,
please refer to Table 4 .
3.3. Pin Description
The following tables show the pin definition and description of EG91.
Table 3: IO Parameters Definition
Type Description
AI Analog input
AO Analog output
DI Digital input
DO Digital output
IO Bidirectional
OD Open drain
PI Power input
PO Power output
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description
Power supply for
VBAT_BB 32, 33 PI
module’s baseband
part
EG91_Hardware_Design 23 / 93
DC
Characteristics
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
Comment
It must be able to
provide sufficient
current up to 0.8A.
LTE Module Series
EG91 Hardware Design
It must be able to
provide sufficient
current up to 1.8A in a
burst transmission.
VBAT_RF 52, 53 PI
Power supply for
module’s RF part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
Power supply for
VDD_EXT 29 PO
Provide 1.8V for
external circuit
Vnorm=1.8V
I
max=50mA
O
external GPIO’s pull up
circuits.
If unused, keep it open.
3, 31, 48,
50, 54, 55,
58, 59, 61,
GND
62, 67~74,
Ground
79~82,
89~91,
100~106
Turn-on/off
Pin Name Pin No. I/O Description DC Characteristics Comment
The output voltage is
0.8V because of the
diode drop in the
Qualcomm chipset.
PWRKEY 15 DI
Turn on/off the
module
V
max=2.1V
IH
V
min=1.3V
IH
V
max=0.5V
IL
Pull-up to 1.8V
V
RESET_N 17 DI
Reset signal of the
module
max=2.1V
IH
V
min=1.3V
IH
V
max=0.5V
IL
internally.
Activelow.
If unused,keep it
open.
Status Indication
Pin Name Pin No. I/O Description DC Characteristics Comment
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
STATUS 20 DO
NETLIGHT 21 DO
Indicate the
module’s operating
status
Indicate the
module’s network
activity status
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
USB Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
USB_VBUS 8 PI
USB connection
detection
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
Typical:5.0V
If unused,keep it
open.
EG91_Hardware_Design 24 / 93
LTE Module Series
EG91 Hardware Design
USB_DP 9 IO
USB_DM 10 IO
USB differential
data bus (+)
USB differential
data bus (-)
Compliant with USB
2.0 standard
specification.
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90Ω.
Require differential
impedance of 90Ω.
(U)SIM Interfaces
Pin Name Pin No. I/O Description DC Characteristics Comment
Connect to ground of
(U)SIM card
connector.
USIM_GND 47
Specified ground
for (U)SIM card
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
USIM1_VDD 43 PO
Power supply for
(U)SIMcard
For 3.0V (U)SIM:
Vmax=3.05V
Either 1.8V or 3.0V is
supported by the
module automatically.
Vmin=2.7V
I
max=50mA
O
For 1.8V (U)SIM:
V
max=0.6V
IL
V
min=1.2V
IH
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=1.0V
V
IL
V
min=1.95V
IH
V
max=0.45V
OL
V
min=2.55V
OH
USIM1_DATA 45 IO
Data signal of
(U)SIMcard
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
V
min=2.55V
OH
USIM1_CLK 46 DO
Clock signal of
(U)SIMcard
EG91_Hardware_Design 25 / 93
EG91 Hardware Design
USIM1_RST 44 DO
USIM1_
PRESENCE
42 DI
USIM2_VDD 87 PO
USIM2_DATA 86 IO
USIM2_CLK 84 DO
USIM2_RST 85 DO
Reset signal of
(U)SIMcard
(U)SIMcard
insertion detection
Power supply for
(U)SIMcard
Data signal of
(U)SIMcard
Clock signal of
(U)SIMcard
Reset signal of
(U)SIMcard
For 1.8V (U)SIM:
max=0.45V
V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
V
max=0.45V
OL
V
min=2.55V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=3.05V
Vmin=2.7V
I
max=50mA
O
For 1.8V (U)SIM:
V
max=0.6V
IL
V
min=1.2V
IH
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=1.0V
V
IL
V
min=1.95V
IH
V
max=0.45V
OL
V
min=2.55V
OH
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
V
min=2.55V
OH
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
LTE Module Series
1.8V power domain.
If unused, keep it
open.
Either 1.8V or 3.0V is
supported by the
module automatically.
EG91_Hardware_Design 26 / 93
LTE Module Series
EG91 Hardware Design
VOHmin=2.55V
V
min=-0.3V
USIM2_
PRESENCE
83 DI
(U)SIMcard
insertion detection
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
Main UART Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
V
RI 39 DO Ring indicator
DCD 38 DO
Data carrier
detection
CTS 36 DO Clear to send
RTS 37 DI Request to send
Data terminal
DTR 30 DI
ready. Sleep mode
control.
OL
V
OH
V
OL
V
OH
V
OL
V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
max=0.45V
min=1.35V
max=0.45V
min=1.35V
max=0.45V
min=1.35V
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
Pull-up by default.
Low level wakes up
the module.
If unused, keep it
open.
TXD 35 DO Transmit data
V
V
V
RXD 34 DI Receive data
V
V
V
max=0.45V
OL
min=1.35V
OH
min=-0.3V
IL
max=0.6V
IL
min=1.2V
IH
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
Debug UART Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
DBG_TXD 23 DO Transmit data
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
V
EG91_Hardware_Design 27 / 93
LTE Module Series
EG91 Hardware Design
open.
V
min=-0.3V
DBG_RXD 22 DI Receive data
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
PCM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
V
min=-0.3V
PCM_DIN 6 DI PCM data input
PCM_
DOUT
7 DO PCM data output
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
PCM data frame
PCM_SYNC 5 IO
synchronization
signal
PCM_CLK 4 IO PCM clock
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
I2C Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
An external pull-up
I2C_SCL 40 OD
I2C serial clock.
Used for external
codec
resistor is required.
1.8V only.
If unused, keep it
open.
I2C serial data.
I2C_SDA 41 OD
Used for external
codec
EG91_Hardware_Design 28 / 93
An external pull-up
resistor is required.
1.8V only.
If unused, keep it
open.
LTE Module Series
EG91 Hardware Design
ADC Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
ADC0 24 AI
General purpose
analog to digital
converter
Voltage range:
0.3V to VBAT_BB
If unused, keep it
open.
SPI Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
SPI_CLK 26 DO
SPI_MOSI 27 DO
SPI_MISO 28 DI
Clock signal of SPI
interface
Master output slave
input of SPI
interface
Master input slave
output of SPI
interface
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
RF Interfaces
Pin Name Pin No. I/O Description DC Characteristics Comment
50Ω impedance.
If unused, keep it
open.
The pin is defined as
ANT_DIV on
ANT_GNSS
49
(EG91-N
A/-NS/
-V/-EC)
AI GNSS antenna pad
EG91-E.
49
ANT_DIV
(EG91-E
)
56
(EG91-
NA/-NS/
AI
Receive diversity
antenna pad
50Ω impedance.
If unused, keep it
open.
The pin is reserved on
EG91-E.
-V/-EC)
50Ω impedance.
ANT_MAIN 60 IO Main antenna pad
If unused, keep it
open.
Other Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
EG91_Hardware_Design 29 / 93