Quectel Wireless Solutions 201708EC21E User Manual

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LTE Module Series
EC21 Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Email:info@quectel.com
Or our local office.For more information, please visit:
http://www.quectel.com/support/salesupport.aspx
For technical support, or to report documentation errors, please visit:
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Or email to: Support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
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TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
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THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
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OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.
EC21_Hardware_Design Confidential / Released 1 / 94
EC21 Hardware Design
About the Document
History
Revision Date Author Description
1.0 2016-04-15 Yeoman CHEN Initial
LTE Module Series
Yeoman CHEN/
1.1 2016-09-22
1.2 2016-11-04
Frank WANG/
Lyndon LIU
Lyndon LIU/
Michael ZHANG
1. Updated frequency bands in Table 1.
2. Updated transmitting power, supported maximum
baud rate of main UART, supported internet
protocols, supported USB drivers of USB interface,
and temperature range in Table 2.
3. Updated timing of turning on module in Figure 12.
4. Updated timing of turning off module in Figure 13.
5. Updated timing of resetting module in Figure 16.
6. Updated main UART supports baud rate in Chapter
3.11.
7. Added notes for ADC interface in Chapter 3.13.
8. Updated GNSS Performance in Table 21.
9. Updated operating frequencies of module in Table
23.
10. Added current consumption in Chapter 6.4.
11. Updated RF output power in Chapter 6.5.
12. Added RF receiving sensitivity in Chapter 6.6.
1. Added SGMII and WLAN interfaces in Table 2.
2. Updated function diagram in Figure 1.
3. Updated pin assignment (Top View) in Figure 2.
4. Added description of SGMII and WLAN interfaces in
Table 4.
5. Added SGMII interface in Chapter 3.17.
6. Added WLAN interface in Chapter 3.18.
7. Added USB_BOOT interface in Chapter 3.19.
8. Added reference design of RF layout in Chapter
5.1.4.
9. Added current consumption of EC21-V in Chapter
EC21_Hardware_Design Confidential / Released 2 / 94
EC21 Hardware Design
1.3 2017-01-24
Lyndon LIU/
Rex WANG
LTE Module Series
6.4.
10. Added note about SIMO in Chapter 6.6.
1. Updated frequency bands in Table 1.
2. Updated function diagram in Figure 1.
3. Updated pin assignment (top view) in Figure 2.
4. Added BT interface in Chapter 3.18.2.
5. Updated reference circuit of wireless connectivity
interfaces with FC20 module in Figure 29.
6. Updated GNSS performance in Table 24.
7. Updated module operating frequencies in Table 26.
8. Added EC21-AUV current consumption in Table 38.
9. Updated EC21-A conducted RF receiving sensitivity
of in Table 42.
10. Added EC21-J conducted RF receiving sensitivity in
Table 48.
1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT
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LTE Module Series
EC21 Hardware Design
Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 4
Table Index ............................................................................................................................................... 6
Figure Index .............................................................................................................................................. 8
1 Introduction ..................................................................................................................................... 10
1.1. Safety Information ..................................................................................................................11
2 Product Concept ............................................................................................................................. 12
2.1. General Description .............................................................................................................. 12
2.2. Key Features ......................................................................................................................... 13
2.3. Functional Diagram ............................................................................................................... 15
2.4. Evaluation Board ................................................................................................................... 16
3 Application Interfaces ..................................................................................................................... 17
3.1. General Description .............................................................................................................. 17
3.2. Pin Assignment ..................................................................................................................... 18
3.3. Pin Description ...................................................................................................................... 19
3.4. Operating Modes .................................................................................................................. 28
3.5. Power Saving ........................................................................................................................ 28
3.5.1.
Sleep Mode.................................................................................................................. 28
3.5.1.1. UART Application ............................................................................................... 28
3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 29
3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 30
3.5.1.4. USB Application without USB Suspend Function ............................................... 31
3.5.2. Airplane Mode .............................................................................................................. 32
3.6. Power Supply ........................................................................................................................ 32
3.6.1. Power Supply Pins ....................................................................................................... 32
3.6.2. Decrease Voltage Drop ................................................................................................ 33
3.6.3. Reference Design for Power Supply ............................................................................ 34
3.6.4. Monitor the Power Supply ............................................................................................ 35
3.7. Turn on and off Scenarios ..................................................................................................... 35
3.7.1. Turn on Module Using the PWRKEY ........................................................................... 35
3.7.2. Turn off Module ............................................................................................................ 37
3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 37
3.7.2.2. Turn off Module Using AT Command ................................................................. 37
3.8. Reset the Module .................................................................................................................. 38
3.9. USIM Card Interface ............................................................................................................. 39
3.10. USB Interface ........................................................................................................................ 41
3.11. UART Interfaces .................................................................................................................... 43
3.12. PCM and I2C Interfaces ........................................................................................................ 45
3.13. ADC Function ........................................................................................................................ 48
3.14. Network Status Indication ..................................................................................................... 49
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3.15. STATUS ................................................................................................................................ 50
3.16. Behavior of the RI ................................................................................................................. 51
3.17. SGMII Interface ..................................................................................................................... 51
3.18. Wireless Connectivity Interfaces ........................................................................................... 54
3.18.1. WLAN Interface ........................................................................................................... 56
3.18.2. BT Interface* ................................................................................................................ 56
3.19. USB_BOOT Interface ............................................................................................................ 57
4 GNSS Receiver ................................................................................................................................ 58
4.1. General Description .............................................................................................................. 58
4.2. GNSS Performance .............................................................................................................. 58
4.3. Layout Guidelines ................................................................................................................. 59
5 Antenna Interfaces .......................................................................................................................... 60
5.1. Main/Rx-diversity Antenna Interface ..................................................................................... 60
5.1.1. Pin Definition ................................................................................................................ 60
5.1.2. Operating Frequency ................................................................................................... 60
5.1.3. Reference Design of RF Antenna Interface ................................................................. 61
5.1.4. Reference Design of RF Layout ................................................................................... 62
5.2.
GNSS Antenna Interface ....................................................................................................... 64
5.3. Antenna Installation .............................................................................................................. 65
5.3.1. Antenna Requirement .................................................................................................. 65
5.3.2. Recommended RF Connector for Antenna Installation ................................................ 66
6 Electrical, Reliability and Radio Characteristics .......................................................................... 68
6.1. Absolute Maximum Ratings .................................................................................................. 68
6.2. Power Supply Ratings ........................................................................................................... 68
6.3. Operating Temperature ......................................................................................................... 69
6.4. Current Consumption ............................................................................................................ 70
6.5. RF Output Power .................................................................................................................. 76
6.6. RF Receiving Sensitivity ....................................................................................................... 76
6.7. Electrostatic Discharge ......................................................................................................... 80
7 Mechanical Dimensions.................................................................................................................. 81
7.1. Mechanical Dimensions of the Module.................................................................................. 81
7.2. Recommended Footprint ....................................................................................................... 83
7.3. Design Effect Drawings of the Module .................................................................................. 84
8
Storage, Manufacturing and Packaging ........................................................................................ 85
8.1. Storage ................................................................................................................................. 85
8.2. Manufacturing and Soldering ................................................................................................ 86
8.3. Packaging ............................................................................................................................. 87
9 Appendix A References .................................................................................................................. 88
10 Appendix B GPRS Coding Schemes ............................................................................................. 92
11 Appendix C GPRS Multi-slot Classes ............................................................................................ 93
12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 94
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EC21 Hardware Design
Table Index
TABLE 1: FREQUENCY BANDS OF EC21 SERIES MODULE ........................................................................ 12
TABLE 2: KEY FEATURES OF EC21 MODULE ............................................................................................... 13
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 19
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 28
TABLE 6: VBAT AND GND PINS ....................................................................................................................... 33
TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 35
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 38
TABLE 9: PIN DEFINITION OF THE USIM CARD INTERFACE ...................................................................... 39
TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 41
TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE ..................................................................... 43
TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ................................................................. 43
TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 44
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 46
TABLE 15: PIN DEFINITION OF THE ADC ...................................................................................................... 48
TABLE 16: CHARACTERISTIC OF THE ADC .................................................................................................. 48
TABLE 17: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ...................... 49
TABLE 18: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ................... 49
TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ 50
TABLE 20: BEHAVIOR OF THE RI ................................................................................................................... 51
TABLE 21: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 52
TABLE 22: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 54
TABLE 23: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 57
TABLE 24: GNSS PERFORMANCE ................................................................................................................. 58
TABLE 25: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 60
TABLE 26: MODULE OPERATING FREQUENCIES ........................................................................................ 60
TABLE 27: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 64
TABLE 28: GNSS FREQUENCY ....................................................................................................................... 64
TABLE 29: ANTENNA REQUIREMENTS .......................................................................................................... 65
TABLE 30: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 68
TABLE 31: POWER SUPPLY RATINGS ........................................................................................................... 68
TABLE 32: OPERATING TEMPERATURE ........................................................................................................ 69
TABLE 33: EC21-A CURRENT CONSUMPTION ............................................................................................. 70
TABLE 34: EC21-AUT CURRENT CONSUMPTION ........................................................................................ 71
TABLE 35: EC21-E CURRENT CONSUMPTION ............................................................................................. 72
TABLE 36: EC21-KL CURRENT CONSUMPTION ........................................................................................... 73
TABLE 37: EC21-V CURRENT CONSUMPTION ............................................................................................. 74
TABLE 38: EC21-AUV CURRENT CONSUMPTION ........................................................................................ 74
TABLE 39: GNSS CURRENT CONSUMPTION OF EC21 SERIES MODULE ................................................. 75
TABLE 40: RF OUTPUT POWER ..................................................................................................................... 76
TABLE 41: EC21-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 76
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LTE Module Series
EC21 Hardware Design
TABLE 42: EC21-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77
TABLE 43: EC21-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77
TABLE 44: EC21-AUT CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 77
TABLE 45: EC21-AUTL CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 78
TABLE 46: EC21-KL CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 78
TABLE 47: EC21-CT CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 78
TABLE 48: EC21-J CONDUCTED RF RECEIVING SENSITIVITY................................................................... 79
TABLE 49: EC21-AUV CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 79
TABLE 50: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 80
TABLE 51: RELATED DOCUMENTS ................................................................................................................ 88
TABLE 52: TERMS AND ABBREVIATIONS ...................................................................................................... 88
TABLE 53: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 92
TABLE 54: GPRS MULTI-SLOT CLASSES ...................................................................................................... 93
TABLE 55: EDGE MODULATION AND CODING SCHEMES ........................................................................... 94
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18
FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 29
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 30
FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 31
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 31
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 33
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 34
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 34
FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 35
FIGURE 11: TURN ON THE MODULE USING KEYSTROKE .......................................................................... 36
FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 36
FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 37
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 38
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 38
FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 39
FIGURE 17: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH AN 8-PIN USIM CARD
CONNECTOR .................................................................................................................................................... 40
FIGURE 18: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH A 6-PIN USIM CARD CONNECTOR
........................................................................................................................................................................... 40
FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 42
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 44
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 45
FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 46
FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 46
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 47
FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 50
FIGURE 26: REFERENCE CIRCUITS OF STATUS ......................................................................................... 50
FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 52
FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................. 53
FIGURE 29: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE
........................................................................................................................................................................... 55
FIGURE 30: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 57
FIGURE 31: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61
FIGURE 32: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62
FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 62
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .......................................................................................................................................................... 63
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .......................................................................................................................................................... 63
FIGURE 36: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64
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FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 66
FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 66
FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 67
FIGURE 40: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 81
FIGURE 41: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 82
FIGURE 42: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 83
FIGURE 43: TOP VIEW OF THE MODULE ...................................................................................................... 84
FIGURE 44: BOTTOM VIEW OF THE MODULE .............................................................................................. 84
FIGURE 45: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 86
FIGURE 46: TAPE AND REEL SPECIFICATIONS ........................................................................................... 87
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EC21 Hardware Design
1 Introduction
This document defines the EC21module and describes its air interface and hardware interface which are
connected with your application.
This document can help you quickly understand module interface specifications, electrical andmechanical
details, as well as other related information of EC21 module. Associated with application note and user
guide, you can use EC21 module to design and set up mobile applications easily.
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LTE Module Series
EC21 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EC21 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, andincorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the
customer’s failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals,clinics or other health care
facilities. These requests are designed to prevent possible interference with
sensitive medical equipment.
Cellular terminals or mobiles operatingover radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid USIM/SIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres includefuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
EC21_Hardware_Design Confidential / Released 11 / 94
LTE Module Series
EC21 Hardware Design
2 Product Concept
2.1. General Description
EC21 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive
diversity. It provides data connectivity on LTE-FDD, LTE-TDD,DC-HSPA+, HSPA+, HSDPA, HSUPA,
WCDMA,EDGE andGPRSnetworks. It also provides GNSS
applications.EC21 contains tenvariants:EC21-E, EC21-A, EC21-V, EC21-AUT,
EC21-AU,EC21-AUV,EC21-AUTL, EC21-J, EC21-CT and EC21-KL. You can choose a dedicated type
based on the region or operator. The following table shows the frequency bands of EC21 series module.
1)
and voice functionality2) for your specific
Table 1: Frequency Bands of EC21 Series Module
Modules2) LTE Bands 3G Bands GSM
EC21-E
EC21-A
EC21-V
EC21-AUT
EC21-AU3)
EC21-AUV
EC21-AUTL
FDD:B1/B3/B5/B7/B8/B20
FDD:B2/B4/B12
FDD:B4/B13 N N Y
FDD:B1/B3/B5/B7/B28
FDD: B1/B2/B3/B4/B5/B7/B8/
B28
TDD: B40
FDD: B1/B3/B5/B8/B28 B1/B5/B8 N Y N
FDD:B3/B7/B28 N N Y N
WCDMA:B1/B
5/B8
WCDMA:B2/B
4/B5
WCDMA:
B1/B5
WCDMA:
B1/B2/B5/B8
900/1800 Y
N Y
N Y
850/900/
1800/1900
Rx­diversity
Y
GNSS1)
GPS,
GLONASS,
BeiDou/
Compass,
Galileo,QZS
S
EC21-J
EC21-CT
EC21-KL
EC21_Hardware_Design Confidential / Released 12 / 94
FDD: B1/B3/B8/B18/B19/B26 N N Y N
FDD:B1/B3/B5 N N N N
FDD:B1/B3/B5/B7/B8 N N Y N
LTE Module Series
EC21 Hardware Design
NOTES
1)
1.
GNSS function is optional.
2)
2.
EC21 series module (EC21-E, EC21-A, EC21-V, EC21-AUT, EC21-AU,EC21-AUV, EC21-AUTL,
EC21-J, EC21-CT and EC21-KL) includes Data-only and Telematics versions. Data-only version does not support voice function, while Telematics version supports it.
3)
3.
B2 band on EC21-AU module does not support Rx-diversity.
4. Y = supported (including LTE and WCDMA). N = Not supported.
With a compact profile of 32.0mm ×29.0mm ×2.4mm, EC21 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone,tablet PC, etc.
EC21 is an SMD type module which can be embedded into applications through its 144-pin pads,
including 80LCC signal pads and 64 other pads.
2.2. Key Features
The following table describes the detailed features of EC21 module.
Table 2: Key Features of EC21 Module
Features Details
Power Supply Supply voltage: 3.3V~4.3VTypical supply voltage: 3.8V
Class 4 (33dBm±2dB) for GSM900
Class 1 (30dBm±2dB) for DCS1800
Class E2 (27dBm±3dB) for GSM900 8-PSK
Transmitting Power
LTE Features
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class 3 (22.5dBm -3/+1dB) for WCDMA bands
Class 3 (22.5dBm -3/+1dB) for LTE-FDD bands
Class 3 (22.5dBm -3/+1dB) for LTE-TDD bands
Support up to non-CA CAT1
Support 1.4 to 20MHz RF bandwidth
SupportMIMO in DL direction
FDD: Max 5Mbps (UL), 10Mbps (DL)
TDD: Max 3.1Mbps(UL), 8.96Mbps(DL)
Support 3GPP R8 DC-HSPA+
WCDMA Features
Support 16-QAM, 64-QAM and QPSKmodulation
3GPP R6 CAT6 HSUPA: Max 5.76Mbps (UL)
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EC21 Hardware Design
GSMFeatures
Internet Protocol Features
LTE Module Series
3GPP R8 CAT24 DC-HSPA+: Max 42Mbps (DL)
R99:
CSD: 9.6kbps, 14.4kbps
GPRS:
Support GPRS multi-slot class 12 (12 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Maximum of four Rx time slots per frame
EDGE:
Support EDGE multi-slot class 12 (12 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Support
TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/MMS*/FTPS*/
SSL*protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
Text and PDU mode
SMS
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
USIM Interface Support USIM/SIM card: 1.8V, 3.0V
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
Used for audio function with external codec
Support 8-bit A-law*, μ-law*and 16-bit linear data formats
PCM Interface
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
Compliant with USB 2.0 specification (slave only);the data transfer rate can
reach up to 480Mbps
USB Interface
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging, firmware upgradeand voice over USB*
SupportUSB drivers for Windows XP, Windows Vista, Windows 7, Windows
8/8.1, Window 10, Linux 2.6 or later, Android 4.0/4.2/4.4/5.0/5.1/6.0
UART Interface
Main UART:
Used for AT command communication and data transmission
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EC21 Hardware Design
Baud rate reach up to 3000000bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console, log output
115200bps baud rate
SGMII Interface Support 10/100/1000Mbps Ethernet connectivity
LTE Module Series
Wireless Connectivity
Interfaces
Support a low-power SDIO 3.0 interface for WLAN and UART/PCM
interface for Bluetooth*
Rx-diversity Support LTE/WCDMA Rx-diversity
GNSS Features
AT Commands
Network Indication
Antenna Interface
Physical Characteristics
Temperature Range
Gen8CLite of Qualcomm
Protocol: NMEA 0183
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Including main antennainterface(ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Size: (32.0±0.15)×(29.0±0.15)×(2.4±0.2)mm
Weight: approx. 4.9g
Operation temperature range: -35°C ~ +75°C
Extended temperature range: -40°C ~ +85°C
1)
2)
Firmware Upgrade USB interfaceand DFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1. 1) Within operating temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P
might reduce in their value and exceed the specified tolerances. When the temperature
out
returns to normal operating temperature levels, the module will meet 3GPP specificationsagain.
3. “*” means under development.
2.3. Functional Diagram
EC21_Hardware_Design Confidential / Released 15 / 94
LTE Module Series
EC21 Hardware Design
The following figure shows a block diagram of EC21 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
ANT_MAIN ANT_DIVANT_GNSS
VBAT_RF
VBAT_BB
PWRKEY
RESET_N
ADCs
STATUS
APT
PMIC
Tx
Control
19.2M
PA
XO
Switch
Duplex
PRx DRx
SAW
LNA
Transceiver
IQ Control
Baseband
Switch
SAW
NAND DDR2
SDRAM
VDD_EXT
USB
USIM
PCM
SGMII
WLAN
I2C
UART
GPIOs
BT
Figure 1: Functional Diagram
2.4. Evaluation Board
In order to help youdevelop applications with EC21, Quectel supplies an evaluation board (EVB), USB
data cable, earphone, antenna and other peripherals to control or test the module.
EC21_Hardware_Design Confidential / Released 16 / 94
LTE Module Series
EC21 Hardware Design
3 Application Interfaces
3.1. General Description
EC21 is equipped with 80-pin SMT pads plus 64-pin ground pads and reserved pads that can
beconnected to cellular application platform. Sub-interfaces included in these pads are described in detail
in the following chapters:
Power supply
USIM interface
USB interface
UART interfaces
PCM interface
ADC interface Status indication
SGMII interface
Wireless connectivity interfaces
USB_BOOT interface
EC21_Hardware_Design Confidential / Released 17 / 94
EC21 Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of EC21 module.
LTE Module Series
Figure 2: Pin Assignment (Top View)
NOTES
1. 1)means that these pins cannot be pulled up before startup.
2)
2.
PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
3. Pads 119~126 are SGMII function pins.
4. Pads 37~40, 118, 127 and 129~139 are wireless connectivity interfaces, among which pads 127 and
129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT function is under
development.
5. Pads 24~27 are multiplexing pinsused for audio design on EC21 module and BT function on FC20
EC21_Hardware_Design Confidential / Released 18 / 94
LTE Module Series
EC21 Hardware Design
module.
6. Keep all RESERVEDpins and unused pins unconnected.
7. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should
not be designed in schematic and PCB decal.
8. “
” means these interface functions are only supported on Telematics version.
3.3. Pin Description
The following tables show the pin definition of EC21 module.
Table 3: I/O Parameters Definition
Type Description
IO Bidirectional
DI Digital input
DO Digital output
PI Power input
PO Power output
AI Analog input
AO Analog output
OD Open drain
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
VBAT_BB 59,60 PI
VBAT_RF 57,58 PI
Power supply for
module baseband
part
Power supply for
module RF part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to provide
sufficient current up to
0.8A.
It must be able to provide
sufficient current up to
1.8A in a burst
transmission.
EC21_Hardware_Design Confidential / Released 19 / 94
LTE Module Series
EC21 Hardware Design
Power supply for
external GPIO’s pull up
circuits.
VDD_EXT 7 PO
Provide 1.8V for
external circuit
Vnorm=1.8V
I
max=50mA
O
8,9,19,22,3
GND
6,46,48,50
~54,56,72,
Ground
85~112
Turn on/off
Pin Name Pin No. I/O Description DC Characteristics Comment
The output voltage is
0.8V because of the
diode drop in the
Qualcomm chipset.
PWRKEY 21 DI
Turnon/off the
module
RESET_N 20 DI Reset the module
V
max=2.1V
IH
V
min=1.3V
IH
V
max=0.5V
IL
max=2.1V
V
IH
V
min=1.3V
IH
V
max=0.5V
IL
Status Indication
Pin Name Pin No. I/O Description DC Characteristics Comment
STATUS 61 OD
Indicate the module
operating status
Indicate the module
NET_MODE 5 DO
network registration
mode
NET_
STATUS
6 DO
Indicate the module
network activity
status
The drive current
should be less than
0.9mA.
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
Require external
pull-up. If unused,
keep it open.
1.8V power domain.
Cannot be pulled up
before startup.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
USB Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
USB_VBUS 71 PI USB detection Vnorm=5.0V
USB_DP 69 IO
USB differential data
bus
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90ohm.
USB_DM 70 IO
USB differential data
bus
Compliant with USB
2.0 standard
specification.
EC21_Hardware_Design Confidential / Released 20 / 94
Require differential
impedance of 90ohm.
LTE Module Series
EC21 Hardware Design
USIM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
USIM_GND 10
USIM_VDD 14 PO
USIM_DATA 15 IO
USIM_CLK 16 DO
USIM_RST 17 DO
USIM_
PRESENCE
13 DI
Specified ground for
USIM card
Power supply for
USIM card
Data signal of USIM
card
Clock signal of USIM
card
Reset signal of
USIM card
USIM card insertion
detection
For 1.8V USIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V USIM:
Vmax=3.05V
Either 1.8V or 3.0V is
supported by the
module automatically.
Vmin=2.7V
I
max=50mA
O
For 1.8V USIM:
V
max=0.6V
IL
V
min=1.2V
IH
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V USIM:
V
max=1.0V
IL
V
min=1.95V
IH
V
max=0.45V
OL
V
min=2.55V
OH
For 1.8V USIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V USIM:
V
max=0.45V
OL
V
min=2.55V
OH
For 1.8V USIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V USIM:
V
max=0.45V
OL
V
min=2.55V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it open.
EC21_Hardware_Design Confidential / Released 21 / 94
LTE Module Series
EC21 Hardware Design
UART Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
V
RI 62 DO Ring indicator
DCD 63 DO
Data carrier
detection
CTS 64 DO Clear to send
RTS 65 DI Request to send
Data terminal
DTR 66 DI
ready,sleep mode
control
OL
V
OH
V
OL
VOHmin=1.35V
V
OL
V
OH
V
IL
V
IL
V
IH
V
IH
V
IL
V
IL
V
IH
V
IH
max=0.45V
min=1.35V
max=0.45V
max=0.45V
min=1.35V
min=-0.3V
max=0.6V
min=1.2V
max=2.0V
min=-0.3V
max=0.6V
min=1.2V
max=2.0V
1.8V power domain.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
1.8V power domain.
Pull-up by default. Low
level wakes up the
module.
If unused, keep it open.
TXD 67 DO Transmit data
RXD 68 DI Receive data
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
V
Debug UART Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
DBG_TXD 12 DO Transmit data
DBG_RXD 11 DI Receive data
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
V
ADC Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
General purpose
ADC0 45 AI
analog to digital
converter
General purpose
ADC1 44 AI
analog to digital
converter
Voltage range:
0.3V to VBAT_BB
Voltage range:
0.3V to VBAT_BB
EC21_Hardware_Design Confidential / Released 22 / 94
If unused, keep it open.
If unused, keep it open.
LTE Module Series
EC21 Hardware Design
PCM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
V
min=-0.3V
IL
V
PCM_IN 24 DI PCM data input
PCM_OUT 25 DO PCM data output
PCM data frame
PCM_SYNC 26 IO
synchronization
signal
PCM_CLK 27 IO PCM clock
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
VOLmax=0.45V
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it open.
1.8V power domain.
If unused, keep it open.
1.8V power domain.
In master mode, it is an
output signal.
In slave mode, it is an
input signal.
If unused, keep it open.
1.8V power domain.
In master mode, it is an
output signal.
In slave mode, it is an
input signal.
If unused, keep it open.
I2C Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
I2C serial clock.
I2C_SCL 41 OD
Used for external
codec
I2C serial data.
I2C_SDA 42 OD
Used for external
codec
External pull-up
resistor is required.
1.8V only.
If unused, keep it open.
External pull-up
resistor is required.
1.8V only.
If unused, keep it open.
SGMII Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
For 1.8V:
max=0.45V
V
EPHY_RST_N 119 DO Ethernet PHY reset
OL
V
min=1.4V
OH
For 2.85V:
V
max=0.35V
OL
V
min=2.14V
OH
1.8V/2.85V power
domain.
If unused, keep it
open.
EC21_Hardware_Design Confidential / Released 23 / 94
EC21 Hardware Design
EPHY_INT_N 120 DI
SGMII_
MDATA
SGMII_
MCLK
121 IO
122 DO
USIM2_VDD 128 PO
Ethernet PHY
interrupt
SGMII MDIO
(Management Data
Input/Output) data
SGMII MDIO
(Management Data
Input/Output) clock
SGMII MDIO pull-up
power source
V
min=-0.3V
IL
VILmax=0.6V
V
min=1.2V
IH
V
max=2.0V
IH
For 1.8V:
V
max=0.45V
OL
V
min=1.4V
OH
V
max=0.58V
IL
V
min=1.27V
IH
For 2.85V:
V
max=0.35V
OL
V
min=2.14V
OH
V
max=0.71V
IL
V
min=1.78V
IH
For 1.8V:
V
max=0.45V
OL
V
min=1.4V
OH
For 2.85V:
V
max=0.35V
OL
V
min=2.14V
OH
LTE Module Series
1.8V power domain.
If unused, keep it
open.
1.8V/2.85V power
domain.
If unused, keep it
open.
1.8V/2.85V power
domain.
If unused, keep it
open.
Configurable power
source.
1.8V/2.85V power
domain.
External pull-up for
SGMII MDIO pins.
If unused, keep it
open.
SGMII_TX_M 123 AO
SGMII_TX_P 124 AO
SGMII_RX_P 125 AI
SGMII_RX_M 126 AI
SGMII transmission
- minus
SGMII transmission
- plus
SGMII receiving
- plus
SGMII receiving
-minus
If unused, keep it
open.
If unused, keep it
open.
If unused, keep it
open.
If unused, keep it
open.
Wireless Connectivity Interfaces
Pin Name Pin No. I/O Description DC Characteristics Comment
SDC1_
DATA3
129 IO SDIO data bus D3
V
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
EC21_Hardware_Design Confidential / Released 24 / 94
LTE Module Series
EC21 Hardware Design
SDC1_
DATA2
SDC1_
DATA1
SDC1_
DATA0
130 IO SDIO data bus D2
131 IO SDIO data bus D1
132 IO SDIO data bus D1
SDC1_CLK 133 DO SDIO clock
VILmin=-0.3V
VILmax=0.6V
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
SDC1_CMD 134 DO SDIO command
PM_ENABLE 127 DO
WAKE_ON_
WIRELESS
135 DI
External power
control
Wake up the host
(EC21 module) by
FC20 module.
WLAN function
WLAN_EN 136 DO
controlvia FC20
module
COEX_UART_
RX
137 DI
LTE/WLAN
coexistence signal
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
Active low.
If unused, keep it
open.
1.8V power domain.
Active high.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
EC21_Hardware_Design Confidential / Released 25 / 94
LTE Module Series
EC21 Hardware Design
COEX_UART_
TX
WLAN_SLP_
CLK
138 DO
118 DO WLAN sleep clock
BT_RTS* 37 DI
BT_TXD* 38 DO
BT_RXD* 39 DI
BT_CTS* 40 DO
LTE/WLAN
coexistence signal
BT UART request to
send
BT UART transmit
data
BT UART receive
data
BT UART clear to
send
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
open.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
BT_EN* 139 DO
BTfunctioncontrolvia
FC20 module
V
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
open.
RF Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
ANT_DIV 35 AI
Diversity antenna
pad
50ohm impedance
If unused, keep it
open.
ANT_MAIN 49 IO Main antenna pad 50ohm impedance
ANT_GNSS 47 AI GNSS antenna pad 50 ohm impedance
If unused, keep it
open.
GPIO Pins
Pin Name Pin No. I/O Description DC Chara ct eristics Comment
1.8V power domain.
Cannot be pulled up
before startup.
Low level wakes up
the module.
If unused, keep it
WAKEUP_IN 1 DI Sleep mode control
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
open.
W_DISABLE# 4 DI Airplane mode VILmin=-0.3V 1.8V power domain.
EC21_Hardware_Design Confidential / Released 26 / 94
LTE Module Series
EC21 Hardware Design
control VILmax=0.6V
VIHmin=1.2V
V
max=2.0V
IH
Pull-up by default.
In low voltage level,
module can enter into
airplane mode.
If unused, keep it
open.
V
min=-0.3V
AP_READY 2 DI
Application
processor sleep
state detection
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
Other Interface Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
V
min=-0.3V
USB_BOOT 115 DI
Force the module to
boot from USB port.
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
RESERVED Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
3, 18, 23,
28~34,
RESERVED
43, 55,
73~84,
113, 114,
Reserved
Keep these pins
unconnected.
116, 117,
140~144
NOTES
1. “*” means under development.
2. Pads 24~27 are multiplexing pins used for audio design on EC21 module and BT function on FC20
module.
EC21_Hardware_Design Confidential / Released 27 / 94
LTE Module Series
EC21 Hardware Design
3.4. Operating Modes
The table below briefly summarizes the various operating modes referred in the following chapters.
Table 5: Overview of Operating Modes
Mode Details
Normal
Idle
Operation
Talk/Data
Minimum
Functionality
Mode
Airplane
Mode
AT+CFUN command can set the module to a minimum functionality mode without
removing the power supply. In this case, both RF function and USIM card will be invalid.
AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this
case, RF function will be invalid.
In this mode, the current consumption of the module will be reduced to the minimal level.
Sleep Mode
During this mode, the module can still receive paging message, SMS, voice call and
TCP/UDP data from the network normally.
Power down
Mode
In this mode, the power management unit shuts down the power supply. Software is not
active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF
and VBAT_BB) remains applied.
3.5. Power Saving
Software is active. The module hasbeen registered onthe network, and
it is ready to send and receive data.
Network connection is ongoing. In this mode, the power consumption is
decided by network settingand data transfer rate.
3.5.1. Sleep Mode
EC21 is able to reduce its current consumption to a minimum value during the sleep mode. The following
section describes power saving procedure of EC21 module.
3.5.1.1. UART Application
If the host communicates with module via UART interface, the following preconditions can let the module
enter into sleep mode.
Execute AT+QSCLK=1 command to enable sleep mode.
Drive DTR to high level.
EC21_Hardware_Design Confidential / Released 28 / 94
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