Quectel Wireless Solutions 201707BG96, 201901BG96M User Manual
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LTE Module Series
BG96 Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email:info@quectel.com
Or our local office. For more information, please visit:
http://quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://quectel.com/support/technical.htm
Or email to: support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF
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REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
BG96_Hardware_Design 1 / 81
BG96 Hardware Design
About the Document
History
Revision Date Author Description
Lyndon LIU/
1.0 2017-08-04
Daryl DU
Initial
LTE Module Series
1.1 2017-08-31 Daryl DU
1.2 2017-12-22
Lyndon LIU/
Daryl DU
1. Modified GSM features in Table 2.
2. Added a note for e-I-DRX in Chapter 3.3.
3. Elaborated the description of e-I-DRX in Chapter 3.4.3.
4. Updated RF receiving sensitivity in Chapter 6.6.
1. Added the storage temperature of the module in Table
2 and Chapter 6.3.
2. Updated transmitting power values in Table 2.
3. Added the description of sleep mode in Table 5 and
Chapter 3.4.4.
4. Added the description of ADC interfaces in Chapter
3.16.
5. Updated the GNSS performance in Table 21.
6. Updated the peak supply current values in Table 28.
7. Updated the current consumption valuesin Chapter
6.4.
8. Updated RF output power values inTable 34.
9. Updated LTE Cat NB1 RF receiving sensitivityvalues
(without repetitions) in Table 35.
10. Updated the recommended footprintin Chapter 7.2.
Lyndon LIU/
Daryl DU/
1.3 2018-07-12
Hyman
DING
BG96_Hardware_Design 2 / 81
1. Updated the timing of turning on module in Figure 8.
2. Updated theUSB interfacereference design(Figure 15).
3. Added the description of GPIO interfaces (Chapter
3.17).
4. Updated GNSS performance parameters in Table 25.
5. Updated the GNSS antenna interface reference design
(Figure 27).
BG96 Hardware Design
Lyndon LIU/
1.4 2019-03-13
Rex WANG
LTE Module Series
6. Updated GNSS current consumption parameters in
Table 35.
7. Updated the module’s baking temperatureand baking
hours in Chapter 8.1.
1. Updated the general description in Chapter 2.1.
2. Updated and added the BG96-M module in Table 1.
3. Updated the internal protocol features and USB
interface in Table 2.
4. Updated the functional diagram in Figure 1.
5. Opened the W_DISABLE# pin function in the related
Chapters.
6. Updated the DC characteristics of PWRKEY pin in
Table 4.
7. Updated the description and star structure of the
power supply figure in Chapter 3.5.2
8. Updated the timing of turning on module in Figure 8.
9. Updated the Characteristics of ADC interfaces in Table
22.
10. Updated BG96 module info and added BG96-M
module in Chapter 5.1.2.
11. Updated the GNSS frequency in Table 29.
12. Updated theantenna requirements in Table 30.
13. Updated the current consumption in Table 34.
14. Added B25 output power in Table 36.
15. Updated BG96 and added BG96-Mconducted RF
receiving sensitivity in Chapter 6.6.
16. Updated the reel packaging info in Table 40.
BG96_Hardware_Design 3 / 81
LTE Module Series
BG96 Hardware Design
Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 4
Table Index ............................................................................................................................................... 6
Figure Index .............................................................................................................................................. 8
1 Introduction ....................................................................................................................................... 9
1.1. Safety Information .................................................................................................................. 10
1.2. FCC/ISED Regulatory notices ................................................................................................ 12
2 Product Concept ............................................................................................................................. 14
2.1. General Description ................................................................................................................ 14
2.2. Key Features .......................................................................................................................... 15
2.3. Functional Diagram ................................................................................................................ 17
2.4. Evaluation Board .................................................................................................................... 18
3 Application Interfaces ..................................................................................................................... 20
3.1. Pin Assignment ....................................................................................................................... 21
3.2. Pin Description ....................................................................................................................... 23
3.3. Operating Modes .................................................................................................................... 30
3.4. Power Saving ......................................................................................................................... 31
3.4.1. Airplane Mode
.............................................................................................................. 31
3.4.2. Power Saving Mode(PSM)........................................................................................... 31
3.4.3. Extended Idle Mode DRX(e-I-DRX) ............................................................................. 32
3.4.4. Sleep Mode.................................................................................................................. 34
3.4.4.1. UART Application ............................................................................................... 34
3.5. Power Supply ......................................................................................................................... 35
3.5.1. Power Supply Pins ....................................................................................................... 35
3.5.2. Decrease Voltage Drop ................................................................................................ 35
3.5.3. Monitor the Power Supply ............................................................................................ 37
3.6. Turn on and off Scenarios ...................................................................................................... 37
3.6.1. Turn on Module Using the PWRKEY Pin ..................................................................... 37
3.6.2. Turn off Module ............................................................................................................ 39
3.6.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 39
3.6.2.2. Turn off Module Using AT Command ................................................................. 40
3.7. Reset the Module ................................................................................................................... 40
3.8. (U)SIM Interface ..................................................................................................................... 42
3.9. USB Interface ......................................................................................................................... 45
3.10.
UART Interfaces ..................................................................................................................... 46
3.11. PCM* and I2C* Interfaces ...................................................................................................... 49
3.12. Network Status Indication ....................................................................................................... 50
3.13. STATUS .................................................................................................................................. 52
BG96_Hardware_Design 4 / 81
LTE Module Series
BG96 Hardware Design
3.14. Behaviors of RI ....................................................................................................................... 52
3.15. USB_BOOT Interface ............................................................................................................. 53
3.16. ADC Interfaces ....................................................................................................................... 54
3.17. GPIOInterfaces ....................................................................................................................... 55
4 GNSS Receiver ................................................................................................................................ 57
4.1. General Description ................................................................................................................ 57
4.2. GNSS Performance ................................................................................................................ 57
4.3. Layout Guidelines ................................................................................................................... 58
5 Antenna Interfaces .......................................................................................................................... 59
5.1. MainAntenna Interface ........................................................................................................... 59
5.1.1. Pin Definition ................................................................................................................ 59
5.1.2. Operating Frequency ................................................................................................... 59
5.1.3. Reference Design of RF Antenna Interface ................................................................. 61
5.1.4. Reference Design of RF Layout ................................................................................... 61
5.2. GNSS Antenna Interface ........................................................................................................ 64
5.3. Antenna Installation ................................................................................................................ 65
5.3.1. Antenna Requirements ................................................................................................ 65
5.3.2. Recommended RF Connector for Antenna Installation ................................................ 66
6 Electrical, Reliability and RadioCharacteristics ........................................................................... 69
6.1. Absolute Maximum Ratings .................................................................................................... 69
6.2. Power Supply Ratings ............................................................................................................ 69
6.3. Operation and StorageTemperatures ..................................................................................... 70
6.4. Current Consumption ............................................................................................................. 71
6.5. RF Output Power .................................................................................................................... 75
6.6. RF Receiving Sensitivity ......................................................................................................... 76
6.7. Electrostatic Discharge ........................................................................................................... 78
7 Mechanical Dimensions.................................................................................................................. 79
7.1. Mechanical Dimensions of the Module ................................................................................... 79
7.2. Recommended Footprint ........................................................................................................ 81
7.3. Design Effect Drawings of the Module .................................................................................... 82
8 Storage, Manufacturing and Packaging ........................................................................................ 84
8.1. Storage ................................................................................................................................... 84
8.2.
Manufacturing and Soldering .................................................................................................. 85
8.3. Packaging ............................................................................................................................... 86
9 Appendix A References .................................................................................................................. 88
10 Appendix B GPRS Coding Schemes ............................................................................................. 91
11 Appendix C GPRS Multi-slot Classes ............................................................................................ 92
12 Appendix D EDGE Modulationand Coding Schemes ................................................................... 94
BG96_Hardware_Design 5 / 81
LTE Module Series
BG96 Hardware Design
Table Index
TABLE 1: FREQUENCY BANDS OF BG96 MODULE ...................................................................................... 14
TABLE 2: KEY FEATURES OF BG96 MODULE ............................................................................................... 15
TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 23
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 23
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 30
TABLE 6: VBAT AND GND PINS ....................................................................................................................... 35
TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 37
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 40
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 42
TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 45
TABLE 11: PIN DEFINITION OF UART1 INTERFACE ..................................................................................... 47
TABLE 12: PIN DEFINITION OF UART2 INTERFACE ..................................................................................... 47
TABLE 13: PIN DEFINITION OF UART3 INTERFACE ..................................................................................... 47
TABLE 14:LOGIC LEVELS OF DIGITAL I/O ..................................................................................................... 48
TABLE 15: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 49
TABLE 16: PIN DEFINITION OF NETLIGHT .................................................................................................... 51
TABLE 17: WORKING STATE OF NETLIGHT .................................................................................................. 51
TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 52
TABLE 19: DEFAULT BEHAVIORS OF RI ........................................................................................................ 53
TABLE 20: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 54
TABLE 21: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 55
TABLE 22: CHARACTERISTICS OF ADC INTERFACES ................................................................................ 55
TABLE 23: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... 56
TABLE 24:LOGIC LEVELS OF GPIO INTERFACES ........................................................................................ 56
TABLE 25: GNSS PERFORMANCE ................................................................................................................. 57
TABLE 26: PIN DEFINITION OF MAIN ANTENNA INTERFACE ...................................................................... 59
TABLE 27: BG96 OPERATING FREQUENCY .................................................................................................. 59
TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 64
TABLE 29: GNSS FREQUENCY ....................................................................................................................... 64
TABLE 30: ANTENNA REQUIREMENTS .......................................................................................................... 66
TABLE 31: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 69
TABLE 32: POWER SUPPLY RATINGS ........................................................................................................... 70
TABLE 33: OPERATION AND STORAGE TEMPERATURES .......................................................................... 70
TABLE 34: BG96 CURRENT CONSUMPTION ................................................................................................. 71
TABLE 35: GNSS CURRENT CONSUMPTION ................................................................................................ 75
TABLE 36: RF OUTPUT POWER ..................................................................................................................... 75
TABLE 37: BG96 CONDUCTED RF RECEIVING SENSITIVITY ..................................................................... 76
TABLE 38: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 78
TABLE 39: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 85
TABLE 40: REEL PACKAGING ......................................................................................................................... 87
TABLE 41: RELATED DOCUMENTS ................................................................................................................ 88
BG96_Hardware_Design 6 / 81
LTE Module Series
BG96 Hardware Design
TABLE 42: TERMS AND ABBREVIATIONS ...................................................................................................... 88
TABLE 43: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 91
TABLE 44: GPRS MULTI-SLOT CLASSES ...................................................................................................... 92
TABLE 45: EDGE MODULATION AND CODING SCHEMES ........................................................................... 94
BG96_Hardware_Design 7 / 81
LTE Module Series
BG96 Hardware Design
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 18
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 22
FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 34
FIGURE 4: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 36
FIGURE 5: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 37
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 38
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 38
FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 39
FIGURE 9: TIMING OF TURNING OFF MODULE ........................................................................................... 40
FIGURE 10: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 41
FIGURE 11: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ....................................................... 41
FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 42
FIGURE 13: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 43
FIGURE 14: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 44
FIGURE 15: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 45
FIGURE 16: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 48
FIGURE 17: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 49
FIGURE 18: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 50
FIGURE 19: REFERENCE CIRCUIT OF THE NETWORK STATUS INDICATOR ........................................... 51
FIGURE 20: REFERENCE CIRCUIT OF STATUS ........................................................................................... 52
FIGURE 21: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 54
FIGURE 22: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61
FIGURE 23: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62
FIGURE 24: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 62
FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 63
FIGURE 26: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .................................................................................................................................................. 63
FIGURE 27: REFERENCE CIRCUIT OF GNSS ANTENNA INTERFACE ........................................................ 65
FIGURE 28: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 67
FIGURE 29: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 67
FIGURE 30: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 68
FIGURE 31: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 79
FIGURE 32: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 80
FIGURE 33: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 81
FIGURE 34: TOP VIEW OF THE MODULE ...................................................................................................... 82
FIGURE 35: BOTTOM VIEW OF THE MODULE .............................................................................................. 82
FIGURE 36: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE ................................................ 85
FIGURE 37: TAPE DIMENSIONS ..................................................................................................................... 87
FIGURE 38: REEL DIMENSIONS ..................................................................................................................... 87
BG96_Hardware_Design 8 / 81
LTE Module Series
BG96 Hardware Design
1 Introduction
This document defines BG96module and describes its air interface and hardware interfaces which are
connected with customers’ applications.
This document can help customers quickly understand the interface
specifications, electrical and mechanical details, as well as other related
information of BG96.To facilitate its application in different fields, reference
design is also provided for customers’ reference. Associated with application
notes and user guides, customers can use the module to design and set up
mobile applications easily.
Model: BG96, BG96 MINIPCIE
FCC ID：XMR201707BG96
IC: 10224A-201709BG96
Model: BG96-M
FCC ID：XMR201901BG96M
BG96_Hardware_Design 9 / 81
LTE Module Series
BG96 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating BG96. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals,clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
BG96_Hardware_Design 10 / 81
LTE Module Series
BG96 Hardware Design
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
BG96_Hardware_Design 11 / 81
LTE Module Series
BG96 Hardware Design
1.2. FCC/ISED Regulatory notices
Modification statement
Quectel has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s
authority to operate the equipment.
Quectel n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou
modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
RF exposure
This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The
antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna
gain must be below:
Antenna Gain
Frequency Band FCC ID: XMR201901BG96M
Model: BG96-M
GSM850 NA 10.446dBi
GSM1900 NA 12.030dBi
LTE band2 8dBi 9.0dBi
LTE band4 5dBi 7.0dBi
LTE band5 9.42dBi 10.416dBi
LTE band12 8.73dBi 9.734dBi
LTE band13 9.17dBi 10.173dBi
LTE band25 8dBi 8.0dBi
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé.
L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et
votre corps. Gain de l'antenne doit être ci-dessous:
Gain de l‘antenne
❒ GSM850:≤7.13dBi
❒ GSM1900:≤12.03dBi
❒ LTE Band2:≤9.0dBi
❒ LTE Band4:≤7.0dBi
FCC ID: XMR201707BG96
Model: BG96,BG96MINIPCIE
BG96_Hardware_Design 12 / 81
LTE Module Series
BG96 Hardware Design
❒ LTE Band5:≤7.1dBi
❒ LTE Band12:≤6.61dBi
❒ LTE Band13:≤6.93dBi
❒ L TE Band25:≤8.0dBi
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The certification label of the
module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to
display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains",
or similar wording expressing the same meaning, as follows:
Model: BG96, BG96 MINIPCIE
Contains FCC ID：XMR201707BG96
Contains IC: 10224A-201709BG96
Model: BG96-M
Contains FCC ID：XMR201901BG96M
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de
certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence
d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et l’ISED du module, précédé des mots « Contient un
module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit :
Model: BG96, BG96 MINIPCIE
Contient FCC ID：XMR201707BG96
Contient IC: 10224A-201709BG96
CAN ICES-3 (B) / NMB-3 (B)
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
BG96_Hardware_Design 13 / 81
LTE Module Series
BG96 Hardware Design
2 Product Concept
2.1. General Description
BG96isa series ofembeddedIoT(LTE Cat.M1/LTE Cat.NB1/EGPRS) wireless communication module.It
provides data connectivity on LTE-TDD/LTE-FDD/GPRS/EGPRSnetworks, and supports half-duplex
operation in LTE networks. It also provides GNSS
application demands.BG96 contains two variants: BG96 and BG96-M. Customers can choose a
dedicated type based on the region or operator. The following table shows the frequency bands of BG96
modules.
1)
and voice2)functionalityto meet customers’specific
Table 1: Frequency Bands of BG96 Modules
Module LTE Bands GSM3) Rx-diversity GNSS1)
Cat M1& NB1:
LTE-FDD:
B1/B2/B3/B4/B5/B8/B12/
4)
/
GSM850/EGSM900/
DCS1800/PCS1900
Not Supported
GPS,
GLONASS,BeiDo
u/Compass,
Galileo, QZSS
BG96
B13/B18/B19/B20/B25
5)
B26
/B28
LTE-TDD:
B39 (for Cat M1
only)
Cat M1 only:
BG96-M
LTE-FDD:
B1/B2/B3/B4/B5/B8/B12/
B13/B18/B19/B20/B25
5)
B26
/B28
LTE-TDD:
B39 (for Cat M1 only)
4)
/
Not Supported Not Supported
GPS,
GLONASS,BeiDo
u/Compass,
Galileo, QZSS
NOTES
BG96_Hardware_Design 14 / 81
LTE Module Series
BG96 Hardware Design
1)
1.
GNSS function is optional.
2)
2.
BG96 supports VoLTE(Voice over LTE) under LTECat M1 network.
3. 3)BG96 GSM only supports Packet Switch.
4. 4)B25 will be supported on BG96 modules with R1.2 hardware version.
5. 5)B26 is under development.
With a compact profile of 26.5mm ×22.5mm ×2.3mm, BG96 can meet almost all requirements forM2M
applications such as smart metering, tracking system, security, wireless POS, etc.
BG96 is an SMD type module which can be embedded into applications through its 102 LGA
pads.BG96supports internet service protocols like TCP, UDP and PPP. Extended AT commands have
been developed for customers to use these internet service protocols easily.
2.2. Key Features
The following table describes the detailed features of BG96 modules.
Table 2: Key Features of BG96Modules
Features Details
Power Supply
Transmitting Power
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
Support LTE Cat M1 and LTE Cat NB1
LTE Features
Support 1.4MHz RF bandwidth for LTE Cat M1
Support 200KHz RF bandwidth for LTE Cat NB1
Support SISO in DL direction
BG96_Hardware_Design 15 / 81
GSMFeatures
Internet Protocol
Features
LTE Module Series
BG96 Hardware Design
Cat M1: Max. 375Kbps (DL)/375Kbps (UL)
Cat NB1: Max. 32Kbps (DL)/70Kbps (UL)
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max. 107Kbps (DL), Max. 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max. 296Kbps (DL), Max. 236.8Kbps (UL)
Support
PPP/TCP/UDP/SSL/TLS/FTP(S)/HTTP(S)/NITZ/PING/MQTTprotocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
Text and PDU mode
SMS
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V
Audio Feature* Support one digital audio interface: PCM interface
Compliant with USB 2.0 specification (slave only) and the data transfer rate
can reach up to 480Mbps
USB Interface
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging and firmware upgrade
SupportUSB serial drivers forWindows 7/8/8.1/10, Windows CE
5.0/6.0/7.0, Linux 3.x(3.4 or later)/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x.
UART1:
Used for data transmission and AT command communication
115200bps by default
The default frame format is 8N1 (8 data bits, no parity, 1 stop bit)
Support RTS and CTS hardware flow control
UART Interfaces
UART2:
Used for module debugging and log output
115200bps baud rate
UART3:
Used for outputting GNSS data or NMEA sentences
115200bps baud rate
AT Commands
3GPP TS 27.007 and 3GPP TS 27.005 AT commands, as well as
Quectel enhanced AT commands
BG96_Hardware_Design 16 / 81
LTE Module Series
BG96 Hardware Design
Network Indication OneNETLIGHT pin for network connectivity status indication
Antenna Interfaces
Physical Characteristics
Temperature Range
Including main antenna (ANT_MAIN) and GNSS antenna (ANT_GNSS)
interfaces
Size: (26.5±0.15)mm×(22.5±0.15)mm ×(2.3±0.2)mm
Weight: approx. 3.1g
2)
1)
Operation temperature range: -35°C ~ +75°C
Extended temperature range: -40°C ~ +85°C
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade USB interface, DFOTA
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1. “*” means under development.
1)
2.
Within operation temperature range, the module is 3GPP compliant.
2)
3.
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
might reduce in their value and exceed the specified tolerances. When the temperature returns to
out
the normal operating temperature levels, the module will meet 3GPP specificationsagain.
2.3. Functional Diagram
The following figure shows a block diagram of BG96 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
BG96_Hardware_Design 17 / 81
LTE Module Series
BG96 Hardware Design
VBAT_RF
VBAT_BB
PWRKEY
RESET_N
STATUS
NETLIGHT
PMIC
PA
(4G)
Control
ANT_MAIN
PA
(2G+ASM)
Tx
ANT_GNSS
Rx
GNSS
Transceiver
IQ Control
Baseband
SAW
LNA
NAND
DDR2
SDRAM
ADCs
VDD_EXT
19.2M
XO
USB
(U)SIM PCM*
UARTs
I2C*
GPIOs
Figure 1: Functional Diagram
NOTE
“*” means under development.
2.4. Evaluation Board
In order to help customers develop applications conveniently with BG96, Quectel supplies theevaluation
board (EVB), USB to RS-232converter cable, USB data cable, earphone, antenna and other peripherals
to control or test the module. For more details, please refer to document [1].
BG96_Hardware_Design 18 / 81
LTE Module Series
BG96 Hardware Design
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LTE Module Series
BG96 Hardware Design
3 Application Interfaces
BG96is equipped with 102 LGA pads that can be connected to customers’ cellular application platforms.
The following sub-chapters will provide detailed description of interfaces listed below:
Power supply
(U)SIMinterface
USB interface
UART interfaces
PCM* and I2C* interfaces
Status indication
USB_BOOT interface
ADC interfaces
GPIO interfaces
NOTE
“*” means under development.
BG96_Hardware_Design 20 / 81
LTE Module Series
BG96 Hardware Design
3.1. Pin Assignment
The following figure showsthe pin assignment of BG96.
BG96_Hardware_Design 21 / 81
LTE Module Series
BG96 Hardware Design
PS M_I ND
ADC 1
GND
PCM _C LK*
PCM _SY N C*
PCM _I N*
PCM _OU T*
USB_VBUS
USB_DP
USB_DM
RESERVED
RESERVED
RESERVED
RESERVED
PW RKEY
RESERVED
RESET_N
W_ DI SABL E#
62
ANT _M AIN
GND
GND
59
60
61
RESERVED
GND
GND
58
57
56
RESERVED
55
GND
GND
53
54
1
2
82 81
80 79
3
4
10 2 10 1
10 0
99
5
63
6
7
GPIO64
83
64
84
98
97
8
65
9
85
96
10
66
86
95
11
12
13
87
68
88
94
93
67
14
1)
15
16
89 90
69
91 92
71
70
72
17
18
RESERVED
VB AT_ RF
VB AT_ RF
GND
50
51
52
78
77
76
USB_BOOT
75
74
73
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
ANT _G NSS
GND
USIM_GND
USIM_CLK
USIM_DATA
USIM_RST
USIM_VDD
USIM_PRESENCE
I2C_SDA*
I2C_SCL*
RI
DCD
RTS
CTS
TXD
RXD
VB AT_ BB
VB AT_ BB
27
19
AP _REA D Y
PO WER USB UART
20
ST ATU S
21
NETLIGHT
22
DBG_RXD
(U)SIM
23
DBG_TXD
24
ADC0
PCM
25
RESERVED
26
GPIO 26
UART3_TXD
ANT
Figure 2: Pin Assignment (Top View)
NOTES
1. Keep all RESERVEDpins and unused pins unconnected.
2. GND pads should be connected to ground in the design.
28
UART3_RXD
29
VDD _EX T
30
DTR
GND
31
GND
RESERVED
OTHE RS
BG96_Hardware_Design 22 / 81
LTE Module Series
BG96 Hardware Design
3. 1)PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
4. “*” means under development.
3.2. Pin Description
The following tables show the pin definition and description of BG96.
Table 3: Definition of I/O Parameters
Type Description
IO Bidirectional
DI Digital input
DO Digital output
PI Power input
PO Power output
AI Analog input
AO Analog output
OD Open drain
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description
Power supply
VBAT_BB 32, 33 PI
VBAT_RF 52,53 PI
BG96_Hardware_Design 23 / 81
for the
module’s
baseband part
Power supply
for the
DC
Characteristics
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
Vmax=4.3V
Vmin=3.3V
Comment
LTE Module Series
BG96 Hardware Design
module’s RF
part
Provide 1.8V
VDD_EXT 29 PO
for external
circuit
3, 31, 48,
50, 54, 55,
58, 59, 61,
GND
62, 67~74,
Ground
79~82,
89~91,
100~102
Turn on/off
Pin Name Pin No. I/O Description
PWRKEY 15 DI
Turnon/off the
module
Vnorm=3.8V
Vnorm=1.8V
I
max=50mA
O
DC
Characteristics
Vnorm=0.8V
V
max=0.5V
IL
Power supply for external
GPIO’s pull-up circuits.
Comment
The output voltage
is0.8V because of
thediode drop in
theQualcomm chipset.
RESET_N 17 DI
Resetthe
module
Status Indication
Pin Name Pin No. I/O Description
Indicate the
STATUS 20 DO
module’soperat
ionstatus
Indicate the
NETLIGHT 21 DO
module’snetwor
k activity status
USB Interface
Pin Name Pin No. I/O Description
USB_VBUS 8 PI USB detection
V
max=2.1V
IH
V
min=1.3V
IH
V
max=0.5V
IL
DC
Characteristics
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
DC
Characteristics
Vmax=5.25V
Vmin=3.0V
If unused, keep this pin
open.
Comment
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
Comment
USB_DP 9 IO
USB differential
data bus(+)
BG96_Hardware_Design 24 / 81
Vnorm=5.0V
Compliant with
USB 2.0 standard
specification.
Require differential
impedance of 90Ω.
LTE Module Series
BG96 Hardware Design
USB_DM 10 IO
USB differential
data bus (-)
(U)SIM Interface
Pin Name Pin No. I/O Description
USIM_
PRESENCE
42 DI
USIM_VDD 43 PO
(U)SIM card
insertion
detection
Power supply
for (U)SIM card
Compliant with
USB 2.0 standard
specification.
DC
Characteristics
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
For 1.8V(U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V(U)SIM:
Vmax=3.05V
Vmin=2.7V
IOmax=50mA
Require differential
impedance of 90Ω.
Comment
1.8V power domain.
If unused, keep this pin
open.
Either 1.8V or 3.0V is
supported by the module
automatically.
USIM_RST 44 DO
USIM_DATA 45 IO
USIM_CLK 46 DO
Reset signal of
(U)SIM card
Data signal of
(U)SIM card
Clock signal of
(U)SIM card
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
V
min=2.55V
OH
For 1.8V (U)SIM:
V
max=0.6V
IL
V
min=1.2V
IH
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=1.0V
V
IL
V
min=1.95V
IH
V
max=0.45V
OL
V
min=2.55V
OH
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
max=0.45V
V
OL
V
min=2.55V
OH
BG96_Hardware_Design 25 / 81
BG96 Hardware Design
USIM_GND 47
UART1 Interface
Specified
ground for
(U)SIM card
LTE Module Series
Pin Name Pin No. I/O Description
Data terminal
DTR 30 DI
ready(sleepmo
de control)
RXD 34 DI Receive data
TXD 35 DO Transmit data
CTS 36 DO Clear to send
RTS 37 DI
DCD 38 DO
Request to
send
Data carrier
detection
DC
Characteristics
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
Comment
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
RI 39 DO Ring indicator
UART2 Interface
Pin Name Pin No. I/O Description
DBG_RXD 22 DI Receive data
DBG_TXD 23 DO Transmit data
UART3 Interface
BG96_Hardware_Design 26 / 81
V
max=0.45V
OL
V
min=1.35V
OH
DC
Characteristics
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep this pin
open.
Comment
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
LTE Module Series
BG96 Hardware Design
Pin Name Pin No. I/O Description
UART3_TXD
27 DO
Transmit data
UART3_RXD 28 DI Receive data
PCM* Interface
Pin Name Pin No. I/O Description
PCM_CLK* 4 DO
PCMclock
output
PCMframe
PCM_SYNC* 5 DO
synchronization
output
DC
Characteristics
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
DC
Characteristics
V
max=0.45V
OL
V
min=1.35V
OH
V
max=0.45V
OL
V
min=1.35V
OH
Comment
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
Comment
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
PCM_IN* 6 DI
PCM_OUT* 7 DO
PCMdata input
PCMdata
output
I2C* Interface
Pin Name Pin No. I/O Description
I2C serial clock.
I2C_SCL* 40 OD
Used for
external codec.
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
DC
Characteristics
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
Comment
External pull-up resistor
is required.
1.8V only.
If unused, keep
this pin open.
I2C serial data.
I2C_SDA* 41 OD
Used for
external codec.
BG96_Hardware_Design 27 / 81
External pull-up resistor
is required.
1.8V only.
If unused, keep this pin
open.
Antenna Interfaces
LTE Module Series
BG96 Hardware Design
Pin Name Pin No. I/O Description
ANT_MAIN 60 IO
ANT_GNSS 49 AI
Main antenna
interface
GNSS antenna
interface
Other Pins
Pin Name Pin No. I/O Description
PSM_IND1) 1 DO
W_DISABLE# 18 DI
Power saving
mode indicator
Airplane mode
control
DC
Characteristics
Comment
50Ωimpedance
50Ωimpedance
DC
Characteristics
V
max=0.45V
OL
V
min=1.35V
OH
If unused, keep this pin
open.
Comment
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
Pull-up by default.
In low voltage level, the
module can enter into
airplane mode.
If unused, keep this pin
open.
Application
AP_READY 19 DI
processor
sleep state
detection
Force the
module to enter
USB_BOOT 75 DI
into emergency
download
mode
General-
GPIO26 26 IO
purpose input/
output interface
General-
purpose input/
GPIO64 64 IO
output
interface
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
VOLmax=0.45V
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
1.8V power domain.
If unused, keep this pin
open.
BG96_Hardware_Design 28 / 81
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