Quectel Wireless Solutions 201903EG91NS Users Manual

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EG91_H

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Design

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LTE Module Series

EG91 Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China

Tel: +86 21 5108 6236

Email: info@quectel.com

Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm

Or email to: support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT

MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT

ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR

RELIANCE UPON THE INFORMATION. ALLINFORMATION SUPPLIED HEREIN IS SUBJECT TO

CHANGE WITHOUT PRIOR NOTICE.

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF

QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION

AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE

FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF

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REGISTRATION OF A UTILITY MODEL OR DESIGN.

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EG91 Hardware Design

About the Document

History

Revision Date Author Description

Felix YIN/

1.0 2017-03-22

Yeoman CHEN/

Jackie WANG

Initial

LTE Module Series

1.1 2018-01-23

1.2 2018-03-14

Felix YIN/

Rex WANG

Felix YIN/

Rex WANG

1. Added band B28A.

2. Updated the description of UMTS and GSM

features in Table 2.

3. Updated the functional diagram in Figure 1.

4. Updated module operating frequencies in

Table 21.

5. Updated current consumption in Table 26.

6. Updated RF output power in Table 27.

7. Updated the conducted RF receiving

sensitivity in Table 28.

8. Updated the GPRS multi-slot classes in

Table 33.

9. Added thermal consideration in Chapter 5.8

10. Added a GND pad in each of the four corners

of the module’s footprint in Chapter 6.2.

11. Updated storage information in Chapter 7.1.

12. Added packaging information in Chapter 7.3.

1. Added the description of EG91-NA.

2. Updated the functional diagram in Figure 1.

3. Updated pin assignment in Figure 2.

4. Updated GNSS function in Table 1.

5. Updated GNSS Features in Table 2.

6. Updated reference circuit of USB interface

in Figure 21.

7. Added description of GNSS receiver in

Chapter 4.

EG91_Hardware_Design 2 / 93

EG91 Hardware Design

Ward WANG/

1.3 2019-02-03

Nathan LIU/

Rex WANG

LTE Module Series

8. Updated pin definition of RF antenna in

Table 21.

9. Updated module operating frequencies in

Table 22.

10. Added description of GNSS antenna

interface in Chapter 5.2.

11. Updated antenna requirements in Table 25.

12. Updated RF output power in Table 32.

1. Added new variants EG91-NS, EG91-V,

EG91-EC and related contents.

2. Opened pin 24 as ADC0 and added related

contents.

3. Updated functional diagram (Figure 1)

4. Updated pin assignment (Figure 2)

5. Updated GNSS features (Table 2)

6. Added USB_BOOT interface information

(Chapter 3.18)

7. Updated storage information (Chapter 8.1)

8. Updated module operating frequencies

(Table 23)

9. Updatedantenna requirements (Table26)

10. Added current consumption of EG91-NS,

EG91-V and EG91-EC (Table 32, 33 and 34)

11. Added conducted RF receiving sensitivityof

EG91-NS, EG91-V and EG91-EC (Table 39,

40 and 41)

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Contents

About the Document ................................................................................................................................ 2

Contents .................................................................................................................................................... 4

Table Index ............................................................................................................................................... 7

Figure Index .............................................................................................................................................. 9

1 Introduction ..................................................................................................................................... 11

1.1. Safety Information ................................................................................................................. 12

1.2. FCC/ISED Regulatory notices ............................................................................................... 13

2 Product Concept ............................................................................................................................. 16

2.1. General Description .............................................................................................................. 16

2.2. Key Features ......................................................................................................................... 17

2.3. Functional Diagram ............................................................................................................... 19

2.4. Evaluation Board ................................................................................................................... 20

3 Application Interfaces ..................................................................................................................... 21

3.1. General Description .............................................................................................................. 21

3.2. Pin Assignment ..................................................................................................................... 22

3.3. Pin Description ...................................................................................................................... 23

3.4. Operating Modes .................................................................................................................. 30

3.5.

Power Saving ........................................................................................................................ 31

3.5.1. Sleep Mode.................................................................................................................. 31

3.5.1.1. UART Application ............................................................................................... 31

3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 32

3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 32

3.5.1.4. USB Application without USB Suspend Function ............................................... 33

3.5.2. Airplane Mode .............................................................................................................. 34

3.6. Power Supply ........................................................................................................................ 34

3.6.1. Power Supply Pins ....................................................................................................... 34

3.6.2. Decrease Voltage Drop ................................................................................................ 35

3.6.3. Reference Design for Power Supply ............................................................................ 36

3.6.4. Monitor the Power Supply ............................................................................................ 37

3.7. Power-on/off Scenarios ......................................................................................................... 37

3.7.1. Turn on Module Using the PWRKEY ........................................................................... 37

3.7.2. Turn off Module ............................................................................................................ 39

3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 39

3.7.2.2. Turn off Module Using AT Command ................................................................. 39

3.8. Reset the Module .................................................................................................................. 40

3.9. (U)SIM Interfaces .................................................................................................................. 41

3.10. USB Interface ........................................................................................................................ 44

3.11. UART Interfaces ................................................................................................................... 46

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3.12. PCM and I2C Interfaces ........................................................................................................ 48

3.13. SPI Interface ......................................................................................................................... 51

3.14. Network Status Indication ..................................................................................................... 51

3.15. STATUS ................................................................................................................................ 52

3.16. ADC Interface ....................................................................................................................... 53

3.17. Behaviors of RI ..................................................................................................................... 54

3.18. USB_BOOT Interface............................................................................................................ 55

4 GNSS Receiver ................................................................................................................................ 57

4.1. General Description .............................................................................................................. 57

4.2. GNSS Performance .............................................................................................................. 57

4.3. Layout Guidelines ................................................................................................................. 58

5 Antenna Interfaces .......................................................................................................................... 59

5.1. Main/Rx-diversityAntenna Interfaces..................................................................................... 59

5.1.1. Pin Definition ................................................................................................................ 59

5.1.2. Operating Frequency ................................................................................................... 59

5.1.3. Reference Design of RF Antenna Interface ................................................................. 60

5.1.4. Reference Design of RF Layout ................................................................................... 61

5.2. GNSS Antenna Interface ....................................................................................................... 63

5.3. Antenna Installation .............................................................................................................. 64

5.3.1. Antenna Requirement .................................................................................................. 64

5.3.2. Recommended RF Connector for Antenna Installation ................................................ 65

6 Electrical, Reliability and RadioCharacteristics ........................................................................... 67

6.1. Absolute Maximum Ratings .................................................................................................. 67

6.2. Power Supply Ratings ........................................................................................................... 67

6.3. Operation and Storage Temperatures .................................................................................. 68

6.4. Current Consumption ............................................................................................................ 69

6.5. RF Output Power .................................................................................................................. 76

6.6. RF Receiving Sensitivity ....................................................................................................... 77

6.7. Electrostatic Discharge ......................................................................................................... 79

6.8. Thermal Consideration .......................................................................................................... 79

7 Mechanical Dimensions.................................................................................................................. 82

7.1. Mechanical Dimensions of the Module.................................................................................. 82

7.2. Recommended Footprint ....................................................................................................... 84

7.3.

Design Effect Drawings of the Module .................................................................................. 85

8 Storage, Manufacturing and Packaging ........................................................................................ 86

8.1. Storage ................................................................................................................................. 86

8.2. Manufacturing and Soldering ................................................................................................ 87

8.3. Packaging ............................................................................................................................. 88

9 Appendix A References .................................................................................................................. 90

10 Appendix B GPRS Coding Schemes ............................................................................................. 94

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11 Appendix C GPRS Multi-slot Classes ............................................................................................ 95

12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 97

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Table Index

TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ....................................................................... 16

TABLE 2: KEY FEATURES OF EG91 MODULE ............................................................................................... 17

TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 23

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 23

TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 30

TABLE 6: PIN DEFINITION OF VBAT AND GND ............................................................................................. 35

TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 37

TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 40

TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 42

TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 44

TABLE 11: PIN DEFINITION OF MAIN UART INTERFACES ........................................................................... 46

TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 46

TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 47

TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 50

TABLE 15: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 51

TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 52

TABLE 17: WORKING STATE OF NETWORK STATUS INDICATOR .............................................................. 52

TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 53

TABLE 19: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 53

TABLE 20: CHARACTERISTICS OF ADC INTERFACE ................................................................................... 54

TABLE 21: DEFAULT BEHAVIORS OF RI ........................................................................................................ 54

TABLE 22: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 55

TABLE 23: GNSS PERFORMANCE ................................................................................................................. 57

TABLE 24: PIN DEFINITION OF RF ANTENNA ............................................................................................... 59

TABLE 25: MODULE OPERATING FREQUENCIES ........................................................................................ 59

TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 63

TABLE 27: GNSS FREQUENCY ....................................................................................................................... 63

TABLE 28: ANTENNA REQUIREMENTS .......................................................................................................... 64

TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 67

TABLE 30: POWER SUPPLY RATINGS ........................................................................................................... 67

TABLE 31: OPERATION AND STORAGE TEMPERATURES .......................................................................... 68

TABLE 32: EG91-E CURRENT CONSUMPTION ............................................................................................. 69

TABLE 33: EG91-NA CURRENT CONSUMPTION ........................................................................................... 71

TABLE 34: EG91-NS CURRENT CONSUMPTION .......................................................................................... 72

TABLE 35: EG91-V CURRENT CONSUMPTION ............................................................................................. 73

TABLE 36: EG91-EC CURRENT CONSUMPTION .......................................................................................... 74

TABLE 37: GNSS CURRENT CONSUMPTION OF EG91 ............................................................................... 76

TABLE 38: RF OUTPUT POWER ..................................................................................................................... 76

TABLE 39: EG91-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77

TABLE 40: EG91-NA CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 77

TABLE 41: EG91-NS CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 78

TABLE 42: EG91-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 78

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TABLE 43: EG91-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 78

TABLE 44: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 79

TABLE 45: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 87

TABLE 46: RELATED DOCUMENTS ................................................................................................................ 90

TABLE 47: TERMS AND ABBREVIATIONS ...................................................................................................... 90

TABLE 48: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 94

TABLE 49: GPRS MULTI-SLOT CLASSES ...................................................................................................... 95

TABLE 50: EDGE MODULATION AND CODING SCHEMES ........................................................................... 97

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 20

FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 22

FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 31

FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 32

FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 33

FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 34

FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 35

FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 36

FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 36

FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 37

FIGURE 11: TURN ON THE MODULE USING BUTTON ................................................................................. 38

FIGURE 12: POWER-ON SCENARIO .............................................................................................................. 38

FIGURE 13: POWER-OFF SCENARIO ............................................................................................................ 39

FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 40

FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 41

FIGURE 16: RESET SCENARIO ...................................................................................................................... 41

FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 43

FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 43

FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 45

FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 47

FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 48

FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 49

FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 49

FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 50

FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ......................................... 51

FIGURE 26: REFERENCE CIRCUIT OF NETWORK STATUS INDICATOR ................................................... 52

FIGURE 27: REFERENCE CIRCUIT OF STATUS ........................................................................................... 53

FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 55

FIGURE 29: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 56

FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61

FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62

FIGURE 32: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 62

FIGURE 33: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

................................................................................................................................................................... 62

FIGURE 34: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)

................................................................................................................................................................... 62

FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64

FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 65

FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 66

FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 66



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FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 80

FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)

................................................................................................................................................................... 81

FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 82

FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 83

FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 84

FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 85

FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 85

FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 87

FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 88

FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 89

FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................... 89



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1 Introduction

This document defines the EG91module and describes its air interface and hardware interface which are

connected with customers’ applications.

This document can help customers quickly understand module interface specifications, electrical

andmechanical details, as well as other related information of EG91 module. Associated with application

note and user guide, customers can use EG91 module to design and set up mobile applications easily.

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1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service

or repair of any cellular terminal or mobile incorporating EG91module. Manufacturers of the cellular terminal

should send the following safety information to users and operating personnel, and incorporate these

guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’

failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. Please comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation

of wireless appliances in an aircraft is forbidden to prevent interference with

communication systems. If the device offers an Airplane Mode, then it should be

enabled prior to boarding an aircraft. Please consult the airline staff for more

restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in

hospitals,clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network

cannot be guaranteed to connect in all possible conditions (for example, with

unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such

conditions, please remember using emergency call. In order to make or receive a

call, the cellular terminal or mobile must be switched on in a service area with

adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it

receives and transmits radio frequency signals. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as your phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders, etc.

EG91_Hardware_Design 12 / 93

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1.2. FCC/ISED Regulatory notices

Modification statement Quectel has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Quectel n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

RF exposure

This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The

antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna

gain must be below:

Antenna Gain

❒ WCDAM II:≤9.000dBi ❒ WCDAM V:≤6.000dBi

❒ WCDAM VIII:≤10.416dBi

❒ LTE Band2:≤8.500dBi ❒ LTE Band4:≤5.500dBi ❒ LTE Band5:≤9.916dBi ❒ LTE Band12:≤9.234dBi ❒ LTE Band13:≤9.673dBi ❒ L TE Band25:≤8.500dBi

❒ L TE Band25:≤9.837dBi

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

The host end product must include a user manual that clearly defines operating requirements and conditions that must be

observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to above, a separate approval is required to satisfy the SAR requirements of FCC Part

2.1093.

If the device is used for other equipment that separate approval is required for all other operating configurations, including

portable configurations with respect to 2.1093 and different antenna configurations.

Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

Gain de l‘antenne

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❒ WCDAM II:≤9.00dBi ❒ WCDAM V:≤6.00dBi

❒ WCDAM VIII:≤7.15dBi

❒ LTE Band2:≤8.50dBi ❒ LTE Band4:≤5.50dBi ❒ LTE Band5:≤6.64dBi ❒ LTE Band12:≤6.15dBi ❒ LTE Band13:≤6.44dBi ❒ L TE Band25:≤8.50dBi

❒ L TE Band25:≤6.63dBi

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device

The host device shall be properly labelled to identify the modules within the host device. The certification label of the

module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to

display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains",

or similar wording expressing the same meaning, as follows:

Contains FCC ID：XMR201903EG91NS

Contains IC: 10224A-20193EG91NS

The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and

the FCC ID and ISED.

L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et l’ISED du module, précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit :

Contient FCC ID：XMR201903EG91NS

Contient IC: 10224A-20193EG91NS

Le manuel d'utilisation OEM de l'hôte doit également contenir des instructions claires sur la manière dont les utilisateurs

finaux peuvent trouver et / ou accéder au module et à l'ID FCC et l’ISED.

EG91_Hardware_Design 14 / 93

LTE Module Series

EG91 Hardware Design

CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

Installation Guidance

The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional

radiators in order to be properly authorized for operation as a Part 15 digital device.

The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or

modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the

equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the

Internet, the information required by this section may be included in the manual in that alternative form, provided the user

can reasonably be expected to have the capability to access information in that form.

To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with

the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator

under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host

manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be

compliant with the Part 15B unintentional radiator requirements.

EG91_Hardware_Design 15 / 93

LTE Module Series

EG91 Hardware Design

2 Product Concept

2.1. General Description

EG91module is an embedded 4G wireless communication module with receive diversity. It

supportsLTE-FDD/WCDMA/GSM wireless communication, andprovides data connectivity on

LTE-FDD,DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It can also provide

voice functionality

frequency bands of EG91series module.

to meet customers’ specific application demands. The following table shows the

Table 1: Frequency Bands of EG91Series Module

Module

EG91-E

EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 Not supported

EG91-NS

EG91-V FDD: B4/B13 Not supported Not supported

EG91-EC

LTE Bands (with Rx-diversity)

FDD:

B1/B3/B7/B8/B20/B28A

FDD:

B2/B4/B5/B12/B13/B25/

B26

FDD:

B1/B3/B7/B8/B20/B28

WCDMA (with Rx-diversity)

B1/B8 900/1800MHz Not supported

B2/B4/B5 Not supported

B1/B8 900/1800MHz

GSM GNSS2)

GPS, GLONASS,

BeiDou/Compass,G

alileo, QZSS

GPS, GLONASS,

BeiDou/Compass,

Galileo, QZSS

GPS, GLONASS,

BeiDou/Compass,

Galileo, QZSS

GPS, GLONASS,

BeiDou/Compass,

Galileo, QZSS

NOTES

EG91contains Telematicsversion and Data-only version. Telematics version supports voice and

datafunctions, while Data-only version only supports data function.

GNSS function is optional.

EG91_Hardware_Design 16 / 93

LTE Module Series

EG91 Hardware Design

With a compact profile of 29.0mm ×25.0mm ×2.3mm, EG91 can meet almost all requirements for M2M

applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile

computing device, PDA phone, tablet PC, etc.

EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads.

EG91 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have

been developed for customers to use these internet service protocols easily.

2.2. Key Features

The following table describes the detailed features of EG91 module.

Table 2: Key Features of EG91 Module

Feature Details

Power Supply

Supply voltage: 3.3V~4.3V

Typical supply voltage: 3.8V

Class 4 (33dBm±2dB) for EGSM900

Class 1 (30dBm±2dB) for DCS1800

Transmitting Power

Class E2 (27dBm±3dB) for EGSM900 8-PSK

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Class 3 (24dBm+1/-3dB) for WCDMA bands

Class 3 (23dBm±2dB) for LTE-FDD bands

Support up to non-CA Cat 1 FDD

LTE Features

Support 1.4MHz~20MHz RF bandwidth

Support MIMO in DL direction

LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL)

Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA

Support QPSK, 16-QAM and 64-QAM modulation

UMTS Features

DC-HSDPA: Max 42Mbps (DL)

HSUPA: Max 5.76Mbps (UL)

WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)

R99:

CSD: 9.6kbps

GPRS:

GSMFeatures

Support GPRS multi-slot class 33(33 by default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Max 107Kbps (DL), Max 85.6Kbps (UL)

EDGE:

EG91_Hardware_Design 17 / 93

EG91 Hardware Design

Internet Protocol Features

SMS

LTE Module Series

Support EDGE multi-slot class 33(33 by default)

Support GMSK and 8-PSK for different MCS (Modulation and Coding

Scheme)

Downlink coding schemes: CS 1-4 and MCS 1-9

Uplink coding schemes: CS 1-4 and MCS 1-9

Max 296Kbps (DL)/Max 236.8Kbps (UL)

SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/

SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols

Support PAP (Password Authentication Protocol) and CHAP (Challenge

Handshake Authentication Protocol) protocols which are usually used for

PPP connections

Text and PDU modes

Point-to-point MO and MT

SMS cell broadcast

SMS storage: ME by default

(U)SIMInterfaces Support 1.8V and 3.0V (U)SIM cards

Support one digital audio interface: PCM interface

GSM: HR/FR/EFR/AMR/AMR-WB

Audio Features

WCDMA: AMR/AMR-WB

LTE: AMR/AMR-WB

Support echo cancellation and noise suppression

Used for audio function with external codec

Support 16-bit linear data format

PCM Interface

Support long frame synchronization and short frame synchronization

Support master and slave mode, but must be the master in long frame

synchronization

Compliant with USB 2.0 specification (slave only);the data transfer rate can

reach up to 480Mbps

Used for AT command communication, data transmission,GNSS NMEA

USB Interface

sentences output, software debugging, firmware upgrade and voice over

USB*

Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE

5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc.

Main UART:

Used for AT command communication and data transmission

Baud rates reach up to 921600bps, 115200bps by default

UART Interface

Support RTS and CTS hardware flow control

Debug UART:

Used for Linux console and log output

115200bps baud rate

Rx-diversity Support LTE/WCDMA Rx-diversity

GNSS Features Gen8C Lite of Qualcomm

EG91_Hardware_Design 18 / 93

LTE Module Series

EG91 Hardware Design

Protocol: NMEA 0183

AT Commands

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT

commands

Network Indication NETLIGHTpin for network activitystatusindication

Antenna Interfaces

Including main antenna interface (ANT_MAIN), Rx-diversity antenna

(ANT_DIV) interface and GNSS antenna interface(ANT_GNSS)

Size: (29.0±0.15)mm × (25.0±0.15)mm × (2.3±0.2)mm

Physical Characteristics

Package: LGA

Weight: approx. 3.8g

Temperature Range

Operation temperature range: -35°C ~ +75°C

Extended temperature range: -40°C ~ +85°C

Storage temperature range: -40°C ~ +90°C

Firmware Upgrade USB interface orDFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive

NOTES

1. 1)GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC.

2. 2) Within operationtemperature range, the module is 3GPP compliant.

3. 3) Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

might reduce in their value and exceed the specified tolerances. When the temperature

out

returns to normal operationtemperature levels, the module will meet 3GPP specificationsagain.

4. “*” means under development.

2.3. Functional Diagram

The following figure shows a block diagram of EG91 and illustrates the major functional parts.

 Power management

 Baseband

 DDR+NAND flash

 Radio frequency

 Peripheral interfaces

EG91_Hardware_Design 19 / 93

LTE Module Series

EG91 Hardware Design

VBAT_RF

VBAT_BB

PWRKEY

RESET_N

STATUS

PMIC

Control

ANT_MAIN ANT_DIV

PAM

Duplexer

PRx DRx

ANT_GNSS

GPS

SAW

LNA

SAW

Transceiver

IQ C ontrol

Baseband

Switch

SAW

NAND DDR2

SDRAM

19.2M XO

VDD_EXT

(U)SIM1

USB PCM UARTI2C

(U)SIM2

SPI

GPIOs

Figure 1: Functional Diagram

NOTE

GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC.

2.4. Evaluation Board

Quectel provides a complete set of evaluation tools to facilitate the use and testing ofEG91 module. The

evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna

and other peripherals.

EG91_Hardware_Design 20 / 93

LTE Module Series

EG91 Hardware Design

3 Application Interfaces

3.1. General Description

EG91is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be

connected to customers’ cellular application platforms. Sub-interfaces included in these pads are

described in detail in the following chapters:

 Power supply

 (U)SIMinterfaces

 USB interface

 UART interfaces

 PCMand I2C interfaces

 SPI interface

 Statusindication

 USB_BOOT interface

EG91_Hardware_Design 21 / 93

EG91 Hardware Design

3.2. Pin Assignment

The following figure shows the pin assignment of EG91 module.

RESERVED (Pin 49 on EG91-E)

ANT_DIV (EG91-NA/-NS/-V/-EC)

LTE Module Series

GND

PCM _C LK

PCM _SY N C

PCM _D IN

PCM_DOUT

USB_VBUS

USB_DP

USB_DM

PW RKEY

RESET_N

RESERVED

ANT _M AIN

GND

103

GND

82 81

80 79

10 2 10 1

USIM2_PRESENCE

USIM2_CLK

10 0

USIM2_RST

USIM2_DATA

USIM2_VDD

89 90

91 92

104

VB AT_ RF

GND

USB_BOOT

106

ANT_GNSS (EG91-NA/-NS/-V/-EC) ANT _DI V (EG 91-E)

GND

USIM_GND

USIM1_CLK

USIM1_DATA

USIM1_RST

USIM1_VDD

USIM1_PRESENCE

I2C_SDA

I2C_SCL

DCD

RTS

CTS

TXD

RXD

VB AT_ BB

105

DBG_RXD

PCM

ADC 0

DBG_TXD

RESERVED

SP I

PO WER USB UART

AP _R EAD Y

(U)SIM

ST ATU S

NETLIGHT

Figure 2:Pin Assignment (Top View)

EG91_Hardware_Design 22 / 93

DTR

GND

SP I_C LK

SP I_ MOSI

VDD _EX T

SP I_ MIS O

ANT

GND

RESERVED

OTHE RS

LTE Module Series

EG91 Hardware Design

NOTES

1. 1)PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.

2. Keep all RESERVEDpins and unused pins unconnected.

3. GND pads should be connected to ground in the design.

4. Definition of pin 49 and 56 are different amongEG91-E/-NS/-V/-EC and EG91-NA.For more details,

please refer to Table 4.

3.3. Pin Description

The following tables show the pin definition and description of EG91.

Table 3: IO Parameters Definition

Type Description

AI Analog input

AO Analog output

DI Digital input

DO Digital output

IO Bidirectional

OD Open drain

PI Power input

PO Power output

Table 4: Pin Description

Power Supply

Pin Name Pin No. I/O Description

Power supply for

VBAT_BB 32, 33 PI

module’s baseband

part

EG91_Hardware_Design 23 / 93

DC Characteristics

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

Comment

It must be able to

provide sufficient

current up to 0.8A.

LTE Module Series

EG91 Hardware Design

It must be able to

provide sufficient

current up to 1.8A in a

burst transmission.

VBAT_RF 52, 53 PI

Power supply for

module’s RF part

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

Power supply for

VDD_EXT 29 PO

Provide 1.8V for

external circuit

Vnorm=1.8V

max=50mA

external GPIO’s pull up

circuits.

If unused, keep it open.

3, 31, 48,

50, 54, 55,

58, 59, 61,

GND

62, 67~74,

Ground

79~82,

89~91,

100~106

Turn-on/off

Pin Name Pin No. I/O Description DC Characteristics Comment

The output voltage is

0.8V because of the

diode drop in the

Qualcomm chipset.

PWRKEY 15 DI

Turn on/off the

module

max=2.1V

min=1.3V

max=0.5V

Pull-up to 1.8V

RESET_N 17 DI

Reset signal of the

module

max=2.1V

min=1.3V

max=0.5V

internally.

Activelow.

If unused,keep it

open.

Status Indication

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

STATUS 20 DO

NETLIGHT 21 DO

Indicate the

module’s operating

status

Indicate the

module’s network

activity status

min=1.35V

max=0.45V

min=1.35V

max=0.45V

USB Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

USB_VBUS 8 PI

USB connection

detection

Vmax=5.25V

Vmin=3.0V

Vnorm=5.0V

Typical:5.0V

If unused,keep it

open.

EG91_Hardware_Design 24 / 93

LTE Module Series

EG91 Hardware Design

USB_DP 9 IO

USB_DM 10 IO

USB differential

data bus (+)

USB differential

data bus (-)

Compliant with USB

2.0 standard

specification.

Compliant with USB

2.0 standard

specification.

Require differential

impedance of 90Ω.

Require differential

impedance of 90Ω.

(U)SIM Interfaces

Pin Name Pin No. I/O Description DC Characteristics Comment

Connect to ground of

(U)SIM card

connector.

USIM_GND 47

Specified ground

for (U)SIM card

For 1.8V (U)SIM:

Vmax=1.9V

Vmin=1.7V

USIM1_VDD 43 PO

Power supply for

(U)SIMcard

For 3.0V (U)SIM:

Vmax=3.05V

Either 1.8V or 3.0V is

supported by the

module automatically.

Vmin=2.7V

max=50mA

For 1.8V (U)SIM:

max=0.6V

min=1.2V

max=0.45V

min=1.35V

For 3.0V (U)SIM:

max=1.0V

min=1.95V

max=0.45V

min=2.55V

USIM1_DATA 45 IO

Data signal of

(U)SIMcard

For 1.8V (U)SIM:

max=0.45V

min=1.35V

For 3.0V (U)SIM:

max=0.45V

min=2.55V

USIM1_CLK 46 DO

Clock signal of

(U)SIMcard

EG91_Hardware_Design 25 / 93

EG91 Hardware Design

USIM1_RST 44 DO

USIM1_

PRESENCE

42 DI

USIM2_VDD 87 PO

USIM2_DATA 86 IO

USIM2_CLK 84 DO

USIM2_RST 85 DO

Reset signal of

(U)SIMcard

insertion detection

Power supply for

(U)SIMcard

Data signal of

(U)SIMcard

Clock signal of

(U)SIMcard

Reset signal of

(U)SIMcard

For 1.8V (U)SIM:

max=0.45V

min=1.35V

For 3.0V (U)SIM:

max=0.45V

min=2.55V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

For 1.8V (U)SIM:

Vmax=1.9V

Vmin=1.7V

For 3.0V (U)SIM:

Vmax=3.05V

Vmin=2.7V

max=50mA

For 1.8V (U)SIM:

max=0.6V

min=1.2V

max=0.45V

min=1.35V

For 3.0V (U)SIM:

max=1.0V

min=1.95V

max=0.45V

min=2.55V

For 1.8V (U)SIM:

max=0.45V

min=1.35V

For 3.0V (U)SIM:

max=0.45V

min=2.55V

For 1.8V (U)SIM:

max=0.45V

min=1.35V

For 3.0V (U)SIM:

max=0.45V

LTE Module Series

1.8V power domain.

If unused, keep it

open.

Either 1.8V or 3.0V is

supported by the

module automatically.

EG91_Hardware_Design 26 / 93

LTE Module Series

EG91 Hardware Design

VOHmin=2.55V

min=-0.3V

USIM2_

PRESENCE

83 DI

(U)SIMcard

insertion detection

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

Main UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

RI 39 DO Ring indicator

DCD 38 DO

Data carrier

detection

CTS 36 DO Clear to send

RTS 37 DI Request to send

Data terminal

DTR 30 DI

ready. Sleep mode

control.

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Pull-up by default.

Low level wakes up

the module.

If unused, keep it

open.

TXD 35 DO Transmit data

RXD 34 DI Receive data

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

Debug UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

DBG_TXD 23 DO Transmit data

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

EG91_Hardware_Design 27 / 93

LTE Module Series

EG91 Hardware Design

open.

min=-0.3V

DBG_RXD 22 DI Receive data

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

PCM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

min=-0.3V

PCM_DIN 6 DI PCM data input

PCM_

DOUT

7 DO PCM data output

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

In master mode, it is

an output signal. In

slave mode, it is an

input signal.

If unused, keep it

open.

1.8V power domain.

In master mode, it is

an output signal. In

slave mode, it is an

input signal.

If unused, keep it

open.

PCM data frame

PCM_SYNC 5 IO

synchronization

signal

PCM_CLK 4 IO PCM clock

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

I2C Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

An external pull-up

I2C_SCL 40 OD

I2C serial clock.

Used for external

codec

resistor is required.

1.8V only.

If unused, keep it

open.

I2C serial data.

I2C_SDA 41 OD

Used for external

codec

EG91_Hardware_Design 28 / 93

An external pull-up

resistor is required.

1.8V only.

If unused, keep it

open.

LTE Module Series

EG91 Hardware Design

ADC Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

ADC0 24 AI

General purpose

analog to digital

converter

Voltage range:

0.3V to VBAT_BB

If unused, keep it

open.

SPI Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

SPI_CLK 26 DO

SPI_MOSI 27 DO

SPI_MISO 28 DI

Clock signal of SPI

interface

Master output slave

input of SPI

interface

Master input slave

output of SPI

interface

max=0.45V

min=1.35V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

RF Interfaces

Pin Name Pin No. I/O Description DC Characteristics Comment

50Ω impedance.

If unused, keep it

open.

The pin is defined as

ANT_DIV on

ANT_GNSS

(EG91-N

A/-NS/

-V/-EC)

AI GNSS antenna pad

EG91-E.

ANT_DIV

(EG91-E

)

(EG91-

NA/-NS/

Receive diversity

antenna pad

50Ω impedance.

If unused, keep it

open.

The pin is reserved on

EG91-E.

-V/-EC)

50Ω impedance.

ANT_MAIN 60 IO Main antenna pad

If unused, keep it

open.

Other Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

EG91_Hardware_Design 29 / 93

LTE Module Series

EG91 Hardware Design

min=-0.3V

AP_READY 19 DI

USB_BOOT 75 DI

Application

processor sleep

state detection

Force the module to

enter into

emergency

download mode

VILmax=0.6V

min=1.2V

max=2.0V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

It is recommended to

reserve the test

points.

RESERVED Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

1,2, 11~14,

16, 51,

57, 63~66,

76~78,

Keep these pins

unconnected.

88, 92~99

Keep these pins

RESERVED 18, 25, 49 Reserved

unconnected.

Pin 49 is only

reserved on EG91-E.

NOTE

Keep all RESERVED pins and unused pins unconnected.

3.4. Operating Modes

The table below briefly summarizes the various operating modes referred in the following chapters.

Table 5: Overview of Operating Modes

Mode Details

Software is active. The module hasregistered on network, and it is ready

to send and receive data.

Network connection is ongoing. In this mode, the power consumption is

decided by network settingand data transfer rate.

Normal

Operation

Minimum

Functionality

Idle

Talk/Data

AT+CFUN command can set the module to a minimum functionality mode without

removing the power supply. In this case, both RF function and (U)SIM card will be invalid.

EG91_Hardware_Design 30 / 93

Mode

LTE Module Series

EG91 Hardware Design

Airplane

Mode

AT+CFUN command or W_DISABLE# pin can set the module to enter intoairplane

mode. In this case, RF function will be invalid.

In this mode, the current consumption of the module will be reduced to the minimal level.

Sleep Mode

Power Down

Mode

During this mode, the module can still receive paging message, SMS, voice call and

TCP/UDP data from the network normally.

In this mode, the power management unit shuts down the power supply. Software is not

active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF

and VBAT_BB) remains applied.

3.5. Power Saving

3.5.1. Sleep Mode

EG91 is able to reduce its current consumption to a minimum value during the sleep mode. The following

sub-chaptersdescribe the power saving procedures of EG91 module.

3.5.1.1. UART Application

If the host communicates with the module via UART interface, the following preconditions can let the

module enter into sleep mode.

 Execute AT+QSCLK=1commandto enable sleep mode.

 Drive DTR to high level.

The following figure shows the connection between the module and the host.

Figure 3: Sleep Mode Application via UART

Driving the host DTR to low level will wake up the module.

EG91_Hardware_Design 31 / 93

LTE Module Series

EG91 Hardware Design

 When EG91 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17for

details about RI behavior.

 AP_READY will detect the sleep state of host (can be configured to high level or low level detection).

Please refer to AT+QCFG="apready"*commandfor details.

NOTE

“*” means under development.

3.5.1.2. USB Application with USB Remote Wakeup Function

If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions

must be met to let the module enter into sleep mode.

 Execute AT+QSCLK=1commandto enable sleep mode.

 Ensure the DTR is held at high level or keep it open.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspend state.

The following figure shows the connection between the module and the host.

Figure 4: Sleep Mode Application with USB Remote Wakeup

 Sending data to EG91through USB will wake up the module.

 When EG91has a URC to report, the module will send remote wakeup signals via USB busso as to

wake up the host.

3.5.1.3. USB Application with USB Suspend/Resume and RI Function

If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is

needed to wake up the host.

There are threepreconditions to let the module enter into the sleep mode.

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 Execute AT+QSCLK=1commandto enable sleep mode.

 Ensure the DTR is held at high level or keep it open.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended

state.

The following figure shows the connection between the module and the host.

Figure 5: Sleep Mode Application with RI

 Sending data to EG91through USB will wake up the module.

 When EG91has a URC to report, RI signal will wake up the host.

3.5.1.4. USB Application without USB Suspend Function

If the host does not support USB suspend function, USB_VBUS should be disconnected with an

externalcontrol circuit to let the module enter into sleep mode.

 Execute AT+QSCLK=1commandto enable sleep mode.

 Ensure the DTR is held at high level or keep it open.

 Disconnect USB_VBUS.

The following figure shows the connection between the module and the host.

Module Host

GPIO

USB_VBUS

USB_DP

USB_DM

AP_READY

GND

Power

Switch

RI EINT

VDD

USB_DP

USB_DM

GPIO

GND

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Figure 6: Sleep Mode Application without Suspend Function

Switching onthe power switch tosupply power to USB_VBUS will wake up the module.

NOTE

Please pay attention to the level match shown in dotted line between the module and the host.Please

refer to document [1] for more details about EG91 power management application.

3.5.2. Airplane Mode

When the module enters into airplane mode, the RF function does not work, and all AT commands

correlative with RF function will be inaccessible. This mode can be set viathe following ways.

Hardware:

The W_DISABLE# pin is pulled up by default.Driving it to low level will let the module enter into airplane

mode.

Software: AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4.

 AT+CFUN=0: Minimum functionality mode.Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled.

NOTES

1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by

AT+QCFG="airplanecontrol" command and this command is under development.

2. The execution of AT+CFUN command will not affect GNSS function.

3.6. Power Supply

3.6.1. Power Supply Pins

EG91 provides four VBAT pins dedicated to connectwithanexternal power supply. There are two separate

voltage domains for VBAT.

 Two VBAT_RF pins for module’sRF part.

 Two VBAT_BB pins for module’s baseband part.

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The following table shows the details of VBAT pins and ground pins.

Table 6: Pin Definition of VBAT and GND

Pin Name Pin No. Description Min. Typ. Max. Unit

VBAT_RF 52,53

VBAT_BB 32,33

Power supply for module’s

RF part.

Power supply for module’s

baseband part.

3.3 3.8 4.3 V

3, 31, 48,50,

54, 55,58, 59,

GND

61,62, 67~74,

Ground - 0 - V

79~82,89~91,

100~106

3.6.2. Decrease Voltage Drop

The power supply range of the module is from 3.3Vto4.3V. Please make sure thatthe input voltage will

never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G

network.The voltage drop will be less in 3G and 4G networks.

Figure 7: Power Supply Limits during Burst Transmission

To decrease voltage drop, a bypass capacitor of about 100µF with low ESR(ESR=0.7Ω) should be used,

and amulti-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It

is recommended to usethree ceramic capacitors (100nF, 33pF, 10pF)for composing the MLCC array, and

place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external

application has to be a single voltage source and can be expanded to two sub paths with star structure.

The width of VBAT_BB trace should be no less than 1mm, andthe width of VBAT_RF trace should be no

less than 2mm.In principle, the longerthe VBAT trace is, the wider it will be.

In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS

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diode with low reverse stand-off voltage V

current I

should be used. The following figure shows the star structure of the power supply.

VB AT

WS4.5D3HV

100uF

100nF

33pF

10pF

, low clamping voltage VC and high reverse peak pulse

RWM

100uF

Figure 8: Star Structure of the Power Supply

3.6.3. Reference Design for Power Supply

VB AT_R F

VB AT_BB

100nFC733pFC810pF

Module

Power design for the module is very important, asthe performance of the module largely depends on the

power source. The power supply should be able to provide sufficient current up to 2A at least. If the

voltage drop between the input and output is not too high, it is suggested that an LDO should be usedto

supply power for the module. If there is a big voltage difference between the input source and the desired

output (VBAT), a buck converter is preferred to be used as the power supply.

The following figure shows a reference design for +5V input power source. The typicaloutput ofthe power

supply is about 3.8V and the maximum load current is 3A.

Figure 9: Reference Circuit of Power Supply

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3.6.4. Monitor the Power Supply

AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to

document [2].

3.7. Power-on/off Scenarios

3.7.1. Turn on Module Using the PWRKEY

The following table shows the pin definitionof PWRKEY.

Table 7: Pin Definition of PWRKEY

Pin Name Pin No. Description DC Characteristics Comment

max=2.1V

PWRKEY 15 Turn on/off the module

min=1.3V

max=0.5V

The output voltage is 0.8V

because of the diode drop in

the Qualcomm chipset.

When EG91 is in powerdown mode, it can be turned on to normal mode by driving the PWRKEY pin to a

low level for at least 500ms. It is recommended to use an open drain/collector driver to control the

PWRKEY.After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference

circuit is illustrated in the following figure.

Figure 10: Turn on the Module Using Driving Circuit

Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike

may generate from the finger. Therefore, aTVS component is indispensable to be placed nearby the

button for ESD protection. A reference circuit is shownin the following figure.

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Figure 11: Turn on the Module Using Button

The power-on scenario is illustrated in the following figure.

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VBAT

PWRKEY

VDD_EXT

BOOT_CONFIG &

USB_BOOT Pins

RESET_N

STATUS

(DO)

NOTE

≥500ms

VIL≤0.5V

About 100ms

≥100ms, afte r this time, the BOOT_CONFIG & USB_BOOT pin s can be set high level by external circuit.

≥2.5s

Inactive

≥12s

=0.8V

ActiveUART

Inactive ActiveUSB

Figure 12: Power-on Scenario

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≥13s

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NOTES

1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is

no less than 30ms.

2. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to

be powered on automatically and shutdown is not needed.

3.7.2. Turn off Module

Either of the following methodscan be used to turn off the module:

 Normal power-offprocedure: Turn off the module using the PWRKEY pin.

 Normal power-off procedure: Turn off the module using AT+QPOWDcommand.

3.7.2.1. Turn off Module Using the PWRKEY Pin

Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off

procedure after the PWRKEY is released. The power-off scenario is illustrated inthe following figure.

Figure 13: Power-off Scenario

3.7.2.2. Turn off Module Using AT Command

It is also a safe way to use AT+QPOWDcommandto turn off the module, which is similar to turning off the

module via PWRKEY pin.

Please refer todocument [2] for details about the AT+QPOWDcommand.

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NOTES

1. In order to avoid damaging internal flash, please do not switch off the power supply when the module

works normally. Only after the module is shut down by PWRKEY or AT command, the power supply

can be cut off.

2. When turning off module with AT command, please keep PWRKEY at high level after the execution of

power-off command. Otherwise the module will be turned on again after successful turn-off.

3.8. Reset the Module

The RESET_N pin can be used to reset the module.The module can be reset by driving RESET_N to a

low level voltage for 150ms~460ms.

Table 8: Pin Definition of RESET_N

Pin Name Pin No. Description DC Characteristics Comment

max=2.1V

RESET_N 17 Reset the module

min=1.3V

max=0.5V

The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button

can be used to control the RESET_N.

Figure 14: Reference Circuit of RESET_N by Using Driving Circuit

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Figure 15: Reference Circuit of RESET_N by Using Button

The reset scenario is illustrated inthe following figure.

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Figure 16: Reset Scenario

NOTES

1. Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed.

2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.

3.9. (U)SIM Interfaces

EG91provides two (U)SIMinterfaces, and only one (U)SIMcard can work at a time. The (U)SIM1 and

(U)SIM2cards can be switched by AT+QDSIM* command. For more details, please refer to document [2].

The(U)SIM interfacescircuitrymeet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIMcards

are supported.

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Table 9: Pin Definition of (U)SIM Interfaces

Pin Name Pin No. I/O Description Comment

Either 1.8V or 3.0V is

USIM1_VDD 43 PO Power supply for (U)SIM1 card

supported by the module

automatically.

USIM1_DATA 45 IO Data signal of (U)SIM1 card

USIM1_CLK 46 DO Clock signal of (U)SIM1card

USIM1_RST 44 DO Reset signal of (U)SIM1 card

USIM1_

PRESENCE

42 DI (U)SIM1 card insertion detection

USIM_GND 47 Specified ground for (U)SIMcard

Either 1.8V or 3.0V is

USIM2_VDD 87 PO Power supply for (U)SIM2 card

supported by the module

automatically.

USIM2_DATA 86 IO Data signal of (U)SIM2 card

USIM2_CLK 84 DO Clock signal of (U)SIM2 card

USIM2_RST 85 DO Reset signal of (U)SIM2 card

USIM2_

PRESENCE

83 DI (U)SIM2 card insertion detection

EG91 supports (U)SIMcard hot-plug via USIM_PRESENCE(USIM1_PRESENCE/USIM2_PRESENCE)

pin. The functionsupports low level and high level detection, andis disabled by default. Pleaserefer to

document [2] about AT+QSIMDETcommand for details.

The following figure shows a reference design for (U)SIM interface with an8-pin (U)SIMcard connector.

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Figure 17: Reference Circuitof (U)SIMInterface with an 8-Pin (U)SIMCard Connector

If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected.

Areference circuit of (U)SIM interface with a 6-pin (U)SIMcard connector is illustrated inthe following

figure.

Figure 18: Reference Circuitof (U)SIM Interface with a 6-Pin (U)SIM Card Connector

In order to enhance the reliability and availability of the (U)SIM cardin customers’ applications, please

follow the criteria below in the (U)SIMcircuit design:

 Keep placementof (U)SIMcard connector to the module as close as possible. Keep the trace length

as less than 200mm as possible.

 Keep (U)SIMcard signals away from RF and VBAT traces.

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 Assure the ground trace between the module and the (U)SIMcard connector short and wide. Keep

the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.

Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as

close to (U)SIM card connector as possible.If the ground is complete on customers’ PCB,

USIM_GND can be connected to PCB ground directly.

 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away fromeach other and

shield them with surrounded ground.

 In order to offer good ESD protection, it is recommended to add a TVSdiode array whose parasitic

capacitance should not be more than15pF. The 0Ωresistors should be added in series between the

module and the (U)SIMcard to facilitate debugging. The 33pFcapacitors are used for filtering

interference of EGSM900.Please note that the (U)SIMperipheral circuit should be close to the

(U)SIMcard connector.

 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace

and sensitive occasion areapplied, and should be placed close to the (U)SIMcard connector.



NOTE

“*” means under development.

3.10. USB Interface

EG91 contains one integrated Universal Serial Bus (USB) interfacewhich complies with the USB 2.0

specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is

used for AT command communication, data transmission, GNSS NMEA sentences output,software

debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB

interface.

Table 10: Pin Definition of USB Interface

Pin Name Pin No. I/O Description Comment

USB_DP 9 IO USB differential data bus (+)

USB_DM 10 IO USB differential data bus (-)

Require differential

impedance of 90Ω.

Require differential

impedance of 90Ω.

USB_VBUS 8 PI USB connection detection Typical:5.0V

GND 3 Ground

For more details about USB 2.0 specifications, please visit http://www.usb.org/home

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The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The

following figure shows areference circuit of USB interface.

Figure 19: Reference Circuit of USB Interface

A common mode choke L1 is recommended to be added in series between the module and

customer’sMCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4)

should beadded in series between the module and the test points so as to facilitate debugging, and the

resistors are

not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4

componentsmust be placed close to the module, and also these resistors should be placed close to each

other. Theextra stubs of trace must be as short as possible.

The following principles should be complied with when design the USB interface, so as to meet USB 2.0

specification.

 It is important to route the USB signal traces as differential pairs with total grounding. The impedance

of USB differential trace is 90Ω.

 Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is

important to route the USB differential traces in inner-layer with ground shielding onnot only upper

and lower layers but also right and left sides.

 Pay attention to the influence of junction capacitance of ESD protection components on USB data

lines. Typically, the capacitance value should be less than 2pF.

 Keep the ESD protection components to the USB connector as close as possible.

NOTES

1. EG91 module can only be used as a slave device.

2. “*” means under development.

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3.11. UART Interfaces

The module provides two UART interfaces: the main UART interface and thedebug UART interface. The

following shows their features.

 The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps,

230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It

supports RTS and CTS hardware flow control, and is used for AT command communication only.

 The debug UART interface supports 115200bpsbaud rate. It is used forLinux console and log output.

The following tables show the pin definition of the two UART interfaces.

Table 11: Pin Definition of Main UART Interfaces

Pin Name Pin No. I/O Description Comment

RI 39 DO Ring indicator

DCD 38 DO Data carrier detection

CTS 36 DO Clear to send

RTS 37 DI Request to send

1.8V power domain

DTR 30 DI Sleep mode control

TXD 35 DO Transmit data

RXD 34 DI Receive data

Table 12: Pin Definition of Debug UART Interface

Pin Name Pin No. I/O Description Comment

DBG_TXD 23 DO Transmit data 1.8V power domain

DBG_RXD 22 DI Receive data 1.8V power domain

The logic levels are described in the following table.

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Table 13:Logic Levels of Digital I/O

Parameter Min. Max. Unit

VIL -0.3 0.6 V

VIH 1.2 2.0 V

VOL 0 0.45 V

VOH 1.35 1.8 V

The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is

equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is

recommended. The following figure shows areference design.

Figure 20: Reference Circuit with Translator Chip

Please visit http://www.ti.com

formore information.

Another example with transistor translation circuit is shown as below. Thecircuitdesign of dotted line

section can refer to the circuitdesign of solid linesection, in terms of both module input and output circuit

design. Please pay attention to the direction of connection.

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Figure 21: Reference Circuit with Transistor Circuit

NOTE

Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.

3.12. PCM and I2C Interfaces

EG91 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the

following modes and one I2C interface:

 Primary mode (short frame synchronization, works as both master and slave)

 Auxiliary mode (long frame synchronization, works as master only)

In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports

256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz

PCM_CLK at 16KHz PCM_SYNC.

In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the

rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates

with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC.

EG91 supports 16-bit linear data format. The following figures show theprimary mode’s timing relationship

with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well asthe auxiliary mode’s timing relationship with

8KHz PCM_SYNC and 256KHz PCM_CLK.

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125us

PCM_CLK

PCM_SYNC

PCM_DOUT

PCM_DIN

12 256255

MSB

LSB

LSBMSB

MSB

Figure 22: Primary Mode Timing

Figure 23: Auxiliary Mode Timing

The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio

codec design.

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Table 14: Pin Definition of PCM and I2C Interfaces

Pin Name Pin No. I/O Description Comment

PCM_DIN 6 DI PCM data input 1.8V power domain

PCM_DOUT 7 DO PCM data output 1.8V power domain

PCM_SYNC 5 IO

PCM data frame

synchronization signal

1.8V power domain

PCM_CLK 4 IO PCM data bit clock 1.8V power domain

I2C_SCL 40 OD I2C serial clock Require an external pull-up to 1.8V

I2C_SDA 41 OD I2C serial data Require an external pull-up to 1.8V

Clock and mode can be configured by AT command, and the default configuration is master mode using

short frame synchronizationformat with 2048KHzPCM_CLK and 8KHz PCM_SYNC.Please refer to

document [2] aboutAT+QDAIcommand for details.

The following figure shows areference design of PCM interface with external codec IC.

Figure 24: Reference Circuit of PCM Application with Audio Codec

NOTES

1. It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for

PCM_CLK.

2. EG91 works as a master device pertaining to I2C interface.

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3.13. SPI Interface

SPI interface of EG91acts asthe master only. It provides a duplex, synchronous and serial communication

link with the peripheral devices. It isdedicated to one-to-one connection, withoutchip select.Its operation

voltage is 1.8V with clock rates up to 50MHz.

The following table shows the pin definition of SPI interface.

Table 15: Pin Definition of SPI Interface

Pin Name Pin No. I/O Description Comment

SPI_CLK 26 DO Clock signal of SPI interface 1.8V power domain

SPI_MOSI 27 DO

SPI_MISO 28 DI

The following figure shows areference design of SPI interface with peripherals.

Figure 25: Reference Circuit of SPI Interface with Peripherals

NOTE

Master output slave input of SPI

interface

Master input slave output of SPI

interface

1.8V power domain

The module provides 1.8V SPI interface. A level translator should be used between the module and the

host if customer’s applicationis equipped with a 3.3V processoror device interface.

3.14. Network Status Indication

The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status

indication LED.

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The following tables describe the pin definition and logic level changes of NETLIGHT in different network

status.

Table 16: Pin Definition of Network StatusIndicator

Pin Name Pin No. I/O Description Comment

NETLIGHT 21 DO Indicate the module’snetwork activity status 1.8V power domain

Table 17: Working State of Network Status Indicator

Pin Name Logic Level Changes Network Status

Flicker slowly (200ms High/1800ms Low) Network searching

Flicker slowly (1800ms High/200ms Low) Idle

NETLIGHT

Flicker quickly (125ms High/125ms Low) Data transfer is ongoing

Always High Voice calling

A reference circuit is shown in the following figure.

Figure 26: Reference Circuit of Network Status Indicator

3.15. STATUS

The STATUS pin is set as the module’s operation status indicator. It will output high level when the

module is powered on. The following table describes the pin definition of STATUS.

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Table 18: Pin Definition of STATUS

Pin Name Pin No. I/O Description Comment

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STATUS 20 DO Indicate the module’soperatingstatus

The following figure showsthe reference circuit of STATUS.

Figure 27: Reference Circuit of STATUS

1.8V power domain.

If unused, keep it open.

3.16. ADC Interface

The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 command can

beused to read the voltage value on ADC0 pin. For more details about the command, please refer to

document [2].

In order to improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by

ground.

Table 19: Pin Definition of ADC Interface

Pin Name Pin No. I/O Description Comment

ADC0 24 AI

Force the module to enter into

emergency download mode

The following table describes the characteristics of ADC interface.

If unused, keep this pin

open.

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Table 20: Characteristics of ADC Interface

Parameter Min. Typ. Max. Unit

ADC0 Voltage Range 0.3 VBAT_BB V

ADC Resolution 15 bits

NOTES

1. It is prohibited to supply any voltage to ADC pins when VBAT is removed.

2. It is recommended to use resistor divider circuit for ADC application.

3.17. Behaviors of RI

AT+QCFG="risignaltype","physical"command can be used to configure RI behavior.The default RI

behaviors can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for

details.

No matter on which port URC is presented, URC will trigger the behavior ofRI pin.

NOTE

URC can be outputted from UART port, USB AT port and USB modem port through configuration via

AT+QURCCFG command. The default port is USB AT port.

The default behaviors of the RI are shown as below.

Table 21: Default Behaviors of RI

State Response

Idle RI keeps athigh level

URC RI outputs 120ms low pulse when a new URC returns

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3.18. USB_BOOT Interface

EG91provides a USB_BOOT pin. Customerscan pull up USB_BOOT to VDD_EXT before powering on

the module, thus the module will enter into emergency download mode when powered on. In this mode,

the module supports firmware upgrade over USB interface.

Table 22: Pin Definition of USB_BOOT Interface

Pin Name Pin No. I/O Description Comment

1.8V power domain.

USB_BOOT 75 DI

Force the module to enter into

emergency download mode

The following figures showthereference circuit of USB_BOOT interface and timing sequence of entering

into emergency download mode.

Active high.

It is recommended to

reserve test point.

Module

VDD_EXT

Test point

USB_BOOT

Close to test poin t

TVS

Figure 28: Reference Circuit of USB_BOOT Interface

4.7K

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NOTE

VBAT

PWRKEY

VDD_EXT

USB_BOOT

RESET_N

500ms

≥

VH=0.8V

0. 5V

≤

About 100ms

Setting USB_BOOT to high level between VBAT rising on and VDD_EXT rising on can let the module enter into emergency download mode.

Figure 29: Timing Sequence for Entering into Emergency Download Mode

NOTES

1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is

no less than 30ms.

2. When using MCU to control module to enter into the emergency download mode, follow the above

timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up the VBAT.

Short the test points as shown in Figure 28 can manually force the module to enter into download

mode.

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4 GNSS Receiver

4.1. General Description

EG91 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of

Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS).

EG91 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via

USB interface by default.

By default, EG91 GNSS engine is switched off. It has to be switched on via AT command. For more

details about GNSS engine technology and configurations, please refer to document [3].

4.2. GNSS Performance

The following table shows GNSS performance of EG91.

Table 23: GNSS Performance

Parameter Description Conditions Typ. Unit

Cold start Autonomous -146 dBm

Sensitivity

(GNSS)

TTFF

(GNSS)

Reacquisition Autonomous -157 dBm

Tracking Autonomous -157 dBm

Cold start

@open sky

Warm start

@open sky

Autonomous 34.6 s

XTRA enabled 11.57 s

Autonomous 26.09 s

XTRA enabled 3.7 s

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Autonomous 1.8 s

XTRA enabled 3.4 s

Autonomous

@open sky

<2.5 m

Accuracy

(GNSS)

Hot start

@open sky

CEP-50

NOTES

1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep

on positioning for 3 minutes.

2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can

fix position again within 3 minutes after loss of lock.

3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes

position within 3 minutes after executing cold start command.

4.3. Layout Guidelines

The following layout guidelines should be taken into account in customers’ design.

 Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.

 Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be

kept away from the antennas.

 Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar

isolation and protection.

 Keep the characteristic impedance for ANT_GNSS trace as 50Ω.

Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information.

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5 Antenna Interfaces

EG91 antenna interfaces include a main antenna interface and anRx-diversity antennainterface which is

used toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS

antenna interface which is only supported on EG91-NA/-NS/-V/-EC. The impedance of the antenna port

is50Ω.

5.1. Main/Rx-diversityAntenna Interfaces

5.1.1. Pin Definition

The pin definitionof main antenna and Rx-diversityantenna interfaces is shown below.

Table 24: Pin Definition of RF Antenna

Pin Name Pin No. I/O Description Comment

ANT_MAIN 60 IO Main antenna pad 50Ω impedance

ANT_DIV

(EG91-E)

ANT_DIV

(EG91-NA/-NS/-V/-EC)

49 AI Receive diversity antenna pad 50Ω impedance

56 AI Receive diversity antenna pad 50Ω impedance

5.1.2. Operating Frequency

Table 25: Module Operating Frequencies

3GPP Band Transmit Receive Unit

EGSM900 880~915 925~960 MHz

DCS1800 1710~1785 1805~1880 MHz

WCDMA B1 1920~1980 2110~2170 MHz

WCDMA B2 1850~1910 1930~1990 MHz

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WCDMA B4 1710~1755 2110~2155 MHz

WCDMA B5 824~849 869~894 MHz

WCDMA B8 880~915 925~960 MHz

LTE-FDD B1 1920~1980 2110~2170 MHz

LTE FDD B2 1850~1910 1930~1990 MHz

LTE-FDD B3 1710~1785 1805~1880 MHz

LTE FDD B4 1710~1755 2110~2155 MHz

LTE FDD B5 824~849 869~894 MHz

LTE-FDD B7 2500~2570 2620~2690 MHz

LTE-FDD B8 880~915 925~960 MHz

LTE FDD B12 699~716 729~746 MHz

LTE FDD B13 777~787 746~756 MHz

LTE-FDD B20 832~862 791~821 MHz

LTE-FDD B25 1850~1915 1930~1995 MHz

LTE-FDD B26 814~849 859~894 MHz

LTE-FDD B28 703~748 758~803 MHz

5.1.3. Reference Design of RF Antenna Interface

Areference design of ANT_MAIN and ANT_DIVantenna pads is shown as below. Aπ-type matching circuit

should be reserved for better RF performance. The capacitors are not mounted by default.

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Figure 30: Reference Circuit of RF Antenna Interface

NOTES

1. Keep a proper distance between the main antenna and theRx-diversityantenna to improve the

receiving sensitivity.

2. ANT_DIV function is enabledby default.AT+QCFG="diversity",0command can be used to disable

receive diversity.

3. Place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible.

5.1.4. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

height from the reference ground to the signal layer (H), and the space between the RF trace and the

ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic

impedance. The following figures are reference designs of microstrip or coplanar waveguide with different

PCB structures.

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Figure 31: Microstrip Line Design on a 2-layer PCB

Figure 32: Coplanar Waveguide Design on a 2-layer PCB

Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

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In order to ensure RF performance and reliability, the following principles should be complied with in RF

layout design:

 Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50Ω.

 The GND pins adjacent to RF pins should not bedesigned as thermal relief pads, and should be fully

connected to ground.

 The distance between the RF pinsand the RFconnector should be as short as possible, and all the

right angle traces should be changed to curved ones.

 There should be clearance area under the signal pin of the antenna connector or solder joint.

 The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround

RF traces and the reference ground could help to improve RF performance. The distance between

the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).

For more details about RF layout, please refer to document [5].

5.2. GNSS Antenna Interface

The GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC. The following tables show pin

definition and frequency specification of GNSS antenna interface.

Table 26: Pin Definition of GNSS Antenna Interface

Pin Name Pin No. I/O Description Comment

ANT_GNSS

(EG91-NA/-NS/-V/-EC)

49 AI GNSS antenna 50Ωimpedance

Table 27: GNSS Frequency

Type Frequency Unit

GPS 1575.42±1.023 MHz

GLONASS 1597.5~1605.8 MHz

Galileo 1575.42±2.046 MHz

BeiDou 1561.098±2.046 MHz

QZSS 1575.42 MHz

A reference design of GNSS antenna is shown as below.

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Figure 35: Reference Circuit of GNSS Antenna

NOTES

1. An external LDO can be selected to supply power according to the active antenna requirement.

2. If the module is designed with a passive antenna, then the VDD circuit is not needed.

5.3. Antenna Installation

5.3.1. Antenna Requirement

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 28: Antenna Requirements

Type Requirements

Frequency range: 1559MHz~1609MHz

Polarization: RHCP or linear

VSWR: < 2 (Typ.)

GNSS1)

GSM/WCDMA/LTE

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Passive antenna gain: > 0dBi

Active antenna noise figure: < 1.5dB

Active antenna gain: > 0dBi

Active antenna embedded LNA gain: < 17dB

VSWR: ≤ 2

Efficiency: > 30%

Max Input Power: 50 W

Input Impedance: 50Ω

Cable insertion loss: <1dB

LTE Module Series

EG91 Hardware Design

(EGSM900,WCDMA B5/B8,

LTE B5/B8/B12/B13/B20/B26/B28)

Cable Insertion Loss: <1.5dB

(DCS1800, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B25)

Cable insertion loss: <2dB

(LTE B7)

NOTE

It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active

antenna may generate harmonics which will affect the GNSS performance.

5.3.2. Recommended RF Connector for Antenna Installation

If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector

provided by Hirose.

Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm)

U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

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Figure 37:Mechanicals of U.FL-LP Connectors

The following figure describes the space factor of mated connector.

Figure 38:Space Factor of Mated Connector (Unit: mm)

For more details, please visit http://www.hirose.com

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6 Electrical, Reliability and

RadioCharacteristics

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are

listed in the following table.

Table 29: Absolute Maximum Ratings

Parameter Min. Max. Unit

VBAT_RF/VBAT_BB -0.3 4.7 V

USB_VBUS -0.3 5.5 V

Peak Current of VBAT_BB 0 0.8 A

Peak Current of VBAT_RF 0 1.8 A

Voltage at Digital Pins -0.3 2.3 V

6.2. Power Supply Ratings

Table 30: Power Supply Ratings

Parameter Description Conditions Min. Typ. Max. Unit

The actual input voltages

VBAT

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VBAT_BB and

VBAT_RF

must stay between the

minimum and maximum

values.

3.3 3.8 4.3 V

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EG91 Hardware Design

VBAT

USB_VBUS

Voltage drop during

burst transmission

Peak supply current

(during

transmissionslot)

USB

connectiondetection

Maximum power control

level on EGSM900

Maximum power control

level on EGSM900

400 mV

1.8 2.0 A

3.0 5.0 5.25 V

6.3. Operation and Storage Temperatures

The operation and storage temperaturesare listed in the following table.

Table 31: Operation and Storage Temperatures

Parameter Min. Typ. Max. Unit

Operation Temperature Range1) -35 +25 +75 ºC

ExtendedTemperatureRange2) -40 +85 ºC

Storage Temperature Range -40 +90 ºC

NOTES

Within operation temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

might reduce in their value and exceed the specified tolerances. When the temperature

out

returns to the normal operating temperature levels, the module will meet 3GPP specifications again.

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6.4. Current Consumption

The values of current consumption are shown below.

LTE Module Series

Table 32: EG91-E Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 13 uA

AT+CFUN=0 (USB disconnected)

1.1 mA

GSM DRX=2 (USB disconnected) 2.0 mA

GSM DRX=5 (USB suspended) 1.9 mA

GSM DRX=9 (USB disconnected) 1.3 mA

WCDMA PF=64 (USB disconnected) 1.7 mA

Sleep state

WCDMA PF=64 (USB suspended) 2.1 mA

WCDMA PF=512 (USB disconnected) 1.1 mA

LTE-FDD PF=64 (USB disconnected) 2.1 mA

VBAT

Idle state

GPRS data

transfer

LTE-FDD PF=64 (USB suspended) 2.6 mA

LTE-FDD PF=256 (USB disconnected) 1.4 mA

GSM DRX=5 (USB disconnected) 19.0 mA

GSM DRX=5 (USB connected) 29.0 mA

WCDMA PF=64 (USB disconnected) 19.0 mA

WCDMA PF=64 (USB connected) 29.0 mA

LTE-FDDPF=64 (USB disconnected) 19.0 mA

LTE-FDDPF=64 (USB connected) 29.0 mA

EGSM900 4DL/1UL @32.67dBm 260 mA

EGSM900 3DL/2UL @32.59dBm 463 mA

EGSM900 2DL/3UL @30.74dBm 552 mA

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EGSM900 1DL/4UL @29.26dBm 619 mA

DCS1800 4DL/1UL @29.2dBm 165 mA

DCS1800 3DL/2UL @29.13dBm 267 mA

DCS1800 2DL/3UL @29.01dBm 406 mA

DCS1800 1DL/4UL @28.86dBm 467 mA

EGSM900 4DL/1UL PCL=8 @27.1dBm 163 mA

EGSM900 3DL/2UL PCL=8 @27.16dBm 274 mA

EGSM900 2DL/3UL PCL=8 @26.91dBm 383 mA

EDGE data

transfer

WCDMA

datatransfer

EGSM900 1DL/4UL PCL=8 @26.12dBm 463 mA

DCS1800 4DL/1UL PCL=2 @25.54dBm 136 mA

DCS1800 3DL/2UL PCL=2 @25.68dBm 220 mA

DCS1800 2DL/3UL PCL=2 @25.61dBm 306 mA

DCS1800 1DL/4UL PCL=2 @25.41dBm 396 mA

WCDMA B1 HSDPACH10700 @22.29dBm 507 mA

WCDMA B1 HSUPA CH10700 @21.79dBm 516 mA

WCDMA B8 HSDPACH3012 @22.47dBm 489 mA

WCDMA B8 HSUPA CH3012 @21.98dBm 482 mA

LTE-FDD B1 CH18300 @22.98dBm 685 mA

LTE-FDD B3 CH19575 @23.23dBm 698 mA

LTE-FDD B7 CH21100 @23.46dBm 723 mA

LTE datatransfer

LTE-FDD B8 CH21625 @23.35dBm 655 mA

LTE-FDD B20 CH24300 @23.41dBm 723 mA

LTE-FDD B28A CH27360 @23.16dBm 660 mA

GSM

voice call

EGSM900 PCL=5 @32.5dBm 258 mA

DCS1800PCL=0 @29.23dBm 159 mA

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WCDMA

voice call

WCDMA B1 CH10700 @23.06dBm 555 mA

WCDMA B8 CH3012 @23.45dBm 535 mA

Table 33: EG91-NA Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 13 uA

AT+CFUN=0 (USB disconnected)

1.0 mA

WCDMA PF=64 (USB disconnected) 2.2 mA

WCDMA PF=64 (USB suspended) 2.5 mA

Sleep state

WCDMA PF=512 (USB disconnected) 1.4 mA

LTE-FDD PF=64 (USB disconnected) 2.6 mA

VBAT

Idle state

WCDMA

datatransfer

LTE-FDD PF=64 (USB suspended) 2.9 mA

LTE-FDD PF=256 (USB disconnected) 1.7 mA

WCDMA PF=64 (USB disconnected) 14.0 mA

WCDMA PF=64 (USB connected) 26.0 mA

LTE-FDDPF=64 (USB disconnected) 15.0 mA

LTE-FDDPF=64 (USB connected) 26.0 mA

WCDMA B2 HSDPA CH9938@22.45 dBm 569 mA

WCDMA B2 HSUPACH9938 @21.73 dBm 559 mA

WCDMA B4 HSDPACH1537@23.05 dBm 572 mA

WCDMA B4 HSUPACH1537@22.86 dBm 586 mA

WCDMA B5 HSDPA CH4407@23 dBm 518 mA

WCDMA B5 HSUPACH4407 @22.88 dBm 514 mA

LTE

datatransfer

LTE-FDD B2 CH1100@23.29 dBm 705 mA

LTE-FDD B4 CH2175@23.19 dBm 693 mA

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LTE-FDD B5 CH2525@23.39dBm 601 mA

LTE-FDD B12 CH5060@23.16 dBm 650 mA

LTE-FDD B13 CH5230 @23.36 dBm 602 mA

WCDMA B2 CH9938 @23.34 dBm 627 mA

WCDMA

voice call

WCDMA B4 CH1537@23.47 dBm 591 mA

WCDMA B5 CH4357@23.37 dBm 536 mA

Table 34: EG91-NS Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 8 uA

AT+CFUN=0 (USB disconnected)

1.2 mA

WCDMA PF=64 (USB disconnected) 2 mA

WCDMA PF=64 (USB suspended) 2.3 mA

Sleep state

WCDMA PF=512 (USB disconnected) 1.3 mA

LTE-FDD PF=64 (USB disconnected) 2.5 mA

VBAT

Idle state

WCDMA

datatransfer

LTE-FDD PF=64 (USB suspended) 2.8 mA

LTE-FDD PF=256 (USB disconnected) 1.6 mA

WCDMA PF=64 (USB disconnected) 19.9 mA

WCDMA PF=64 (USB connected) 30.1 mA

LTE-FDDPF=64 (USB disconnected) 21.2 mA

LTE-FDDPF=64 (USB connected) 30.9 mA

WCDMA B2 HSDPA CH9938@22.4 dBm 527 mA

WCDMA B2 HSUPACH9938 @22.31 dBm 547 mA

WCDMA B4 HSDPACH1537@23.01 dBm 575 mA

WCDMA B4 HSUPACH1537@22.69 dBm 589 mA

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WCDMA B5 HSDPA CH4407@23.05 dBm 553 mA

WCDMA B5 HSUPACH4407 @22.91 dBm 556 mA

LTE-FDD B2 CH1100@23.26 dBm 724 mA

LTE-FDD B4 CH2175@23.52 dBm 693 mA

LTE-FDD B5 CH2525@23.51dBm 613 mA

LTE

datatransfer

LTE-FDD B12 CH5060@23.39 dBm 634 mA

LTE-FDD B13 CH5230 @23.54 dBm 576 mA

LTE-FDD B25CH8590@23.64 dBm 739 mA

LTE-FDD B26CH8765@23.34 dBm 647 mA

WCDMA B2 CH9938 @23.39 dBm 571 mA

WCDMA

voice call

WCDMA B4 CH1738@23.27 dBm 593 mA

WCDMA B5 CH4357@23.35 dBm 554 mA

Table 35: EG91-V Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 9 uA

AT+CFUN=0 (USB disconnected)

LTE-FDD PF=64 (USB disconnected) TBD mA

Sleep state

LTE-FDD PF=64 (USB suspended) TBD mA

VBAT

LTE-FDD PF=256 (USB disconnected) TBD mA

LTE-FDDPF=64 (USB disconnected) 16.5 mA

Idle state

LTE-FDDPF=64 (USB connected) 30.8 mA

LTE-FDD B4 CH2175@23.36dBm 715 mA

LTEdatatransfer

LTE-FDD B13 CH5230@23.38dBm 642 mA

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TBD mA

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EG91 Hardware Design

Table 36: EG91-EC Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down TBD uA

VBAT

Sleep state

AT+CFUN=0 (USB disconnected)

TBD mA

GSM DRX=2 (USB disconnected) TBD mA

GSM DRX=5 (USB suspended) TBD mA

GSM DRX=9 (USB disconnected) TBD mA

WCDMA PF=64 (USB disconnected) TBD mA

WCDMA PF=64 (USB suspended) TBD mA

WCDMA PF=512 (USB disconnected) TBD mA

LTE-FDD PF=64 (USB disconnected) TBD mA

LTE-FDD PF=64 (USB suspended) TBD mA

LTE-FDD PF=256 (USB disconnected) TBD mA

GSM DRX=5 (USB disconnected) TBD mA

Idle state

GPRS data

transfer

GSM DRX=5 (USB connected) TBD mA

WCDMA PF=64 (USB disconnected) TBD mA

WCDMA PF=64 (USB connected) TBD mA

LTE-FDDPF=64 (USB disconnected) TBD mA

LTE-FDDPF=64 (USB connected) TBD mA

EGSM900 4DL/1UL @TBDdBm TBD mA

EGSM900 3DL/2UL @TBDdBm TBD mA

EGSM900 2DL/3UL @TBDdBm TBD mA

EGSM900 1DL/4UL @TBDdBm TBD mA

DCS1800 4DL/1UL @TBDdBm TBD mA

DCS1800 3DL/2UL @TBDdBm TBD mA

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DCS1800 2DL/3UL @TBDdBm TBD mA

DCS1800 1DL/4UL @TBDdBm TBD mA

EGSM900 4DL/1UL PCL=8 @TBDdBm TBD mA

EGSM900 3DL/2UL PCL=8 @TBDdBm TBD mA

EGSM900 2DL/3UL PCL=8 @TBDdBm TBD mA

EDGE data

transfer

WCDMA

datatransfer

EGSM900 1DL/4UL PCL=8 @TBDdBm TBD mA

DCS1800 4DL/1UL PCL=2 @TBDdBm TBD mA

DCS1800 3DL/2UL PCL=2 @TBDdBm TBD mA

DCS1800 2DL/3UL PCL=2 @TBDdBm TBD mA

DCS1800 1DL/4UL PCL=2 @TBDdBm TBD mA

WCDMA B1 HSDPA@TBD dBm TBD mA

WCDMA B1 HSUPA @TBD dBm TBD mA

WCDMA B8 HSDPA@TBD dBm TBD mA

WCDMA B8 HSUPA @TBD dBm TBD mA

LTE-FDD B1@TBD dBm TBD mA

LTE-FDD B3@TBD dBm TBD mA

LTE

datatransfer

LTE-FDD B7@TBD dBm TBD mA

LTE-FDD B8@TBD dBm TBD mA

LTE-FDD B20@TBD dBm TBD mA

LTE-FDD B28@TBD dBm TBD mA

GSM

voice call

WCDMA

voice call

EGSM900 PCL=5 @TBDdBm TBD mA

DCS1800PCL=0 @TBDdBm TBD mA

WCDMA B1@TBD dBm TBD mA

WCDMA B8@TBD dBm TBD mA

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Table 37: GNSS Current Consumption of EG91

Parameter Description Conditions Typ. Unit

Cold start @Passive Antenna 54 mA

VBAT

(GNSS)

Searching

(AT+CFUN=0)

Tracking

(AT+CFUN=0)

Hot Start @Passive Antenna 54 mA

Lost state @Passive Antenna 53 mA

Open Sky @Passive Antenna 32 mA

6.5. RF Output Power

The following table shows the RF output power of EG91 module.

Table 38: RF Output Power

Frequency Max. Min.

EGSM900 33dBm±2dB 5dBm±5dB

DCS1800 30dBm±2dB 0dBm±5dB

EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB

DCS1800(8-PSK) 26dBm±3dB 0dBm±5dB

WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB <-49dBm

LTE-FDD B1/B2/B3/B4/B5/B7/

B8/B12/B13/B20/B25/B26/B28A/B28B

23dBm±2dB <-39dBm

NOTE

In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. Thedesign conforms to the

GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

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6.6. RF Receiving Sensitivity

The following tables show the conducted RF receiving sensitivity of EG91 module.

LTE Module Series

Table 39: EG91-E Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP

EGSM900 -108.6dBm NA NA -102dBm

DCS1800 -109.4 dBm NA NA -102dbm

WCDMA B1 -109.5dBm -110dBm -112.5dBm -106.7dBm

WCDMA B8 -109.5dBm -110dBm -112.5dBm -103.7dBm

LTE-FDD B1(10M) -97.5dBm -98.3dBm -101.4dBm -96.3dBm

LTE-FDD B3(10M) -98.3dBm -98.5dBm -101.5dBm -93.3dBm

LTE-FDD B7(10M) -96.3dBm -98.4dBm -101.3dBm -94.3dBm

LTE-FDD B8(10M) -97.1dBm -99.1dBm -101.2dBm -93.3dBm

LTE-FDD B20(10M) -97dBm -99dBm -101.3dBm -93.3dBm

LTE-FDD B28A(10M) -98.3dBm -99dBm -101.4dBm -94.8dBm

Table 40: EG91-NA Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP

WCDMA B2 -110dBm -111dBm -112.5dBm -104.7dBm

WCDMA B4 -110dBm -111dBm -112.5dBm -106.7dBm

WCDMA B5 -111dBm -111.5dBm -113dBm -104.7dBm

LTE-FDD B2 (10M) -98dBm -99dBm -102.2dBm -94.3dBm

LTE-FDD B4 (10M) -97.8dBm -99.5dBm -102.2dBm -96.3dBm

LTE-FDD B5 (10M) -99.6dBm -100.3dBm -103dBm -94.3dBm

LTE-FDD B12 (10M) -99.5dBm -100dBm -102.5dBm -93.3dBm

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LTE-FDD B13 (10M) -99.2dBm -100dBm -102.5dBm -93.3dBm

Table 41: EG91-NS Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP

WCDMA B2 -110dBm -111dBm -112.5dBm -104.7dBm

WCDMA B4 -110dBm -111dBm -112.5dBm -106.7dBm

WCDMA B5 -111dBm -111.5dBm -113dBm -104.7dBm

LTE-FDD B2 (10M) -98dBm -99dBm -102.2dBm -94.3dBm

LTE-FDD B4 (10M) -97.8dBm -99.5dBm -102.2dBm -96.3dBm

LTE-FDD B5 (10M) -99.4dBm -100dBm -102.7dBm -94.3dBm

LTE-FDD B12 (10M) -99.5dBm -100dBm -102.5dBm -93.3dBm

LTE-FDD B13 (10M) -99.2dBm -100dBm -102.5dBm -93.3dBm

LTE-FDD B25 (10M) -97.6dBm -99dBm -102.2dBm -92.8dBm

LTE-FDD B26 (10M) -99.1dBm -99.9dBm -102.7dBm -93.8dBm

Table 42: EG91-V Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP

LTE-FDD B4 (10M) -98.2dBm -99.2dBm -102.2dBm -96.3dBm

LTE-FDD B13 (10M) -99.2dBm -100dBm -102.5dBm -93.3dBm

Table 43: EG91-EC Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP

EGSM900 TBD TBD TBD -102dBm

DCS1800 TBD TBD TBD -102dbm

WCDMA B1 TBD TBD TBD -106.7dBm

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WCDMA B8 TBD TBD TBD -103.7dBm

LTE-FDD B1 (10M) TBD TBD TBD -96.3dBm

LTE-FDD B3 (10M) TBD TBD TBD -93.3dBm

LTE-FDD B7 (10M) TBD TBD TBD -94.3dBm

LTE-FDD B8 (10M)

TBD TBD TBD -93.3dBm

LTE-FDD B20 (10M) TBD TBD TBD -93.3dBm

LTE-FDD B28 (10M) TBD TBD TBD -94.8dBm

6.7. Electrostatic Discharge

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject

to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be applied throughout the processing, handling and operation of any

application that incorporates the module.

The following table shows the module’s electrostatic discharge characteristics.

Table 44: Electrostatic Discharge Characteristics

Test Points Contact Discharge Air Discharge Unit

VBAT, GND ±5 ±10 KV

All Antenna Interfaces ±4 ±8 KV

Other Interfaces ±0.5 ±1 KV

6.8. Thermal Consideration

In order to achieve better performance of the module, it is recommended to comply with the following

principles for thermal consideration:

 On customers’ PCB design, please keep placement of the module away from heating sources,

especially high power components such as ARM processor, audio power amplifier, power supply, etc.

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 Do not place components on the opposite side of the PCB area where the module is mounted, in

order to facilitate adding of heatsink when necessary.

 Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as

to ensure better heat dissipation performance.

 The reference ground of the area where the module is mounted should be complete, and add ground

vias as many as possible for better heat dissipation.

 Make sure the ground pads of the module and PCB are fully connected.

 According to customers’ application demands, the heatsink can be mounted on the top of the module,

or the opposite side of the PCB area where the module is mounted, or both of them.

 The heatsink should be designed with as many fins as possible to increase heat dissipation area.

Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and

module/PCB.

The following shows two kinds of heatsink designs for reference and customers can choose one or bothof

them according to their application structure.

Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)

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EG91 Module

Application Board

Thermal Pad

Heatsink

Shielding Cover

Thermal Pad

Heatsink

Application Board

Figure 40: Referenced Heatsink Design (Heatsink at the Backsideof Customers’ PCB)

NOTES

1. The module offers the best performance when the internal BB chip stays below 105°C. When the

maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but

provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB

chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will

recover to network connected state after the maximum temperature falls below 115°C. Therefore, the

thermal design should be maximally optimized to make sure the maximum BB chip temperature

always maintains below 105°C. Customers can execute AT+QTEMP command and get the

maximum BB chip temperature from the first returned value.

2. For more detailed guidelines on thermal design, please refer to document [6].

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7 Mechanical Dimensions

This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm.

The tolerances for dimensions without tolerance values are ±0.05mm.

7.1. Mechanical Dimensions of the Module

25±0.15

2.30±0.2

29±0.15

Figure 41: Module Top and Side Dimensions

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LTE Mo

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LTE Module Series

EG91 Hardware Design

8 Storage, Manufacturing and

Packaging

8.1. Storage

EG91is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below.

1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.

2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other

high temperature processes must be:

 Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.

 Stored at <10% RH.

3. Devices require bake before mounting, if any circumstances below occurs:

 When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity

is >10% before opening the vacuum-sealed bag.  Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.

If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.

NOTE

As the plastic package cannot be subjected to high temperature, it should be removed from devices

before high temperature (120ºC) baking. If shorter baking time is desired, please refer to

IPC/JEDECJ-STD-033 for baking procedure.

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8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the

stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted

properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality,

thethickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please

refer todocument [4].

It is suggested that the peak reflow temperature is 240ºC~245ºC, and the absolute maximum reflow

temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly

recommended that the module should be mounted after reflow soldering for the other side of PCB has

been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and

related parameters are shown below.

Temp. (°C)

245

240

220

200

Soak Zone

150

100

Max slope: 1~3°C/sec

Figure 46: Reflow Soldering Thermal Profile

Table 45: Recommended Thermal Profile Parameters

Reflow Zone

Max slope: 2~3°C/sec

Cooling down slope: 1~4°C/sec

Factor Recommendation

Soak Zone

Max slope 1 to 3°C/sec

Soak time (between A and B: 150°C and 200°C) 60 to 120 sec

Reflow Zone

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Max slope 2 to 3°C/sec

Reflow time (D: over 220°C) 40 to 60 sec

Max temperature 240°C ~ 245°C

Cooling down slope 1 to 4°C/sec

LTE Module Series

Reflow Cycle

Max reflow cycle 1

8.3. Packaging

EG91is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until

the devices are ready to be soldered onto the application.

The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the

packaging details, measured in mm.

Figure 47: Tape Dimensions

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48.5

Cover tap

Direction of feed

100

+0.20

44.5

-0.00

Figure 48: Reel Dimensions

Carrier tape

packing module

1083

Figure 49: Tape and Reel Directions

Carrier tape unfolding

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9 Appendix A References

Table 46: Related Documents

SN Document Name Remark

LTE Module Series

[1]

[2] Quectel_EG9x_AT_Commands_Manual

[3]

[4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide

[5] Quectel_RF_Layout_Application_Note RF Layout Application Note

[6] Quectel_LTE_Module_Thermal_Design_Guide

Table 47: Terms and Abbreviations

Quectel_EC2x&EG9x&EM05_Power_Management_A

pplication_Note

Quectel_EC25&EC21_GNSS_AT_Commands_

Manual

Power Management Application Note

for EC25, EC21, EC20 R2.0, EC20

R2.1, EG95, EG91 and EM05

AT Commands Manual for EG95 and

EG91

GNSS AT Commands Manual for EC25

and EC21 modules

Thermal design guide for LTE modules

including EC25, EC21, EC20 R2.0,

EC20 R2.1, EG91, EG95, EG25-G,

EP06, EG06, EM06 and AG35.

Abbreviation Description

AMR Adaptive Multi-rate

bps Bits Per Second

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear To Send

DC-HSPA+ Dual-carrier High Speed Packet Access

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DFOTA Delta Firmware Upgrade Over-The-Air

DL Downlink

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

ESD Electrostatic Discharge

FDD Frequency Division Duplex

FR Full Rate

GMSK Gaussian Minimum Shift Keying

LTE Module Series

GSM Global System for Mobile Communications

HR Half Rate

HSPA High Speed Packet Access

HSDPA High Speed Downlink Packet Access

HSUPA High Speed Uplink Packet Access

I/O Input/Output

Inorm Normal Current

LED Light Emitting Diode

LNA Low Noise Amplifier

LTE Long Term Evolution

MIMO Multiple Input Multiple Output

MO Mobile Originated

MS Mobile Station (GSM engine)

MSL Moisture Sensitivity Level

MT Mobile Terminated

PAP Password Authentication Protocol

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PCB Printed Circuit Board

PDU Protocol Data Unit

PPP Point-to-Point Protocol

QAM Quadrature Amplitude Modulation

QPSK Quadrature Phase Shift Keying

RF Radio Frequency

RHCP Right Hand Circularly Polarized

Rx Receive

SMS Short Message Service

LTE Module Series

TDD Time Division Duplexing

TX Transmitting Direction

UL Uplink

UMTS Universal Mobile Telecommunications System

URC Unsolicited Result Code

(U)SIM (Universal) Subscriber Identity Module

Vmax Maximum Voltage Value

Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VOHin Minimum Output High Level Voltage Value

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VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

VSWR Voltage Standing Wave Ratio

WCDMA Wideband Code Division Multiple Access

LTE Module Series

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10 Appendix B GPRS Coding Schemes

Table 48: Description of Different Coding Schemes

Scheme

Code Rate

USF

Pre-coded USF

Radio Block excl.USF and BCS

BCS

Tail

Coded Bits

Punctured Bits

Data Rate Kb/s

CS-1 CS-2 CS-3 CS-4

1/2 2/3 3/4 1

3 3 3 3

3 6 6 12

181 268 312 428

40 16 16 16

4 4 4 -

456 588 676 456

0 132 220 -

9.05 13.4 15.6 21.4

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11 Appendix C GPRS Multi-slot Classes

Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot

classes are product dependent, and determine the maximum achievable data rates in both the uplink and

downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,

while the second number indicates the amount of uplink timeslots. The active slots determine the total

number of slots the GPRS device can use simultaneously for both uplink and downlink communications.

The description of different multi-slot classes is shown in the following table.

Table 49: GPRS Multi-slot Classes

Multislot Class Downlink Slots Uplink Slots Active Slots

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5

13 3 3 NA

14 4 4 NA

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15 5 5 NA

16 6 6 NA

17 7 7 NA

18 8 8 NA

19 6 2 NA

20 6 3 NA

21 6 4 NA

22 6 4 NA

23 6 6 NA

24 8 2 NA

25 8 3 NA

26 8 4 NA

27 8 4 NA

28 8 6 NA

29 8 8 NA

30 5 1 6

31 5 2 6

32 5 3 6

33 5 4 6

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12 Appendix D EDGE Modulation and

Coding Schemes

Table 50: EDGE Modulation and Coding Schemes

Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot

CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps

CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps

CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps

CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps

MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps

MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps

MCS-3 GMSK A 14.8kbps 29.6kbps 59.2kbps

MCS-4 GMSK C 17.6kbps 35.2kbps 70.4kbps

MCS-5 8-PSK B 22.4kbps 44.8kbps 89.6kbps

MCS-6 8-PSK A 29.6kbps 59.2kbps 118.4kbps

MCS-7 8-PSK B 44.8kbps 89.6kbps 179.2kbps

MCS-8 8-PSK A 54.4kbps 108.8kbps 217.6kbps

MCS-9 8-PSK A 59.2kbps 118.4kbps 236.8kbps

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Quectel Wireless Solutions 201903EG91NS Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual