Quectel Wireless Solutions 201805EC21AU Users Manual

EC21 Hardware Design

LTE Module Series

Rev. EC21_Hardware_Design_V1.5

Date: 2017-03-05

Status: Released

www.quectel.com

LTE Module Series

EC21 Hardware Design

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About the Document

History

Revision Date Author Description

1.0 2016-04-15 Yeoman CHEN Initial

Yeoman CHEN/

1.1 2016-09-22

1.2 2016-11-04

Frank WANG/

Lyndon LIU

Lyndon LIU/

Michael ZHANG

1. Updated frequency bands in Table 1.

2. Updated transmitting power, supported maximum

baud rate of main UART, supported internet

protocols, supported USB drivers of USB interface,

and temperature range in Table 2.

3. Updated timing of turning on module in Figure 12.

4. Updated timing of turning off module in Figure 13.

5. Updated timing of resetting module in Figure 16.

6. Updated main UART supports baud rate in Chapter

3.11.

7. Added notes for ADC interface in Chapter 3.13.

8. Updated GNSS Performance in Table 21.

9. Updated operating frequencies of module in Table

23.

10. Added current consumption in Chapter 6.4.

11. Updated RF output power in Chapter 6.5.

12. Added RF receiving sensitivity in Chapter 6.6.

1. Added SGMII and WLAN interfaces in Table 2.

2. Updated function diagram in Figure 1.

3. Updated pin assignment (Top View) in Figure 2.

4. Added description of SGMII and WLAN interfaces in

Table 4.

5. Added SGMII interface in Chapter 3.17.

6. Added WLAN interface in Chapter 3.18.

7. Added USB_BOOT interface in Chapter 3.19.

8. Added reference design of RF layout in Chapter

5.1.4.

9. Added current consumption of EC21-V in Chapter

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1.3 2017-01-24

Lyndon LIU/

Rex WANG

6.4.

10. Added note about SIMO in Chapter 6.6.

1. Updated frequency bands in Table 1.

2. Updated function diagram in Figure 1.

3. Updated pin assignment (top view) in Figure 2.

4. Added BT interface in Chapter 3.18.2.

5. Updated reference circuit of wireless connectivity

interfaces with FC20 module in Figure 29.

6. Updated GNSS performance in Table 24.

7. Updated module operating frequencies in Table 26.

8. Added EC21-AUV current consumption in Table 38.

9. Updated EC21-A conducted RF receiving sensitivity

of in Table 42.

10. Added EC21-J conducted RF receiving sensitivity in

Table 48.

1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT

1. Updated functional diagram in Figure 1.

2. Updated frequency bands in Table 1.

3. Updated UMTS and GSM features in Table 2.

4. Updated description of pin 40/136/137/138.

5. Updated PWRKEY pulled down time to 500ms in

chapter 3.7.1 and reference circuit in Figure 10.

6. Updated reference circuit of (U)SIM interface in

Figure 17&18.

7. Updated reference circuit of USB interface in Figure

19.

8. Updated PCM mode in Chapter 3.12.

9. Updated USB_BOOT reference circuit in Chapter

Annice ZHANG/

1.5 2018-03-05

Lyndon LIU/

Frank WANG

3.20.

10. Added SD card interface in Chapter 3.13.

11. Updated module operating frequencies in Table 26.

12. Updated EC21 series modules current consumption

in Chapter 6.5.

13. Updated EC21 series modules conducted RF

receiving sensitivity in Chapter 6.6.

14. Added thermal consideration description in Chapter

6.8.

15. Updated dimension tolerance information in

Chapter 7.

16. Added storage temperature range in Table 2 and

Chapter 6.3.

17. Updated RF output power in Table 42.

18. Updated antenna requirements in Table 29.

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19. Updated GPRS multi-slot classes in Table 55.

20. Updated storage information in Chapter 8.1

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Contents

About the Document ................................................................................................................................ 2

Contents .................................................................................................................................................... 5

Table Index ............................................................................................................................................... 8

Figure Index ............................................................................................................................................ 10

1 Introduction ..................................................................................................................................... 12

1.1. Safety Information ................................................................................................................. 13

1.2. FCC Statement ..................................................................................................................... 14

2 Product Concept ............................................................................................................................. 16

2.1. General Description .............................................................................................................. 16

2.2. Key Features ......................................................................................................................... 17

2.3. Functional Diagram ............................................................................................................... 20

2.4. Evaluation Board ................................................................................................................... 20

3 Application Interfaces ..................................................................................................................... 21

3.1. General Description .............................................................................................................. 21

3.2. Pin Assignment ..................................................................................................................... 22

3.3. Pin Description ...................................................................................................................... 23

3.4. Operating Modes .................................................................................................................. 34

3.5.

Power Saving ........................................................................................................................ 35

3.5.1. Sleep Mode.................................................................................................................. 35

3.5.1.1. UART Application ............................................................................................... 35

3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 36

3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 37

3.5.1.4. USB Application without USB Suspend Function ............................................... 37

3.5.2. Airplane Mode .............................................................................................................. 38

3.6. Power Supply ........................................................................................................................ 39

3.6.1. Power Supply Pins ....................................................................................................... 39

3.6.2. Decrease Voltage Drop ................................................................................................ 39

3.6.3. Reference Design for Power Supply ............................................................................ 40

3.6.4. Monitor the Power Supply ............................................................................................ 41

3.7. Turn on and off Scenarios ..................................................................................................... 41

3.7.1. Turn on Module Using the PWRKEY ........................................................................... 41

3.7.2. Turn off Module ............................................................................................................ 43

3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 43

3.7.2.2. Turn off Module Using AT Command ................................................................. 44

3.8. Reset the Module .................................................................................................................. 44

3.9. (U)SIM Interface .................................................................................................................... 46

3.10. USB Interface ........................................................................................................................ 48

3.11. UART Interfaces .................................................................................................................... 50

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3.12. PCM and I2C Interfaces ........................................................................................................ 52

3.13. SD Card Interface ................................................................................................................. 54

3.14. ADC Interfaces ...................................................................................................................... 57

3.15. Network Status Indication ...................................................................................................... 57

3.16. STATUS ................................................................................................................................ 59

3.17. Behaviors of RI ..................................................................................................................... 59

3.18. SGMII Interface ..................................................................................................................... 60

3.19. Wireless Connectivity Interfaces ........................................................................................... 62

3.19.1. WLAN Interface ........................................................................................................... 65

3.19.2. BT Interface* ................................................................................................................ 65

3.20. USB_BOOT Interface ............................................................................................................ 66

4 GNSS Receiver ................................................................................................................................ 67

4.1. General Description .............................................................................................................. 67

4.2. GNSS Performance .............................................................................................................. 67

4.3. Layout Guidelines ................................................................................................................. 68

5 Antenna Interfaces .......................................................................................................................... 69

5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 69

5.1.1. Pin Definition ................................................................................................................ 69

5.1.2. Operating Frequency ................................................................................................... 69

5.1.3. Reference Design of RF Antenna Interface ................................................................. 70

5.1.4. Reference Design of RF Layout ................................................................................... 71

5.2. GNSS Antenna Interface ....................................................................................................... 73

5.3. Antenna Installation ............................................................................................................... 74

5.3.1. Antenna Requirement .................................................................................................. 74

5.3.2. Recommended RF Connector for Antenna Installation ................................................ 75

6 Electrical, Reliability and Radio Characteristics .......................................................................... 77

6.1. Absolute Maximum Ratings .................................................................................................. 77

6.2. Power Supply Ratings ........................................................................................................... 78

6.3. Operation and Storage Temperatures ................................................................................... 78

6.4. Current Consumption ............................................................................................................ 79

6.5. RF Output Power .................................................................................................................. 85

6.6. RF Receiving Sensitivity ....................................................................................................... 86

6.7. Electrostatic Discharge ......................................................................................................... 90

6.8. Thermal Consideration .........................................................................................................

. 90



7 Mechanical Dimensions.................................................................................................................. 93

7.1. Mechanical Dimensions of the Module.................................................................................. 93

7.2. Recommended Footprint ....................................................................................................... 95

7.3. Design Effect Drawings of the Module .................................................................................. 96

8 Storage, Manufacturing and Packaging ........................................................................................ 97

8.1. Storage.................................................................................................................................. 97

8.2. Manufacturing and Soldering ................................................................................................ 98

8.3. Packaging ............................................................................................................................. 99

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9 Appendix A References ................................................................................................................ 100

10 Appendix B GPRS Coding Schemes ........................................................................................... 104

11 Appendix C GPRS Multi-slot Classes .......................................................................................... 105

12 Appendix D EDGE Modulation and Coding Schemes ................................................................ 107

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Table Index

TABLE 1: FREQUENCY BANDS OF EC21 SERIES MODULE ........................................................................ 16

TABLE 2: KEY FEATURES OF EC21 MODULE ............................................................................................... 17

TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 23

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 23

TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 34

TABLE 6: VBAT AND GND PINS ....................................................................................................................... 39

TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 41

TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 45

TABLE 9: PIN DEFINITION OF THE (U)SIM INTERFACE ............................................................................... 46

TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 48

TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................. 50

TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 50

TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 51

TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 53

TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 55

TABLE 16: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 57

TABLE 17: CHARACTERISTIC OF ADC .......................................................................................................... 57

TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ...................... 58

TABLE 19: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ................... 58

TABLE 20: PIN DEFINITION OF STATUS ........................................................................................................ 59

TABLE 21: BEHAVIOR OF RI ............................................................................................................................ 60

TABLE 22: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 60

TABLE 23: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 63

TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 66

TABLE 25: GNSS PERFORMANCE ................................................................................................................. 67

TABLE 26: PIN DEFINITION OF RF ANTENNAS ............................................................................................. 69

TABLE 27: MODULE OPERATING FREQUENCIES ........................................................................................ 69

TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 73

TABLE 29: GNSS FREQUENCY ....................................................................................................................... 73

TABLE 30: ANTENNA REQUIREMENTS .......................................................................................................... 74

TABLE 31: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 77

TABLE 32: POWER SUPPLY RATINGS ........................................................................................................... 78

TABLE 33: OPERATION AND STORAGE TEMPERATURES .......................................................................... 78

TABLE 34: EC21-E CURRENT CONSUMPTION ............................................................................................. 79

TABLE 35: EC21-A CURRENT CONSUMPTION ............................................................................................. 81

TABLE 36: EC21-V CURRENT CONSUMPTION ............................................................................................. 82

TABLE 37: EC21-AUT CURRENT CONSUMPTION ........................................................................................ 82

TABLE 38: EC21-AUV CURRENT CONSUMPTION ........................................................................................ 83

TABLE 39: EC21-J CURRENT CONSUMPTION .............................................................................................. 84

TABLE 40: EC21-KL CURRENT CONSUMPTION ........................................................................................... 85

TABLE 41: GNSS CURRENT CONSUMPTION OF EC21 SERIES MODULE ................................................. 85

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TABLE 42: RF OUTPUT POWER ..................................................................................................................... 86

TABLE 43: EC21-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 86

TABLE 44: EC21-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 87

TABLE 45: EC21-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 87

TABLE 46: EC21-AUT CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 87

TABLE 47: EC21-KL CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 88

TABLE 48: EC21-J CONDUCTED RF RECEIVING SENSITIVITY................................................................... 88

TABLE 49: EC21-AUV CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 88

TABLE 50: EC21-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 89

TABLE 51: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 90

TABLE 52: RELATED DOCUMENTS .............................................................................................................. 100

TABLE 53: TERMS AND ABBREVIATIONS .................................................................................................... 100

TABLE 54: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 104

TABLE 55: GPRS MULTI-SLOT CLASSES .................................................................................................... 105

TABLE 56: EDGE MODULATION AND CODING SCHEMES ......................................................................... 107

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 20

FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 22

FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 35

FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 36

FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 37

FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 38

FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 39

FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 40

FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 41

FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 42

FIGURE 11: TURN ON THE MODULE BY USING BUTTON ........................................................................... 42

FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 43

FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 44

FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 45

FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 45

FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 46

FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 47

FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 47

FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 49

FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 51

FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 52

FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 53

FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 53

FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 54

FIGURE 25: REFERENCE CIRCUIT OF SD CARD ......................................................................................... 56

FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 58

FIGURE 27: REFERENCE CIRCUITS OF STATUS ......................................................................................... 59

FIGURE 28: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 61

FIGURE 29: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................. 62

FIGURE 30: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE

................................................................................................................................................................... 64

FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 66

FIGURE 32: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 71

FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 71

FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 72

FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE

GROUND) .................................................................................................................................................. 72

FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

GROUND) .................................................................................................................................................. 72

FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 74

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FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 75

FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 76

FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 76

FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 91

FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB) . 91

FIGURE 43: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 93

FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 94

FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 95

FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 96

FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 96

FIGURE 48: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 98

FIGURE 49: TAPE AND REEL SPECIFICATIONS ........................................................................................... 99

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1 Introduction

This document defines the EC21 module and describes its air interface and hardware interface which are

connected with customers’ applications.

This document can help customers quickly understand module interface specifications, electrical and

mechanical details, as well as other related information of EC21 module. Associated with application note

and user guide, customers can use EC21 module to design and set up mobile applications easily.

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1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,

service or repair of any cellular terminal or mobile incorporating EC21 module. Manufacturers of the cellular

terminal should send the following safety information to users and operating personnel, and incorporate

these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the

customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. You must comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden, so as

to prevent interference with communication systems. Consult the airline staff about

the use of wireless devices on boarding the aircraft, if your device offers an

Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals,clinics or other health care

facilities. These requests are desinged to prevent possible interference with

sensitive medical equipment.

Cellular terminals or mobiles operating over radio frequency signal and cellular

network cannot be guaranteed to connect in all conditions, for example no mobile

fee or with an invalid (U)SIM card. While you are in this condition and need

emergent help, please remember using emergency call. In order to make or

receive a call, the cellular terminal or mobile must be switched on and in a service

area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,

it receives and transmits radio frequency energy. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as your phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders, etc.

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1.2. FCC Statement

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile

device.

And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna

installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of

2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body

and must not transmit simultaneously with any other antenna or transmitter.

3.A label with the following statements must be attached to the host end product: This device contains FCC

ID: XMR201805EC21AU.

4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF

radiation, maximum antenna gain (including cable loss) must not exceed 4dBi

5. This module must not transmit simultaneously with any other antenna or transmitter

6. The host end product must include a user manual that clearly defines operating requirements and

conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is

required to satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all other operating

configurations, including portable configurations with respect to 2.1093 and different antenna

configurations.

For this device, OEM integrators must be provided with labeling instructions of finished products. Please

refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a

permanently affixed label, the module must be labelled withan FCC ID - Section 2.926 (see 2.2 Certification

(labelling requirements) above). The OEM manual must provide clear instructions explaining to the OEM

the labelling requirements,options and OEM user manual instructions that are required (see next

paragraph).

For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is notvisible when

installed in the host, or (2) if the host is marketed so that end users do not havestraightforward commonly

used methods for access to remove the module so that the FCC ID ofthe module is visible; then an

additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC

ID:XMR201805EC21AU” or “Contains FCC ID: XMR201805EC21AU” mustbe used. The host OEM user

manual must also contain clear instructions on how end users can find and/or access the module and the

FCC ID.

The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for

unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user

that changes or modifications not expressly approved by the party responsible for compliance could void

the user's authority to operate the equipment. In cases where the manual is provided only in a form other

than paper, such as on a computer disk or over the Internet, the information required by this section may be

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included in the manual in that alternative form, provided the user can reasonably be expected to have the

capability to access information in that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)

This device may not cause harmful interference, and (2) this device must accept any interference received,

including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to

operate the equipment.

To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring

compliance with the module(s) installed and fully operational. For example, if a host was previously

authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter

certified module and a module is added, the host manufacturer is responsible for ensuring that the after the

module is installed and operational the host continues to be compliant with the Part 15B unintentional

radiator requirements.

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2 Product Concept

2.1. General Description

EC21 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive

diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,

WCDMA, EDGE and GPRS networks. It also provides GNSS

specific applications. EC21 contains nine variants: EC21-E, EC21-A, EC21-V, EC21-AU, EC21-AUT,

EC21-AUV, EC21-J, EC21-KL and EC20-CEL. Customers can choose a dedicated type based on the

region or operator. The following table shows the frequency bands of EC21 series module.

1)

and voice functionality2) for customers’

Table 1: Frequency Bands of EC21 Series Module

Modules2) LTE Bands UMTS Bands GSM

EC21-E

EC21-A

EC21-V

EC21-AU3)

EC21-AUT

EC21-AUV

EC21-J

FDD: B1/B3/B5/B7/B8/B20

FDD: B2/B4/B12

FDD: B4/B13 N N Y

FDD: B1/B2/B3/B4/B5/B7/B8/

B28

TDD: B40

FDD: B1/B3/B5/B7/B28

FDD: B1/B3/B5/B8/B28 B1/B5/B8 N Y N

FDD: B1/B3/B8/B18/B19/B26 N N Y N

WCDMA:

B1/B5/B8

WCDMA:

B2/B4/B5

WCDMA:

B1/B2/B5/B8

WCDMA:

B1/B5

900/1800 Y

N Y

850/900/

1800/1900

N Y

Rxdiversity

Y

GNSS1)

GPS,

GLONASS,

BeiDou/

Compass,

Galileo,

QZSS

EC21-KL

EC20-CEL

EC21_Hardware_Design 16 / 105

FDD: B1/B3/B5/B7/B8 N N Y N

FDD: B1/B3/B5 N N N N

LTE Module Series

EC21 Hardware Design

NOTES

1)

1.

GNSS function is optional.

2)

2.

EC21 series module (EC21-E, EC21-A, EC21-V, EC21-AU, EC21-AUT, EC21-AUV, EC21-J,

EC21-KL and EC20-CEL) contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function.

3)

3.

B2 band on EC21-AU module does not support Rx-diversity.

4. Y = Supported. N = Not supported.

With a compact profile of 29.0mm × 32.0mm × 2.4mm, EC21 can meet almost all requirements for M2M

applications such as automotive, metering, tracking system, security, router, wireless POS, mobile

computing device, PDA phone, tablet PC, etc.

EC21 is an SMD type module which can be embedded into applications through its 144-pin pads,

including 80 LCC signal pads and 64 other pads.

2.2. Key Features

The following table describes the detailed features of EC21 module.

Table 2: Key Features of EC21 Module

Features Details

Power Supply

Transmitting Power

Supply voltage: 3.3V~4.3V

Typical supply voltage: 3.8V

Class 4 (33dBm±2dB) for GSM850

Class 4 (33dBm±2dB) for GSM900

Class 1 (30dBm±2dB) for DCS1800

Class 1 (30dBm±2dB) for PCS1900

Class E2 (27dBm±3dB) for GSM850 8-PSK

Class E2 (27dBm±3dB) for GSM900 8-PSK

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Class E2 (26dBm±3dB) for PCS1900 8-PSK

Class 3 (24dBm+1/-3dB) for WCDMA bands

Class 3 (23dBm±2dB) for LTE-FDD bands

Class 3 (23dBm±2dB) for LTE-TDD bands

Support up to non-CA Cat 1 FDD and TDD

LTE Features

Support 1.4MHz~20MHz RF bandwidth

Support MIMO in DL direction

LTE-FDD: Max 10Mbps (DL)/5Mbps (UL)

EC21_Hardware_Design 17 / 105

EC21 Hardware Design

UMTS Features

GSM Features

LTE Module Series

LTE-TDD: Max 8.96Mbps (DL)/3.1Mbps (UL)

Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA

Support QPSK, 16-QAM and 64-QAM modulation

DC-HSDPA: Max 42Mbps (DL)

HSUPA: Max 5.76Mbps (UL)

WCDMA: Max 384Kbps (DL)/384Kbps (UL)

GPRS:

Support GPRS multi-slot class 33 (33 by default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Max 107Kbps (DL)/85.6Kbps (UL)

EDGE:

Support EDGE multi-slot class 33 (33 by default)

Support GMSK and 8-PSK for different MCS (Modulation and Coding

Scheme)

Downlink coding schemes: CS 1-4 and MCS 1-9

Uplink coding schemes: CS 1-4 and MCS 1-9

Max 296Kbps (DL)/ 236.8Kbps (UL)

Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/ CMUX*/HTTPS*/

SMTP*/ MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols

Internet Protocol Features

Support PAP (Password Authentication Protocol) and CHAP (Challenge

Handshake Authentication Protocol) protocols which are usually used for

PPP connections

Text and PDU mode

SMS

Point to point MO and MT

SMS cell broadcast

SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V

Support one digital audio interface: PCM interface

GSM: HR/FR/EFR/AMR/AMR-WB

Audio Features

WCDMA: AMR/AMR-WB

LTE: AMR/AMR-WB

Support echo cancellation and noise suppression

Used for audio function with external codec

Support 8-bit A-law*, μ-law* and 16-bit linear data formats

PCM Interface

Support long frame synchronization and short frame synchronization

Support master and slave modes, but must be the master in long frame

synchronization

Compliant with USB 2.0 specification (slave only); the data transfer rate

can reach up to 480Mbps

USB Interface

Used for AT command communication, data transmission, GNSS NMEA

output, software debugging, firmware upgrade and voice over USB*

Support USB serial drivers for: Windows XP, Windows Vista, Windows

EC21_Hardware_Design 18 / 105

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EC21 Hardware Design

7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1,

Android 4.x/5.x/6.x/7.x

Main UART:

Used for AT command communication and data transmission

Baud rates reach up to 921600bps, 115200bps by default

UART Interface

Support RTS and CTS hardware flow control

Debug UART:

Used for Linux console and log output

115200bps baud rate

SD Card Interface Support SD 3.0 protocol

SGMII Interface Support 10/100/1000Mbps Ethernet connectivity

Wireless Connectivity

Interfaces

Support a low-power SDIO 3.0 interface for WLAN and UART/PCM

interface for Bluetooth*

Rx-diversity Support LTE/WCDMA Rx-diversity

GNSS Features

AT Commands

Network Indication

Antenna Interface

Physical Characteristics

Gen8C Lite of Qualcomm

Protocol: NMEA 0183

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT

commands

Two pins including NET_MODE and NET_STATUS to indicate network

connectivity status

Including main antenna interface (ANT_MAIN), Rx-diversity antenna

interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)

Size: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mm

Weight: approx. 4.9g

Operation temperature range: -35°C ~ +75°C

Temperature Range

Extended temperature range: -40°C ~ +85°C

Storage temperature range: -40°C ~ +90°C

Firmware Upgrade USB interface and DFOTA*

2)

1)

RoHS All hardware components are fully compliant with EU RoHS directive

NOTES

1. 1) Within operating temperature range, the module is 3GPP compliant.

2. 2) Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

might reduce in their value and exceed the specified tolerances. When the temperature

out

returns to normal operating temperature levels, the module will meet 3GPP specifications again.

3. “*” means under development.

EC21_Hardware_Design 19 / 105

LTE Module Series

EC21 Hardware Design

2.3. Functional Diagram

The following figure shows a block diagram of EC21 and illustrates the major functional parts.

 Power management

 Baseband

 DDR+NAND flash

 Radio frequency

 Peripheral interfaces

Figure 1: Functional Diagram

2.4. Evaluation Board

In order to help customers develop applications with EC21, Quectel supplies an evaluation board (EVB),

USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.

EC21_Hardware_Design 20 / 105

LTE Module Series

EC21 Hardware Design

3 Application Interfaces

3.1. General Description

EC21 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application

platform. Sub-interfaces included in these pads are described in detail in the following chapters:

 Power supply

 (U)SIM interface

 USB interface

 UART interfaces

 PCM and I2C interfaces

 SD card interface

 ADC interfaces  Status indication  SGMII interface

 Wireless connectivity interfaces

 USB_BOOT interface

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3.2. Pin Assignment

The following figure shows the pin assignment of EC21 module.

Figure 2: Pin Assignment (Top View)

NOTES

1. 1) means that these pins cannot be pulled up before startup.

2)

2.

PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.

3)

3.

means these interface functions are only supported on Telematics version.

4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads

118, 127 and 129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT

function is under development.

5. Pads 119~126 and 128 are used for SGMII interface.

EC21_Hardware_Design 22 / 105

LTE Module Series

EC21 Hardware Design

6. Pads 24~27 are multiplexing pins used for audio design on EC21 module and BT function on FC20

module.

7. Keep all RESERVED pins and unused pins unconnected.

8. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not

be designed in schematic and PCB decal, and these pins should be served as a keep out area.

9. “*” means under development.

3.3. Pin Description

The following tables show the pin definition of EC21 module.

Table 3: I/O Parameters Definition

Type Description

IO Bidirectional

DI Digital input

DO Digital output

PI Power input

PO Power output

AI Analog input

AO Analog output

OD Open drain

Table 4: Pin Description

Power Supply

Pin Name Pin No. I/O Description DC Characteristics Comment

VBAT_BB 59, 60 PI

VBAT_RF 57, 58 PI

Power supply for

module’s baseband

part

Power supply for

module’s RF part

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

It must be able to

provide sufficient current

up to 0.8A.

It must be able to

provide sufficient current

up to 1.8A in a burst

EC21_Hardware_Design 23 / 105

LTE Module Series

EC21 Hardware Design

transmission.

Power supply for

VDD_EXT 7 PO

Provide 1.8V for

external circuit

Vnorm=1.8V

I

max=50mA

O

external GPIO’s pull-up

circuits.

If unused, keep it open.

8, 9, 19,

22, 36, 46,

GND

48, 50~54,

Ground

56, 72,

85~112

Turn on/off

Pin Name Pin No. I/O Description DC Characteristics Comment

The output voltage is

0.8V because of the

diode drop in the

Qualcomm chipset.

If unused, keep it

open.

PWRKEY 21 DI

RESET_N 20 DI

Turn on/off the

module

Reset signal of the

module

V

max=2.1V

IH

V

min=1.3V

IH

V

max=0.5V

IL

V

max=2.1V

IH

V

min=1.3V

IH

V

max=0.5V

IL

Status Indication

Pin Name Pin No. I/O Description DC Characteristics Comment

STATUS 61 OD

Indicate the module

operating status

The drive current

should be less than

0.9mA.

Require external

pull-up. If unused,

keep it open.

1.8V power domain.

It cannot be pulled up

before startup.

If unused, keep it

NET_MODE 5 DO

Indicate the module

network registration

mode

V

min=1.35V

OH

V

max=0.45V

OL

open.

NET_

STATUS

Indicate the module

6 DO

network activity

status

V

min=1.35V

OH

V

max=0.45V

OL

1.8V power domain.

If unused, keep it

open.

USB Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

USB_VBUS 71 PI USB detection

Vmax=5.25V

Vmin=3.0V

Vnorm=5.0V

Typical: 5.0V

If unused, keep it

open.

EC21_Hardware_Design 24 / 105

LTE Module Series

EC21 Hardware Design

Require differential

impedance of 90Ω.

If unused, keep it

open.

Require differential

impedance of 90Ω.

If unused, keep it

open.

USB_DP 69 IO

USB_DM 70 IO

USB differential data

bus (+)

USB differential data

bus (-)

Compliant with USB

2.0 standard

specification.

Compliant with USB

2.0 standard

specification.

(U)SIM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

USIM_GND 10

Specified ground for

(U)SIM card

For 1.8V (U)SIM:

Vmax=1.9V

Vmin=1.7V

USIM_VDD 14 PO

Power supply for

(U)SIM card

For 3.0V (U)SIM:

Vmax=3.05V

Either 1.8V or 3.0V is

supported by the

module automatically.

Vmin=2.7V

I

max=50mA

O

For 1.8V (U)SIM:

V

max=0.6V

IL

V

min=1.2V

IH

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

V

max=1.0V

IL

V

min=1.95V

IH

V

max=0.45V

OL

V

min=2.55V

OH

USIM_DATA 15 IO

Data signal of

(U)SIM card

For 1.8V (U)SIM:

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

V

max=0.45V

OL

V

min=2.55V

OH

For 1.8V (U)SIM:

V

max=0.45V

OL

V

min=1.35V

OH

USIM_CLK 16 DO

USIM_RST 17 DO

Clock signal of

(U)SIM card

Reset signal of

(U)SIM card

EC21_Hardware_Design 25 / 105

LTE Module Series

EC21 Hardware Design

For 3.0V (U)SIM:

VOLmax=0.45V

V

min=2.55V

OH

V

min=-0.3V

USIM_

PRESENCE

13 DI

(U)SIM card

insertion detection

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

If unused, keep it

open.

Main UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

V

RI 62 DO Ring indicator

DCD 63 DO

Data carrier

detection

CTS 64 DO Clear to send

RTS 65 DI Request to send

DTR 66 DI

Data terminal ready,

sleep mode control

OL

V

OH

V

OL

V

OH

V

OL

V

OH

V

IL

V

IL

V

IH

V

IH

V

IL

V

IL

V

IH

V

IH

max=0.45V

min=1.35V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Pulled up by default.

Low level wakes up

the module.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

TXD 67 DO Transmit data

RXD 68 DI Receive data

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

Debug UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

If unused, keep it

open.

DBG_TXD 12 DO Transmit data

V

max=0.45V

OL

V

min=1.35V

OH

EC21_Hardware_Design 26 / 105

LTE Module Series

EC21 Hardware Design

V

min=-0.3V

DBG_RXD 11 DI Receive data

IL

VILmax=0.6V

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

If unused, keep it

open.

ADC Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

General purpose

ADC0 45 AI

analog to digital

converter

General purpose

ADC1 44 AI

analog to digital

converter

Voltage range:

0.3V to VBAT_BB

Voltage range:

0.3V to VBAT_BB

If unused, keep it

open.

If unused, keep it

open.

PCM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

V

min=-0.3V

PCM_IN 24 DI PCM data input

PCM_OUT 25 DO PCM data output

PCM data frame

PCM_SYNC 26 IO

synchronization

signal

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

V

max=0.45V

OL

V

min=1.35V

OH

VOLmax=0.45V

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

In master mode, it is

an output signal.

In slave mode, it is an

input signal.

If unused, keep it

open.

1.8V power domain.

In master mode, it is

an output signal.

In slave mode, it is an

input signal.

If unused, keep it

open.

PCM_CLK 27 IO PCM clock

max=0.45V

V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

I2C Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

I2C_SCL 41 OD

I2C serial clock.

Used for external

External pull-up

resistor is required.

EC21_Hardware_Design 27 / 105

LTE Module Series

EC21 Hardware Design

codec 1.8V only.

If unused, keep it

open.

External pull-up

I2C serial data.

I2C_SDA 42 OD

Used for external

codec

resistor is required.

1.8V only.

If unused, keep it

open.

SD Card Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V signaling:

V

max=0.45V

OL

V

min=1.4V

OH

V

min=-0.3V

SDC2_

DATA3

28 IO

SD card SDIO bus

DATA3

IL

V

max=0.58V

IL

V

min=1.27V

IH

V

max=2.0V

IH

3.0V signaling:

max=0.38V

V

OL

V

min=2.01V

OH

V

min=-0.3V

IL

V

max=0.76V

IL

V

min=1.72V

IH

V

max=3.34V

IH

SDIO signal level can

be selected according

to SD card supported

level, more details

please refer to SD 3.0

protocol.

If unused, keep it

open.

1.8V signaling:

V

max=0.45V

OL

V

min=1.4V

OH

V

min=-0.3V

SDC2_

DATA2

SDC2_

DATA1

29 IO

30 IO

SD card SDIO bus

DATA2

SD card SDIO bus

DATA1

IL

V

max=0.58V

IL

V

min=1.27V

IH

V

max=2.0V

IH

3.0V signaling:

max=0.38V

V

OL

V

min=2.01V

OH

V

min=-0.3V

IL

V

max=0.76V

IL

V

min=1.72V

IH

V

max=3.34V

IH

1.8V signaling:

V

max=0.45V

OL

SDIO signal level can

be selected according

to SD card supported

level, more details

please refer to SD 3.0

protocol.

If unused, keep it

open.

SDIO signal level can

be selected according

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EC21 Hardware Design

SDC2_

DATA0

31 IO

SDC2_CLK 32 DO

SD card SDIO bus

DATA0

SD card SDIO bus

clock

VOHmin=1.4V

VILmin=-0.3V

V

max=0.58V

IL

V

min=1.27V

IH

V

max=2.0V

IH

3.0V signaling:

max=0.38V

V

OL

V

min=2.01V

OH

V

min=-0.3V

IL

V

max=0.76V

IL

V

min=1.72V

IH

V

max=3.34V

IH

1.8V signaling:

V

max=0.45V

OL

V

min=1.4V

OH

V

min=-0.3V

IL

V

max=0.58V

IL

V

min=1.27V

IH

V

max=2.0V

IH

3.0V signaling:

max=0.38V

V

OL

V

min=2.01V

OH

V

min=-0.3V

IL

V

max=0.76V

IL

V

min=1.72V

IH

V

max=3.34V

IH

1.8V signaling:

V

max=0.45V

OL

V

min=1.4V

OH

3.0V signaling:

max=0.38V

V

OL

V

min=2.01V

OH

to SD card supported

level, more details

please refer to SD 3.0

protocol.

If unused, keep it

open.

SDIO signal level can

be selected according

to SD card supported

level, more details

please refer to SD 3.0

protocol.

If unused, keep it

open.

SDIO signal level can

be selected according

to SD card supported

level, more details

please refer to SD 3.0

protocol.

If unused, keep it

open.

SDIO signal level can

be selected according

to SD card supported

level, more details

please refer to SD 3.0

protocol.

If unused, keep it

open.

SDC2_CMD 33 IO

SD card SDIO bus

command

1.8V signaling:

V

max=0.45V

OL

V

min=1.4V

OH

V

min=-0.3V

IL

V

max=0.58V

IL

V

min=1.27V

IH

V

max=2.0V

IH

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SD_INS_

DET

23 DI

VDD_SDIO 34 PO

SD card insertion

detect

SD card SDIO bus

pull-up power

3.0V signaling:

max=0.38V

V

OL

V

min=2.01V

OH

V

min=-0.3V

IL

V

max=0.76V

IL

V

min=1.72V

IH

V

max=3.34V

IH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

I

max=50mA

O

1.8V power domain.

If unused, keep it

open.

1.8V/2.85V

configurable. Cannot

be used for SD card

power.

If unused, keep it

open.

SGMII Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

For 1.8V:

max=0.45V

V

EPHY_RST_N 119 DO Ethernet PHY reset

EPHY_INT_N 120 DI

Ethernet PHY

interrupt

OL

V

min=1.4V

OH

For 2.85V:

V

max=0.35V

OL

V

min=2.14V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V/2.85V power

domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

For 1.8V:

V

max=0.45V

OL

V

min=1.4V

OH

V

max=0.58V

SGMII_

MDATA

SGMII MDIO

121 IO

(Management Data

Input/Output) data

IL

V

min=1.27V

IH

For 2.85V:

V

max=0.35V

OL

V

min=2.14V

OH

V

max=0.71V

IL

V

min=1.78V

IH

1.8V/2.85V power

domain.

If unused, keep it

open.

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SGMII_

MCLK

122 DO

USIM2_VDD 128 PO

SGMII MDIO

(Management Data

Input/Output) clock

SGMII MDIO pull-up

power source

For 1.8V:

V

max=0.45V

OL

V

min=1.4V

OH

For 2.85V:

V

max=0.35V

OL

V

min=2.14V

OH

1.8V/2.85V power

domain.

If unused, keep it

open.

Configurable power

source.

1.8V/2.85V power

domain.

External pull-up for

SGMII MDIO pins.

If unused, keep it

open.

SGMII_TX_M 123 AO

SGMII_TX_P 124 AO

SGMII_RX_P 125 AI

SGMII_RX_M 126 AI

SGMII transmission

- minus

SGMII transmission

- plus

SGMII receiving

- plus

SGMII receiving

- minus

If unused, keep it

open.

If unused, keep it

open.

If unused, keep it

open.

If unused, keep it

open.

Wireless Connectivity Interfaces

Pin Name Pin No. I/O Description DC Characteristics Comment

V

max=0.45V

OL

V

min=1.35V

SDC1_

DATA3

SDC1_

DATA2

SDC1_

DATA1

129 IO

130 IO

131 IO

WLAN SDIO data

bus D3

WLAN SDIO data

bus D2

WLAN SDIO data

bus D1

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

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SDC1_

DATA0

132 IO

SDC1_CLK 133 DO

WLAN SDIO data

bus D0

WLAN SDIO bus

clock

VIHmax=2.0V

max=0.45V

V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

V

max=0.45V

OL

V

min=1.35V

OH

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

SDC1_CMD 134 DO

PM_ENABLE 127 DO

WAKE_ON_

WIRELESS

135 DI

WLAN SDIO bus

command

External power

control

Wake up the host

(EC21 module) by

FC20 module.

WLAN function

WLAN_EN 136 DO

control via FC20

module

COEX_UART_

RX

137 DI

LTE/WLAN&BT

coexistence signal

V

max=0.45V

OL

V

min=1.35V

OH

V

max=0.45V

OL

V

min=1.35V

OH

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Active low.

If unused, keep it

open.

1.8V power domain.

Active high.

It cannot be pulled up

before startup.

If unused, keep it

open.

1.8V power domain.

It cannot be pulled up

before startup.

If unused, keep it

open.

1.8V power domain.

COEX_UART_

TX

138 DO

LTE/WLAN&BT

coexistence signal

V

max=0.45V

OL

V

min=1.35V

OH

It cannot be pulled up

before startup.

If unused, keep it

open.

WLAN_SLP_

CLK

BT_RTS* 37 DI

118 DO WLAN sleep clock

BT UART request to

send

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

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BT_TXD* 38 DO

BT_RXD* 39 DI

BT UART transmit

data

BT UART receive

data

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

BT_CTS* 40 DO

BT UART clear to

send

V

max=0.45V

OL

V

min=1.35V

OH

It cannot be pulled up

before startup.

If unused, keep it

open.

BT_EN* 139 DO

BT function control

via FC20 module

V

max=0.45V

OL

V

min=1.35V

OH

1.8V power domain.

If unused, keep it

open.

RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment

ANT_DIV 35 AI

Diversity antenna

pad

50Ω impedance

If unused, keep it

open.

ANT_MAIN 49 IO Main antenna pad 50Ω impedance

50Ω impedance

ANT_GNSS 47 AI GNSS antenna pad

If unused, keep it

open.

GPIO Pins Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

Cannot be pulled up

before startup.

Low level wakes up

the module.

If unused, keep it

WAKEUP_IN 1 DI Sleep mode control

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

open.

1.8V power domain.

Pull-up by default.

At low voltage level,

module can enter into

airplane mode.

If unused, keep it

open.

W_DISABLE# 4 DI

Airplane mode

control

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

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V

min=-0.3V

AP_READY 2 DI

Application

processor sleep

state detection

IL

VILmax=0.6V

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

If unused, keep it

open.

USB_BOOT Interface Pin Name Pin No. I/O Description DC Characteristics Comment

USB_BOOT 115 DI

Force the module to

enter into

emergency

download mode.

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain.

Active high.

If unused, keep it

open.

RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment

3, 18, 23,

43, 55,

RESERVED

73~84,

113, 114,

Reserved

Keep these pins

unconnected.

116, 117,

140-144.

NOTES

1. “*” means under development.

2. Pads 24~27 are multiplexing pins used for audio design on EC21 module and BT function on FC20

module.

3.4. Operating Modes

The table below briefly summarizes the various operating modes referred in the following chapters.

Table 5: Overview of Operating Modes

Mode Details

Software is active. The module has registered on the network, and it is

ready to send and receive data.

Network connection is ongoing. In this mode, the power consumption is

decided by network setting and data transfer rate.

Normal

Operation

Minimum

Idle

Talk/Data

AT+CFUN command can set the module to a minimum functionality mode without

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Functionality

removing the power supply. In this case, both RF function and (U)SIM card will be invalid.

Mode

Airplane

Mode

AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this

case, RF function will be invalid.

In this mode, the current consumption of the module will be reduced to the minimal level.

Sleep Mode

Power down

Mode

During this mode, the module can still receive paging message, SMS, voice call and

TCP/UDP data from the network normally.

In this mode, the power management unit shuts down the power supply. Software is not

active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF

and VBAT_BB) remains applied.

3.5. Power Saving

3.5.1. Sleep Mode

EC21 is able to reduce its current consumption to a minimum value during the sleep mode. The following

section describes power saving procedures of EC21 module.

3.5.1.1. UART Application

If the host communicates with module via UART interface, the following preconditions can let the module

enter into sleep mode.

 Execute AT+QSCLK=1 command to enable sleep mode.

 Drive DTR to high level.

The following figure shows the connection between the module and the host.

Figure 3: Sleep Mode Application via UART

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 Driving the host DTR to low level will wake up the module.

 When EC21 has a URC to report, RI signal will wake up the host. Refer to Chapter 3.17 for details

about RI behaviors.

 AP_READY will detect the sleep state of the host (can be configured to high level or low level

detection). Please refer to A T+QCFG="apready"* command for details.

NOTE

“*” means under development.

3.5.1.2. USB Application with USB Remote Wakeup Function

If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions

must be met to let the module enter into sleep mode.

 Execute AT+QSCLK=1 command to enable sleep mode.

 Ensure the DTR is held at high level or keep it open.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended

state.

The following figure shows the connection between the module and the host.

Figure 4: Sleep Mode Application with USB Remote Wakeup

 Sending data to EC21 through USB will wake up the module.

 When EC21 has a URC to report, the module will send remote wake-up signals via USB bus so as to

wake up the host.

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3.5.1.3. USB Application with USB Suspend/Resume and RI Function

If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is

needed to wake up the host.

There are three preconditions to let the module enter into the sleep mode.

 Execute AT+QSCLK=1 command to enable sleep mode.

 Ensure the DTR is held at high level or keep it open.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended

state.

The following figure shows the connection between the module and the host.

Figure 5: Sleep Mode Application with RI

 Sending data to EC21 through USB will wake up the module.

 When EC21 has a URC to report, RI signal will wake up the host.

3.5.1.4. USB Application without USB Suspend Function

If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional

control circuit to let the module enter into sleep mode.

 Execute AT+QSCLK=1 command to enable sleep mode.

 Ensure the DTR is held at high level or keep it open.

 Disconnect USB_VBUS.

The following figure shows the connection between the module and the host.

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Figure 6: Sleep Mode Application without Suspend Function

Switching on the power switch to supply power to USB_VBUS will wake up the module.

NOTE

Please pay attention to the level match shown in dotted line between the module and the host. Refer to

document [1] for more details about EC21 power management application.

3.5.2. Airplane Mode

When the module enters into airplane mode, the RF function does not work, and all AT commands

correlative with RF function will be inaccessible. This mode can be set via the following ways.

Hardware:

The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter into airplane

mode.

Software: AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4.

 AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled.

NOTES

1. W_DISABLE# control function is disabled in firmware by default. It can be enabled by

AT+QCFG="airplanecontrol" command. This command is under development.

2. The execution of AT+CFUN command will not affect GNSS function.

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3.6. Power Supply

3.6.1. Power Supply Pins

EC21 provides four VBAT pins for connection with the external power supply. There are two separate

voltage domains for VBAT.

 Two VBAT_RF pins for module’s RF part.

 Two VBAT_BB pins for module’s baseband part.

The following table shows the details of VBAT pins and ground pins.

Table 6: VBAT and GND Pins

Pin Name Pin No. Description Min. Typ. Max. Unit

VBAT_RF 57, 58

VBAT_BB 59, 60

Power supply for module’s

RF part.

Power supply for module’s

baseband part.

3.3 3.8 4.3 V

8, 9, 19, 22, 36,

GND

46, 48, 50~54,

Ground - 0 - V

56, 72, 85~112

3.6.2. Decrease Voltage Drop

The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will

never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G

network. The voltage drop will be less in 3G and 4G networks.

Figure 7: Power Supply Limits during Burst Transmission

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To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used,

and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It

is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and

place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external

application has to be a single voltage source and can be expanded to two sub paths with star structure.

The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no

less than 2mm. In principle, the longer the VBAT trace is, the wider it will be.

In addition, in order to get a stable power source, it is suggested that a zener diode whose reverse zener

voltage is 5.1V and dissipation power is more than 0.5W should be used. The following figure shows the

star structure of the power supply.

Figure 8: Star Structure of the Power Supply

3.6.3. Reference Design for Power Supply

Power design for the module is very important, as the performance of the module largely depends on the

power source. The power supply should be able to provide sufficient current up to 2A at least. If the

voltage drop between the input and output is not too high, it is suggested that an LDO should be used to

supply power for the module. If there is a big voltage difference between the input source and the desired

output (VBAT), a buck converter is preferred to be used as the power supply.

The following figure shows a reference design for +5V input power source. The typical output of the power

supply is about 3.8V and the maximum load current is 3A.

EC21_Hardware_Design 40 / 105

NOTE

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Figure 9: Reference Circuit of Power Supply

In order to avoid damaging internal flash, please do not switch off the power supply when the module

works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can

be cut off.

3.6.4. Monitor the Power Supply

AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to

document [2].

3.7. Turn on and off Scenarios

3.7.1. Turn on Module Using the PWRKEY

The following table shows the pin definition of PWRKEY.

Table 7: Pin Definition of PWRKEY

Pin Name Pin No. I/O Description Comment

PWRKEY 21 DI Turn on/off the module

When EC21 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a

low level for at least 500ms. It is recommended to use an open drain/collector driver to control the

PWRKEY. After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be

released. A simple reference circuit is illustrated in the following figure.

EC21_Hardware_Design 41 / 105

The output voltage is 0.8V because of

the diode drop in the Qualcomm chipset.

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EC21 Hardware Design

PWRKEY

≥ 500ms

4.7K 10nF

Turn on pulse

47K

Figure 10: Turn on the Module by Using Driving Circuit

The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic

strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the

button for ESD protection. A reference circuit is shown in the following figure.

Figure 11: Turn on the Module by Using Button

The turn on scenario is illustrated in the following figure.

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Figure 12: Timing of Turning on Module

NOTE

Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no

less than 30ms.

3.7.2. Turn off Module

The following procedures can be used to turn off the module:

 Normal power down procedure: Turn off the module using the PWRKEY pin.

 Normal power down procedure: Turn off the module using AT+QPOWD command.

3.7.2.1. Turn off Module Using the PWRKEY Pin

Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-down

procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure.

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Figure 13: Timing of Turning off Module

3.7.2.2. Turn off Module Using AT Command

It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the

module via PWRKEY pin.

Please refer to document [2] for details about AT+QPOWD command.

NOTE

1. In order to avoid damaging internal flash, please do not switch off the power supply when the module

works normally. Only after the module is shut down by PWRKEY or AT command, the power supply

can be cut off.

2. When turn off module with AT command, please keep PWRKEY at high level after the execution of

power-off command. Otherwise the module will be turned on again after successfully turn-off.

3.8. Reset the Module

The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a

low level voltage for time between 150ms and 460ms.

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Table 8: Pin Definition of RESET_N

Pin Name Pin No. I/O Description Comment

RESET_N 20 DI Reset the module 1.8V power domain

The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button

can be used to control the RESET_N.

Figure 14: Reference Circuit of RESET_N by Using Driving Circuit

Figure 15: Reference Circuit of RESET_N by Using Button

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The reset scenario is illustrated in the following figure.

Figure 16: Timing of Resetting Module

NOTES

1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed.

2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.

3.9. (U)SIM Interface

The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards

are supported.

Table 9: Pin Definition of the (U)SIM Interface

Pin Name Pin No. I/O Description Comment

USIM_VDD 14 PO Power supply for (U)SIM card

Either 1.8V or 3.0V is supported

by the module automatically.

USIM_DATA 15 IO Data signal of (U)SIM card

USIM_CLK 16 DO Clock signal of (U)SIM card

USIM_RST 17 DO Reset signal of (U)SIM card

USIM_

PRESENCE

13 DI (U)SIM card insertion detection

1.8V power domain.

If unused, keep it open.

USIM_GND 10 Specified ground for (U)SIM card

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EC21 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and

high level detections, and is disabled by default. Please refer to document [2] about AT+QSIMDET

command for details.

The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.

Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector

If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A

reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following

figure.

Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector

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In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please

follow the criteria below in (U)SIM circuit design:

 Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length

as less than 200mm as possible.

 Keep (U)SIM card signals away from RF and VBAT traces.

 Assure the ground between the module and the (U)SIM card connector short and wide. Keep the

trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.

Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as

close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB,

USIM_GND can be connected to PCB ground directly.

 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and

shield them with surrounded ground.

 In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic

capacitance should not be more than 15pF. The 0Ω resistors should be added in series between the

module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering

interference of GSM900MHz. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector.

 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace

and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.

3.10. USB Interface

EC21 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0

specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is

used for AT command communication, data transmission, GNSS NMEA sentences output, software

debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB

interface.

Table 10: Pin Description of USB Interface

Pin Name Pin No. I/O Description Comment

USB_DP 69 IO USB differential data bus (+)

USB_DM 70 IO USB differential data bus (-)

USB_VBUS 71 PI Used for detecting the USB connection Typically 5.0V

Require differential

impedance of 90Ω

Require differential

impedance of 90Ω

GND 72 Ground

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For more details about the USB 2.0 specification, please visit http://www.usb.org/home.

The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. The

following figure shows a reference circuit of USB interface.

Figure 19: Reference Circuit of USB Application

A common mode choke L1 is recommended to be added in series between the module and customer’s

MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be

added in series between the module and the test points so as to facilitate debugging, and the resistors are

not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components

must be placed close to the module, and also these resistors should be placed close to each other. The

extra stubs of trace must be as short as possible.

The following principles should be complied with when design the USB interface, so as to meet USB 2.0

specification.

 It is important to route the USB signal traces as differential pairs with total grounding. The impedance

of USB differential trace is 90Ω.

 Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is

important to route the USB differential traces in inner-layer with ground shielding on not only upper

and lower layers but also right and left sides.

 Pay attention to the influence of junction capacitance of ESD protection components on USB data

lines. Typically, the capacitance value should be less than 2pF.

 Keep the ESD protection components to the USB connector as close as possible.

NOTES

1. EC21 module can only be used as a slave device.

2. “*” means under development.

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3.11. UART Interfaces

The module provides two UART interfaces: the main UART interface and the debug UART interface. The

following shows their features.

 The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps,

230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. The interface is

used for data transmission and AT command communication.

 The debug UART interface supports 115200bps baud rate. It is used for Linux console and log

output.

The following tables show the pin definition of the UART interfaces.

Table 11: Pin Definition of Main UART Interface

Pin Name Pin No. I/O Description Comment

RI 62 DO Ring indicator

DCD 63 DO Data carrier detection

CTS 64 DO Clear to send

RTS 65 DI Request to send

1.8V power domain

DTR 66 DI Data terminal ready

TXD 67 DO Transmit data

RXD 68 DI Receive data

Table 12: Pin Definition of Debug UART Interface

Pin Name Pin No. I/O Description Comment

DBG_TXD 12 DO Transmit data 1.8V power domain

DBG_RXD 11 DI Receive data 1.8V power domain

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The logic levels are described in the following table.

Table 13: Logic Levels of Digital I/O

Parameter Min. Max. Unit

VIL -0.3 0.6 V

VIH 1.2 2.0 V

VOL 0 0.45 V

VOH 1.35 1.8 V

The module provides 1.8V UART interface. A level translator should be used if customers’ application is

equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by T e xas Instrument s is

recommended. The following figure shows a reference design.

Figure 20: Reference Circuit with Translator Chip

Please visit http://www.ti.com

for more information.

Another example with transistor translation circuit is shown as below. The circuit design of dotted line

section can refer to the design of solid line section, in terms of both module input and output circuit

designs, but please pay attention to the direction of connection.

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Figure 21: Reference Circuit with Transistor Circuit

NOTE

Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.

3.12. PCM and I2C Interfaces

EC21 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the

following modes and one I2C interface:

 Primary mode (short frame synchronization, works as both master and slave)

 Auxiliary mode (long frame synchronization, works as master only)

In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports

256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz

PCM_CLK at 16kHz PCM_SYNC.

In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a

256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC.

EC21 supports 8-bit A-law* and μ-law*, and also 16-bit linear data formats. The following figures show the

primary mode’s timing relationship with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well as the

auxiliary mode’s timing relationship with 8kHz PCM_SYNC and 256kHz PCM_CLK.

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Figure 22: Primary Mode Timing

Figure 23: Auxiliary Mode Timing

The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio

codec design.

Table 14: Pin Definition of PCM and I2C Interfaces

Pin Name Pin No. I/O Description Comment

PCM_IN 24 DI PCM data input 1.8V power domain

PCM_OUT 25 DO PCM data output 1.8V power domain

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PCM_SYNC 26 IO

PCM data frame

synchronization signal

1.8V power domain

PCM_CLK 27 IO PCM data bit clock 1.8V power domain

I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V

I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8V

Clock and mode can be configured by AT command, and the default configuration is master mode using

short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to

document [2] about AT+QDAI command for details.

The following figure shows a reference design of PCM interface with external codec IC.

Figure 24: Reference Circuit of PCM Application with Audio Codec

NOTES

1. “*” means under development.

2. It is recommended to reserve RC (R=22Ω, C=22pF) circuits on the PCM lines, especially for

PCM_CLK.

3. EC21 works as a master device pertaining to I2C interface.

3.13. SD Card Interface

EC21 supports SDIO3.0 interface for SD card.

The following table shows the pin definition of SD card interface.

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Table 15: Pin Definition of SD Card Interface

Pin Name Pin No. I/O Description Comment

SDIO signal level can be

selected according to SD

SDC2_DATA3 28 IO SD card SDIO bus DATA3

card supported level, more

details please refer to SD

3.0 protocol.

If unused, keep it open.

SDIO signal level can be

selected according to SD

SDC2_DATA2 29 IO SD card SDIO bus DATA2

card supported level, more

details please refer to SD

3.0 protocol.

If unused, keep it open.

SDC2_DATA1 30 IO SD card SDIO bus DATA1

SDC2_DATA0 31 IO SD card SDIO bus DATA0

SDC2_CLK 32 DO SD card SDIO bus clock

SDC2_CMD 33 IO SD card SDIO bus command

SDIO signal level can be

selected according to SD

card supported level, more

details please refer to SD

3.0 protocol.

If unused, keep it open.

SDIO signal level can be

selected according to SD

card supported level, more

details please refer to SD

3.0 protocol.

If unused, keep it open.

SDIO signal level can be

selected according to SD

card supported level, more

details please refer to SD

3.0 protocol.

If unused, keep it open.

SDIO signal level can be

selected according to SD

card supported level, more

details please refer to SD

3.0 protocol.

If unused, keep it open.

1.8V/2.85V configurable.

VDD_SDIO 34 PO SD card SDIO bus pull up power

Cannot be used for SD

card power. If unused,

keep it open.

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SD_INS_DET 23 DI SD card insertion detection

The following figure shows a reference design of SD card.

Figure 25: Reference Circuit of SD card

1.8V power domain.

If unused, keep it open.

In SD card interface design, in order to ensure good communication performance with SD card, the

following design principles should be complied with:

 The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A

should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used

for SDIO pull-up resistors, an externally power supply is needed for SD card.

 To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these

resistors is among 10KΩ~100KΩ and the recommended value is 100KΩ. VDD_SDIO should be used

as the pull-up power.

 In order to adjust signal quality, it is recommended to add 0Ω resistors R1~R6 in series between the

module and the SD card. The bypass capacitors C1~C6 are reserved and not mounted by default. All

resistors and bypass capacitors should be placed close to the module.

 In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near

the SD card connector with junction capacitance less than 15pF.

 Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals,

etc., as well as noisy signals such as clock signals, DCDC signals, etc.

 It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace

is 50Ω (±10%).

 Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of

SDIO bus should be less than 15pF.

 It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm

and the total routing length less than 50mm. The total trace length inside the module is 27mm, so the

exterior total trace length should be less than 23mm.

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3.14. ADC Interfaces

The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2].

In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.

Table 16: Pin Definition of ADC Interfaces

Pin Name Pin No. Description

ADC0 45 General purpose analog to digital converter

ADC1 44 General purpose analog to digital converter

The following table describes the characteristic of ADC function.

Table 17: Characteristic of ADC

Parameter Min. Typ. Max. Unit

ADC0 Voltage Range 0.3 VBAT_BB V

ADC1 Voltage Range 0.3 VBAT_BB V

ADC Resolution 15 bits

NOTES

1. ADC input voltage must not exceed VBAT_BB.

2. It is prohibited to supply any voltage to ADC pins when VBAT is removed.

3. It is recommended to use a resistor divider circuit for ADC application.

3.15. Network Status Indication

The network indication pins can be used to drive network status indication LEDs. The module provides

two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and

logic level changes in different network status.

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Table 18: Pin Definition of Network Connection Status/Activity Indicator

Pin Name Pin No. I/O Description Comment

1.8V power domain

Cannot be pulled up

before startup

1.8V power domain

NET_MODE1) 5 DO

NET_STATUS 6 DO

Indicate the module’s network registration

status

Indicate the module’s network activity

status

Table 19: Working State of Network Connection Status/Activity Indicator

Pin Name Logic Level Changes Network Status

Always High Registered on LTE network

NET_MODE

Always Low Others

Flicker slowly (200ms High/1800ms Low) Network searching

Flicker slowly (1800ms High/200ms Low) Idle

NET_STATUS

Flicker quickly (125ms High/125ms Low) Data transfer is ongoing

Always High Voice calling

A reference circuit is shown in the following figure.

Figure 26: Reference Circuit of the Network Indicator

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3.16. STATUS

The STATUS pin is an open drain output for indicating the module’s operation status. Customers can

connect it to a GPIO of DTE with a pull up resistor, or as the LED indication circuit shown below. When the

module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present

high-impedance state.

Table 20: Pin Definition of STATUS

Pin Name Pin No. I/O Description Comment

An external pull-up resistor

STATUS 61 OD Indicate the module’s operation status

The following figure shows different circuit designs of STATUS, and customers can choose either one

according to their application demands.

is required.

If unused, keep it open.

Figure 27: Reference Circuits of STATUS

3.17. Behaviors of RI

AT+QCFG="risignaltype","physical" command can be used to configure RI behavior.

No matter on which port URC is presented, URC will trigger the behavior of RI pin.

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NOTE

URC can be outputted from UART port, USB AT port and USB modem port through configuration via

AT+QURCCFG command. The default port is USB AT port.

In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below.

Table 21: Behavior of RI

State Response

Idle RI keeps at high level

URC RI outputs 120ms low pulse when a new URC returns

The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for

details.

3.18. SGMII Interface

EC21 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces, key

features of the SGMII interface are shown below:

 IEEE802.3 compliance

 Support 10M/100M/1000M Ethernet work mode

 Support VLAN tagging

 Support IEEE1588 and Precision Time Protocol (PTP)

 Can be used to connect to external Ethernet PHY like AR8033, or to an external switch

 Management interfaces support dual voltage 1.8V/2.85V

The following table shows the pin definition of SGMII interface.

Table 22: Pin Definition of the SGMII Interface

Pin Name Pin No. I/O Description Comment

Control Signal Part

EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain

EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain

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SGMII_MDATA 121 IO

SGMII_MCLK 122 DO

SGMII MDIO (Management Data

Input/Output) data

SGMII MDIO (Management Data

Input/Output) clock

1.8V/2.85V power domain

Configurable power source.

USIM2_VDD 128 PO

SGMII MDIO pull-up power

source

1.8V/2.85V power domain.

External pull-up power source for

SGMII MDIO pins.

SGMII Signal Part

SGMII_TX_M 123 AO SGMII transmission-minus

SGMII_TX_P 124 AO SGMII transmission-plus

SGMII_RX_P 125 AI SGMII receiving-plus

SGMII_RX_M 126 AI SGMII receiving-minus

Connect with a 0.1uF capacitor,

close to the PHY side.

Connect with a 0.1uF capacitor,

close to the PHY side.

Connect with a 0.1uF capacitor,

close to EC21 module.

Connect with a 0.1uF capacitor,

close to EC21 module.

The following figure shows the simplified block diagram for Ethernet application.

SGMII

Module

Control

AR8033

MDI

Ethernet

Transformer

RJ45

Figure 28: Simplified Block Diagram for Ethernet Application

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The following figure shows a reference design of SGMII interface with PHY AR8033 application.

Figure 29: Reference Circuit of SGMII Interface with PHY AR8033 Application

In order to enhance the reliability and availability in customers’ applications, please follow the criteria

below in the Ethernet PHY circuit design:

 Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits,

analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc.

 Keep the maximum trace length less than 10-inch and keep skew on the differential pairs less than

20mil.

 The differential impedance of SGMII data trace is 100Ω±10%, and the reference ground of the area

should be complete.

 Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and the

same to the adjacent signal traces.

3.19. Wireless Connectivity Interfaces

EC21

supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.

The following table shows the pin definition of wireless connectivity interfaces.

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Table 23: Pin Definition of Wireless Connectivity Interfaces

Pin Name Pin No. I/O Description Comment

WLAN Part

SDC1_DATA3 129 IO SDIO data bus D3 1.8V power domain

SDC1_DATA2 130 IO SDIO data bus D2 1.8V power domain

SDC1_DATA1 131 IO SDIO data bus D1 1.8V power domain

SDC1_DATA0 132 IO SDIO data bus D0 1.8V power domain

SDC1_CLK 133 DO SDIO clock 1.8V power domain

SDC1_CMD 134 IO SDIO command 1.8V power domain

1.8V power domain

WLAN_EN 136 DO

WLAN function control via FC20

module.

Active high.

It cannot be pulled up

before startup

Coexistence and Control Part

PM_ENABLE 127 DO External power control 1.8V power domain

WAKE_ON_

WIRELESS

135 DI

COEX_UART_RX 137 DI

COEX_UART_TX 138 DO

Wake up the host (EC21

module) by FC20 module

LTE/WLAN&BT coexistence

signal

LTE/WLAN&BT coexistence

signal

1.8V power domain

It cannot be pulled up

before startup

1.8V power domain

It cannot be pulled up

before startup

WLAN_SLP_CLK 118 DO WLAN sleep clock

BT Part*

BT_RTS* 37 DI BT UART request to send 1.8V power domain

BT_TXD* 38 DO BT UART transmit data 1.8V power domain

BT_RXD* 39 DI BT UART receive data 1.8V power domain

1.8V power domain

BT_CTS* 40 DO BT UART clear to send

It cannot be pulled up

before startup

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PCM_IN1) 24 DI PCM data input 1.8V power domain

PCM_OUT1) 25 DO PCM data output 1.8V power domain

PCM_SYNC1) 26 IO

PCM data frame synchronization

signal

1.8V power domain

PCM_CLK1) 27 IO PCM data bit clock 1.8V power domain

BT_EN* 139 DO

WLAN function control via FC20

module.

1.8V power domain

Active high.

The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20

module.

POWER

WLAN

Module

SDC1_ DATA3

SDC1_ DATA2

SDC1_ DATA1

SDC1_D ATA0

WLAN_SLP_CLK

WAKE_ ON_W IREL ESS

PM_EN ABLE

VDD_EXT VIO

SDC1_CLK

SDC1_CMD

WLAN_EN

DCDC/LDO

FC20 Module

VDD_3V3

SDIO_D 3

SDIO_D 2

SDIO_D 1

SDIO_D 0

SDIO_CLK

SDIO_C MD

WLAN_EN

32KHZ _IN

WAKE_ ON_W IREL ESS

COEX

Bluetooth*

COEX_ UAR T_RX

COEX_ UAR T_TX

BT_EN

BT_R TS

BT_C TS

BT_T XD

BT_R XD

PCM_I N

PCM_ OUT

PCM_SYN C

PCM_ CLK

LTE_UART_TXD

LTE_UART_RXD

BT_EN

BT_U ART_RTS

BT_U ART_CTS

BT_U ART_R XD

BT_U ART_TXD

PCM_OU T

PCM_I N

PCM_SYN C

PCM_C LK

Figure 30: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module

NOTES

1. FC20 module can only be used as a slave device.

2. When BT function is enabled on EC21 module, PCM_SYNC and PCM_CLK pins are only used to

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output signals.

3. For more information about wireless connectivity interfaces, please refer to document [5].

4. “*” means under development.

1)

5.

Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20

module.

3.19.1. WLAN Interface

EC21 provides a low power SDIO 3.0 interface and control interface for WLAN design.

SDIO interface supports the SDR mode (up to 50MHz).

As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the

SDIO 3.0 specification, please comply with the following principles:

 It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal

trace is 50

 Protect other sensitive signals/circuits (RF, analog signals, etc.) from SDIO corruption and protect

SDIO signals from noisy signals (clocks, DCDCs, etc.).

 It is recommended to keep matching length between CLK and DATA/CMD less than 1mm and total

routing length less than 50mm.

 Keep termination resistors within 15Ω~24Ω on clock lines near the module and keep the route

distance from the module clock pins to termination resistors less than 5mm.

 Make sure the adjacent trace spacing is is 2 times of the trace width and bus capacitance is less than

15pF.

Ω (±10%).

3.19.2. BT Interface*

EC21 supports a dedicated UART interface and a PCM interface for BT function application.

Further information about BT interface will be added in future version of this document.

NOTE

“*” means under development.

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3.20. USB_BOOT Interface

EC21 provides a USB_BOOT pin. Developers can pull up USB_BOOT to VDD_EXT before powering on

the module, thus the module will enter into emergency download mode when powered on. In this mode,

the module supports firmware upgrade over USB interface.

Table 24: Pin Definition of USB_BOOT Interface

Pin Name Pin No. I/O Description Comment

1.8V power domain.

USB_BOOT 115 DI

Force the module enter into

emergency download mode

The following figure shows a reference circuit of USB_BOOT interface.

Active high.

It is recommended to

reserve test point.

Module

VDD_EXT

USB_BOOT

Test point

Cl ose to tes t po in t

TVS

Figure 31: Reference Circuit of USB_BOOT Interface

4.7K

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4 GNSS Receiver

4.1. General Description

EC21 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of

Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS).

EC21 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via

USB interface by default.

By default, EC21 GNSS engine is switched off. It has to be switched on via AT command. For more details

about GNSS engine technology and configurations, please refer to document [3].

4.2. GNSS Performance

The following table shows the GNSS performance of EC21.

Table 25: GNSS Performance

Parameter Description Conditions Typ. Unit

Cold start Autonomous -146 dBm

Sensitivity

(GNSS)

TTFF

(GNSS)

Reacquisition Autonomous -157 dBm

Tracking Autonomous -157 dBm

Cold start

@open sky

Warm start

@open sky

Autonomous 35 s

XTRA enabled 18 s

Autonomous 26 s

XTRA enabled 2.2 s

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Autonomous 2.5 s

XTRA enabled 1.8 s

Autonomous

@open sky

<1.5 m

Accuracy

(GNSS)

Hot start

@open sky

CEP-50

NOTES

1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep

on positioning for 3 minutes.

2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can

fix position again within 3 minutes after loss of lock.

3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes

position within 3 minutes after executing cold start command.

4.3. Layout Guidelines

The following layout guidelines should be taken into account in customers’ designs.

 Maximize the distance among GNSS antenna, main antenna and the Rx-diversity antenna.

 Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be

kept away from the antennas.

 Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar

isolation and protection.

 Keep 50Ω characteristic impedance for the ANT_GNSS trace.

Please refer to Chapter 5 for GNSS antenna reference design and antenna installation consideration.

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5 Antenna Interfaces

EC21 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is

used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS

antenna interface. The impedance of the antenna port is 50Ω.

5.1. Main/Rx-diversity Antenna Interfaces

5.1.1. Pin Definition

The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.

Table 26: Pin Definition of RF Antennas

Pin Name Pin No. I/O Description Comment

ANT_MAIN 49 IO Main antenna pad 50Ω impedance

ANT_DIV 35 AI Receive diversity antenna pad 50Ω impedance

5.1.2. Operating Frequency

Table 27: Module Operating Frequencies

3GPP Band Transmit Receive Unit

GSM850 824~849 869~894 MHz

EGSM900 880~915 925~960 MHz

DCS1800 1710~1785 1805~1880 MHz

PCS1900 1850~1910 1930~1990 MHz

WCDMA B1 1920~1980 2110~2170 MHz

WCDMA B2 1850~1910 1930~1990 MHz

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WCDMA B4 1710~1755 2110~2155 MHz

WCDMA B5 824~849 869~894 MHz

WCDMA B8 880~915 925~960 MHz

LTE FDD B1 1920~1980 2110~2170 MHz

LTE FDD B2 1850~1910 1930~1990 MHz

LTE FDD B3 1710~1785 1805~1880 MHz

LTE FDD B4 1710~1755 2110~2155 MHz

LTE FDD B5 824~849 869~894 MHz

LTE FDD B7 2500~2570 2620~2690 MHz

LTE FDD B8 880~915 925~960 MHz

LTE FDD B12 699~716 729~746 MHz

LTE FDD B13 777~787 746~756 MHz

LTE FDD B18 815~830 860~875 MHz

LTE FDD B19 830~845 875~890 MHz

LTE FDD B20 832~862 791~821 MHz

LTE FDD B26 814~849 859~894 MHz

LTE FDD B28 703~748 758~803 MHz

LTE TDD B40 2300~2400 2300~2400 MHz

5.1.3. Reference Design of RF Antenna Interface

A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching

circuit should be reserved for better RF performance. The capacitors are not mounted by default.

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Figure 32: Reference Circuit of RF Antenna Interface

NOTES

1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the

receiving sensitivity.

2. ANT_DIV function is enabled by default.

3. Place the π-type matching components (R1, C1, C2, R2, C3, C4) as close to the antenna as

possible.

5.1.4. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

the distance between signal layer and reference ground (H), and the clearance between RF trace and

ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic

impedance control. The following are reference designs of microstrip line or coplanar waveguide line with

different PCB structures

.

Figure 33: Microstrip Line Design on a 2-layer PCB

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Figure 34: Coplanar Waveguide Line Design on a 2-layer PCB

Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)

In order to ensure RF performance and reliability, the following principles should be complied with in RF

layout design:

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 Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.

 The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully

connected to ground.

 The distance between the RF pins and the RF connector should be as short as possible, and all the

right angle traces should be changed to curved ones.

 There should be clearance area under the signal pin of the antenna connector or solder joint.

 The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around

RF traces and the reference ground could help to improve RF performance. The distance between

the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).

For more details about RF layout, please refer to document [6].

5.2. GNSS Antenna Interface

The following tables show the pin definition and frequency specification of GNSS antenna interface.

Table 28: Pin Definition of GNSS Antenna Interface

Pin Name Pin No. I/O Description Comment

ANT_GNSS 47 AI GNSS antenna 50Ω impedance

Table 29: GNSS Frequency

Type Frequency Unit

GPS/Galileo/QZSS 1575.42±1.023 MHz

GLONASS 1597.5~1605.8 MHz

BeiDou 1561.098±2.046 MHz

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A reference design of GNSS antenna is shown as below.

Figure 37: Reference Circuit of GNSS Antenna

NOTES

1. An external LDO can be selected to supply power according to the active antenna requirement.

2. If the module is designed with a passive antenna, then the VDD circuit is not needed.

5.3. Antenna Installation

5.3.1. Antenna Requirement

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 30: Antenna Requirements

Type Requirements

Frequency range: 1561MHz~1615MHz

Polarization: RHCP or linear

VSWR: <2 (Typ.)

GNSS1)

GSM/WCDMA/LTE

EC21_Hardware_Design 74 / 105

Passive antenna gain: > 0dBi

Active antenna noise figure: <1.5dB

Active antenna gain: > 0dBi

Active antenna embedded LNA gain: <17 dB

VSWR: ≤2

Efficiency: > 30%

LTE Module Series

EC21 Hardware Design

Max Input Power: 50 W

Input Impedance: 50Ω

Cable insertion loss: <1dB

(GSM850, GSM900, WCDMA B5/B8,

LTE-FDD B5/B8/B12/B13/B18/B19/B20/B26/B28)

Cable insertion loss: <1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4)

Cable insertion loss <2dB

(LTE-FDD B7, LTE-TDD B40)

NOTE

1)

It is recommended to use a passive antenna when the module supports B13 or B14, because

harmonics will be generated when using an active antenna, which will affect the GNSS performance

5.3.2. Recommended RF Connector for Antenna Installation

If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector

provided by Hirose.

Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm)

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U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

Figure 39: Mechanicals of U.FL-LP Connectors

The following figure describes the space factor of mated connector.

Figure 40: Space Factor of Mated Connector (Unit: mm)

For more details, please visit http://www.hirose.com.

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6 Electrical, Reliability and Radio

Characteristics

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are

listed in the following table.

Table 31: Absolute Maximum Ratings

Parameter Min. Max. Unit

VBAT_RF/VBAT_BB -0.3 4.7 V

USB_VBUS -0.3 5.5 V

Peak Current of VBAT_BB 0 0.8 A

Peak Current of VBAT_RF 0 1.8 A

Voltage at Digital Pins -0.3 2.3 V

Voltage at ADC0 0 VBAT_BB V

Voltage at ADC1 0 VBAT_BB V

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6.2. Power Supply Ratings

Table 32: Power Supply Ratings

Parameter Description Conditions Min. Typ. Max. Unit

The actual input voltages

VBAT_BB and

VBAT_RF

VBAT

must stay between the

minimum and maximum

values.

3.3 3.8 4.3 V

I

VBAT

Voltage drop during

burst transmission

Peak supply current

(during transmission

slot)

Maximum power control

level on GSM900

Maximum power control

level on GSM900

400 mV

1.8 2.0 A

USB_VBUS USB detection 3.0 5.0 5.25 V

6.3. Operation and Storage Temperatures

The operation and storage temperatures are listed in the following table.

Table 33: Operation and Storage Temperatures

Parameter Min. Typ. Max. Unit

Operation Temperature Range1) -35 +25 +75 ºC

Extended Temperature Range2) -40 +85 ºC

Storage Temperature Range -40 +90 ºC

NOTES

1)

1.

Within operation temperature range, the module is 3GPP compliant.

2)

2.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

might reduce in their value and exceed the specified tolerances. When the temperature

out

returns to the normal operating temperature levels, the module will meet 3GPP specifications again.

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6.4. Current Consumption

The values of current consumption are shown below.

Table 34: EC21-E Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 13 uA

I

VBAT

AT+CFUN=0 (USB disconnected)

1.4 mA

GSM900 @DRX=9 (USB disconnected) 1.8 mA

DCS1800 @DRX=9 (USB disconnected) 1.8 mA

Sleep state

WCDMA PF=64 (USB disconnected) 2.4 mA

WCDMA PF=128 (USB disconnected) 1.9 mA

FDD-LTE PF=64 (USB disconnected) 3.2 mA

FDD-LTE PF=128 (USB disconnected) 2.1 mA

GSM900 @DRX=5 (USB disconnected) 22.0 mA

GSM900 @DRX=5 (USB connected) 32.0 mA

Idle state

(GNSS OFF)

WCDMA PF=64 (USB disconnected) 22.5 mA

WCDMA PF=64 (USB connected) 32.7 mA

LTE-FDD PF=64 (USB disconnected) 22.5 mA

LTE-FDD PF=64 (USB connected) 32.5 mA

GSM900 4DL/1UL @32.3dBm 220 mA

GSM900 3DL/2UL @32.18dBm 387 mA

GPRS data transfer

(GNSS OFF)

GSM900 2DL/3UL @30.3dBm 467 mA

GSM900 1DL/4UL @29.4dBm 555 mA

DCS1800 4DL/1UL @29.6dBm 185 mA

DCS1800 3DL/2UL @29.1dBm 305 mA

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DCS1800 2DL/3UL @28.8dBm 431 mA

DCS1800 1DL/4UL @29.1dBm 540 mA

GSM900 4DL/1UL @26dBm 148 mA

GSM900 3DL/2UL @26dBm 245 mA

GSM900 2DL/3UL @25dBm 338 mA

EDGE data transfer

(GNSS OFF)

WCDMA data transfer

(GNSS OFF)

GSM900 1DL/4UL @25dBm 432 mA

DCS1800 4DL/1UL @26dBm 150 mA

DCS1800 3DL/2UL @25dBm 243 mA

DCS1800 2DL/3UL @25dBm 337 mA

DCS1800 1DL/4UL @25dBm 430 mA

WCDMA B1 HSDPA @22.5dBm 659 mA

WCDMA B1 HSUPA @21.11dBm 545 mA

WCDMA B5 HSDPA @23.5dBm 767 mA

WCDMA B5 HSUPA @21.4dBm 537 mA

WCDMA B8 HSDPA @22.41dBm 543 mA

WCDMA B8 HSUPA @21.2dBm 445 mA

LTE-FDD B1 @23.45dBm 807 mA

LTE-FDD B3 @23.4dBm 825 mA

LTE data transfer

(GNSS OFF)

LTE-FDD B5 @23.4dBm 786 mA

LTE-FDD B7 @23.86dBm 887 mA

LTE-FDD B8 @23.5dBm 675 mA

LTE-FDD B20 @23.57dBm 770 mA

GSM900 PCL=5 @32.8dBm 336 mA

GSM voice call

PCS1800 PCL=0 @29.3dBm 291 mA

WCDMA voice call WCDMA B1 @23.69dBm 683 mA

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WCDMA B5 @23.61dBm 741 mA

WCDMA B8 @23.35dBm 564 mA

Table 35: EC21-A Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 10 uA

I

VBAT

AT+CFUN=0 (USB disconnected)

1.25 mA

WCDMA PF=64 (USB disconnected) 2.03 mA

Sleep state

WCDMA PF=128 (USB disconnected) 1.65 mA

LTE-FDD PF=64 (USB disconnected) 2.31 mA

LTE-FDD PF=128 (USB disconnected) 1.85 mA

WCDMA PF=64 (USB disconnected) 23.1 mA

Idle state

(GNSS OFF)

WCDMA PF=64 (USB connected) 32.8 mA

LTE-FDD PF=64 (USB disconnected) 22.8 mA

LTE-FDD PF=64 (USB connected) 32.8 mA

WCDMA B2 HSDPA @21.54dBm 479.0 mA

WCDMA B2 HSUPA @22.19dBm 530.0 mA

WCDMA data transfer

(GNSS OFF)

WCDMA B4 HSDPA @22.15dBm 539.0 mA

WCDMA B4 HSUPA @21.82dBm 531.0 mA

WCDMA B5 HSDPA @22.22dBm 454.0 mA

WCDMA B5 HSUPA @21.45dBm 433.0 mA

LTE-FDD B2 @23.11dBm 721.0 mA

LTE data transfer

(GNSS OFF)

LTE-FDD B4 @23.16dBm 748.0 mA

LTE-FDD B12 @23.25dBm 668.0 mA

WCDMA voice call WCDMA B2 @22.97dBm 565.0 mA

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WCDMA B4 @22.91dBm 590.0 mA

WCDMA B5 @23.06dBm 493.0 mA

Table 36: EC21-V Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 10 uA

1.07 mA

Sleep state

AT+CFUN=0 (USB disconnected)

LTE-FDD PF=64 (USB disconnected) 2.85 mA

LTE-FDD PF=128 (USB disconnected) 2.26 mA

I

VBAT

Idle state

(GNSS OFF)

LTE data transfer

(GNSS OFF)

LTE-FDD PF=64 (USB disconnected) 22.0 mA

LTE-FDD PF=64 (USB connected) 32.0 mA

LTE-FDD B4 @22.77dBm 762.0 mA

LTE-FDD B13 @23.05dBm 533.0 mA

Table 37: EC21-AUT Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 10 uA

AT+CFUN=0 (USB disconnected)

0.99 mA

WCDMA PF=64 (USB disconnected) 2.1 mA

Sleep state

WCDMA PF=128 (USB disconnected) 1.7 mA

LTE-FDD PF=64 (USB disconnected) 2.9 mA

I

VBAT

LTE-FDD PF=128 (USB disconnected) 2.4 mA

WCDMA PF=64 (USB disconnected) 22.0 mA

WCDMA PF=64 (USB connected) 32.0 mA

Idle state

LTE-FDD PF=64 (USB disconnected) 23.6 mA

LTE-FDD PF=64 (USB connected) 33.6 mA

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WCDMA B1 HSDPA @22.59dBm 589.0 mA

WCDMA data

(GNSS OFF)

WCDMA B1 HSUPA @22.29dBm 623.0 mA

WCDMA B5 HSDPA @22.22dBm 511.0 mA

WCDMA B5 HSUPA @21.64dBm 503.0 mA

LTE-FDD B1 @23.38dBm 813.0 mA

LTE-FDD B3 @22.87dBm 840.0 mA

LTE data

transfer

LTE-FDD B5 @23.12dBm 613.0 mA

(GNSS OFF)

LTE-FDD B7 @22.96dBm 761.0 mA

LTE-FDD B28 @23.31dBm 650.0 mA

WCDMA voice

call

WCDMA B1 @24.21dBm 687.0 mA

WCDMA B5 @23.18dBm 535.0 mA

Table 38: EC21-AUV Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 10 uA

AT+CFUN=0 (USB disconnected)

1.15 mA

WCDMA PF=64 (USB disconnected) 2.06 mA

Sleep state

WCDMA PF=128 (USB disconnected) 1.65 mA

LTE-FDD PF=64 (USB disconnected) 2.46 mA

LTE-FDD PF=128 (USB disconnected) 1.86 mA

I

VBAT

Idle state

(GNSS OFF)

WCDMA PF=64 (USB disconnected) 22.0 mA

WCDMA PF=64 (USB connected) 32.0 mA

LTE-FDD PF=64 (USB disconnected) 23.5 mA

LTE-FDD PF=64 (USB connected) 33.5 mA

WCDMA B1 HSDPA @22.59dBm 623.0 mA

WCDMA data

transfer (GNSS

WCDMA B1 HSUPA @22.47dBm 628.0 mA

OFF)

WCDMA B5 HSDPA @22.95dBm 605.0 mA

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WCDMA B5 HSUPA @22.87dBm 610.0 mA

WCDMA B8 HSDPA @22.37dBm 549.0 mA

WCDMA B8 HSUPA @22.09dBm 564.0 mA

LTE-FDD B1 @23.28dBm 789.0 mA

LTE-FDD B3 @23.2dBm 768.0 mA

LTE data transfer

(GNSS OFF)

LTE-FDD B5 @23.05dBm 669.0 mA

LTE-FDD B8 @23.21dBm 693.0 mA

LTE-FDD B28 @22.9dBm 795.0 mA

WCDMA B1 @23.43dBm 672.0 mA

WCDMA voice call

WCDMA B5 @23.32dBm 616.0 mA

WCDMA B8 @23.31dBm 592.0 mA

Table 39: EC21-J Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 10 uA

AT+CFUN=0 (USB disconnected)

0.85 mA

I

VBAT

Sleep state

LTE-FDD PF=64 (USB disconnected) 2.20 mA

LTE-FDD PF=128 (USB disconnected) 1.46 mA

Idle state

(GNSS OFF)

LTE-FDD PF=64 (USB disconnected) 23.5 mA

LTE-FDD PF=64 (USB connected) 33.8 mA

LTE-FDD B1 @23.35dBm 734.0 mA

LTE-FDD B3 @22.95dBm 778.0 mA

LTE data transfer

(GNSS OFF)

LTE-FDD B8 @22.81dBm 722.0 mA

LTE-FDD B18 @23.15dBm 677.0 mA

LTE-FDD B19 @23.17dBm 688.0 mA

LTE-FDD B26 @23.37dBm 723.0 mA

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Table 40: EC21-KL Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 10 uA

I

VBAT

1.08 mA

Sleep state

AT+CFUN=0 (USB disconnected)

LTE-FDD PF=64 (USB disconnected) 2.1 mA

LTE-FDD PF=128 (USB disconnected) 1.4 mA

Idle state

(GNSS OFF)

LTE-FDD PF=64 (USB disconnected) 24.8 mA

LTE-FDD PF=64 (USB connected) 33.5 mA

LTE-FDD B1 @23.0dBm 771.0 mA

LTE-FDD B3 @23.36dBm 780.0 mA

LTE data transfer

(GNSS OFF)

LTE-FDD B5 @23.56dBm 628.0 mA

LTE-FDD B7 @23.32dBm 754.0 mA

LTE-FDD B8 @23.33dBm 680.0 mA

Table 41: GNSS Current Consumption of EC21 Series Module

Parameter Description Conditions Typ. Unit

Cold start @Passive Antenna 58 mA

Lost state @Passive Antenna 58 mA

Instrument Environment 33 mA

Open Sky @Passive Antenna 35 mA

I

VBAT

(GNSS)

Searching

(AT+CFUN=0)

Tracking

(AT+CFUN=0)

Open Sky @Active Antenna 43 mA

6.5. RF Output Power

The following table shows the RF output power of EC21 module.

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Table 42: RF Output Power

Frequency Max. Min.

GSM850/GSM900 33dBm±2dB 5dBm±5dB

DCS1800/PCS1900 30dBm±2dB 0dBm±5dB

GSM850/GSM900 (8-PSK) 27dBm±3dB 5dBm±5dB

DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB

WCDMA bands 24dBm+1/-3dB <-49dBm

LTE-FDD bands 23dBm±2dB <-39dBm

LTE-TDD bands 23dBm±2dB <-39dBm

NOTE

In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the

GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

6.6. RF Receiving Sensitivity

The following tables show the conducted RF receiving sensitivity of EC21 series module.

Table 43: EC21-E Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

GSM900 -109.0dBm / / -102.0dBm

DCS1800 -109.0dBm / / -102.0dbm

WCDMA Band 1 -110.5dBm / / -106.7dBm

WCDMA Band 5 -110.5dBm / / -104.7dBm

WCDMA Band 8 -110.5dBm / / -103.7dBm

LTE-FDD B1 (10M) -98.0dBm -98.0dBm -101.5dBm -96.3dBm

LTE-FDD B3 (10M) -96.5dBm -98.5dBm -101.5dBm -93.3dBm

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LTE-FDD B5 (10M) -98.0dBm -98.5dBm -101.0dBm -94.3dBm

LTE-FDD B7 (10M) -97.0dBm -94.5dBm -99.5dBm -94.3dBm

LTE-FDD B8 (10M) -97.0dBm -97.0dBm -101.0dBm -93.3dBm

LTE-FDD B20 (10M) -97.5dBm -99.0dBm -102.5dBm -93.3dBm

Table 44: EC21-A Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

WCDMA B2 -110.0dBm / / -104.7dBm

WCDMA B4 -110.0dBm / / -106.7dBm

WCDMA B5 -110.5dBm / / -104.7dBm

LTE-FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm

LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm

LTE-FDD B12 (10M) -96.5dBm -98.0dBm -101.0dBm -93.3dBm

Table 45: EC21-V Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm

LTE-FDD B13 (10M) -95.0dBm -97.0dBm -100.0dBm -93.3dBm

Table 46: EC21-AUT Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

WCDMA B1 -110.0dBm / / -106.7dBm

WCDMA B5 -110.5dBm / / -104.7dBm

LTE-FDD B1 (10M) -98.5dBm -98.0dBm -101.0dBm -96.3dBm

LTE-FDD B3 (10M) -98.0dBm -96.0dBm -100.0dBm -93.3dBm

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LTE-FDD B5 (10M) -98.0dBm -99.0dBm -102.5dBm -94.3dBm

LTE-FDD B7 (10M) -97.0dBm -95.0dBm -98.5dBm -94.3dBm

LTE-FDD B28 (10M) -97.0dBm -99.0dBm -102.0dBm -94.8dBm

Table 47: EC21-KL Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

LTE-FDD B1 (10M) -98.0dBm -99.5dBm -100.5dBm -96.3dBm

LTE-FDD B3 (10M) -97.0dBm -97.5dBm -99.5dBm -93.3dBm

LTE-FDD B5 (10M) -98.0dBm -99.5dBm -100.5dBm -94.3dBm

LTE-FDD B7 (10M) -96.0dBm -96.0dBm -98.5dBm -94.3dBm

LTE-FDD B8 (10M) -97.0dBm -99.0dBm -101.0dBm -93.3dBm

Table 48: EC21-J Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

LTE-FDD B1 (10M) -97.5dBm -98.7dBm -100.2dBm -96.3dBm

LTE-FDD B3 (10M) -96.5dBm -97.1dBm -100.5dBm -93.3dBm

LTE-FDD B8 (10M) -98.4dBm -99.0dBm -101.2dBm -93.3dBm

LTE-FDD B18 (10M) -99.5dBm -99.0dBm -101.7dBm -96.3dBm

LTE-FDD B19 (10M) -99.2dBm -99.0dBm -101.4dBm -96.3dBm

LTE-FDD B26 (10M) -99.5dBm -99.0dBm -101.5dBm -93.8dBm

Table 49: EC21-AUV Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

WCDMA B1 -109.5dBm / / -106.7dBm

WCDMA B5 -111.0dBm / / -104.7dBm

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WCDMA B8 -111.0dBm / / -103.7dBm

LTE-FDD B1 (10M) -97.7dBm -97.5dBm -101.3dBm -96.3dBm

LTE-FDD B3 (10M) -98.2dBm -98.6dBm -102.7dBm -93.3dBm

LTE-FDD B5 (10M) -98.7dBm -98.2dBm -102.5dBm -94.3dBm

LTE-FDD B8 (10M) -98.2dBm -98.2dBm -102.3dBm -93.3dBm

LTE-FDD B28 (10M) -98.0dBm -98.7dBm -102.1dBm -94.8dBm

Table 50: EC21-AU Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

GSM850 -109.0dBm / / -102.0dBm

GSM900 -109.0dBm / / -102.0dBm

DCS1800 -109.0dBm / / -102.0dBm

PCS1900 -109.0dBm / / -102.0dBm

WCDMA B1 -110.0dBm / / -106.7dBm

WCDMA B2 -110.0dBm / / -104.7dBm

WCDMA B5 -111.0dBm / / -104.7dBm

WCDMA B8 -111.0dBm / / -103.7dBm

LTE-FDD B1 (10M) -97.2dBm -97.5dBm -100.2dBm -96.3dBm

LTE-FDD B2 (10M) -98.2dBm / / -94.3dBm

LTE-FDD B3 (10M) -98.7dBm -98.6dBm -102.2dBm -93.3dBm

LTE-FDD B4 (10M) -97.7dBm -97.4dBm -100.2dBm -96.3dBm

LTE-FDD B5 (10M) -98.0dBm -98.2dBm -101.0dBm -94.3dBm

LTE-FDD B7 (10M) -97.7dBm -97.7dBm -101.2dBm -94.3dBm

LTE-FDD B8 (10M) -99.2dBm -98.2dBm -102.2dBm -93.3dBm

LTE-FDD B28 (10M) -98.6dBm -98.7dBm -102.0dBm -94.8dBm

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LTE-TDD B40 (10M) -97.2dBm -98.4dBm -101.2dBm -96.3dBm

NOTE

1)

SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two

antennas at the receiver side, which can improve RX performance.

6.7. Electrostatic Discharge

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject

to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be applied throughout the processing, handling and operation of any

application that incorporates the module.

The following table shows the module’s electrostatic discharge characteristics.

Table 51: Electrostatic Discharge Characteristics

Tested Points Contact Discharge Air Dischar ge Unit

VBAT, GND ±5 ±10 kV

All Antenna Interfaces ±4 ±8 kV

Other Interfaces ±0.5 ±1 kV

6.8. Thermal Consideration

In order to achieve better performance of the module, it is recommended to comply with the following

principles for thermal consideration:

 On customers’ PCB design, please keep placement of the module away from heating sources,

especially high power components such as ARM processor, audio power amplifier, power supply, etc.

 Do not place components on the opposite side of the PCB area where the module is mounted, in

order to facilitate adding of heatsink when necessary.

 Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as

to ensure better heat dissipation performance.

 The reference ground of the area where the module is mounted should be complete, and add ground

vias as many as possible for better heat dissipation.

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 Make sure the ground pads of the module and PCB are fully connected.

 According to customers’ application demands, the heatsink can be mounted on the top of the module,

or the opposite side of the PCB area where the module is mounted, or both of them.

 The heatsink should be designed with as many fins as possible to increase heat dissipation area.

Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and

module/PCB.

The following shows two kinds of heatsink designs for reference and customers can choose one or both

of them according to their application structure.

Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)

Figure 42: Referenced Heatsink Design (Heatsink at the Bottom of Customers’ PCB)

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NOTE

The module offers the best performance when the internal BB chip stays below 105°C. When the

maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides

reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip

temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to

network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design

should be maximally optimized to make sure the maximum BB chip temperature always maintains below

105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from

the first returned value.

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7 Mechanical Dimensions

This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.

The tolerances for dimensions without tolerance values are ±0.05mm.

7.1. Mechanical Dimensions of the Module

29.0±0.15

32.0±0.15

Figure 43: Module Top and Side Dimensions

2.4±0.2

0.8

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EC21 Hardware Design

Figure 44: Module Bottom Dimensions (Bottom View)

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LTE Module Series

EC21 Hardware Design

7.2. Recommended Footprint

Figure 45: Recommended Footprint (Top View)

NOTES

1. The keep out area should not be designed.

2. For easy maintenance of the module, please keep about 3mm between the module and other

components in the host PCB.

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LTE Module Series

EC21 Hardware Design

7.3. Design Effect Drawings of the Module

Figure

46: Top View of the Module

Figure 47: Bottom View of the Module

NOTE

These are design effect drawings of EC21 module. For more accurate pictures, please refer to the

module that you get from Quectel.

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LTE Module Series

EC21 Hardware Design

8 Storage, Manufacturing and

Packaging

8.1. Storage

EC21 is stored in a vacuum-sealed bag. The storage restrictions are shown as below.

1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH.

2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other

high temperature processes must be:

 Mounted within 168 hours at the factory environment of ≤30ºC/60%RH

 Stored at <10%RH

3. Devices require baking before mounting, if any circumstances below occurs:

 When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity

is >10% before opening the vacuum-sealed bag.

 Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.

4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.

NOTE

As the plastic package cannot be subjected to high temperature, it should be removed from devices

before high temperature (120ºC) baking. If shorter baking time is desired, please refer to

IPC/JEDECJ-STD-033 for baking procedure.

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EC21 Hardware Design

8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the

stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly

so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the

thickness of stencil for the module is recommended to be 0.20mm. For more details, please refer to

document [4].

It is suggested that the peak reflow temperature is 235ºC~245ºC (for SnAg3.0Cu0.5 alloy). The absolute

maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is

suggested that the module should be mounted after reflow soldering for the other side of PCB has been

completed. Recommended reflow soldering thermal profile is shown below:

Figure 48: Reflow Soldering Thermal Profile

NOTE

During manufacturing and soldering, or any other processes that may contact the module directly, NEVER

wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol,

trichloroethylene, etc.

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EC21 Hardware Design

8.3. Packaging

EC21 is packaged in tape and reel carriers. One reel is 11.88m long and contains 250pcs modules. The

figure below shows the packaging details, measured in mm.

± 0.15

20.20

± 0.3

44.00

± 0.1

1.75

32.5

33.5

48.5

± 0.15 ± 0.15

2.00

±0.1

44.00

±0.1

4.00

± 0.1

32.5± 0.15

33.5± 0.15

1

.

0

±

0

5

.

1

± 0.15

29.3

± 0.15

30.3

0.35± 0.05

4.2

3.1

± 0.15

30.3

± 0.15 ± 0.15

Cover tap

e

13

Direction of feed

100

+0.20

44.5

-0.00

Figure 49: Tape and Reel Specifications

EC21_Hardware_Design 99 / 105

Quectel Wireless Solutions 201805EC21AU Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual