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Quectel Wireless Solutions
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201202M10
Users Manual
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Quectel Wireless Solutions 201202M10 Users Manual

M10
Quectel Cellular Engine
Hardware Design
M10_HD_V3.0
M10 Hardware Design
Document Title Revision Date Status Document Control ID
M10 Hardware Design
3.0
2012-03-02
Released
M10_HD_V3.0
General Notes
Quectel offers this information as a service to its customers, to support application and
engineering efforts that use the products designed by Quectel. The information provided is
based upon requirements specifically provided for customers of Quectel. Quectel has not
undertaken any independent search for additional information, relevant to any information
that may be in the customer’s possession. Furthermore, system validation of this product
designed by Quectel within a larger electronic system remains the responsibility of the
customer or the customer’s system integrator. All specifications supplied herein are subject to
change.
Copyright
This document contains proprietary technical information of Quectel Co., Ltd. Copying of
this document, distribution to others, and communication of the contents thereof, are
forbidden without permission. Offenders are liable to the payment of damages. All rights are
reserved in the event of a patent grant or registration of a utility model or design. All
specification supplied herein are subject to change without notice at any time.
Copyright © Quectel Wireless Solutions Co., Ltd. 2012
M10 Hardware Design
Contents
Contents ............................................................................................................................................ 2
Table Index ........................................................................................................................................ 4
Figure Index ...................................................................................................................................... 5
0. Revision history ............................................................................................................................ 7
1. Introduction ................................................................................................................................... 9
1.1. Related documents .............................................................................................................. 9
1.2. Terms and abbreviations .................................................................................................... 10
1.3. Directives and standards .................................................................................................... 12
1.3.1. FCC Statement ........................................................................................................ 12
1.3.2. FCC Radiation exposure statement ......................................................................... 12
1.3.3. Industry Canada licence .......................................................................................... 12
1.4. Safety cautions .................................................................................................................. 13
2. Product concept ........................................................................................................................... 15
2.1. Key features ...................................................................................................................... 15
2.2. Functional diagram ............................................................................................................ 17
2.3. Evaluation board ............................................................................................................... 18
3. Application interface ................................................................................................................... 19
3.1. Pin of module .................................................................................................................... 19
3.1.1. Pin assignment ......................................................................................................... 19
3.1.2. Pin description ......................................................................................................... 20
3.2. Operating modes ............................................................................................................... 25
3.3. Power supply ..................................................................................................................... 26
3.3.1. Power supply pins.................................................................................................... 27
3.3.2. Minimizing supply voltage drop.............................................................................. 27
3.3.3. Monitor power supply ............................................................................................. 28
3.4. Power up and down scenarios ........................................................................................... 28
3.4.1. Power on .................................................................................................................. 28
3.4.2. Power down ............................................................................................................. 31
3.4.3. Restart module using the PWRKEY pin.................................................................. 35
3.5. Power saving ..................................................................................................................... 36
3.5.1. Minimum functionality mode .................................................................................. 36
3.5.2. SLEEP mode (slow clock mode) ............................................................................. 36
3.5.3. Wake up module from SLEEP mode ...................................................................... 37
3.6. Summary of state transitions (except SLEEP mode) ......................................................... 37
3.7. RTC backup ...................................................................................................................... 37
3.8. Serial interfaces ................................................................................................................. 39
3.8.1. UART Port .............................................................................................................. 40
3.8.2. Debug Port ............................................................................................................... 43
3.8.3. UART Port 3 ........................................................................................................... 44
3.8.4. UART Application .................................................................................................. 45
3.9. Audio interfaces................................................................................................................. 46
M10 Hardware Design
3.9.1. Decrease TDD noise and other noise ...................................................................... 47
3.9.2. Microphone interfaces configuration ....................................................................... 48
3.9.3. Receiver and speaker interface configuration .......................................................... 49
3.9.4. Earphone interface configuration ............................................................................ 51
3.10. SIM card interface ........................................................................................................... 52
3.10.1. SIM card application ............................................................................................. 52
3.10.2. Design considerations for SIM card holder ........................................................... 54
3.11. Keypad interface .............................................................................................................. 56
3.12. ADC................................................................................................................................. 57
3.13. Behaviors of the RI ......................................................................................................... 58
3.14. Network status indication ................................................................................................ 60
3.15. Operating status indication .............................................................................................. 61
3.16. General purpose input & output (GPIO) ......................................................................... 61
3.17. Open drain output (LIGHT_MOS) .................................................................................. 62
3.18. SD card interface ............................................................................................................. 63
4. Antenna interface ........................................................................................................................ 65
4.1. Antenna installation ........................................................................................................... 65
4.2. RF output power ................................................................................................................ 66
4.3. RF receiving sensitivity ..................................................................................................... 66
4.4. Operating frequencies ....................................................................................................... 66
4.5. Recommendation of RF pad welding ................................................................................ 66
5. Electrical, reliability and radio characteristics ............................................................................ 68
5.1. Absolute maximum ratings ................................................................................................ 68
5.2. Operating temperature ....................................................................................................... 68
5.3. Power supply ratings ......................................................................................................... 69
5.4. Current consumption ......................................................................................................... 70
5.5. Electro-static discharge ..................................................................................................... 72
6. Mechanical dimensions ............................................................................................................... 73
6.1. Mechanical dimensions of module .................................................................................... 73
6.2. Footprint of recommendation ............................................................................................ 75
6.3. Top view of the module .................................................................................................... 77
6.4. Bottom view of the module ............................................................................................... 77
Appendix A: GPRS coding schemes ............................................................................................... 78
Appendix B: GPRS multi-slot classes ............................................................................................. 79
M10 Hardware Design
Table Index
TABLE 1: RELATED DOCUMENTS ............................................................................................. 9
TABLE 2: TERMS AND ABBREVIATIONS ................................................................................ 10
TABLE 3: MODULE KEY FEATURES ........................................................................................ 15
TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR
INTERFACE .................................................................................................................. 17
TABLE 5: PIN DESCRIPTION ...................................................................................................... 20
TABLE 6: OVERVIEW OF OPERATING MODES ...................................................................... 25
TABLE 7: AT COMMANDS USED IN ALARM MODE ............................................................. 31
TABLE 8: SUMMARY OF STATE TRANSITION ....................................................................... 37
TABLE 9: LOGIC LEVELS OF THE SERIAL INTERFACE ....................................................... 40
TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES ................................................. 40
TABLE 11: PIN DEFINITION OF AUDIO INTERFACE ............................................................. 47
TABLE 12: TYPICAL ELECTRET MICROPHONE CHARACTERISTIC ................................. 51
TABLE 13: TYPICAL SPEAKER CHARACTERISTIC ............................................................... 51
TABLE 14: PIN DEFINITION OF THE SIM INTERFACE .......................................................... 52
TABLE 15: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER .................................. 55
TABLE 16: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ......................................... 55
TABLE 17: PIN DEFINITION OF THE KEYPAD INTERFACE ................................................. 56
TABLE 18: PIN DEFINITION OF THE ADC ............................................................................... 57
TABLE 19: CHARACTERISTIC OF THE ADC ........................................................................... 58
TABLE 20: BEHAVIORS OF THE RI ........................................................................................... 58
TABLE 21: WORKING STATE OF THE NETLIGHT .................................................................. 60
TABLE 22: PIN DEFINITION OF THE STATUS ......................................................................... 61
TABLE 23: PIN DEFINITION OF THE GPIO INTERFACE ....................................................... 62
TABLE 24: PIN DEFINITION OF THE LIGHT_MOS ................................................................. 62
TABLE 25: PIN DEFINITION OF THE SD CARD INTERFACE ............................................... 63
TABLE 26: PIN NAME OF THE SD CARD AND T-FLASH(MICRO SD) CARD ..................... 64
TABLE 27: PIN DEFINITION OF THE RF_ANT ........................................................................ 65
TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ............................................ 66
TABLE 29: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY ............................ 66
TABLE 30: THE MODULE OPERATING FREQUENCIES ........................................................ 66
TABLE 31: ABSOLUTE MAXIMUM RATINGS ......................................................................... 68
TABLE 32: OPERATING TEMPERATURE ................................................................................. 68
TABLE 33: THE MODULE POWER SUPPLY RATINGS ........................................................... 69
TABLE 34: THE MODULE CURRENT CONSUMPTION .......................................................... 70
TABLE 35: THE ESD ENDURANCE (TEMPERATURE:25℃,HUMIDITY:45 %) .................... 72
TABLE 36: DESCRIPTION OF DIFFERENT CODING SCHEMES ........................................... 78
TABLE 37: GPRS MULTI-SLOT CLASSES ................................................................................ 79
M10 Hardware Design
Figure Index
FIGURE 1: MODULE FUNCTIONAL DIAGRAM ...................................................................... 18
FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT ......................................................... 19
FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ................... 26
FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ................... 27
FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT ....................................................... 28
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ......................................... 29
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ................................................... 29
FIGURE 8: TIMING OF TURN ON SYSTEM ............................................................................. 30
FIGURE 9: TIMING OF TURN OFF THE MODULE .................................................................. 32
FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT .... 34
FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON ...................... 34
FIGURE 12: TIMING OF RESTART SYSTEM ............................................................................ 35
FIGURE 13: TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN ............. 35
FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ........................................ 38
FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ............................................ 38
FIGURE 16: RTC SUPPLY FROM CAPACITOR ......................................................................... 38
FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC ....................................... 39
FIGURE 18: CONNECTION OF ALL FUNCTIONAL UART PORT .......................................... 42
FIGURE 19: CONNECTION OF THREE LINES UART PORT ................................................... 42
FIGURE 20: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL .......... 43
FIGURE 21: CONNECTION OF SOFTWARE UPGRADE ......................................................... 43
FIGURE 22: CONNECTION OF SOFTWARE DEBUG .............................................................. 44
FIGURE 23: CONNECTION OF AUXILIARY UART PORT ...................................................... 44
FIGURE 24: 3.3V LEVEL MATCH CIRCUIT .............................................................................. 45
FIGURE 25: 5V LEVEL MATCH CIRCUIT ................................................................................. 45
FIGURE 26: RS232 LEVEL MATCH CIRCUIT ........................................................................... 46
FIGURE 27: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2 ..................... 48
FIGURE 28: SPEAKER INTERFACE CONFIGURATION OF AOUT1 ...................................... 49
FIGURE 29: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1 ..... 49
FIGURE 30: SPEAKER INTERFACE CONFIGURATION OF AOUT2 ...................................... 50
FIGURE 31: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2 ..... 50
FIGURE 32: EARPHONE INTERFACE CONFIGURATION ...................................................... 51
FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD ............................................ 53
FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD ............................................ 53
FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER ...................................... 54
FIGURE 36: MOLEX 91228 SIM CARD HOLDER ..................................................................... 55
FIGURE 37: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE ..................................... 57
FIGURE 38: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER .................................... 59
FIGURE 39: RI BEHAVIOUR OF DATA CALLING AS A RECEIVER ...................................... 59
FIGURE 40: RI BEHAVIOUR AS A CALLER ............................................................................. 59
FIGURE 41: RI BEHAVIOUR OF URC OR SMS RECEIVED .................................................... 60
M10 Hardware Design
FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................ 60
FIGURE 43: REFERENCE CIRCUIT OF THE STATUS ............................................................. 61
FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS ..................................................... 62
FIGURE 45: REFERENCE CIRCUIT OF SD CARD ................................................................... 63
FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE ......................................................... 65
FIGURE 47: RECOMMENDATION OF RF PAD WELDING ..................................................... 67
FIGURE 48: M10 TOP AND SIDE DIMENSIONS（UNIT: MM） ............................................ 73
FIGURE 49: M10 BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 74
FIGURE 50: PAD BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 74
FIGURE 51: FOOTPRINT OF RECOMMENDATION（UNIT: MM） ...................................... 76
FIGURE 52: TOP VIEW OF THE MODULE ................................................................................ 77
FIGURE 53: BOTTOM VIEW OF THE MODULE ...................................................................... 77
FIGURE 54: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 .................................... 78
FIGURE 55: RADIO BLOCK STRUCTURE OF CS-4 ................................................................ 78
M10 Hardware Design
0. Revision history
Revision Date Author Description of change
1.00 2009-06-27 Tracy ZHANG Initial
1.01 2009-09-18 Yong AN 1. Modified VRTC voltage inputting range.
2. Modified Figure 1.
3. Added Table 7 and Figure 4 with remark.
4. Modified ordering information content in
Chapter 6.
5. Added VCHG pin description.
6. Modified current consumption data in Table 36.
7. Added appendix A and B.
1.02 2009-11-12 Yong AN 1. Baud rate of the main UART port is set to
autobauding mode from former fixed baud rate
of 115200 in default configuration.
2. Modified contents about autobauding in
Chapter 3.8
3. Modified the SIM card detection function
through “AT+QSIMDET”.
1.03 2010-06-09 Yong AN 1. Added charging interface description.
2. Added Serial Port 3 interface description.
3. Added STATUS pin and its function description.
4. Added GPIO control by AT+QGPIO command.
5. Modified timing of powering on, powering
down and restarting the module.
6. Added ESD level of SIM card interface.
7. Modified function description of audio AOUT2
channel.
8. Disabled VDD_EXT pin as the indication of
power-on and power-down.
9. Both STATUS and AT+QGPIO functions are
supported at R05A05 release version and later,
while Serial Port 3 function will be supported at
R06AXX and later.
2.0 2010-07-30 DavidWEI 1. Added recommendation of RF pad welding.
3.0 2012-02-28 LayneYE 1. Modified the power supply range
2. Modified buzzer interface as RESERVED
3. Modified the display interface as SD interface
4. Modified the peak current in a transmitting burst
5. Modified the current consumption in GSM talk
mode and GPRS communication mode
6. Modified the RF receiving sensitivity
M10 Hardware Design
7. Deleted the content of charging function.
M10 Hardware Design
1. Introduction
This document defines the M10 module and describes the hardware interface of M10 module
which are connected with the customer application and the air interface.
This document can help customer quickly understand module interface specifications, electrical
and mechanical details. Associated with application notes and user guide, customer can use M10
module to design and set up mobile applications easily.
1.1. Related documents
Table 1: Related documents
SN Document name Remark
[ 1 ] M1 0_ AT C AT c omm an d s s e t
[2] ITU-T Draft new
recommendation V.25ter
[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
[5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of
[6] GSM 11.14 Digital cellular telecommunications (Phase 2+);
[7] GSM 11.11 Digital cellular telecommunications (Phase 2+);
[8] GSM 03.38 Digital cellular telecommunications (Phase 2+);
[9] GSM 11.10 Digital cellular telecommunications (Phase 2); Mobile
[10] GSM_UART_AN UART port application notes
[11] M10_HD_AN01 M10 hardware design application notes
[12] GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note
[13] M10_EVB_UGD M10 EVB user guide application notes
Serial asynchronous automatic dialing and control
command set for GSM Mobile Equipment (ME)
Data Terminal Equipment – Data Circuit terminating
Equipment (DTE – DCE) interface for Short Message
Service (SMS) and Cell Broadcast Service (CBS)
Specification of the SIM Application Toolkit for the
Subscriber Identity module – Mobile Equipment (SIM –
ME) interface
Specification of the Subscriber Identity module – Mobile
Equipment (SIM – ME) interface
Alphabets and language-specific information
Station (MS) conformance specification; Part 1:
Conformance specification
M10 Hardware Design
1.2. Terms and abbreviations
Table 2: Terms and abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AMR Adaptive Multi-Rate
ARP Antenna Reference Point
ASIC Application Specific Integrated Circuit
BER Bit Error Rate
BOM Bill Of Material
BTS Base Transceiver Station
CHAP Challenge Handshake Authentication Protocol
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear To Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DCE Data Communications Equipment (typically module)
DTE Data Terminal Equipment (typically computer, external controller)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
Imax Maximum Load Current
Inorm Normal Current
kbps Kilo Bits Per Second
LED Light Emitting Diode
M10 Hardware Design
Abbreviation Description
Li-Ion Lithium-Ion
MO Mobile Originated
MS Mobile Station (GSM engine)
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PDU Protocol Data Unit
PPP Point-to-Point Protocol
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
RX Receive Direction
SIM Subscriber Identification Module
SMS Short Message Service
TDMA Time Division Multiple Access
TE Terminal Equipment
TX Transmitting Direction
UART Universal Asynchronous Receiver & Transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Vmax Maximum Voltage Value
Vnorm Normal Voltage Value
Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output High Level Voltage Value
VOHmin Minimum Output High Level Voltage Value
VOLmax Maximum Output Low Level Voltage Value
VOLmin Minimum Output Low Level Voltage Value
Phonebook abbreviations
FD SIM Fix Dialing phonebook
LD SIM Last Dialing phonebook (list of numbers most recently dialed)
MC Mobile Equipment list of unanswered MT Calls (missed calls)
ON SIM (or ME) Own Numbers (MSISDNs) list
RC Mobile Equipment list of Received Calls
M10 Hardware Design
Abbreviation Description
SM SIM phonebook
1.3. Directives and standards
The M10 module is designed to comply with the FCC statements. FCC ID is XMR201202M10.
The Host system using M10, should have label indicating FCC ID: XMR201202M10.
1.3.1. FCC Statement
Changes or modifications not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment.
1.3.2. FCC Radiation exposure statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator and your body.
The manual of the host system, which uses M10, must include RF exposure warning statement to
advice user should keep minimum 20cm from the radio antenna of M10 module depending on
portable or Mobile status.
Note: If a portable device (such as PDA) uses M10 module, the device needs to do permissive
change and SAR testing.
1.3.3. Industry Canada license
English version
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject
to the following two conditions:
a) This device may not cause harmful interference.
b) This device must accept any interference, including interference that may cause
undesired operation of the device.
The Host system using M10, should have label indicating “transmitter module IC:
10064-201202M10.
French version
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
M10 Hardware Design
y
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :
a) l'appareil ne doit pas produire de brouillage, et b) L’utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en compromettre le fonctionnement.
1.4. Safety cautions
The following safety precautions must be observed during all phases of the operation, such as
usage, service or repair of any cellular terminal or mobile incorporating M10 module.
Manufacturers of the cellular terminal should send the following safety information to users and
operating personnel and to incorporate these guidelines into all manuals supplied with the product.
If not so, Quectel does not take on any liability for customer failure to comply with these
precautions.
When in a hospital or other health care facility, observe the restrictions about the
use of mobile. Switch the cellular terminal or mobile off. Medical equipment may
be sensitive to not operate normally for RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure
it switched off. The operation of wireless appliances in an aircraft is forbidden to
prevent interference with communication systems. Forget to think much of these
instructions may lead to the flight safety or offend against local legal action, or
both.
Do not operate the cellular terminal or mobile in the presence of flammable gas
or fume. Switch off the cellular terminal when you are near petrol station, fuel
depot, chemical plant or where blasting operations are in progress. Operation of
any electrical equipment in potentially explosive atmosphere can constitute a
safet
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy
while switched on. RF interference can occur if it is used close to TV set, radio,
computer or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile
while driving a vehicle, unless it is securely mounted in a holder for hands-free
operation. Before making a call with a hand-held terminal or mobile, park the
vehicle.
M10 Hardware Design
GSM cellular terminals or mobiles operate over radio frequency signal and
cellular network and cannot be guaranteed to connect in all conditions, for
example no mobile fee or an invalid SIM card. While you are in this condition
and need emergent help, Please Remember using emergency call. In order to
make or receive call, the cellular terminal or mobile must be switched on and in
a service area with adequate cellular signal strength.
Some networks do not allow for emergency call if certain network services or
phone features are in use (e.g. lock functions, fixed dialing etc.). You may have
to deactivate those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in
cellular terminal or mobile.
M10 Hardware Design
2. Product concept
The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850MHz,
GSM900MHz, DCS1800MHz and PCS1900MHz. The M10 features GPRS multi-slot class 12
and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about
GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B.
With a tiny profile of 29mm×29mm ×3.6 mm, the module can meet almost all the requirements
for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS,
Security, Telematics, Remote Controlling, etc.
M10 is an SMD type module, which can be embedded in customer application through its 64-pin
pads. It provides all hardware interfaces between the module and customer’s host board.
Designed with power saving technique, current consumption of M10 is as low as 1.1 mA in
SLEEP mode when DRX is 5.
M10 is integrated with Internet service protocols, which are TCP/IP, PPP. Extended AT
commands have been developed for customer to use these Internet service protocols easily.
The modules are fully RoHS compliant to EU regulation.
2.1. Key features
Table 3: Module key features
Feature Implementation
Power supply Single supply voltage: 3.3V~4.6V
Typical supply voltage: 4V
Power saving Typical power consumption in SLEEP mode to 1.1 mA@ DRX=5
0.95mA@ DRX=9
Frequency bands
GSM class Small MS
Transmitting power Class 4 (2W) at GSM850 and GSM900
GPRS connectivity
Temperature range Normal operation: -35°C ~ +80°C
Daud-band: GSM850, GSM900, DCS1800, PCS1900. The module can search these frequency bands automatically The frequency bands can be set by AT command. Compliant to GSM Phase 2/2+
Class 1 (1W) at DCS1800 and PCS1900 GPRS multi-slot class 12 (default) GPRS multi-slot class 1~12 (configurable) GPRS mobile station class B
M10 Hardware Design
Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C 1)
Storage temperature: -45°C ~ +90°C
DATA GPRS:
CSD:
GPRS data downlink transfer: max. 85.6 kbps GPRS data uplink transfer: max. 85.6 kbps Coding scheme: CS-1, CS-2, CS-3 and CS-4 Support the protocols PAP (Password Authentication Protocol)
usually used for PPP connections
Internet service protocols TCP/UDP/FTP/HTTP/MMS/SMTP Support Packet Switched Broadcast Control Channel (PBCCH) CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent Support Unstructured Supplementary Services Data (USSD)
SMS MT, MO, CB, Text and PDU mode
SMS storage: SIM card
FAX Group 3 Class 1 and Class 2
SIM interface Support SIM card: 1.8V, 3V
Antenna interface Connected via 50 Ohm antenna pad
Audio features Speech codec modes:
Half Rate (ETS 06.20) Full Rate (ETS 06.10) Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) Adaptive Multi-Rate (AMR) Echo Cancellation Echo Suppression Noise Reduction
Serial interface Serial Port:
Seven lines on serial port interface Use for AT command, GPRS data and CSD data Multiplexing function Support autobauding from 4800 bps to 115200 bps
Debug Port:
Two lines on second serial port interface DBG_TXD and
DBG_RXD
Debug Port used for software debugging and log output
UART3:
Use for AT command
Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC
SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99
Real time clock Implemented
Alarm function Programmable via AT command
Physical characteristics Size:
29±0.15×29±0.15×3.6±0.3mm
Weight: 6g
Firmware upgrade Firmware upgrade over Serial Port
M10 Hardware Design
1) When the module works in this temperature range, the deviation from the GSM
specification might occur. For example, the frequency error or the phase error could increase.
Table 4: Coding schemes and maximum net data rates over air interface
Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot
CS-1: 9.05kbps 18.1kbps 36.2kbps
CS-2: 13.4kbps 26.8kbps 53.6kbps
CS-3: 15.6kbps 31.2kbps 62.4kbps
CS-4: 21.4kbps 42.8kbps 85.6kbps
2.2. Functional diagram
The following figure shows a block diagram of M10 and illustrates the major functional parts.
Power management Baseband Serial Flash The GSM radio frequency part The Peripheral interface
—Power supply —Turn on/off interface —UART interface —Audio interface —SIM interface —Keypad interface —ADC —SD card interface —RF interface
M10 Hardware Design
Figure 1: Module functional diagram
2.3. Evaluation board
In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB)
that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial
interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the
module. For details, please refer to the document [13].
M10 Hardware Design
3. Application interface
The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular
application platform. Sub-interfaces included in these pads are described in detail in following
chapters:
Power supply (refer to Chapter 3.3) Serial interfaces (refer to Chapter 3.8) Two analog audio interfaces (refer to Chapter 3.9) SIM interface (refer to Chapter 3.10) SD card interface(refer to Chapter 3.18)
Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6.
3.1. Pin of module
3.1.1. Pin assignment
The following figure shows pin name and assignment of M10.
Figure 2: Top view of module pin assignment
M10 Hardware Design
3.1.2. Pin description
Table 5: Pin description
Power supply
PIN NAME PIN
NO.
VBAT 50,51
52
I/O DESCRIPTION DC
CHARACTERISTICS
I Module main
power supply.
VBAT=3.3V~4.6V
Vmax= 4.6V
Vmin=3.3V
Vnorm=4.0V
.
COMMENT
It must be able to
provide sufficient
current in a
transmitting burst
which typically
rises to 1.6A.
VRTC 16 I/O Power supply for
RTC when VBAT
is not supplied.
Charging for
backup battery or
golden capacitor
when the VBAT is
supplied.
VDD_EXT 7 O Supply 2.8V
voltage for
external circuit.
VImax=VBAT
VImin=2.6V
VInorm=2.75V
VOmax=2.85V
VOmin=2.6V
VOnorm=2.75V
Iout(max)= 730uA
Iin=2.6~5 uA
Vmax=2.9V
Vmin=2.7V
Vnorm=2.8V
Imax=20mA
Recommended to
connect to a
backup battery or a
golden capacitor.
1. If unused, keep
this pin open.
2. Recommended
to add a 2.2~4.7uF
bypass capacitor,
when used for
power supply.
GND 8,42,
Digital ground
44~
49
Turn on /off
PIN NAME PIN
NO.
PWRKEY 18 I Power on/off key
I/O DESCRIPTION DC
CHARACTERISTICS
VILmax=0.1*VBAT
PWRKEY should
be pulled down for
VIHmin=0.6*VBAT
VImax=VBAT
COMMENT
Pull up to VBAT
internally.
a moment to turn
on or off the
system.
Emergency shutdown
PIN NAME PIN
NO.
I/O DESCRIPTION DC
CHARACTERISTICS
COMMENT
M10 Hardware Design
EMERG_
OFF
17 I Emergency off.
Pulling down for
at least 20ms will
turn off the module
in case of
emergency. Use it
only when normal
shutdown through
PWRKEY or AT
command cannot
perform well.
Module status indication
PIN NAME PIN
I/O DESCRIPTION DC
NO.
STATUS 54 O Used to indicate
module’s operating
status. High level
indicates module
power-on and low
level indicates
power-down.
Audio interfaces
VILmax=0.4V
VIHmin=2.2V
V
max=2.8V
open
CHARACTERISTICS
VOLmax=
0.15*VDD_EXT
VOHmax=
0.85*VDD_EXT
Open
drain/collector
driver required in
cellular device
application.
If unused, keep
this pin open.
COMMENT
If unused, keep
this pin open.
PIN NAME PIN
NO.
MIC1P
MIC1N
MIC2P
MIC2N
23
24
25
26
I/O DESCRIPTION DC
CHARACTERISTICS
I Positive and
negative
voice-band input.
For Audio DC
characteristics refer to
Chapter 3.10.
I Auxiliary positive
and negative
voice-band input.
SPK1P
SPK1N
22
21
O Positive and
negative
voice-band output.
SPK2P 20 O Auxiliary positive
voice-band output.
AGND 19
AGND is separate
ground connection
for external audio
circuits.
General purpose input/output
PIN NAME PIN
NO.
I/O DESCRIPTION DC
CHARACTERISTICS
COMMENT
If unused, keep
these pins open.
COMMENT
M10 Hardware Design
KBC0~
KBC4
KBR0~
33~37 I Keypad interface VILmin=-0.3V
VILmax=
28~32 O Pull up to
VIHmin=
KBR4
VIHmax=
GPIO1_
KBC5
38
I/O Normal
input/output
port/Keypad
VOLmax=
VOHmin=
interface
GPIO0 64 I/O Normal
input/output port
NETLIGHT 6 O Network status
indication
LIGHT_
MOS
27
O Open drain output
port
Imax=60mA If unused, keep
Main Serial port
PIN NAME PIN
NO.
DTR 59 I Data terminal
I/O DESCRIPTION DC
CHARACTERISTICS
VILmin=-0.3V
ready
VILmax=
RXD 61 I Receive data
TXD 60 O Transmit data
RTS 58 I Request to send
VIHmin=
VIHmax=
CTS 57 O Clear to send
RI 55 O Ring indicator
DCD 56 O Data carrier
VOLmax=
VOHmin=
detection
Debug port
DBG_TXD 10 O Serial interface for
DBG_RXD 9 I
debugging only
Same as above If unused, keep
0.25*VDD_EXT
0.75*VDD_EXT
VDD_EXT+0.3
0.15*VDD_EXT
0.85*VDD_EXT
0.25*VDD_EXT
0.75*VDD_EXT
VDD_EXT+0.3
0.15*VDD_EXT
0.85*VDD_EXT
If unused, keep
these pins open.
VDD_EXT, if
unused, keep these
pins open.
If unused, keep
these pins open.
this pin open.
COMMENT
If only use TXD,
RXD and GND to
communicate,
recommend
connecting RTS to
GND via 0R
resistor and
keeping other pins
open.
these pins open.
UART3
TXD3 62 O Transmit data Same as above If unused, keep
RXD3 63 I Receive data
these pins open.
SD card interface
PIN NAME PIN
NO.
I/O DESCRIPTION DC
CHARACTERISTICS
COMMENT
SD_DATA 1 I/O SD serial data VILmin=-0.3V If unused, keep
M10 Hardware Design
SD_CLK 2 O SD serial clock VILmax=
0.25*VDD_EXT
SD_CMD 3 O SD command
VIHmin=
0.75*VDD_EXT
VIHmax=
VDD_EXT+0.3
VOLmax=
0.15*VDD_EXT
VOHmin=
0.85*VDD_EXT
SIM interface
PIN NAME PIN
NO.
SIM_VDD 12 O Voltage supply for
I/O DESCRIPTION DC
CHARACTERISTICS
The voltage can be
SIM card
selected by software
automatically. Either
1.8V or 3V.
SIM_DATA 13 I/O SIM data When SIM_VDD=3V
VILmax=0.4V
VIHmin=
SIM_VDD-0.4
VOLmax=0.4V
VOHmin=
SIM_VDD-0.4
When SIM_VDD=1.8V
VILmax=
0.15*SIM_VDD
VIHmin=
SIM_VDD-0.4
VOLmax=
0.15*SIM_VDD
VOHmin=
SIM_VDD-0.4
SIM_CLK 14 O SIM clock When SIM_VDD=3V
VILmax=0.4V
VIHmin=
0.9*SIM_VDD
VOLmax=0.4V
VOHmin=
0.9*SIM_VDD
When SIM_VDD=1.8V
VILmax=
0.12*SIM_VDD
VIHmin=
these pins open.
If used,
SD_DATA is
connected to SD
card DATA0 pin.
COMMENT
All signals of SIM
interface should be
protected against
ESD with a TVS
diode array.
Maximum cable
length is 200mm
from the module
pad to SIM card
holder.
M10 Hardware Design
0.9*SIM_VDD
VOLmax=
0.12*SIM_VDD
VOHmin=
0.9*SIM_VDD
SIM_RST 15 O SIM reset When SIM_VDD=3V
VILmax=0.36V
VIHmin=
0.9*SIM_VDD
VOLmax=0.4V
VOHmin=
0.9*SIM_VDD
When SIM_VDD=1.8V
VILmax=
0.12*SIM_VDD
VIHmin=
0.9*SIM_VDD
VOLmax=
0.12*SIM_VDD
VOHmin=
0.9*SIM_VDD
SIM_
PRESENCE
11 I SIM card detection VILmax=0.67V
VIHmin=1.7V
If unused, keep
this pin open.
AUX ADC
PIN NAME PIN
NO.
ADC0 41 I General purpose
ADC1 40 I
I/O DESCRIPTION DC
CHARACTERISTICS
Voltage range:
analog to digital
0V ~ 2.8V
COMMENT
If unused, keep
this pin open.
converter
RF interface
PIN NAME PIN
NO.
I/O DESCRIPTION DC
CHARACTERISTICS
COMMENT
RF_ANT 43 I/O RF antenna pad Impedance of 50Ω Refer to Chapter
4.
Other interfaces
PIN NAME PIN
NO.
RESERVED 4,5,
39,53
I/O DESCRIPTION DC
COMMENT
CHARACTERISTICS
Keep these pins
open
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