EG25-G Mini PCIe
Hardware Design
LTE Module Series
Rev. EG25-G_Mini_PCIe_Hardware_Design_V1.0
Date: 2019-01-03
Status: Released
www.quectel.com
LTE Module Series
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Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
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About the Document
History
Revision
Date
Author
Description
1.0
2019-01-03
Lorry XU/
Ethan SHAN
Initial
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 5
Figure Index ................................................................................................................................................. 6
1 Introduction .......................................................................................................................................... 7
1.1. Safety Information...................................................................................................................... 8
2 Product Concept .................................................................................................................................. 9
2.1. General Description ................................................................................................................... 9
2.2. Description of Product Series .................................................................................................. 10
2.3. Key Features ........................................................................................................................... 10
2.4. Functional Diagram ................................................................................................................. 13
3 Application Interfaces ....................................................................................................................... 14
3.1. Pin Assignment ........................................................................................................................ 14
3.2. Pin Description ......................................................................................................................... 15
3.3. Power Supply ........................................................................................................................... 18
3.4. (U)SIM Interface ...................................................................................................................... 19
3.5. USB Interface .......................................................................................................................... 21
3.6. UART Interface ........................................................................................................................ 22
3.7. PCM and I2C Interfaces .......................................................................................................... 23
3.8. Control and Indicator Signals .................................................................................................. 25
3.8.1. RI Signal ......................................................................................................................... 26
3.8.2. DTR Signal ..................................................................................................................... 26
3.8.3. W_DISABLE# Signal ...................................................................................................... 26
3.8.4. PERST# Signal .............................................................................................................. 27
3.8.5. LED_WWAN# Signal ..................................................................................................... 27
3.8.6. WAKE# Signal ................................................................................................................ 28
3.9. Antenna Interfaces .................................................................................................................. 29
3.9.1. Antenna Requirements .................................................................................................. 29
3.9.2. Recommended RF Connector for Antenna Installation ................................................. 30
4 Electrical, Reliability and Radio Characteristics ............................................................................ 32
4.1. General Description ................................................................................................................. 32
4.2. Power Supply Requirements ................................................................................................... 32
4.3. I/O Requirements ..................................................................................................................... 33
4.4. RF Characteristics ................................................................................................................... 33
4.5. GNSS Receiver ....................................................................................................................... 35
4.6. ESD Characteristics ................................................................................................................ 36
4.7. Thermal Consideration ............................................................................................................ 36
4.8. Current Consumption .............................................................................................................. 37
5 Dimensions and Packaging .............................................................................................................. 43
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5.1. General Description ................................................................................................................. 43
5.2. Mechanical Dimensions of EG25-G Mini PCIe ....................................................................... 43
5.3. Standard Dimensions of Mini PCI Express ............................................................................. 44
5.4. Packaging ................................................................................................................................ 45
6 Appendix References ........................................................................................................................ 46
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Table Index
TABLE 1: DESCRIPTION OF EG25-G MINI PCIE............................................................................................ 10
TABLE 2: KEY FEATURES OF EG25-G MINI PCIE ......................................................................................... 10
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15
TABLE 5: DEFINITION OF VCC_3V3 AND GND PINS .................................................................................... 18
TABLE 6: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 19
TABLE 7: PIN DEFINITION OF USB INTERFACE ........................................................................................... 21
TABLE 8: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 22
TABLE 9: PIN DEFINITION OF PCM AND I2C INTERFACES ......................................................................... 23
TABLE 10: PIN DEFINITION OF CONTROL AND INDICATOR SIGNALS ....................................................... 25
TABLE 11: RF FUNCTION STATUS .................................................................................................................. 26
TABLE 12: INDICATIONS OF NETWORK STATUS (AT+QCFG=“LEDMODE”,0, DEFAULT SETTING) ......... 28
TABLE 13: INDICATIONS OF NETWORK STATUS (AT+QCFG=“LEDMODE”,2) ........................................... 28
TABLE 14: ANTENNA REQUIREMENTS .......................................................................................................... 29
TABLE 15: POWER SUPPLY REQUIREMENTS .............................................................................................. 32
TABLE 16: I/O REQUIREMENTS ...................................................................................................................... 33
TABLE 17: EG25-G MINI PCIE CONDUCTED RF OUTPUT POWER ............................................................. 33
TABLE 18: EG25-G MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ............................................... 34
TABLE 19: ESD CHARACTERISTICS OF EG25-G MINI PCIE ........................................................................ 36
TABLE 20: CURRENT CONSUMPTION OF EG25-G MINI PCIE .................................................................... 37
TABLE 21: GNSS CURRENT CONSUMPTION OF EG25-G MINI PCIE ......................................................... 42
TABLE 22: RELATED DOCUMENTS ................................................................................................................ 46
TABLE 23: TERMS AND ABBREVIATIONS ...................................................................................................... 46
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13
FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14
FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 18
FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 19
FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ... 20
FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 21
FIGURE 7: TIMING IN PRIMARY MODE .......................................................................................................... 24
FIGURE 8: TIMING IN AUXILIARY MODE........................................................................................................ 24
FIGURE 9: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ...................................... 25
FIGURE 10: RI BEHAVIOR ............................................................................................................................... 26
FIGURE 11: TIMING OF RESETTING MODULE .............................................................................................. 27
FIGURE 12: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 27
FIGURE 13: WAKE# BEHAVIOR ...................................................................................................................... 28
FIGURE 14: DIMENSIONS OF THE RF CONNECTORS (UNIT: MM) ............................................................. 30
FIGURE 15: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 30
FIGURE 16: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 31
FIGURE 17: REFERENCED HEATSINK DESIGN ........................................................................................... 37
FIGURE 18: MECHANICAL DIMENSIONS OF EG25-G MINI PCIE ................................................................ 43
FIGURE 19: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 44
FIGURE 20: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 45
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1 Introduction
This document defines EG25-G Mini PCIe module, and describes its air interfaces and hardware
interfaces which are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details as well as other related information of EG25-G Mini PCIe module. To facilitate its
application in different fields, relevant reference design is also provided for customers’ reference.
Associated with application note and user guide, customers can use the module to design and set up
mobile applications easily.
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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EG25-G Mini PCIe module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
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2 Product Concept
2.1. General Description
EG25-G Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+,
HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface.
It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio,
high-speed data transmission and GNSS functionalities for customers’ applications.
EG25-G Mini PCIe module can be applied in the following fields:
PDA and Laptop Computer
Remote Monitor System
Vehicle System
Wireless POS System
Intelligent Meter Reading System
Wireless Router and Switch
Other Wireless Terminal Devices
This chapter generally introduces the following aspects of EG25-G Mini PCIe module:
Product Series
Key Features
Functional Diagram
EG25-G Mini PCIe contains Telematics version and Data-only version. Telematics version supports
voice and data functions, while Data-only version only supports data function.
NOTE
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2.2. Module Description
The following table shows the description of EG25-G Mini PCIe module.
Table 1: Description of EG25-G Mini PCIe
1.
1)
GNSS function is optional.
2.
2)
Digital audio (PCM) function is only supported on Telematics version.
2.3. Key Features
The following table describes the detailed features of EG25-G Mini PCIe module.
Table 2: Key Features of EG25-G Mini PCIe
Module
Description
EG25-G Mini PCIe
Support LTE-FDD:
B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28
Support LTE-TDD: B38/B39/B40/B41
Support WCDMA: B1/B2/B4/B5/B6/B8/B19
Support GSM: 850/900/1800/1900MHz
Support GPS, GLONASS, BeiDou/Compass, Galileo, QZSS 1)
Support digital audio 2)
Feature
Details
Function Interface
PCI Express Mini Card 1.2 Standard Interface
Power Supply
Supply voltage: 3.0V~3.6V
Typical supply voltage: 3.3V
Transmitting Power
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
NOTES
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Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE FDD bands
Class 3 (23dBm±2dB) for LTE TDD bands
LTE Features
Support up to non-CA Cat 4 FDD and TDD
Support 1.4MHz~20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 150Mbps (DL), Max 50Mbps (UL)
LTE-TDD: Max 130Mbps (DL), Max 30Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK,16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)
GSM Features
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL), Max 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL), Max 236.8Kbps (UL)
Internet Protocol Features
Support
TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/SMTP/CMUX*/HTTPS*/
/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
SMS
Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support USIM/SIM card: 1.8V, 3.0V
UART Interface
Support RTS and CTS hardware flow control
Baud rate can reach up to 230400bps, 115200bps by default
Used for AT command communication and data transmission
Audio Features
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
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1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P
out
might reduce in their value and exceed the specified tolerances. When the temperature
returns to normal operation temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
USB Interface
Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging, firmware upgrade and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE
5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc.
Antenna Interfaces
Including main antenna, diversity antenna and GNSS antenna
Rx-diversity
Support LTE/WCDMA Rx-diversity
GNSS Features
Gen8C Lite of Qualcomm
Protocol: NMEA 0183
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Physical Characteristics
Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm
Weight: approx. 9.8g
Temperature Range
Operation temperature range: -35°C ~ +75°C 1)
Extended temperature range: -40°C ~ +80°C 2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
Upgrade via USB interface or DFOTA*
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES
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2.4. Functional Diagram
The following figure shows the block diagram of EG25-G Mini PCIe.
EG25-G Module
PCM&I2C
Mini PCI Express
Interface
USB
W_DISABLE#
PERST#
LED_WWAN#
Main
Antenna
Interface
VCC
Main
Antenna
VBAT
GNSS
Antenna
Interface
GNSS
Antenna
Boost
Circuit
Diversity
Antenna
Interface
Diversity
Antenna
WAKE#
UART
DTR
RI
(U)SIM
Figure 1: Functional Diagram
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3 Application Interfaces
The physical connections and signal levels of EG25-G Mini PCIe comply with PCI Express Mini CEM
specifications. This chapter mainly describes the definition and application of the following interfaces for
EG25-G Mini PCIe:
Power supply
(U)SIM interface
USB interface
UART interface
PCM&I2C interfaces
Control and Indicator signals
Antenna interfaces
3.1. Pin Assignment
The following figure shows the pin assignment of EG25-G Mini PCIe module. The top side contains
EG25-G module and antenna connectors.
PIN2
PIN52
BOT
PIN1
PIN51
TOP
Pin Name
Pin No.
WAKE#
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
RESERVED
RESERVED
RESERVED
GND
UART_RX
UART_TX
GND
RI
RESERVED
GND
UART_CTS
UART_RTS
GND
GND
DTR
RESERVED
GND
GND
VCC_3V3
VCC_3V3
GND
PCM_CLK
PCM_DOUT
PCM_DI
PCM_SYNC
Pin Name
Pin No.
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
VCC_3V3
GND
NC
USIM_VDD
USIM_DATA
USIM_CLK
USIM_RST
RESERVED
GND
W_DISABLE#
PERST#
RESERVED
GND
NC
I2C_SCL
I2C_SDA
GND
USB_DM
USB_DP
GND
LED_WWAN#
USIM_PRESENCE
RESERVED
NC
GND
VCC_3V3
Figure 2: Pin Assignment
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3.2. Pin Description
The following tables show the pin definition and description of EG25-G Mini PCIe on the 52-pin
application.
Table 3: I/O Parameters Definition
Table 4: Pin Description
Type
Description
DI
Digital Input
DO
Digital Output
IO
Bidirectional
OC
Open Collector
PI
Power Input
PO
Power Output
Pin No.
Mini PCI Express
Standard Name
EG25-G Mini PCIe
Pin Name
I/O
Description
Comment
1
WAKE#
WAKE#
OC
Output signal to wake up
the host.
2
3.3Vaux
VCC_3V3
PI
3.3V DC supply
3 RESERVED
RESERVED
Reserved
4
GND
GND
Mini card ground
5 RESERVED
RESERVED
Reserved
6
1.5V
NC Not connected
7
CLKREQ#
RESERVED
Reserved
8
UIM_PWR
USIM_VDD
PO
Power source for the
(U)SIM card
9
GND
GND
Mini card ground
10
UIM_DATA
USIM_DATA
IO
Data signal of (U)SIM card
11
REFCLK-
UART_RX
DI
UART receive data
Connect to
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DTE’s TX.
12
UIM_CLK
USIM_CLK
DO
Clock signal of (U)SIM card
13
REFCLK+
UART_TX
DO
UART transmit data
Connect to
DTE’s RX.
14
UIM_RESET
USIM_RST
DO
Reset signal of (U)SIM card
15
GND
GND
Mini card ground
16
UIM_VPP
RESERVED
Reserved
17
RESERVED
RI
DO
Output signal to wake up
the host.
18
GND
GND
Mini card ground
19
RESERVED
RESERVED
Reserved
20
W_DISABLE#
W_DISABLE#
DI
Airplane mode control
Pull-up by
default.
Active low.
21
GND
GND
Mini card ground
22
PERST#
PERST#
DI
Fundamental reset signal
Pull-up by
default.
Active low
23
PERn0
UART_CTS
DI
UART clear to send
Connect to
DTE’s
RTS.
24
3.3Vaux
RESERVED
Reserved
25
PERp0
UART_RTS
DO
UART request to send
Connect to
DTE’s CTS
26
GND
GND
Mini card ground
27
GND
GND
Mini card ground
28
1.5V
NC Not connected
29
GND
GND
Mini card ground
30
SMB_CLK
I2C_SCL
DO
I2C serial clock
Require
external
pull-up to
1.8V.
31
PETn0
DTR
DI
Sleep mode control
32
SMB_DATA
I2C_SDA
IO
I2C serial data
Require
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external
pull-up to
1.8V.
33
PETp0
RESERVED
Reserved
34
GND
GND
Mini card ground
35
GND
GND
Mini card ground
36
USB_D-
USB_DM
IO
USB differential data (-)
Require
differential
impedance
of 90Ω
37
GND
GND
Mini card ground
38
USB_D+
USB_DP
IO
USB differential data (+)
Require
differential
impedance
of 90Ω
39
3.3Vaux
VCC_3V3
PI
3.3V DC supply
40
GND
GND
Mini card ground
41
3.3Vaux
VCC_3V3
PI
3.3V DC supply
42
LED_WWAN#
LED_WWAN#
OC
LED signal for indicating the
network status of the
module
Active low
43
GND
GND
Mini card ground
44
LED_WLAN#
USIM_PRESENCE
DI
(U)SIM card insertion
detection
45
RESERVED
PCM_CLK 1)
IO
PCM clock signal
46
LED_WPAN#
RESERVED
Reserved
47
RESERVED
PCM_DOUT 1)
DO
PCM data output
48
1.5V
NC Not connected
49
RESERVED
PCM_DIN 1)
DI
PCM data input
50
GND
GND
Mini card ground
51
RESERVED
PCM_SYNC 1)
IO
PCM frame synchronization
52
3.3Vaux
VCC_3V3
PI
3.3V DC supply
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1. Keep all NC, reserved and unused pins unconnected.
2.
1)
The digital audio (PCM) function is only supported on Telematics version.
3.3. Power Supply
The following table shows pin definition of VCC_3V3 pins and ground pins.
Table 5: Definition of VCC_3V3 and GND Pins
The typical supply voltage of EG25-G Mini PCIe is 3.3V. In the 2G network, the input peak current may
reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide enough
current, and a bypass capacitor of no less than 470µF with low ESR should be used to prevent the
voltage from dropping.
The following figure shows a reference design of power supply. The precision of resistor R2 and R3 is 1%,
and the capacitor C3 needs a low ESR.
LDO_IN
C1
C2
MIC29302WU U1
IN
OUT
EN
GND
ADJ
2 4
1
3
5
VCC_3V3
100nF
C3
470uF
C4
100nF
R2
82K 1%
47K 1%
R3
470uF
470R
51K
R4
R1
MCU_POWER
_ON/OFF
47K
4.7K
R5
R6
C5
C6
33pF
10pF
TVS
D1
Figure 3: Reference Circuit of Power Supply
Pin No.
Pin Name
I/O
Power Domain
Description
2, 39, 41, 52
VCC_3V3
PI
3.0V~3.6V
3.3V DC supply
4, 9, 15, 18, 21,
26, 27, 29, 34, 35,
37, 40, 43, 50
GND
Mini card ground
NOTES
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3.4. (U)SIM Interface
The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards
are supported.
Table 6: Pin Definition of (U)SIM Interface
EG25-G Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports
low level and high level detections, and is disabled by default. For more details of AT+QSIMDET
command, please refer to document [2].
The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
USIM_VDD
GND
USIM_RST
USIM_CLK
USIM_DATA
USIM_PRESENCE
100nF
GND
GND
33pF
33pF 33pF
VCC
RST
CLK
IO
VPP
GND
GND
USIM_VDD
15K
(U)SIM Card Connector
Module
VDD_EXT
51K
0R
0R
0R
Figure 4: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector
Pin No.
Pin Name
I/O
Power Domain
Description
8
USIM_VDD
PO
1.8V/3.0V
Power source for (U)SIM card
10
USIM_DATA
IO
1.8V/3.0V
Data signal of (U)SIM card
12
USIM_CLK
DO
1.8V/3.0V
Clock signal of (U)SIM card
14
USIM_RST
DO
1.8V/3.0V
Reset signal of (U)SIM card
44
USIM_
PRESENCE
DI
1.8V/3.0V
(U)SIM card insertion detection
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If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A
reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following
figure.
USIM_VDD
GND
USIM_RST
USIM_CLK
USIM_DATA
0R
0R
0R
100nF
GND
33pF 33pF 33pF
VCC
RST
CLK IO
VPP
GND
GND
15K
USIM_VDD
(U)SIM Card Connector
Module
Figure 5: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector
In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please
follow the criteria below in (U)SIM circuit design:
Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length
as less than 200mm as possible.
Keep (U)SIM card signals away from RF and power supply traces.
Assure the ground trace between the module and the (U)SIM card connector short and wide. Keep
the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.
Make sure the bypass capacitor between USIM_VDD and USIM_GND is less than 1uF, and be
placed as close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB,
USIM_GND can be connected to PCB ground directly.
To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic
capacitance not exceeding 15pF. The 0Ω resistors should be added in series between the module
and the (U)SIM card so as to facilitate debugging. The 33pF capacitors are used for filtering
interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the
(U)SIM card connector.
The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.
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3.5. USB Interface
The following table shows the pin definition of USB interface.
Table 7: Pin Definition of USB Interface
EG25-G Mini PCIe is compliant with USB 2.0 specification. It can only be used as a slave device.
Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is
used for AT command communication, data transmission, GNSS NMEA output, software debugging,
firmware upgrade and voice over USB*. The following figure shows a reference circuit of USB interface.
USB_DP
USB_DM
GND
USB_DP
USB_DM
GND
L1
Close to Module
R3
R4
Test Points
ESD Array
NM_0R
NM_0R
Minimize these stubs
Module
MCU
USB_VBUS
VDD
Figure 6: Reference Circuit of USB Interface
A common mode choke L1 is recommended to be added in series between the module and customer’s
MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be
added in series between the module and the test points so as to facilitate debugging, and the resistors are
not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components
must be placed close to the module, and also these resistors should be placed close to each other. The
extra stubs of trace must be as short as possible.
Pin No.
Pin Name
I/O
Description
Comment
36
USB_DM
IO
USB differential data (-)
Require differential impedance of 90Ω
38
USB_DP
IO
USB differential data (+)
Require differential impedance of 90Ω
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The following principles should be complied with when design the USB interface, so as to meet USB 2.0
specification.
It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90Ω.
Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
Pay attention to the influence of junction capacitance of ESD protection components on USB data
lines. Typically, the capacitance value should be less than 2pF.
Keep the ESD protection components as close to the USB connector as possible.
1. There are three preconditions when enabling EG25-G Mini PCIe to enter into the sleep mode:
a) Execute AT+QSCLK=1 command to enable the sleep mode. Please refer to document [2] for
details.
b) DTR pin should be kept at high level (pull-up internally).
c) USB interface on Mini PCIe must be connected with the USB interface of the host and please
guarantee the USB of the host is in suspension state.
2. “*” means under development.
3.6. UART Interface
The following table shows the pin definition of the main UART interface.
Table 8: Pin Definition of Main UART Interface
The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and
230400bps baud rates, and the default is 115200bps. This interface can be used for AT command
communication and data transmission.
Pin No.
Pin Name
I/O
Power Domain
Description
11
UART_RX
DI
3.3V
UART receive data
13
UART_TX
DO
3.3V
UART transmit data
23
UART_CTS
DI
3.3V
UART clear to send
25
UART_RTS
DO
3.3V
UART request to send
NOTES
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AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be
used to set the hardware flow control (hardware flow control is disabled by default). Please refer to
document [2] for details.
3.7. PCM and I2C Interfaces
EG25-G Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface.
The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec
design.
Table 9: Pin Definition of PCM and I2C Interfaces
EG25-G Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the
following modes:
Primary mode (short frame synchronization, works as either master or slave)
Auxiliary mode (long frame synchronization, works as master only)
1. “*” means under development.
2.
1)
The digital audio (PCM) function is only supported on Telematics version.
Pin No.
Pin Name
I/O
Power Domain
Description
45
PCM_CLK 1)
IO
1.8V
PCM clock signal
47
PCM_DOUT 1)
DO
1.8V
PCM data output
49
PCM_DIN 1)
DI
1.8V
PCM data input
51
PCM_SYNC 1)
IO
1.8V
PCM frame synchronization
30
I2C_SCL
DO
1.8V
I2C serial clock.
Require external pull-up to 1.8V.
32
I2C_SDA
IO
1.8V
I2C serial data.
Require external pull-up to 1.8V.
NOTE
NOTES
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In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128KHz,
256KHz, 512KHz, 1024KHz and 2048KHz for different speed codecs. The following figure shows the
timing relationship in primary mode with 8KHz PCM_SYNC and 2048KHz PCM_CLK.
PCM_CLK
PCM_SYNC
PCM_DOUT
MSB
LSB
MSB
125us
1 2 256255
PCM_DIN
MSB
LSBMSB
Figure 7: Timing in Primary Mode
In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge; while the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a
128KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC only. The following figure shows the timing
relationship in auxiliary mode with 8KHz PCM_SYNC and 128KHz PCM_CLK.
PCM_CLK
PCM_SYNC
PCM_DOUT
MSB
LSB
PCM_DIN
125us
MSB
1 2 1615
LSB
Figure 8: Timing in Auxiliary Mode
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Clock and mode can be configured by AT command, and the default configuration is master mode using
short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. In addition, EG25-G
Mini PCIe’s firmware has integrated the configuration on some PCM codec’s application with I2C interface.
Please refer to document [2] for details about AT+QDAI command.
The following figure shows a reference design of PCM interface with an external codec IC.
PCM_DIN
PCM_DOUT
PCM_SYNC
PCM_CLK
I2C_SCL
I2C_SDA
Module
1.8V
4.7K
4.7K
BCLK
LRCK
DAC
ADC
SCL
SDA
BIAS
MICBIAS
INP
INN
LOUTP
LOUTN
Codec
Figure 9: Reference Circuit of PCM Application with Audio Codec
3.8. Control and Indicator Signals
The following table shows the pin definition of control and indicator signals.
Table 10: Pin Definition of Control and Indicator Signals
Pin No.
Pin Name
I/O
Power Domain
Description
17
RI
DO
3.3V
Output signal to wake up the host.
31
DTR
DI
3.3V
Sleep mode control
20
W_DISABLE#
DI
3.3V
Airplane mode control; pull-up by default;
active low.
22
PERST#
DI
3.3V
Fundamental reset signal; active low.
42
LED_WWAN#
OC
LED signal for indicating the network
status of the module; active low
1
WAKE#
OC Output signal to wake up the host.
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3.8.1. RI Signal
The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors
on the RI pin after executing AT+QCFG=“risignaltype”,“physical” command.
High
Low
120ms
URC return
Figure 10: RI Behavior
3.8.2. DTR Signal
The DTR signal supports sleep control function. Driving it to low level will wake up the module.
3.8.3. W_DISABLE# Signal
EG25-G Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (not include
GNSS).
W_DISABLE# signal function is disabled by default, and AT+QCFG=“airplanecontrol”,1 can be used to
enable this function. The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module
enter into airplane mode.
AT+CFUN can also be used to control the RF status, and the details are as follows:
Table 11: RF Function Status
W_DISABLE1# Level
AT Commands
RF Function Status
High Level
AT+CFUN=1
Enabled
High Level
AT+CFUN=0
AT+CFUN=4
Disabled
Low Level
AT+CFUN=0
AT+CFUN=1
AT+CFUN=4
Disabled
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3.8.4. PERST# Signal
The PERST# signal can be used to force a hardware reset on the card. Customers can reset the module
by driving the PERST# to a low level voltage with the time frame of 150ms~460ms and then releasing it.
The reset scenario is illustrated in the following figure.
VIL≤0.5V
VIH≥2.3V
VCC_3V3
≥150ms
Resetting
Module
Status
Running
PERST#
Restart
≤460ms
Figure 11: Timing of Resetting Module
3.8.5. LED_WWAN# Signal
The LED_WWAN# signal of EG25-G Mini PCIe is used to indicate the network status of the module, and
can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the
LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN#
output signal is active low.
LED_WWAN#
VCC
R
Figure 12: LED_WWAN# Signal Reference Circuit Diagram
There are two indication modes for LED_WWAN# signal to indicate network status, which can be
switched through following AT commands:
AT+QCFG=“ledmode”,0 (Default setting)
AT+QCFG=“ledmode”,2
The following tables show the detailed network status indications of the LED_WWAN# signal.
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Table 12: Indications of Network Status (AT+QCFG=“ledmode”,0, Default Setting)
Pin Status
Description
Flicker slowly (200ms High/1800ms Low)
Network searching
Flicker slowly (1800ms High/200ms Low)
Idle
Flicker quickly (125ms High/125ms Low)
Data transfer is ongoing
Always High
Voice calling
Table 13: Indications of Network Status (AT+QCFG=“ledmode”,2)
Pin Status
Description
Low Level (Light on)
Registered on network
High-impedance (Light off)
No network coverage or not registered
W_DISABLE# signal is at low level.
(Disable the RF)
AT+CFUN=0, AT+CFUN=4
3.8.6. WAKE# Signal
The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and
AT+QCFG=“risignaltype”,“physical” command are required. When a URC returns, there will be 120ms
low level pulse output as below.
URC return
120ms
High
Low
(external
pull-up)
Figure 13: WAKE# Behavior
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3.9. Antenna Interfaces
EG25-G Mini PCIe antenna interfaces include a main antenna interface, an Rx-diversity antenna interface
and a GNSS antenna interface. Rx-diversity function is enabled by default.
3.9.1. Antenna Requirements
The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
Table 14: Antenna Requirements
Type
Requirements
GNSS
Frequency range: 1559MHz~1609MHz
Polarization: RHCP or linear
VSWR: < 2 (Typ.)
Passive antenna gain: > 0dBi
Active antenna noise figure: <1.5dB
Active antenna gain: > -2dBi
Active antenna embedded LNA gain: 20dB (Typ.)
Active antenna total gain: > 18dBi (Typ.)
GSM/UMTS/LTE
VSWR: ≤ 2
Gain: 1dBi
Max Input Power: 50W
Input Impedance: 50Ω
Polarization Type: Vertical
Cable Insertion Loss: < 1dB
(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE B5/B8/B12/B13/
B18/B19/B20/B26/B28)
Cable Insertion Loss: < 1.5dB
(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B25/B39)
Cable insertion loss: < 2dB
(LTE B7/B38/B40/B41)
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3.9.2. Recommended RF Connector for Antenna Installation
EG25-G Mini PCIe is mounted with 2mm × 2mm RF connectors for convenient antenna connection. The
dimensions of the RF connectors are shown as below.
Figure 14: Dimensions of the RF Connectors (Unit: mm)
U.FL-LP mating plugs listed in the following figure can be used to match the RF connectors.
Figure 15: Mechanicals of U.FL-LP Mating Plugs
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The following figure describes the space factor of mating plugs.
Figure 16: Space Factor of Mating Plugs (Unit: mm)
For more details, please visit http://www.hirose.com.
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4 Electrical, Reliability and Radio
Characteristics
4.1. General Description
This chapter mainly describes the following electrical and radio characteristics of EG25-G Mini PCIe:
Power supply requirements
I/O requirements
RF characteristics
GNSS receiver
ESD characteristics
Thermal consideration
Current consumption
4.2. Power Supply Requirements
The input voltage of EG25-G Mini PCIe is 3.3V±9%, as specified by PCI Express Mini CEM Specifications
1.2. The following table shows the power supply requirements of EG25-G Mini PCIe.
Table 15: Power Supply Requirements
Parameter
Description
Min.
Typ.
Max.
Unit
VCC_3V3
Power Supply
3.0
3.3
3.6
V
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4.3. I/O Requirements
The following table shows the I/O requirements of EG25-G Mini PCIe.
Table 16: I/O Requirements
1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to
VCC_3V3 power domain.
2. The maximum voltage value of V
IL
for PERST# signal and W_DISABLE# signal is 0.5V.
4.4. RF Characteristics
The following tables show the conducted RF output power and receiving sensitivity of EG25-G Mini PCIe
module.
Table 17: EG25-G Mini PCIe Conducted RF Output Power
Parameter
Description
Min.
Max.
Unit
VIH
Input High Voltage
0.7 × VCC_3V3
VCC_3V3 + 0.3
V
VIL
Input Low Voltage
-0.3
0.3 × VCC_3V3
V
VOH
Output High Voltage
VCC_3V3 - 0.5
VCC_3V3
V
VOL
Output Low Voltage
0
0.4 V Frequency
Max.
Min.
GSM850/EGSM900
33dBm±2dB
5dBm±5dB
DCS1800/PCS1900
30dBm±2dB
0dBm±5dB
GSM850/EGSM900 (8-PSK)
27dBm±3dB
5dBm±5dB
DCS1800/PCS1900 (8-PSK)
26dBm±3dB
0dBm±5dB
WCDMA B1/B2/B4/B5/B6/B8/B19
24dBm+1/-3dB
< -49dBm
LTE-FDD B1/B2/B3/B4/B5/B7/B8/B12
23dBm±2dB
< -39dBm
NOTES
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Table 18: EG25-G Mini PCIe Conducted RF Receiving Sensitivity
LTE-FDD B13/B18/B19/B20/B25/B26/B28
23dBm±2dB
< -39dBm
LTE-TDD B38/B39/B40/B41
23dBm±2dB
< -39dBm
Frequency
Primary
Diversity
SIMO
3GPP (SIMO)
GSM850
-108dBm
NA
NA
-102dBm
EGSM900
-108dBm
NA
NA
-102dBm
DCS1800
-107.5dBm
NA
NA
-102dBm
PCS1900
-107.5dBm
NA
NA
-102dBm
WCDMA B1
-108.2dBm
-108.5dBm
-109.2dBm
-106.7dBm
WCDMA B2
-109.5dBm
-109dBm
-110dBm
-104.7dBm
WCDMA B4
-108.5dBm
-109dBm
-109.7dBm
-103.7dBm
WCDMA B5
-109dBm
-109.5dBm
-110dBm
-104.7dBm
WCDMA B6
-109dBm
-109.5dBm
-110.5dBm
-106.7dBm
WCDMA B8
-109.2dBm
-109.5dBm
-110.5dBm
-103.7dBm
WCDMA B19
-109dBm
-109.5dBm
-110.5dBm
-106.7dBm
LTE-FDD B1 (10M)
-97.3dBm
-98.3dBm
-99.5dBm
-96.3dBm
LTE-FDD B2 (10M)
-98dBm
-99dBm
-99.9dBm
-94.3dBm
LTE-FDD B3 (10M)
-97.4dBm
-98.1dBm
-99.8dBm
-93.3dBm
LTE-FDD B4 (10M)
-97.7dBm
-98.2dBm
-99.7dBm
-96.3dBm
LTE-TDD B5 (10M)
-98dBm
-98.5dBm
-99.9dBm
-94.3dBm
LTE-TDD B7 (10M)
-97.3dBm
-97.3dBm
-99.1dBm
-94.3dBm
LTE-TDD B8 (10M)
-98dBm
-98.1dBm
-99.8dBm
-93.3dBm
LTE-TDD B12 (10M)
-98dBm
-98.1dBm
-99.9dBm
-93.3dBm
LTE-TDD B13 (10M)
-98dBm
-98.1dBm
-100.1dBm
-93.3dBm
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4.5. GNSS Receiver
EG25-G Mini PCIe integrates a GNSS receiver that supports IZat Gen 8C Lite of Qualcomm (GPS,
GLONASS, BeiDou, Galileo, QZSS). Meanwhile, it supports Qualcomm gpsOneXTRA technology (one
kind of A-GNSS). This technology will download XTRA file from the internet server to enhance the TTFF.
XTRA file contains predicted GPS and GLONASS satellites coordinates and clock biases valid for up to 7
days. It is best if XTRA file is downloaded every 1~2 days. Additionally, EG25-G Mini PCIe can support
standard NMEA-0183 protocol and output NMEA messages with 1Hz via USB NMEA interface.
EG25-G Mini PCIe’s GNSS engine is switched off by default. Customers must switch on it by AT
command. Please refer to document [3] for more details about GNSS engine technology and
configurations. A passive antenna should be used for the GNSS engine.
LTE-TDD B18 (10M)
-98dBm
-99.5dBm
-100dBm
-96.3dBm
LTE-TDD B19 (10M)
-98dBm
-99dBm
-99.8dBm
-96.3dBm
LTE-TDD B20 (10M)
-98dBm
-98.8dBm
-99.7dBm
-93.3dBm
LTE-TDD B25 (10M)
-98dBm
-98dBm
-100.2dBm
-92.8dBm
LTE-TDD B26 (10M)
-98dBm
-98.8dBm
-100dBm
-93.8dBm
LTE-TDD B28 (10M)
-98.1dBm
-98.9dBm
-99.8dBm
-94.8dBm
LTE-TDD B38 (10M)
-97.2dBm
-97.3dBm
-99.2dBm
-96.3dBm
LTE-TDD B39 (10M)
-98dBm
-98.2dBm
-99.8dBm
-96.3dBm
LTE-TDD B40 (10M)
-97.7dBm
-97.5dBm
-99.7dBm
-96.3dBm
LTE-TDD B41 (10M)
-97.2dBm
-97.2dBm
-99.3dBm
-94.3dBm
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4.6. ESD Characteristics
The following table shows the ESD characteristics of EG25-G Mini PCIe.
Table 19: ESD Characteristics of EG25-G Mini PCIe
4.7. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
On customers’ PCB design, please keep placement of the PCI Express Mini Card away from heating
sources.
Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat
dissipation performance.
The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
Add a heatsink on the top of the module and the heatsink should be designed with as many fins as
possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity
should be used between the heatsink and module.
Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to
PCB.
The following figure shows the referenced heatsink design.
Part
Contact Discharge
Air Discharge
Unit
Power Supply and GND
+/-5
+/-10
kV
Antenna Interfaces
+/-4
+/-8
kV
USB Interface
+/-4
+/-8
kV
(U)SIM Interface
+/-4
+/-8
kV
Others
+/-0.5
+/-1
kV
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Thermal Pad
Application Board
Application Board
Heatsink
Thermal Pad
EG25-G Module
EG25-G Mini PCIe
Heatsink
PCI Express Mini Card Connector
Shielding Cover
Thermal Pad
Figure 17: Referenced Heatsink Design
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to document [4].
4.8. Current Consumption
Table 20: Current Consumption of EG25-G Mini PCIe
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
Sleep state
AT+CFUN=0 (USB disconnected)
3.2
mA
EGSM @DRX=2 (USB disconnected)
4.4
mA
EGSM @DRX=5 (USB disconnected)
3.9
mA
EGSM @DRX=5 (USB suspended)
4.1
mA
NOTES
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EGSM @DRX=9 (USB disconnected)
3.7
mA
DCS1800 @DRX=2 (USB disconnected)
4.5
mA
DCS1800 @DRX=5 (USB disconnected)
3.9
mA
DCS1800 @DRX=5 (USB suspended)
4.1
mA
DCS1800 @DRX=9 (USB disconnected)
3.7
mA
WCDMA @PF=64 (USB suspended)
4.2
mA
WCDMA @PF=128 (USB disconnected)
3.9
mA
WCDMA @PF=256 (USB disconnected)
3.6
mA
WCDMA @ PF=512 (USB disconnected)
3.5
mA
LTE-FDD @PF=32 (USB disconnected)
6.4
mA
LTE-FDD @PF=64 (USB disconnected)
4.9
mA
LTE-FDD @PF=64 (USB suspended)
5.1
mA
LTE-FDD @PF=128 (USB disconnected)
4.2
mA
LTE-FDD @PF=256 (USB disconnected)
4.0
mA
LTE-TDD @PF=32 (USB disconnected)
6.5
mA
LTE-TDD @PF=64 (USB disconnected)
5.2
mA
LTE-TDD @PF=64 (USB suspended)
5.3
mA
LTE-TDD @PF=128 (USB disconnected)
4.4
mA
LTE-TDD @PF=256 (USB disconnected)
4.1
mA
Idle state
EGSM DRX=5 (USB disconnected)
25
mA
EGSM DRX=5 (USB connected)
36
mA
WCDMA @PF=64 (USB disconnected)
24
mA
WCDMA @PF=64 (USB connected)
37
mA
LTE-FDD @PF=64 (USB disconnected)
16
mA
LTE-FDD @PF=64 (USB connected)
30
mA
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LTE-TDD @PF=64 (USB disconnected)
16
mA
LTE-TDD @PF=64 (USB connected)
30
mA
GPRS data transfer
(GNSS OFF)
GSM850 1UL/4DL @32.5dBm
285
mA
GSM850 2UL/3DL @32.3dBm
370
mA
GSM850 3UL/2DL @30.2dBm
470
mA
GSM850 4UL/1DL @29.1dBm
600
mA
EGSM900 1UL/4DL @32.3dBm
275
mA
EGSM900 2UL/3DL @32.2dBm
370
mA
EGSM900 3UL/2DL @30.1dBm
545
mA
EGSM900 4UL/1DL @28.9dBm
605
mA
DCS1800 1UL/4DL @29.7dBm
190
mA
DCS1800 2UL/3DL @29.5dBm
290
mA
DCS1800 3UL/2DL @29.4dBm
400
mA
DCS1800 4UL/1DL @29.3dBm
490
mA
PCS1900 1UL/4DL @29.6dBm
195
mA
PCS1900 1UL/4DL @29.4dBm
295
mA
PCS1900 1UL/4DL @29.2dBm
398
mA
PCS1900 1UL/4DL @29.0dBm
500
mA
EDGE data transfer
(GNSS OFF)
GSM850 1UL/4DL @27.1dBm
198
mA
GSM850 2UL/3DL @26.74dBm
370
mA
GSM850 3UL/2DL @26.5dBm
530
mA
GSM850 4UL/1DL @26.2dBm
610
mA
EGSM900 1UL/4DL @26.2dBm
199
mA
EGSM900 2UL/3DL @26.3dBm
365
mA
EGSM900 3UL/2DL @26.5dBm
535
mA
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EGSM900 4UL/1DL@26.4dBm
598
mA
DCS18001UL/4DL @26.0dBm
170
mA
DCS1800 2UL/3DL @25.6dBm
280
mA
DCS1800 3UL/2DL @25.4dBm
370
mA
DCS1800 4UL/1DL @25.2dBm
460
mA
PCS1900 1UL/4DL @25.6dBm
180
mA
PCS1900 1UL/4DL @25.6dBm
270
mA
PCS1900 1UL/4DL @25.5dBm
365
mA
PCS1900 1UL/4DL @25.2dBm
460
mA
WCDMA
data transfer
(GNSS OFF)
WCDMA B1 HSDPA @22.0dBm
600
mA
WCDMA B2 HSDPA @22.1dBm
600
mA
WCDMA B4 HSDPA @22.1dBm
600
mA
WCDMA B5 HSDPA @22.3dBm
530
mA
WCDMA B6 HSUPA @22.2dBm
510
mA
WCDMA B8 HSDPA @22.5dBm
580
mA
WCDMA B19 HSUPA @22.4dBm
510
mA
LTE data transfer
(GNSS OFF)
LTE-FDD B1 @22.9dBm
710
mA
LTE-FDD B2 @23.0dBm
800
mA
LTE-FDD B3 @23.1dBm
770
mA
LTE-FDD B4 @22.9dBm
760
mA
LTE-FDD B5 @23.0dBm
700
mA
LTE-FDD B7 @22.9dBm
730
mA
LTE-FDD B8 @23.2dBm
780
mA
LTE-FDD B12 @23.1dBm
670
mA
LTE-FDD B13 @23.0dBm
820
mA
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LTE-FDD B18 @23.2dBm
800
mA
LTE-FDD B19 @23.1dBm
720
mA
LTE-FDD B20 @23.0dBm
730
mA
LTE-FDD B25 @22.9dBm
720
mA
LTE-FDD B26 @23.0dBm
740
mA
LTE-FDD B28 @23.1dBm
720
mA
LTE-TDD B38 @22.8dBm
430
mA
LTE-TDD B39 @23.0dBm
370
mA
LTE-TDD B40 @22.8dBm
370
mA
LTE-TDD B41 @22.9dBm
440
mA
GSM voice call
GSM850PCL=5 @32.6dBm
300
mA
EGSM900PCL=5 @32.6dBm
299
mA
DCS1800PCL=0 @29.5dBm
200
mA
PCS1900PCL=0 @29.5dBm
189
mA
WCDMA
voice call
WCDMA B1 @22.7dBm
630
mA
WCDMA B2 @22.8dBm
650
mA
WCDMA B4 @22.7dBm
620
mA
WCDMA B5 @22.8dBm
580
mA
WCDMA B6 @22.8dBm
580
mA
WCDMA B8 @22.9dBm
620
mA
WCDMA B19 @22.8dBm
560
mA
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Table 21: GNSS Current Consumption of EG25-G Mini PCIe
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
(GNSS)
Searching
(AT+CFUN=0)
Cold start @Passive Antenna
61
mA
Lost state @Passive Antenna
59
mA
Tracking
(AT+CFUN=0)
Instrument Environment
39
mA
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5 Dimensions and Packaging
5.1. General Description
This chapter mainly describes mechanical dimensions as well as packaging specification of EG25-G Mini
PCIe module. All dimensions are measured in mm. The tolerances for dimensions without tolerance
values are ±0.05mm.
5.2. Mechanical Dimensions of EG25-G Mini PCIe
Figure 18: Mechanical Dimensions of EG25-G Mini PCIe
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5.3. Standard Dimensions of Mini PCI Express
The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]
for detailed A and B.
Figure 19: Standard Dimensions of Mini PCI Express
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EG25-G Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and
standards listed in the document [1]. The following figure takes the Molex 679100002 as an example.
Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679100002)
5.4. Packaging
The EG25-G Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules. The smallest package
of EG25-G Mini PCIe contains 100pcs.
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6 Appendix References
Table 22: Related Documents
Table 23: Terms and Abbreviations
SN
Document Name
Remark
[1]
PCI Express Mini Card Electromechanical
Specification Revision 1.2
Mini PCI Express specification
[2]
Quectel_EC2x&EG2x-G_AT_Commands_Manual
AT commands manual for EC25, EC21,
EG25-G and EG21-G modules
[3]
Quectel_EC2x&EGxx&EM05_GNSS_AT_Commands
_ Manual
GNSS AT commands manual for EC25,
EC21, EC20 R2.0, EC20 R2.1, EG91-NA,
EG95-NA, EG61-NA, EG25-G, EG21-G
and EM05 modules
[4]
Quectel_LTE_Module_Thermal_Design_Guide
Thermal design guide for LTE modules
including EC25, EC21, EC20 R2.0, EC20
R2.1, EG91, EG95, EP06, EG06, EM06
and AG35.
Abbreviation
Description
AMR
Adaptive Multi-rate
bps
Bits Per Second
CS
Coding Scheme
CTS
Clear to Send
DC-HSPA+
Dual-carrier High Speed Packet Access
DFOTA
Delta Firmware Upgrade Over-The-Air
DL
Down Link
DTE
Data Terminal Equipment
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DTR
Data Terminal Ready
EFR
Enhanced Full Rate
EMI
Electro Magnetic Interference
ESD
Electrostatic Discharge
ESR
Equivalent Series Resistance
FDD
Frequency Division Duplexing
FR
Full Rate
GLONASS
GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global
Navigation Satellite System
GMSK
Gaussian Minimum Shift Keying
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
GSM
Global System for Mobile Communications
HR
Half Rate
kbps
Kilo Bits Per Second
LED
Light Emitting Diode
LTE
Long-Term Evolution
Mbps
Million Bits Per Second
MCU
Micro Control Unit
ME
Mobile Equipment
MIMO
Multiple-Input Multiple-Output
MMS
Multimedia Messaging Service
MO
Mobile Originated
MT
Mobile Terminated
NMEA
National Marine Electronics Association
PCM
Pulse Code Modulation
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PDA
Personal Digital Assistant
PDU
Protocol Data Unit
POS
Point of Sale
PPP
Point-to-Point Protocol
RF
Radio Frequency
RTS
Ready To Send
Rx
Receive Direction
SIMO
Single Input Multiple Output
SMS
Short Message Service
TX
Transmitting Direction
TVS
Transient Voltage Suppressor
UART
Universal Asynchronous Receiver & Transmitter
UL
Up Link
URC
Unsolicited Result Code
USB
Universal Serial Bus
(U)SIM
(Universal) Subscriber Identification Module
WCDMA
Wideband Code Division Multiple Access
WLAN
Wireless Local Area Networks
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IC & FCC Requirement
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based
timeaveraging
duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements
of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body
and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR201903EG25G
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
Operating Band
FCC Max Antenna Gain（dBi）
IC Max Antenna Gain（dBi）
GSM850
8.60
7.44
GSM1900
10.19
10.19
WCDMA BAND II
8.00
8.00
WCDMA BAND IV
5.00
5.00
WCDMA BAND V
9.42
8.26
LTE BAND 2
8.00
8.00
LTE BAND 4
5.00
5.00
LTE BAND 5
9.41
8.25
LTE BAND 7
8.00
8.00
LTE BAND 12
8.70
7.76
LTE BAND 13
9.16
8.09
LTE BAND 25
8.00
8.00
LTE BAND 26(814-824)
9.36
NA
LTE BAND 26(824-849)
9.41
8.25
LTE BAND 38
8.00
8.00
LTE BAND 41
8.00
8.00
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
LTE Module Series
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required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions
explaining to the OEM the labeling requirements, options and OEM user manual instructions that are
required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC
ID: XMR201903EG25G” or “Contains FCC ID: XMR201903EG25G” must be used. The host OEM user
manual must also contain clear instructions on how end users can find and/or access the module and
the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria
for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the
user that changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment. In cases where the manual is provided only in
a form other than paper, such as on a computer disk or over the Internet, the information required by
this section may be included in the manual in that alternative form, provided the user can reasonably be
expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without
a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring
that the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
IC Statement
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IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled
to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-201903EG25G” or “where: 10224A-201903EG25G is the module’s certification
number”.
Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module
doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la
même signification, comme suit:
"Contient IC: 10224A-201903EG25G " ou "où: 10224A-201903EG25G est le numéro de certification du
module".
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