Quectel Wireless Solutions 201901EM12G User Manual

EM12-G Hardware Design

LTE-A Module Series

Rev. EM12_Hardware_Design_
Date: 2018-09-28
Status: Preliminary

www.quectel.com

LTE-A Module Series

EM12-G Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: [phone]
Email: [e-mail]

Or our local office. For more information, please visit:

http://quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit:

http://quectel.com/support/technical.htm
Or email to: [e-mail]

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
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COPYRIGHT

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
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REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.

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Revision

Date

Author

Description

Draft

2018-09-28

Oscar LIU/
Reed Wang

Initial

EM12-G Hardware Design

About the Document

History

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Contents

About the Document ................................................................................................................................... 2

Contents ....................................................................................................................................................... 3

Table Index ................................................................................................................................................... 5

Figure Index ................................................................................................................................................. 6

1 Introduction .......................................................................................................................................... 7

1.1. Safety Information ..................................................................................................................... 10

2 Product Concept ................................................................................................................................ 11

2.1. General Description .................................................................................................................. 11

2.2. Key Features ............................................................................................................................. 13

2.3. Functional Diagram ................................................................................................................... 15

2.4. Evaluation Board ....................................................................................................................... 15

3 Application Interfaces ....................................................................................................................... 16

3.1. Pin Assignment ......................................................................................................................... 17

3.2. Pin Description .......................................................................................................................... 18

3.3. Power Supply ............................................................................................................................ 22

3.3.1. Decrease Voltage Drop .................................................................................................. 22

3.3.2. Reference Design for Power Supply .............................................................................. 23

3.4. Turn on and off Scenarios ......................................................................................................... 24

3.4.1. Turn on the Module ........................................................................................................ 24

3.4.1.1. Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# . 25

3.4.1.2. Turn on the Module Automatically ....................................................................... 25

3.4.2. Turn off the Module ........................................................................................................ 26

3.4.2.1. Turn off the Module Through FULL_CARD_POWER_OFF# ............................. 26

3.4.2.2. Turn off the Module via AT Command ................................................................. 27

3.5. Reset the Module ...................................................................................................................... 27

3.6. (U)SIM Interfaces ...................................................................................................................... 28

3.7. USB Interface ............................................................................................................................ 32

3.8. PCIE Interface ........................................................................................................................... 34

3.9. PCM and I2C Interfaces ............................................................................................................ 34

3.10. Control and Indicator Signals .................................................................................................... 36

3.10.1. W_DISABLE1# Signal.................................................................................................... 37

3.10.2. WWAN_LED# Signal ..................................................................................................... 38

3.10.3. WAKE_ON_WAN# Signal .............................................................................................. 38

3.10.4. DPR Signal ..................................................................................................................... 39

3.11. Tunable Antenna Control Interface* .......................................................................................... 40

3.12. Configuration Pins ..................................................................................................................... 40

4 GNSS Receiver ................................................................................................................................... 42

4.1. General Description .................................................................................................................. 42

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5 Antenna Interfaces ............................................................................................................................. 43

5.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 43

5.1.1. Operating Frequency ..................................................................................................... 44

5.2. GNSS Antenna Interface ........................................................................................................... 45

5.3. Antenna Installation .................................................................................................................. 46

5.3.1. Antenna Requirements .................................................................................................. 46

5.3.2. Recommended RF Connector for Antenna Installation ................................................. 46

6 Electrical, Reliability and Radio Characteristics ............................................................................ 50

6.1. Absolute Maximum Ratings ...................................................................................................... 50

6.2. Power Supply Requirements .................................................................................................... 50

6.3. I/O Requirements ...................................................................................................................... 51

6.4. Operation and Storage Temperatures ...................................................................................... 51

6.5. Current Consumption(TBD) ...................................................................................................... 52

6.6. RF Output Power ...................................................................................................................... 52

6.7. RF Receiving Sensitivity ........................................................................................................... 52

6.8. ESD Characteristics .................................................................................................................. 54

6.9. Thermal Dissipation .................................................................................................................. 54

7 Mechanical Dimensions and Packaging ......................................................................................... 56

7.1. Mechanical Dimensions of the Module ..................................................................................... 56

7.2. Standard Dimensions of M.2 PCI Express ............................................................................... 57

7.3. Design Effect Drawings of the Module ...................................................................................... 58

7.4. M.2 Connector ........................................................................................................................... 58

7.5. Barcode Rule ............................................................................................................................ 58

7.6. Packaging ................................................................................................................................. 59

8 Appendix References ........................................................................................................................ 61

1

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Table Index

TABLE 1: FREQUENCY BANDS AND GNSS TYPE OF EM12 MODULE ........................................................ 11

TABLE 2: KEY FEATURES OF EM12 ............................................................................................................... 13

TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 18

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 18

TABLE 5: DEFINITION OF VCC AND GND PINS............................................................................................. 22

TABLE 6: DEFINITION OF FULL_CARD_POWER_OFF# PIN ........................................................................ 24

TABLE 7: RESET# PIN DEFINITION ................................................................................................................ 27

TABLE 8: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 29

TABLE 9: PIN DEFINITION OF USB INTERFACE ........................................................................................... 32

TABLE 10: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 35

TABLE 11: LIST OF CONTROL AND INDICATOR SIGNALS ........................................................................... 37

TABLE 12: RF FUNCTION STATUS ................................................................................................................. 37

TABLE 13: NETWORK STATUS INDICATIONS OF WWAN_LED# SIGNAL ................................................... 38

TABLE 14: STATE OF THE WAKE_ON_WAN# SIGNAL .................................................................................. 38

TABLE 15: FUNCTION OF THE DPR SIGNAL ................................................................................................. 39

TABLE 16: PIN DEFINITION OF TUNABLE ANTENNA CONTROL INTERFACE* .......................................... 40

TABLE 17: PIN DEFINITION OF CONFIGURATION PINS .............................................................................. 40

TABLE 18: LIST OF CONFIGURATION PINS .................................................................................................. 41

TABLE 19: EM12 OPERATING FREQUENCIES .............................................................................................. 44

TABLE 20: GNSS FREQUENCY ....................................................................................................................... 45

TABLE 21: ANTENNA REQUIREMENTS .......................................................................................................... 46

TABLE 22: MAJOR SPECIFICATIONS OF THE RF CONNECTOR ................................................................. 47

TABLE 23: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 50

TABLE 24: POWER SUPPLY REQUIREMENTS .............................................................................................. 50

TABLE 25: I/O REQUIREMENTS ...................................................................................................................... 51

TABLE 26: OPERATION AND STORAGE TEMPERATURES .......................................................................... 51

TABLE 27: RF OUTPUT POWER ..................................................................................................................... 52

TABLE 28: EM12 CONDUCTED RF RECEIVING SENSITIVITY ..................................................................... 52

TABLE 29: ELECTROSTATIC DISCHARGE CHARACTERISTICS (TEMPERATURE: 25ºC, HUMIDITY: 40%)

................................................................................................................................................................... 54

TABLE 30: RELATED DOCUMENTS ................................................................................................................ 61

TABLE 31: TERMS AND ABBREVIATIONS ...................................................................................................... 61

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15

FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 17

FIGURE 3: POWER SUPPLY LIMITS DURING RADIO TRANSMISSION ....................................................... 23

FIGURE 4: REFERENCE CIRCUIT OF VCC .................................................................................................... 23

FIGURE 5: REFERENCE DESIGN OF POWER SUPPLY ............................................................................... 24

FIGURE 6: TURN ON THE MODULE THROUGH GPIO CONTROLLED FULL_CARD_POWER_OFF# ....... 25

FIGURE 7: TURN ON THE MODULE AUTOMATICALLY ................................................................................. 25

FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 26

FIGURE 9: TIMING OF TURNING OFF THE MODULE THROUGH FULL_CARD_POWER_OFF# ............... 26

FIGURE 10: REFERENCE CIRCUIT OF RESET# BY USING DRIVING CIRCUIT ......................................... 27

FIGURE 11: REFERENCE CIRCUIT OF RESET# BY USING BUTTON ......................................................... 28

FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 28

FIGURE 13: REFERENCE CIRCUIT OF NORMALLY SHORT-CIRCUITED (U)SIM CARD CONNECTOR ... 30

FIGURE 14: REFERENCE CIRCUIT OF NORMALLY OPEN (U)SIM CARD CONNECTOR .......................... 30

FIGURE 15: REFERENCE CIRCUIT OF A 6-PIN (U)SIM CARD CONNECTOR ............................................. 31

FIGURE 16: REFERENCE CIRCUIT OF USB 2.0 & 3.0 INTERFACE ............................................................. 33

FIGURE 17: PRIMARY MODE TIMING ............................................................................................................ 35

FIGURE 18: AUXILIARY MODE TIMING .......................................................................................................... 35

FIGURE 19: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 36

FIGURE 20: WWAN_LED# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 38

FIGURE 21: WAKE_ON_WAN# BEHAVIOR .................................................................................................... 39

FIGURE 22: WAKE_ON_WAN# SIGNAL REFERENCE CIRCUIT DESIGN .................................................... 39

FIGURE 23: ANTENNA INTERFACES ON THE MODULE .............................................................................. 43

FIGURE 24: EM12 RF CONNECTOR DIMENSIONS (UNIT: MM) ................................................................... 47

FIGURE 25: SPECIFICATIONS OF MATING PLUGS USING Ø0.81MM COAXIAL CABLES ......................... 48

FIGURE 26: CONNECTION BETWEEN RF CONNECTOR AND MATING PLUG USING Ø0.81MM COAXIAL

CABLE ....................................................................................................................................................... 48

FIGURE 27: CONNECTION BETWEEN RF CONNECTOR AND MATING PLUG USING Ø1.13MM COAXIAL

CABLE ....................................................................................................................................................... 49

FIGURE 28: THERMAL DISSIPATION AREA ON BOTTOM SIDE OF MODULE (TOP VIEW) ....................... 55

FIGURE 29: MECHANICAL DIMENSIONS OF EM12 (UNIT: MM) ................................................................... 56

FIGURE 30: STANDARD DIMENSIONS OF M.2 TYPE 3042-S3 (UNIT: MM) ................................................. 57

FIGURE 31: M.2 NOMENCLATURE ................................................................................................................. 57

FIGURE 32: TOP VIEW OF THE MODULE ...................................................................................................... 58

FIGURE 33: TRAY SIZE .................................................................................................................................... 59

FIGURE 34: TRAY PACKAGING PROCEDURE .............................................................................................. 60

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1 Introduction

This document defines EM12 module and describes its air interface and hardware interfaces which are
connected with customers’ applications.

This document can help customers to quickly understand the interface specifications, electrical and
mechanical details, as well as other related information of EM12 module. To facilitate its application in
different fields, reference design is also provided for customers’ reference. Associated with application
note and user guide, customers can use the module to design and set up mobile applications easily.

減少電磁波影響，請妥適使用.

The device could be used with a separation distance of 20cm to the human body.

Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EM12-G] is in

compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com

FCC Regulations:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) This device must accept any
interference received, including interference that may cause undesired operation.

This device has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiated
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will
not occur in a particular installation If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is

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encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.

-Consult the dealer or an experienced radio/TV technician for help.

Caution: Changes or modifications not expressly approved by the party responsible for compliance
could void the user‘s authority to operate the equipment.

RF Exposure Information

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In
order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity
to the antenna shall not be less than 20cm (8 inches) during normal operation.

ISED Notice

This device complies with Innovation, Science and Economic Development Canada license-exempt
RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired
operation of the device.

Le présent appareil est conforme aux CNR Innovation, Sciences et Développement économique
Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux
conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en

This device complies with the Canadian ICES-003 Class B specifications.
CAN ICES-3(B)/ NMB-3(B)

ISED Radiation Exposure Statement

This device complies with RSS-102 radiation exposure limits set forth for an uncontrolled
environment. In order to avoid the possibility of exceeding the ISED radio frequency exposure limits,
human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation.

Cet appareil est conforme aux limites d'exposition aux rayonnements de la CNR-102 définies pour
un environnement non contrôlé. Afin d'éviter la possibilité de dépasser les limites d'exposition aux

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fréquences radio de la CNR-102, la proximité humaine à l'antenne ne doit pas être inférieure à 20 cm
(8 pouces) pendant le fonctionnement normal.

IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
compliance requirement of the end product, which integrates this module. 20cm minimum distance
has to be able to be maintained between the antenna and the users for the host this module is
integrated into. Under such configuration, the FCC radiation exposure limits set forth for an
population/uncontrolled environment can be satisfied.

Any changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment.

USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm
separation with the antenna while this end product is installed and operated. The end user has to be
informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be
satisfied. The end user has to also be informed that any changes or modifications not expressly
approved by the manufacturer could void the user's authority to operate this equipment. If the size of
the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be
available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful interference and (2) this device
must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following " Contains Transmitter
Module FCC ID: XMR201901EM12G ". If the size of the end product is larger than 8x10cm, then the
following FCC part 15.19 statement has to also be available on the label: This device complies with
Part 15 of FCC rules.

Operation is subject to the following two conditions: (1) this device may not cause harmful
interference and (2) this device must accept any interference received, including interference that
may cause undesired operation.

The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host device; otherwise, the host device must be
labeled to display the Innovation, Science and Economic Development Canada certification number
for the module, preceded by the words “Contains transmitter module IC: 10224A-201901EM12G”

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LTE-A Module Series

Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

EM12-G Hardware Design

1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EM12-G module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.

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Mode

EM12-G

LTE-FDD
(with Rx-diversity)

B1/B2/B3/B4/B5/B7/B8/B9/B12/B13/B14/B17/B18/B19/B20/B21

3

)

/B25/B26/

B28/B29/B30/B32/B66;

LTE-TDD
(with Rx-diversity)

B38/39/B40/B41

DL 2×CA

B1+3,5,18,19,20,26;
B2+2,4,5,12,13,17,29,30,66;
B3+3,5,7,8,19,20,28;
B4+4(CA_4C only),5,12,13,17,29,30;
B5+7,25,30,66;
B7+7,20,28;
B12+25,30;
B13+66;
B19+21

3

)

;
B20+B32;
B25+25,26,41
B29+30;
B38+38;
B39+39 (CA_39C only);
B39+39; B39+41

EM12-G Hardware Design

2 Product Concept

2.1. General Description

EM12-G is a LTE/UMTS/HSPA+ wireless communication module with receive diversity. It provides data
connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with
standard PCI Express M.2 interface.

EM12-G supports embedded operating systems such as Windows CE, Linux and Android, and also
provides GNSS1) and voice functionality2) to meet customers’ specific application demands.

The following table shows the frequency bands and GNSS type of EM12-G module.

Table 1: Frequency Bands and GNSS Type of EM12-G Module

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1.

1)

GNSS function is optional.

2.

2)

EM12-G contains Telematics version and Data-only version. Telematics version supports voice

and data functions, while Data-only version only supports data function.

3. 3)B21 band follow up will be developed

B40+40 (CA_40C only);
B41+41;
B66+66 (CA_66C only);12,29,30,5;
B2+B14;B14+B30;B14+B66;
(Note: B29, B32 is only for secondary component carrier)

DL 3×CA

DL inter-band 3CA:
1+3+7, 1+3+19, 1+3+20, 1+3+5, 1+3+8, 1+3+28,1+7+20,1+3+5,
2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30 ,
3+7+20, 3+7+28 , 3+7+8,
4+5+30, 4+12+30, 4+29+30 ,
5+66+2, 13+66+2,
66+12+30,66+29+30,66+5+30;
B2+B14+B66;
DL 2 intra-band plus inter-band 3CA:
2+2+5, 2+2+13 ,
3+3+7, 3+7+7, 3+3+20 , 3+3+28,3+3+1,
4+4+5, 4+4+13,
7+7+28,
5+66+66, 13+66+66, 66+66+2,
B39+B39+B41; B39+B41+B41;
B14+B66+B66
B25+B25+B26, B25+B41+B41
DL 3 intra-band 3CA:
40+40+40, 41+41+41, 66+66+66

UL CA

B3C;B7C;B38C;B40C;B41C;

WCDMA
(with Rx-diversity)

B1/B2/B3/B4/B5/B8/B9/B19

GNSS 1)

GPS, GLONASS, BeiDou, Galileo

NOTES

EM12-G Hardware Design

EM12-G can be applied in the following fields:

 Rugged Tablet PC and Laptop Computer
 Remote Monitor System
 Vehicle System

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Feature

Details

Function Interface

PCI Express M.2 Interface

Power Supply

Supply voltage: 3.135V~4.4V
Typical supply voltage: 3.7V

Transmitting Power

Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
Class 3 (24dBm+1/-3dB) for WCDMA

LTE Features

Support up to LTE Cat 12
Support 1.4MHz to 20MHz RF bandwidth
Support MIMO in DL direction

 FDD: Max 600Mbps (DL)/150Mbps (UL)
 TDD: Max 408Mbps (DL)/90Mbps (UL)

UMTS Features

Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation

 DC-HSDPA: Max 42Mbps (DL)
 HSUPA: Max 5.76Mbps (UL)
 WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)

Internet Protocol Features

Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/SMTP*
/MMS*/FTPS*/SMTPS*/SSL* protocols
Support the protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) usually used for PPP
connections

SMS

Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default

(U)SIM Interfaces

Support (U)SIM card: 1.8V, 3.0V
Include USIM1 and USIM2 interfaces
Support Dual SIM Single Standby*

EM12-G Hardware Design

 Wireless POS System
 Smart Metering System
 Wireless Router and Switch
 Other Wireless Terminal Devices

2.2. Key Features

The following table describes the detailed features of EM12-G.

Table 2: Key Features of EM12-G

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LTE-A Module Series

1. 1) Within operation temperature range, the module is 3GPP compliant.

2. 2) Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P

out

might reduce in their value and exceed the specified tolerances. When the temperature

returns to normal operating temperature levels, the module will meet 3GPP specifications again.

3. “*” means under development.

Audio Feature

Support one digital audio interface: PCM interface
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression

PCM Interface

Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization

USB Interface

Compliant with USB 3.0 and 2.0 specifications, with maximum transmission
rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0.
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output and voice
over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE

5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x

PCIE Interface*

Support PCIE interface, under development

Antenna Interface

Include main antenna, diversity antenna and GNSS antenna interfaces

Rx-diversity

Support LTE/WCDMA Rx-diversity

GNSS Features

Gen 9HT Lite of Qualcomm
Protocol: NMEA 0183

AT Commands

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands

Physical Characteristics

Size: (42.0±0.15)mm × (30.0±0.15)mm × (2.3±0.1)mm
Weight: TBD

Temperature Range

Operation temperature range: -30°C ~ +70°C

1)

Extended temperature range: -40°C ~ +85°C

2)

Storage temperature range: -40°C ~ +90°C

Firmware Upgrade

USB 2.0 interface and DFOTA*

RoHS

All hardware components are fully compliant with EU RoHS directive

NOTES

EM12-G Hardware Design

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LTE-A Module Series

Baseband

PMIC

Transceiver

ANT_MAIN

ANT_GNSS

ET

VCC

RESET#

38.4MHz
XO

Control

QLINK

Control

Tx

PRx

DRx

PCI Express

M.2 Key

-B Interface

FULL_CARD_POWER_OFF#

W_DISABLE1#

USB2.0&USB3.0

(U)SIM1&(U)SIM2

WWAN_LED#

WAKE_ON_WAN#

NAND +

DDR2 SDRAM

PCM

W_DISABLE2#

GPIOs

Tx/Rx Blocks

ANT_DIV

PCIE*

EM12-G Hardware Design

2.3. Functional Diagram

The following figure shows a block diagram of EM12-G.

2.4. Evaluation Board

In order to help customers develop applications conveniently with EM12-G, Quectel supplies the
evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and
other peripherals to control or test the module. For more details, please refer to document [1].

EM12-G_Hardware_Design 15 / 62

Figure 1: Functional Diagram

LTE-A Module Series

“*” means under development.

NOTE

EM12-G Hardware Design

3 Application Interfaces

The physical connections and signal levels of EM12-G comply with PCI Express M.2 specifications. This
chapter mainly describes the definition and application of the following interfaces/signals/pins of EM12-G:

 Power supply
 (U)SIM interfaces
 USB interface
 PCIE interface*
 PCM and I2C interfaces
 Control and indicator signals
 Tunable antenna control interface*
 Configuration pins

EM12-G_Hardware_Design 16 / 62

LTE-A Module Series

PIN2

PIN74

BOT

PIN1

PIN75

TOP

P in Nam e No.

C O N F IG _ 2 75

GND 73
GND 71

C O N F IG _ 1 69

R E S E T # 67
ANTCTL3 65
ANTCTL2 63
ANTCTL1 61
ANTCTL0 59

GND 57

P C IE _R E FC LK+ 55

P C IE _R E FC LK- 53

GND 51

P C IE _R X + 49

P C IE _R X - 47

GND 45

P C IE _TX+ 43

P C IE _TX- 41

GND 39

USB 3 .0_ R X+ 37

USB 3 .0_ R X- 35

GND 33

USB 3 .0_ T X+ 31

USB 3 .0_ T X- 29

GND 27
D P R 25

W AKE_O N_W AN# 23

C O N F IG _ 0 21

Notc h
Notc h
Notc h
Notc h

GND 11
USB _ D M 9
USB _ D P 7

GND 5

GND 3

C O N F IG _ 3 1

No. P in Nam e

74 VC C
72 VC C
70 VC C
68 NC
66 US IM1_DE T
64 RE S E R VED
62 RE S E R VED
60 RE S E R VED
58 I2C_SC L
56 I2C _S D A
54 NC
52 NC
50 NC
48 US IM2_VD D
46 U S IM 2_R E S E T
44 U S IM2_CLK
42 US IM2_DATA
40 US IM2_DE T
38 NC
36 US IM1_VD D
34 US IM1_DATA
32 U S IM1_CLK
30 U S IM 1_R E S E T
28 P C M_SYNC
26 W _D IS AB LE 2#
24 PC M _O UT
22 PC M _ IN
20 P C M _C L K

Notc h
Notc h
Notc h
Notc h

10 W W AN_L E D #

8 W _ D IS AB L E 1 #
6

F ULL_C A R D _ P O W E R_OFF#

4 VC C
2 VC C

PIN11

PIN10

EM12-G Hardware Design

3.1. Pin Assignment

The following figure shows the pin assignment of EM12-G. The top side contains EM12-G module and
antenna connectors.

EM12-G_Hardware_Design 17 / 62

Figure 2: Pin Assignment

LTE-A Module Series

Type

Description

IO

Bidirectional

DI

Digital input

DO

Digital output

OD

Open drain

PI

Power input

PO

Power output

Pin
No.

M.2 Socket 2
WWAN Module
Pinout

EM12-G
Pin Name

I/O

Description

Comment

1

CONFIG_3

CONFIG_3

Not connected internally.
EM12-G is configured as
WWAN-USB 3.0.

2 3.3V

VCC

PI

Power supply

Vmin=3.135V
Vnorm=3.7V
Vmax=4.4V

3

GND

GND

Ground

4

3.3V

VCC

PI

Power supply

Vmin=3.135V
Vnorm=3.7V
Vmax=4.4V

5

GND

GND

Ground

6

FULL_CARD_
POWER_OFF#

FULL_CARD_
POWER_OFF#

DI

A signal to control power-on/-off
of the module. When it is at low
level, the module powers off.
When it is at high level, the
module powers on.

Pulled down
internally

EM12-G Hardware Design

3.2. Pin Description

The following tables show the pin definition and description of EM12-G on the 75-pin application.

Table 3: Definition of I/O Parameters

Table 4: Pin Description

EM12-G_Hardware_Design 18 / 62