Quectel Wireless Solutions 201202M10 Users Manual

M10

Quectel Cellular Engine

Hardware Design

M10_HD_V3.0

M10 Hardware Design

Document Title Revision Date Status Document Control ID

M10 Hardware Design

3.0

2012-03-02

Released

M10_HD_V3.0

General Notes

Quectel offers this information as a service to its customers, to support application and

engineering efforts that use the products designed by Quectel. The information provided is

based upon requirements specifically provided for customers of Quectel. Quectel has not

undertaken any independent search for additional information, relevant to any information

that may be in the customer’s possession. Furthermore, system validation of this product

designed by Quectel within a larger electronic system remains the responsibility of the

customer or the customer’s system integrator. All specifications supplied herein are subject to

change.

Copyright

This document contains proprietary technical information of Quectel Co., Ltd. Copying of

this document, distribution to others, and communication of the contents thereof, are

forbidden without permission. Offenders are liable to the payment of damages. All rights are

reserved in the event of a patent grant or registration of a utility model or design. All

specification supplied herein are subject to change without notice at any time.

M10_HD_V3.0 - 1 -

M10 Hardware Design

Contents

Contents ............................................................................................................................................ 2

Table Index ........................................................................................................................................ 4

Figure Index ...................................................................................................................................... 5

0. Revision history ............................................................................................................................ 7

1. Introduction ................................................................................................................................... 9

1.1. Related documents .............................................................................................................. 9

1.2. Terms and abbreviations .................................................................................................... 10

1.3. Directives and standards .................................................................................................... 12

1.3.1. FCC Statement ........................................................................................................ 12

1.3.2. FCC Radiation exposure statement ......................................................................... 12

1.3.3. Industry Canada licence .......................................................................................... 12

1.4. Safety cautions .................................................................................................................. 13

2. Product concept ........................................................................................................................... 15

2.1. Key features ...................................................................................................................... 15

2.2. Functional diagram ............................................................................................................ 17

2.3. Evaluation board ............................................................................................................... 18

3. Application interface ................................................................................................................... 19

3.1. Pin of module .................................................................................................................... 19

3.1.1. Pin assignment ......................................................................................................... 19

3.1.2. Pin description ......................................................................................................... 20

3.2. Operating modes ............................................................................................................... 25

3.3. Power supply ..................................................................................................................... 26

3.3.1. Power supply pins.................................................................................................... 27

3.3.2. Minimizing supply voltage drop.............................................................................. 27

3.3.3. Monitor power supply ............................................................................................. 28

3.4. Power up and down scenarios ........................................................................................... 28

3.4.1. Power on .................................................................................................................. 28

3.4.2. Power down ............................................................................................................. 31

3.4.3. Restart module using the PWRKEY pin.................................................................. 35

3.5. Power saving ..................................................................................................................... 36

3.5.1. Minimum functionality mode .................................................................................. 36

3.5.2. SLEEP mode (slow clock mode) ............................................................................. 36

3.5.3. Wake up module from SLEEP mode ...................................................................... 37

3.6. Summary of state transitions (except SLEEP mode) ......................................................... 37

3.7. RTC backup ...................................................................................................................... 37

3.8. Serial interfaces ................................................................................................................. 39

3.8.1. UART Port .............................................................................................................. 40

3.8.2. Debug Port ............................................................................................................... 43

3.8.3. UART Port 3 ........................................................................................................... 44

3.8.4. UART Application .................................................................................................. 45

3.9. Audio interfaces................................................................................................................. 46

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M10 Hardware Design

3.9.1. Decrease TDD noise and other noise ...................................................................... 47

3.9.2. Microphone interfaces configuration ....................................................................... 48

3.9.3. Receiver and speaker interface configuration .......................................................... 49

3.9.4. Earphone interface configuration ............................................................................ 51

3.10. SIM card interface ........................................................................................................... 52

3.10.1. SIM card application ............................................................................................. 52

3.10.2. Design considerations for SIM card holder ........................................................... 54

3.11. Keypad interface .............................................................................................................. 56

3.12. ADC................................................................................................................................. 57

3.13. Behaviors of the RI ......................................................................................................... 58

3.14. Network status indication ................................................................................................ 60

3.15. Operating status indication .............................................................................................. 61

3.16. General purpose input & output (GPIO) ......................................................................... 61

3.17. Open drain output (LIGHT_MOS) .................................................................................. 62

3.18. SD card interface ............................................................................................................. 63

4. Antenna interface ........................................................................................................................ 65

4.1. Antenna installation ........................................................................................................... 65

4.2. RF output power ................................................................................................................ 66

4.3. RF receiving sensitivity ..................................................................................................... 66

4.4. Operating frequencies ....................................................................................................... 66

4.5. Recommendation of RF pad welding ................................................................................ 66

5. Electrical, reliability and radio characteristics ............................................................................ 68

5.1. Absolute maximum ratings ................................................................................................ 68

5.2. Operating temperature ....................................................................................................... 68

5.3. Power supply ratings ......................................................................................................... 69

5.4. Current consumption ......................................................................................................... 70

5.5. Electro-static discharge ..................................................................................................... 72

6. Mechanical dimensions ............................................................................................................... 73

6.1. Mechanical dimensions of module .................................................................................... 73

6.2. Footprint of recommendation ............................................................................................ 75

6.3. Top view of the module .................................................................................................... 77

6.4. Bottom view of the module ............................................................................................... 77

Appendix A: GPRS coding schemes ............................................................................................... 78

Appendix B: GPRS multi-slot classes ............................................................................................. 79

M10_HD_V3.0 - 3 -

M10 Hardware Design

Table Index

TABLE 1: RELATED DOCUMENTS ............................................................................................. 9

TABLE 2: TERMS AND ABBREVIATIONS ................................................................................ 10

TABLE 3: MODULE KEY FEATURES ........................................................................................ 15

TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR

INTERFACE .................................................................................................................. 17

TABLE 5: PIN DESCRIPTION ...................................................................................................... 20

TABLE 6: OVERVIEW OF OPERATING MODES ...................................................................... 25

TABLE 7: AT COMMANDS USED IN ALARM MODE ............................................................. 31

TABLE 8: SUMMARY OF STATE TRANSITION ....................................................................... 37

TABLE 9: LOGIC LEVELS OF THE SERIAL INTERFACE ....................................................... 40

TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES ................................................. 40

TABLE 11: PIN DEFINITION OF AUDIO INTERFACE ............................................................. 47

TABLE 12: TYPICAL ELECTRET MICROPHONE CHARACTERISTIC ................................. 51

TABLE 13: TYPICAL SPEAKER CHARACTERISTIC ............................................................... 51

TABLE 14: PIN DEFINITION OF THE SIM INTERFACE .......................................................... 52

TABLE 15: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER .................................. 55

TABLE 16: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ......................................... 55

TABLE 17: PIN DEFINITION OF THE KEYPAD INTERFACE ................................................. 56

TABLE 18: PIN DEFINITION OF THE ADC ............................................................................... 57

TABLE 19: CHARACTERISTIC OF THE ADC ........................................................................... 58

TABLE 20: BEHAVIORS OF THE RI ........................................................................................... 58

TABLE 21: WORKING STATE OF THE NETLIGHT .................................................................. 60

TABLE 22: PIN DEFINITION OF THE STATUS ......................................................................... 61

TABLE 23: PIN DEFINITION OF THE GPIO INTERFACE ....................................................... 62

TABLE 24: PIN DEFINITION OF THE LIGHT_MOS ................................................................. 62

TABLE 25: PIN DEFINITION OF THE SD CARD INTERFACE ............................................... 63

TABLE 26: PIN NAME OF THE SD CARD AND T-FLASH(MICRO SD) CARD ..................... 64

TABLE 27: PIN DEFINITION OF THE RF_ANT ........................................................................ 65

TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ............................................ 66

TABLE 29: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY ............................ 66

TABLE 30: THE MODULE OPERATING FREQUENCIES ........................................................ 66

TABLE 31: ABSOLUTE MAXIMUM RATINGS ......................................................................... 68

TABLE 32: OPERATING TEMPERATURE ................................................................................. 68

TABLE 33: THE MODULE POWER SUPPLY RATINGS ........................................................... 69

TABLE 34: THE MODULE CURRENT CONSUMPTION .......................................................... 70

TABLE 35: THE ESD ENDURANCE (TEMPERATURE:25℃,HUMIDITY:45 %) .................... 72

TABLE 36: DESCRIPTION OF DIFFERENT CODING SCHEMES ........................................... 78

TABLE 37: GPRS MULTI-SLOT CLASSES ................................................................................ 79

M10_HD_V3.0 - 4 -

M10 Hardware Design

Figure Index

FIGURE 1: MODULE FUNCTIONAL DIAGRAM ...................................................................... 18

FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT ......................................................... 19

FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ................... 26

FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ................... 27

FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT ....................................................... 28

FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ......................................... 29

FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ................................................... 29

FIGURE 8: TIMING OF TURN ON SYSTEM ............................................................................. 30

FIGURE 9: TIMING OF TURN OFF THE MODULE .................................................................. 32

FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT .... 34

FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON ...................... 34

FIGURE 12: TIMING OF RESTART SYSTEM ............................................................................ 35

FIGURE 13: TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN ............. 35

FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ........................................ 38

FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ............................................ 38

FIGURE 16: RTC SUPPLY FROM CAPACITOR ......................................................................... 38

FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC ....................................... 39

FIGURE 18: CONNECTION OF ALL FUNCTIONAL UART PORT .......................................... 42

FIGURE 19: CONNECTION OF THREE LINES UART PORT ................................................... 42

FIGURE 20: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL .......... 43

FIGURE 21: CONNECTION OF SOFTWARE UPGRADE ......................................................... 43

FIGURE 22: CONNECTION OF SOFTWARE DEBUG .............................................................. 44

FIGURE 23: CONNECTION OF AUXILIARY UART PORT ...................................................... 44

FIGURE 24: 3.3V LEVEL MATCH CIRCUIT .............................................................................. 45

FIGURE 25: 5V LEVEL MATCH CIRCUIT ................................................................................. 45

FIGURE 26: RS232 LEVEL MATCH CIRCUIT ........................................................................... 46

FIGURE 27: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2 ..................... 48

FIGURE 28: SPEAKER INTERFACE CONFIGURATION OF AOUT1 ...................................... 49

FIGURE 29: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1 ..... 49

FIGURE 30: SPEAKER INTERFACE CONFIGURATION OF AOUT2 ...................................... 50

FIGURE 31: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2 ..... 50

FIGURE 32: EARPHONE INTERFACE CONFIGURATION ...................................................... 51

FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD ............................................ 53

FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD ............................................ 53

FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER ...................................... 54

FIGURE 36: MOLEX 91228 SIM CARD HOLDER ..................................................................... 55

FIGURE 37: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE ..................................... 57

FIGURE 38: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER .................................... 59

FIGURE 39: RI BEHAVIOUR OF DATA CALLING AS A RECEIVER ...................................... 59

FIGURE 40: RI BEHAVIOUR AS A CALLER ............................................................................. 59

FIGURE 41: RI BEHAVIOUR OF URC OR SMS RECEIVED .................................................... 60



M10_HD_V3.0 - 5 -

M10 Hardware Design

FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................ 60

FIGURE 43: REFERENCE CIRCUIT OF THE STATUS ............................................................. 61

FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS ..................................................... 62

FIGURE 45: REFERENCE CIRCUIT OF SD CARD ................................................................... 63

FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE ......................................................... 65

FIGURE 47: RECOMMENDATION OF RF PAD WELDING ..................................................... 67

FIGURE 48: M10 TOP AND SIDE DIMENSIONS（UNIT: MM） ............................................ 73

FIGURE 49: M10 BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 74

FIGURE 50: PAD BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 74

FIGURE 51: FOOTPRINT OF RECOMMENDATION（UNIT: MM） ...................................... 76

FIGURE 52: TOP VIEW OF THE MODULE ................................................................................ 77

FIGURE 53: BOTTOM VIEW OF THE MODULE ...................................................................... 77

FIGURE 54: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 .................................... 78

FIGURE 55: RADIO BLOCK STRUCTURE OF CS-4 ................................................................ 78

M10_HD_V3.0 - 6 -

M10 Hardware Design

0. Revision history

Revision Date Author Description of change

1.00 2009-06-27 Tracy ZHANG Initial

1.01 2009-09-18 Yong AN 1. Modified VRTC voltage inputting range.

2. Modified Figure 1.

3. Added Table 7 and Figure 4 with remark.

4. Modified ordering information content in

Chapter 6.

5. Added VCHG pin description.

6. Modified current consumption data in Table 36.

7. Added appendix A and B.

1.02 2009-11-12 Yong AN 1. Baud rate of the main UART port is set to

autobauding mode from former fixed baud rate

of 115200 in default configuration.

2. Modified contents about autobauding in

Chapter 3.8

3. Modified the SIM card detection function

through “AT+QSIMDET”.

1.03 2010-06-09 Yong AN 1. Added charging interface description.

2. Added Serial Port 3 interface description.

3. Added STATUS pin and its function description.

4. Added GPIO control by AT+QGPIO command.

5. Modified timing of powering on, powering

down and restarting the module.

6. Added ESD level of SIM card interface.

7. Modified function description of audio AOUT2

channel.

8. Disabled VDD_EXT pin as the indication of

power-on and power-down.

9. Both STATUS and AT+QGPIO functions are

supported at R05A05 release version and later,

while Serial Port 3 function will be supported at

R06AXX and later.

2.0 2010-07-30 DavidWEI 1. Added recommendation of RF pad welding.

3.0 2012-02-28 LayneYE 1. Modified the power supply range

2. Modified buzzer interface as RESERVED

3. Modified the display interface as SD interface

4. Modified the peak current in a transmitting burst

5. Modified the current consumption in GSM talk

mode and GPRS communication mode

6. Modified the RF receiving sensitivity

M10_HD_V3.0 - 7 -

M10 Hardware Design

7. Deleted the content of charging function.

M10_HD_V3.0 - 8 -

M10 Hardware Design

1. Introduction

This document defines the M10 module and describes the hardware interface of M10 module

which are connected with the customer application and the air interface.

This document can help customer quickly understand module interface specifications, electrical

and mechanical details. Associated with application notes and user guide, customer can use M10

module to design and set up mobile applications easily.

1.1. Related documents

Table 1: Related documents

SN Document name Remark

[ 1 ] M1 0_ AT C AT c omm an d s s e t

[2] ITU-T Draft new

recommendation V.25ter

[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT

[4] GSM 07.10 Support GSM 07.10 multiplexing protocol

[5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of

[6] GSM 11.14 Digital cellular telecommunications (Phase 2+);

[7] GSM 11.11 Digital cellular telecommunications (Phase 2+);

[8] GSM 03.38 Digital cellular telecommunications (Phase 2+);

[9] GSM 11.10 Digital cellular telecommunications (Phase 2); Mobile

[10] GSM_UART_AN UART port application notes

[11] M10_HD_AN01 M10 hardware design application notes

[12] GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note

[13] M10_EVB_UGD M10 EVB user guide application notes

Serial asynchronous automatic dialing and control

command set for GSM Mobile Equipment (ME)

Data Terminal Equipment – Data Circuit terminating

Equipment (DTE – DCE) interface for Short Message

Service (SMS) and Cell Broadcast Service (CBS)

Specification of the SIM Application Toolkit for the

Subscriber Identity module – Mobile Equipment (SIM –

ME) interface

Specification of the Subscriber Identity module – Mobile

Equipment (SIM – ME) interface

Alphabets and language-specific information

Station (MS) conformance specification; Part 1:

Conformance specification

M10_HD_V3.0 - 9 -

M10 Hardware Design

1.2. Terms and abbreviations

Table 2: Terms and abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

AMR Adaptive Multi-Rate

ARP Antenna Reference Point

ASIC Application Specific Integrated Circuit

BER Bit Error Rate

BOM Bill Of Material

BTS Base Transceiver Station

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear To Send

DAC Digital-to-Analog Converter

DRX Discontinuous Reception

DSP Digital Signal Processor

DCE Data Communications Equipment (typically module)

DTE Data Terminal Equipment (typically computer, external controller)

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

EGSM Enhanced GSM

EMC Electromagnetic Compatibility

ESD Electrostatic Discharge

ETS European Telecommunication Standard

FCC Federal Communications Commission (U.S.)

FDMA Frequency Division Multiple Access

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

HR Half Rate

I/O Input/Output

IC Integrated Circuit

IMEI International Mobile Equipment Identity

Imax Maximum Load Current

Inorm Normal Current

kbps Kilo Bits Per Second

LED Light Emitting Diode

M10_HD_V3.0 - 10 -

M10 Hardware Design

Abbreviation Description

Li-Ion Lithium-Ion

MO Mobile Originated

MS Mobile Station (GSM engine)

MT Mobile Terminated

PAP Password Authentication Protocol

PBCCH Packet Switched Broadcast Control Channel

PCB Printed Circuit Board

PDU Protocol Data Unit

PPP Point-to-Point Protocol

RF Radio Frequency

RMS Root Mean Square (value)

RTC Real Time Clock

RX Receive Direction

SIM Subscriber Identification Module

SMS Short Message Service

TDMA Time Division Multiple Access

TE Terminal Equipment

TX Transmitting Direction

UART Universal Asynchronous Receiver & Transmitter

URC Unsolicited Result Code

USSD Unstructured Supplementary Service Data

VSWR Voltage Standing Wave Ratio

Vmax Maximum Voltage Value

Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

Phonebook abbreviations

FD SIM Fix Dialing phonebook

LD SIM Last Dialing phonebook (list of numbers most recently dialed)

MC Mobile Equipment list of unanswered MT Calls (missed calls)

ON SIM (or ME) Own Numbers (MSISDNs) list

RC Mobile Equipment list of Received Calls

M10_HD_V3.0 - 11 -

M10 Hardware Design

Abbreviation Description

SM SIM phonebook

1.3. Directives and standards

The M10 module is designed to comply with the FCC statements. FCC ID is XMR201202M10.

The Host system using M10, should have label indicating FCC ID: XMR201202M10.

1.3.1. FCC Statement

Changes or modifications not expressly approved by the party responsible for compliance could

void the user’s authority to operate the equipment.

1.3.2. FCC Radiation exposure statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20cm

between the radiator and your body.

The manual of the host system, which uses M10, must include RF exposure warning statement to

advice user should keep minimum 20cm from the radio antenna of M10 module depending on

portable or Mobile status.

Note: If a portable device (such as PDA) uses M10 module, the device needs to do permissive

change and SAR testing.

1.3.3. Industry Canada license

 English version

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject

to the following two conditions:

a) This device may not cause harmful interference.

b) This device must accept any interference, including interference that may cause

undesired operation of the device.

 The Host system using M10, should have label indicating “transmitter module IC:

10064-201202M10.

 French version

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

M10_HD_V3.0 - 12 -

M10 Hardware Design

y

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :

a) l'appareil ne doit pas produire de brouillage, et b) L’utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,

même si le brouillage est susceptible d'en compromettre le fonctionnement.

1.4. Safety cautions

The following safety precautions must be observed during all phases of the operation, such as

usage, service or repair of any cellular terminal or mobile incorporating M10 module.

Manufacturers of the cellular terminal should send the following safety information to users and

operating personnel and to incorporate these guidelines into all manuals supplied with the product.

If not so, Quectel does not take on any liability for customer failure to comply with these

precautions.

When in a hospital or other health care facility, observe the restrictions about the

use of mobile. Switch the cellular terminal or mobile off. Medical equipment may

be sensitive to not operate normally for RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure

it switched off. The operation of wireless appliances in an aircraft is forbidden to

prevent interference with communication systems. Forget to think much of these

instructions may lead to the flight safety or offend against local legal action, or

both.

Do not operate the cellular terminal or mobile in the presence of flammable gas

or fume. Switch off the cellular terminal when you are near petrol station, fuel

depot, chemical plant or where blasting operations are in progress. Operation of

any electrical equipment in potentially explosive atmosphere can constitute a

safet

hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy

while switched on. RF interference can occur if it is used close to TV set, radio,

computer or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile

while driving a vehicle, unless it is securely mounted in a holder for hands-free

M10_HD_V3.0 - 13 -

operation. Before making a call with a hand-held terminal or mobile, park the

vehicle.

M10 Hardware Design

GSM cellular terminals or mobiles operate over radio frequency signal and

cellular network and cannot be guaranteed to connect in all conditions, for

example no mobile fee or an invalid SIM card. While you are in this condition

and need emergent help, Please Remember using emergency call. In order to

make or receive call, the cellular terminal or mobile must be switched on and in

a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services or

phone features are in use (e.g. lock functions, fixed dialing etc.). You may have

to deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in

cellular terminal or mobile.

M10_HD_V3.0 - 14 -

M10 Hardware Design

2. Product concept

The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850MHz,

GSM900MHz, DCS1800MHz and PCS1900MHz. The M10 features GPRS multi-slot class 12

and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about

GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B.

With a tiny profile of 29mm×29mm ×3.6 mm, the module can meet almost all the requirements

for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS,

Security, Telematics, Remote Controlling, etc.

M10 is an SMD type module, which can be embedded in customer application through its 64-pin

pads. It provides all hardware interfaces between the module and customer’s host board.

Designed with power saving technique, current consumption of M10 is as low as 1.1 mA in

SLEEP mode when DRX is 5.

M10 is integrated with Internet service protocols, which are TCP/IP, PPP. Extended AT

commands have been developed for customer to use these Internet service protocols easily.

The modules are fully RoHS compliant to EU regulation.

2.1. Key features

Table 3: Module key features

Feature Implementation

Power supply Single supply voltage: 3.3V~4.6V

Typical supply voltage: 4V

Power saving Typical power consumption in SLEEP mode to 1.1 mA@ DRX=5

0.95mA@ DRX=9

Frequency bands

GSM class Small MS

Transmitting power  Class 4 (2W) at GSM850 and GSM900

GPRS connectivity

Temperature range  Normal operation: -35°C ~ +80°C

 Daud-band: GSM850, GSM900, DCS1800, PCS1900.  The module can search these frequency bands automatically  The frequency bands can be set by AT command.  Compliant to GSM Phase 2/2+

 Class 1 (1W) at DCS1800 and PCS1900  GPRS multi-slot class 12 (default)  GPRS multi-slot class 1~12 (configurable)  GPRS mobile station class B

M10_HD_V3.0 - 15 -

M10 Hardware Design

 Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C 1)

 Storage temperature: -45°C ~ +90°C

DATA GPRS:

CSD:

 GPRS data downlink transfer: max. 85.6 kbps  GPRS data uplink transfer: max. 85.6 kbps  Coding scheme: CS-1, CS-2, CS-3 and CS-4  Support the protocols PAP (Password Authentication Protocol)

usually used for PPP connections

 Internet service protocols TCP/UDP/FTP/HTTP/MMS/SMTP  Support Packet Switched Broadcast Control Channel (PBCCH)  CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent  Support Unstructured Supplementary Services Data (USSD)

SMS  MT, MO, CB, Text and PDU mode

 SMS storage: SIM card

FAX Group 3 Class 1 and Class 2

SIM interface Support SIM card: 1.8V, 3V

Antenna interface Connected via 50 Ohm antenna pad

Audio features Speech codec modes:

 Half Rate (ETS 06.20)  Full Rate (ETS 06.10)  Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)  Adaptive Multi-Rate (AMR)  Echo Cancellation  Echo Suppression  Noise Reduction

Serial interface Serial Port:

 Seven lines on serial port interface  Use for AT command, GPRS data and CSD data  Multiplexing function  Support autobauding from 4800 bps to 115200 bps

Debug Port:

 Two lines on second serial port interface DBG_TXD and

DBG_RXD

 Debug Port used for software debugging and log output

UART3:

 Use for AT command

Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC

SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99

Real time clock Implemented

Alarm function Programmable via AT command

Physical characteristics Size:

29±0.15×29±0.15×3.6±0.3mm

Weight: 6g

Firmware upgrade Firmware upgrade over Serial Port

M10_HD_V3.0 - 16 -

M10 Hardware Design

1) When the module works in this temperature range, the deviation from the GSM

specification might occur. For example, the frequency error or the phase error could increase.

Table 4: Coding schemes and maximum net data rates over air interface

Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot

CS-1: 9.05kbps 18.1kbps 36.2kbps

CS-2: 13.4kbps 26.8kbps 53.6kbps

CS-3: 15.6kbps 31.2kbps 62.4kbps

CS-4: 21.4kbps 42.8kbps 85.6kbps

2.2. Functional diagram

The following figure shows a block diagram of M10 and illustrates the major functional parts.

 Power management  Baseband  Serial Flash  The GSM radio frequency part  The Peripheral interface

—Power supply —Turn on/off interface —UART interface —Audio interface —SIM interface —Keypad interface —ADC —SD card interface —RF interface

M10_HD_V3.0 - 17 -

M10 Hardware Design

Figure 1: Module functional diagram

2.3. Evaluation board

In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB)

that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial

interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the

module. For details, please refer to the document [13].

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M10 Hardware Design

3. Application interface

The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular

application platform. Sub-interfaces included in these pads are described in detail in following

chapters:

 Power supply (refer to Chapter 3.3)  Serial interfaces (refer to Chapter 3.8)  Two analog audio interfaces (refer to Chapter 3.9)  SIM interface (refer to Chapter 3.10)  SD card interface(refer to Chapter 3.18)

Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6.

3.1. Pin of module

3.1.1. Pin assignment

The following figure shows pin name and assignment of M10.

Figure 2: Top view of module pin assignment

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M10 Hardware Design

3.1.2. Pin description

Table 5: Pin description

Power supply

PIN NAME PIN

NO.

VBAT 50,51

52

I/O DESCRIPTION DC

CHARACTERISTICS

I Module main

power supply.

VBAT=3.3V~4.6V

Vmax= 4.6V

Vmin=3.3V

Vnorm=4.0V

.

COMMENT

It must be able to

provide sufficient

current in a

transmitting burst

which typically

rises to 1.6A.

VRTC 16 I/O Power supply for

RTC when VBAT

is not supplied.

Charging for

backup battery or

golden capacitor

when the VBAT is

supplied.

VDD_EXT 7 O Supply 2.8V

voltage for

external circuit.

VImax=VBAT

VImin=2.6V

VInorm=2.75V

VOmax=2.85V

VOmin=2.6V

VOnorm=2.75V

Iout(max)= 730uA

Iin=2.6~5 uA

Vmax=2.9V

Vmin=2.7V

Vnorm=2.8V

Imax=20mA

Recommended to

connect to a

backup battery or a

golden capacitor.

1. If unused, keep

this pin open.

2. Recommended

to add a 2.2~4.7uF

bypass capacitor,

when used for

power supply.

GND 8,42,

Digital ground

44~

49

Turn on /off

PIN NAME PIN

NO.

PWRKEY 18 I Power on/off key

I/O DESCRIPTION DC

CHARACTERISTICS

VILmax=0.1*VBAT

PWRKEY should

be pulled down for

VIHmin=0.6*VBAT

VImax=VBAT

COMMENT

Pull up to VBAT

internally.

a moment to turn

on or off the

system.

Emergency shutdown

PIN NAME PIN

NO.

I/O DESCRIPTION DC

CHARACTERISTICS

COMMENT

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M10 Hardware Design

EMERG_

OFF

17 I Emergency off.

Pulling down for

at least 20ms will

turn off the module

in case of

emergency. Use it

only when normal

shutdown through

PWRKEY or AT

command cannot

perform well.

Module status indication

PIN NAME PIN

I/O DESCRIPTION DC

NO.

STATUS 54 O Used to indicate

module’s operating

status. High level

indicates module

power-on and low

level indicates

power-down.

Audio interfaces

VILmax=0.4V

VIHmin=2.2V

V

max=2.8V

open

CHARACTERISTICS

VOLmax=

0.15*VDD_EXT

VOHmax=

0.85*VDD_EXT

Open

drain/collector

driver required in

cellular device

application.

If unused, keep

this pin open.

COMMENT

If unused, keep

this pin open.

PIN NAME PIN

NO.

MIC1P

MIC1N

MIC2P

MIC2N

23

24

25

26

I/O DESCRIPTION DC

CHARACTERISTICS

I Positive and

negative

voice-band input.

For Audio DC

characteristics refer to

Chapter 3.10.

I Auxiliary positive

and negative

voice-band input.

SPK1P

SPK1N

22

21

O Positive and

negative

voice-band output.

SPK2P 20 O Auxiliary positive

voice-band output.

AGND 19

AGND is separate

ground connection

for external audio

circuits.

General purpose input/output

PIN NAME PIN

NO.

I/O DESCRIPTION DC

CHARACTERISTICS

COMMENT

If unused, keep

these pins open.

COMMENT

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M10 Hardware Design

KBC0~

KBC4

KBR0~

33~37 I Keypad interface VILmin=-0.3V

VILmax=

28~32 O Pull up to

VIHmin=

KBR4

VIHmax=

GPIO1_

KBC5

38

I/O Normal

input/output

port/Keypad

VOLmax=

VOHmin=

interface

GPIO0 64 I/O Normal

input/output port

NETLIGHT 6 O Network status

indication

LIGHT_

MOS

27

O Open drain output

port

Imax=60mA If unused, keep

Main Serial port

PIN NAME PIN

NO.

DTR 59 I Data terminal

I/O DESCRIPTION DC

CHARACTERISTICS

VILmin=-0.3V

ready

VILmax=

RXD 61 I Receive data

TXD 60 O Transmit data

RTS 58 I Request to send

VIHmin=

VIHmax=

CTS 57 O Clear to send

RI 55 O Ring indicator

DCD 56 O Data carrier

VOLmax=

VOHmin=

detection

Debug port

DBG_TXD 10 O Serial interface for

DBG_RXD 9 I

debugging only

Same as above If unused, keep

0.25*VDD_EXT

0.75*VDD_EXT

VDD_EXT+0.3

0.15*VDD_EXT

0.85*VDD_EXT

0.25*VDD_EXT

0.75*VDD_EXT

VDD_EXT+0.3

0.15*VDD_EXT

0.85*VDD_EXT

If unused, keep

these pins open.

VDD_EXT, if

unused, keep these

pins open.

If unused, keep

these pins open.

this pin open.

COMMENT

If only use TXD,

RXD and GND to

communicate,

recommend

connecting RTS to

GND via 0R

resistor and

keeping other pins

open.

these pins open.

UART3

TXD3 62 O Transmit data Same as above If unused, keep

RXD3 63 I Receive data

these pins open.

SD card interface

PIN NAME PIN

NO.

I/O DESCRIPTION DC

CHARACTERISTICS

COMMENT

SD_DATA 1 I/O SD serial data VILmin=-0.3V If unused, keep

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M10 Hardware Design

SD_CLK 2 O SD serial clock VILmax=

0.25*VDD_EXT

SD_CMD 3 O SD command

VIHmin=

0.75*VDD_EXT

VIHmax=

VDD_EXT+0.3

VOLmax=

0.15*VDD_EXT

VOHmin=

0.85*VDD_EXT

SIM interface

PIN NAME PIN

NO.

SIM_VDD 12 O Voltage supply for

I/O DESCRIPTION DC

CHARACTERISTICS

The voltage can be

SIM card

selected by software

automatically. Either

1.8V or 3V.

SIM_DATA 13 I/O SIM data When SIM_VDD=3V

VILmax=0.4V

VIHmin=

SIM_VDD-0.4

VOLmax=0.4V

VOHmin=

SIM_VDD-0.4

When SIM_VDD=1.8V

VILmax=

0.15*SIM_VDD

VIHmin=

SIM_VDD-0.4

VOLmax=

0.15*SIM_VDD

VOHmin=

SIM_VDD-0.4

SIM_CLK 14 O SIM clock When SIM_VDD=3V

VILmax=0.4V

VIHmin=

0.9*SIM_VDD

VOLmax=0.4V

VOHmin=

0.9*SIM_VDD

When SIM_VDD=1.8V

VILmax=

0.12*SIM_VDD

VIHmin=

these pins open.

If used,

SD_DATA is

connected to SD

card DATA0 pin.

COMMENT

All signals of SIM

interface should be

protected against

ESD with a TVS

diode array.

Maximum cable

length is 200mm

from the module

pad to SIM card

holder.

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M10 Hardware Design

0.9*SIM_VDD

VOLmax=

0.12*SIM_VDD

VOHmin=

0.9*SIM_VDD

SIM_RST 15 O SIM reset When SIM_VDD=3V

VILmax=0.36V

VIHmin=

0.9*SIM_VDD

VOLmax=0.4V

VOHmin=

0.9*SIM_VDD

When SIM_VDD=1.8V

VILmax=

0.12*SIM_VDD

VIHmin=

0.9*SIM_VDD

VOLmax=

0.12*SIM_VDD

VOHmin=

0.9*SIM_VDD

SIM_

PRESENCE

11 I SIM card detection VILmax=0.67V

VIHmin=1.7V

If unused, keep

this pin open.

AUX ADC

PIN NAME PIN

NO.

ADC0 41 I General purpose

ADC1 40 I

I/O DESCRIPTION DC

CHARACTERISTICS

Voltage range:

analog to digital

0V ~ 2.8V

COMMENT

If unused, keep

this pin open.

converter

RF interface

PIN NAME PIN

NO.

I/O DESCRIPTION DC

CHARACTERISTICS

COMMENT

RF_ANT 43 I/O RF antenna pad Impedance of 50Ω Refer to Chapter

4.

Other interfaces

PIN NAME PIN

NO.

RESERVED 4,5,

39,53

I/O DESCRIPTION DC

COMMENT

CHARACTERISTICS

Keep these pins

open

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M10 Hardware Design

3.2. Operating modes

The table below briefly summarizes the various operating modes referred to in the following

chapters.

Table 6: Overview of operating modes

Mode Function

Normal

operation

GSM/GPRS

SLEEP

The module will automatically go into SLEEP mode if DTR

is set to high level and there is no interrupt (such as GPIO

interrupt or data on serial port).

In this case, the current consumption of module will reduce

to the minimal level.

During SLEEP mode, the module can still receive paging

message and SMS from the system normally.

GSM IDLE Software is active. The module has registered to the GSM

network, and the module is ready to send and receive data.

GSM TALK GSM connection is ongoing. In this mode, the power

consumption is decided by the configuration of Power

Control Level (PCL), dynamic DTX control and the

working RF band.

GPRS IDLE The module is not registered to GPRS network. The module

is not reachable through GPRS channel.

POWER

DOWN

1)

Minimum

functionality

mode (without

removing power

supply)

GPRS

STANDBY

The module is registered to GPRS network, but no GPRS

PDP context is active. The SGSN knows the Routing Area

where the module is located at.

GPRS

READY

The PDP context is active, but no data transfer is going on.

The module is ready to receive or send GPRS data. The

SGSN knows the cell where the module is located at.

GPRS DATA There is GPRS data in transfer. In this mode, power

consumption is decided by the PCL, working RF band and

GPRS multi-slot configuration.

Normal shutdown by sending the “AT+QPOWD=1” command, using the

PWRKEY or using the EMERG_OFF pin. The power management ASIC

disconnects the power supply from the base band part of the module, and

only the power supply for the RTC is remained. Software is not active. The

serial interfaces are not accessible. Operating voltage (connected to VBAT)

remains applied.

“AT+CFUN” command can be set the module to a minimum functionality

mode without removing the power supply. In this case, the RF part of the

module will not work or the SIM card will not be accessible, or both RF part

and SIM card will be closed, but the serial port is still accessible. The power

consumption in this case is very low.

M10_HD_V3.0 - 25 -

M10 Hardware Design

Alarm mode RTC alert function launches this restricted operation while the module is in

POWER DOWN mode. The module will not be registered to GSM network

and only parts of AT commands can be available.

1) Use the EMERG_OFF pin only while failing to turn off the module by the command “AT+QPOWD=1” and the ON/OFF pin. Please refer to Chapter 3.4.2.4.

3.3. Power supply

The power supply range of M12 is from 3.3V to 4.6V which is supplied with a single voltage

source of VBAT. The GSM transmitting burst can cause obvious voltage drop at the supply

voltage thus the power supply must be carefully designed and is capable of providing sufficient

current up to 1.6A.

A reference design of DC 5V/2A input power source is shown in Figure 3. The designed output for

the power supply is 4.16V, thus a linear regulator can be used. If there’s a big voltage difference

between the input source and the desired output (VBAT), a switching converter power supply

would be preferable for its better efficiency especially with the 1.6A peak current in burst mode of

the module.

Figure 3: Reference circuit of the source power supply input

The RF Power Amplifier current (1.6A peak in GSM/GPRS mode) flows with a ratio of 1/8 of

time, around 577us every 4.615ms, in talking mode. The following figure is the VBAT voltage

and current ripple at the maximum power transmitting phase, the test condition is VBAT=4.16V,

VBAT maximum output current is 1.6A, C3=100µF tantalum capacitor (ESR=0.7Ω).

M10_HD_V3.0 - 26 -

M10 Hardware Design

4.615ms

577us

IBAT

Burst:1.6A

Max:400mV

VBAT

Figure 4: Ripple in supply voltage during transmitting burst

3.3.1. Power supply pins

The VBAT pins are dedicated to connect the module supply voltage. VRTC pin can be used to

connect a rechargeable coin battery or a golden capacitor which can help to maintain the system

clock when VBAT supply is not applied.

3.3.2. Minimizing supply voltage drop

Please pay special attention to the power supply design for your applications. Make sure that the

input voltage will never drop below 3.3V even in a transmitting burst during which the current

consumption may rise up to 1.6A. If the power voltage drops below 3.3V, the module could turn

off automatically. The PCB traces from the VBAT pads to the power source must be wide enough

to ensure that there is not too much voltage drop occur in the transmitting burst mode. The width

of trace should be no less than 2mm and the principle of the VBAT trace is the longer route, the

wider trace. The VBAT voltage can be measured by oscilloscope.

For the VBAT input, a bypass capacitor of about 100 µF with low ESR is recommended.

Multi-layer ceramic chip (MLCC) capacitor can provide the best combination of low ESR and

small size but may not be economical. A lower cost choice could be a 100 µF tantalum capacitor

with low ESR. Other small ceramic capacitors should be in parallel with the 100µF capacitor,

which is illustrated in Figure 5. The capacitors should be placed close to the M12 VBAT pins.

M10_HD_V3.0 - 27 -

M10 Hardware Design

C1>=100uF; C2=0.1uF~1uF; C3=10pF; C4=33pF

Figure 5: Reference circuit of the VBAT input

3.3.3. Monitor power supply

To monitor the supply voltage, you can use the “AT+CBC” command which includes three

parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the

0-100 percent of battery capacity and actual value measured between VBAT and GND. The

voltage is continuously measured at an interval depending on the operating mode. The displayed

voltage (in mV) is averaged over the last measuring period before the “AT+CBC” command is

executed.

For details, please refer to document [1].

3.4. Power up and down scenarios

3.4.1. Power on

The module can be turned on through the two ways, which are described in following chapters:

 Via PWRKEY pin: start normal operating mode (please refer to chapter 3.4.1.1);  Via RTC interrupt: start ALARM mode (please refer to chapter 3.4.1.2).

Note: The module is set to autobauding mode (AT+IPR=0) in default configuration. In the autobauding mode, the URC “RDY” is not sent to host controller after powering on. AT command can be sent to the module 2-3 seconds after the module is powered on. Host controll er should firstly send an “AT” or “at” string in order that the module can detect baud rate of host controller, and it should send the second or the third “AT” or “at” string until receiving “OK” string from module. Then an “AT+IPR=x;&W” should be sent to set a fixed baud rate for

M10_HD_V3.0 - 28 -

M10 Hardware Design

module and save the configuration to flash memory of module. After these configurations, the URC “RDY” would be received from the Serial Port of module every time when the module is powered on. Refer to Chapter “AT+IPR” in document [1].

3.4.1.1. Power on module using the PWRKEY pin

Customer’s application can turn on the module by driving the pin PWRKEY to a low level voltage

and after STATUS pin outputs a high level, PWRKEY pin can be released. Customer may

monitor the level of the STATUS pin to judge whether the module is power-on or not. An open

collector driver circuit is suggested to control the PWRKEY. A simple reference circuit is

illustrated in Figure 6.

Figure 6: Turn on the module using driving circuit

The other way to control the PWRKEY is using a button directly. A TVS component is

indispensable to be placed nearby the button for ESD protection. When pressing the key,

electrostatic strike may generate from finger. A reference circuit is showed in Figure 7.

Figure 7: Turn on the module using keystroke

M10_HD_V3.0 - 29 -

M10 Hardware Design

The power on scenarios is illustrated as following figure.

VBAT

2

EMERG_OFF

(INPUT)

PWRKEY

(INPUT)

VDD_EXT (OUTPUT)

STATUS

(OUTPUT)

MODULE

STATUS

1

54ms

>1s

V

> 0.6*VBAT

IH

<0.1*VBAT

V

IL

800ms

OFF

BOOTING

RUNNING

Figure 8: Timing of turning on system

① Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time

between them is recommended 30ms.

② Keep the EMERG_OFF pin open if not used.

Note: Customer can monitor the voltage level of the STATUS pin to judge whether the module is power-on. After the STATUS pin goes to high level, PWRKEY may be released. If the STATUS pin is ignored, pull the PWRKEY pin to low level for more than 2 seconds to turn on the module.

3.4.1.2. Power on module using the RTC (Alarm mode)

Alarm mode is a power-on approach by using the RTC. The alert function of RTC can wake-up

the module while it is in power-off state. In alarm mode, the module will not register to GSM

network and the GSM protocol stack software is closed. Thus the part of AT commands related

with SIM card and the protocol stack will not be accessible, and the others can be used.

Use the “AT+QALARM” command to set the alarm time. The RTC remains the alarm time if the

module is powered off by “AT+QPOWD=1” or by PWRKEY pin. Once the alarm time is expired,

M10_HD_V3.0 - 30 -

M10 Hardware Design

the module will go into the alarm mode. In this case, the module will send out an Unsolicited

Result Code (URC) when the baud rate of the Serial Port is set to a fixed one.

RDY

ALARM MODE

+CFUN:0

Note: This result code does not appear when autobauding is active because a valid baud rate is not available immediately after powering up the module. Therefore, the module is recommended to set to a fixed baud rate.

During alarm mode, use “AT+CFUN” command to query the status of software protocol stack; it

will return “0” which indicates that the protocol stack is closed. After 90 seconds, the module will

power down automatically. However, if the GSM protocol stack is started by “AT+CFUN=1”

command during the alarm mode, the process of automatic power-off will not be executed. In

alarm mode, driving the PWRKEY to a low level voltage for a period will cause the module to

power down.

The frequently-used AT commands during alarm mode are briefly summarized In Table 7. For

details of these instructions, please refer to document [1].

Table 7: AT commands used in alarm mode

AT command Function

AT+QALARM Set alarm time

AT+CCLK Set data and time of RTC

AT+QPOWD Power down the module

AT+CFUN Start or close the protocol stack

3.4.2. Power down

The following procedures can be used to turn off the module:

 Normal power down procedure: Turn off module using the PWRKEY pin 

Normal power down procedure: Turn off module using command “AT+QPOWD”



Over-voltage or under-voltage automatic shutdown: Take effect when over-voltage or

under-voltage is detected



Emergent power down procedure: Turn off module using the EMERG_OFF pin

M10_HD_V3.0 - 31 -

M10 Hardware Design

3.4.2.1. Power down module using the PWRKEY pin

Customer’s application can turn off the module by driving the PWRKEY to a low level voltage for

certain time. The power-down scenario is illustrated as in Figure 9.

The power-down procedure causes the module to log off from the network and allows the

software to save important data before completely disconnecting the power supply, thus it is a safe

way.

Before the completion of the power-down procedure, the module sends out the result code as

shown below:

NORMAL POWER DOWN

Note: This result code does not appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set a fixed baud rate.

After this moment, no other AT commands can be executed. And then the module enters the

POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be

indicated by the STATUS pin, which is a low level voltage in this mode.

VBAT

PWRKEY

(INPUT)

STATUS

(OUTPUT)

EMERG_OFF

(INPUT)

0.6s<Pulldown<1s >160us

Logout net about 2s to 12s

Figure 9: Timing of turning off the module

3.4.2.2. Power down module using AT command

Customer’s application can use an AT command “AT+QPOWD=1” to turn off the module. This

command will let the module to log off from the network and allow the software to save important

M10_HD_V3.0 - 32 -

M10 Hardware Design

data before completely disconnecting the power supply, thus it is a safe way.

Before the completion of the power-down procedure, the module sends out the result code as

shown below:

NORMAL POWER DOWN

After this moment, no other AT commands can be executed. And then the module enters the

POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be

indicated by STATUS pin, which is a low level voltage in this mode.

For details about the AT command of “AT+QPOWD”, please refer to document [1].

3.4.2.3. Over-voltage or under-voltage automatic shutdown

The module will constantly monitor the voltage applied on the VBAT, if the voltage is ≤ 3.5V, the

following URC will be presented:

UNDER_VOLTAGE WARNING

If the voltage is ≥ 4.5V, the following URC will be presented:

OVER_VOLTAGE WARNING

The normal input voltage range is 3.3V to 4.6V. If the voltage is > 4.6V or <3.3V, the module

would automatically shutdown itself.

If the voltage is <3.3V, the following URC will be presented:

UNDER_VOLTAGE POWER DOWN

If the voltage is >4.6V, the following URC will be presented:

OVER_VOLTAGE POWER DOWN

Note: These result codes don’t appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set to a fixed baud rate.

After this moment, no other AT command can be executed, the module logs off from network and

enters POWER DOWN mode, and only RTC is still active. The POWER DOWN mode can also

be indicated by the pin STATUS, which is a low level voltage in this mode.

M10_HD_V3.0 - 33 -

M10 Hardware Design

3.4.2.4. Emergency shutdown

The module can be shut down by driving the pin EMERG_OFF to a low level voltage for over 20ms

and then releasing it. The EMERG_OFF line can be driven by an Open Drain/Collector driver or a

button. The circuit is illustrated as the following figures.

Figure 10: Reference circuit for EMERG_OFF by using driving circuit

Figure 11: Reference circuit for EMERG_OFF by using button

Be cautious to use the pin EMERG_OFF. It should only be used under emergent situation. For

instance, if the module is unresponsive or abnormal, the pin EMERG_OFF could be used to

shutdown the system. Although turning off the module by EMERG_OFF is fully tested and nothing

wrong is detected, this operation is still a big risk as it could cause destroying of the code or data

area of the NOR flash memory in the module. Therefore, it is recommended that PWRKEY or AT

command should always be the preferential way to turn off the system.

M10_HD_V3.0 - 34 -

M10 Hardware Design

3.4.3. Restart module using the PWRKEY pin

Customer’s application can restart the module by driving the PWRKEY to a low level voltage for

certain time, which is similar to the way to turn on the module. Before restarting the module, at least

500ms should be delayed after detecting the low level of STATUS. The restart scenario is illustrated

as the following figure.

Figure 12: Timing of restarting system

The module can also be restarted by the PWRKEY after emergency shutdown.

Pulldown>20ms

EMERG_OFF

（INPUT）

PWRKEY

（INPUT）

Delay>2s

Figure 13: Timing of restarting system after emergency shutdown

M10_HD_V3.0 - 35 -

M10 Hardware Design

3.5. Power saving

Upon system requirement, there are several actions to drive the module to enter low current

consumption status. For example, “AT+CFUN” can be used to set the module into minimum

functionality mode and DTR hardware interface signal can be used to lead system to SLEEP

mode.

3.5.1. Minimum functionality mode

Minimum functionality mode reduces the functionality of the module to minimum level, thus

minimizes the current consumption when the slow clocking mode is activated at the same time.

This mode is set with the “AT+CFUN” command which provides the choice of the functionality

levels <fun>=0,1,4.

 0: minimum functionality  1: full functionality (default)  4: disable both transmitting and receiving of RF part

If the module is set to minimum functionality by “AT+CFUN=0”, the RF function and SIM card

function would be closed. In this case, the serial port is still accessible, but all AT commands

correlative with RF function or SIM card function will not be accessible.

If the module has been set by “AT+CFUN=4”, the RF function will be closed but the serial port is

still active. In this case, all AT commands correlative with RF function will not be accessible.

After the module is set by “AT+CFUN=0” or “AT+CFUN=4”, it can return to full functionality by

“AT+CFUN=1”.

For detailed information about “AT+CFUN”, please refer to document [1].

3.5.2. SLEEP mode (slow clock mode)

The SLEEP mode is disabled in default software configuration. Customer’s application can enable

this mode by “AT+QSCLK=1”. On the other hand, the default setting is “AT+QSCLK=0” and in

this mode, the module cannot enter SLEEP mode.

When “AT+QSCLK=1” is set to the module, customer’s application can control the module to

enter or exit from the SLEEP mode through pin DTR. When DTR is set to high level, and there is

no on-air or hardware interrupt such as GPIO interrupt or data on serial port, the module will enter

SLEEP mode automatically. In this mode, the module can still receive voice, SMS or GPRS

paging from network but the serial port is not accessible.

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M10 Hardware Design

3.5.3. Wake up module from SLEEP mode

When the module is in the SLEEP mode, the following methods can wake up the module.

If the DTR Pin is pulled down to a low level, it would wake up the module from the SLEEP mode.

The serial port will be active about 20ms after DTR is changed to low level.

Receive a voice or data call from network to wake up module.

Receive an SMS from network to wake up module.

RTC alarm expired to wake up module.

Note: DTR pin should be held low level during communicating between the module and DTE.

3.6. Summary of state transitions (except SLEEP mode)

Table 8: Summary of state transition

Current mode Next mode POWER DOWN Normal mode Alarm mode

POWER DOWN Use PWRKEY Turn on the module by RTC

alarm

Normal mode Use “AT+QPOWD”

command, PWRKEY

pin, or EMERG_OFF

Set alarm by “AT+QALARM”,

and then turn off the module.

When the timer expires, the

module turns on automatically

and enters Alarm mode.

Alarm mode Use PWRKEY pin or

wait module turning

off automatically

Use

“AT+CFUN”

command

3.7. RTC backup

The RTC (Real Time Clock) can be supplied by an external capacitor or battery (rechargeable or

non-chargeable) through the pin VRTC. A 1.5K resistor has been integrated in the module for

current limiting. A coin-cell battery or a super-cap can be used to backup power supply for RTC.

The following figures show various sample circuits for RTC backup.

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M10 Hardware Design

Figure 14: RTC supply from non-chargeable battery

Figure 15: RTC supply from rechargeable battery

MODULE

VRTC

Large Capacitance

Capacitor

Figure 16: RTC supply from capacitor

Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used.

1.5K RTC

Core

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M10 Hardware Design

Figure 17: Seiko XH414H-IV01E Charge Characteristic

3.8. Serial interfaces

The module provides two unbalanced asynchronous serial ports including Serial Port, Debug Port.

The module is designed as a DCE (Data Communication Equipment), following the traditional

DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from

4800bps to 115200bps.

The UART Port:

 TXD: Send data to RXD of DTE  RXD: Receive data from TXD of DTE  RTS: Requests to send  CTS: Clear to send  DTR: DTE is ready and inform DCE (this pin can wake the module up)  RI: Ring indicator (when the call, SMS, data of the module are coming, the module will

output signal to inform DTE)

 DCD: Data carrier detection (the validity of this pin demonstrates the communication link is

set up)

Note: The module disables hardware flow control by default. When hardware flow control is required, RTS and CTS should be connected to the host. AT command “AT+IFC=2,2” is used to enable hardware flow control. AT command “AT+IFC=0,0” is used to disable the hardware flow control. For more details, please refer to document [1].

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M10 Hardware Design

The Debug Port:

 DBG_TXD: Send data to the COM port of a debugging computer  DBG_RXD: Receive data from the COM port of a debugging computer

UART3:

 TXD_AUX: Send data to the RXD of DTE  RXD_AUX: Receive data from the TXD of DTE

The logic levels are described in the following table.

Table 9: Logic levels of the serial interface

Parameter Min Max Unit

VIL 0 0.25*VDD_EXT V

VIH 0.75*VDD_EXT VDD_EXT +0.3 V

VOL 0 0.15*VDD_EXT V

VOH 0.85*VDD_EXT VDD_EXT V

Table 10: Pin definition of the serial interfaces

Interface Name Pin Function

DBG_RXD 9 Receive data of the debug port

Debug Port

DBG_TXD 10 Transmit data of the debug port

RI 55 Ring indicator

RTS 58 Request to send

CTS 57 Clear to send

Serial Port

RXD 61 Receive data of the serial port

TXD 60 Transmit data of the serial port

DTR 59 Data terminal ready

DCD 56 Data carrier detection

TXD3 62 Transmit data of UART3

UART3

RXD3 63 Receive data of UART3

3.8.1. UART Port

3.8.1.1. The features of UART Port.

Seven lines on UART interface:

 Contain data lines TXD and RXD, hardware flow control lines RTS and CTS, other control

lines DTR, DCD and RI.

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M10 Hardware Design

 The module disables hardware flow control in default, AT command “AT+IFC=2,2” is used

to enable hardware flow control.



Used for AT command, GPRS data, CSD FAX, etc. Multiplexing function is supported on the

UART Port. So far only the basic mode of multiplexing is available.



Support the communication baud rates as the following:



300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200.



The default setting is autobauding mode. Support the following baud rates for Autobauding

function: 4800, 9600, 19200, 38400, 57600, 115200.

After setting a fixed baud rate or Autobauding, please send “AT” or “at” string at that rate. The

UART port is ready when it responds with “OK”.

Autobauding allows the module to detect the baud rate by receiving the string “AT” or “at” from

the host or PC automatically, which gives module flexibility without considering which baud rate

is used by the host controller. Autobauding is enabled by default. To take advantage of the

autobauding mode, special attention should be paid according to the following requirements:

Synchronization between DTE and DCE:

When DCE (the module) powers on with the autobauding enabled, it is recommended to wait 2 to

3 seconds before sending the first “AT” string. After receiving the “OK” response, DTE and DCE

are correctly synchronized.

If the host controller needs URC in the mode of autobauding, it must be synchronized first.

Otherwise the URC will be discarded.

Restrictions on autobauding operation

 The UART port has to be operated at 8 data bits, no parity and 1 stop bit (factory setting).  The A/ and a/ commands can’t be used.  Only the strings “AT” or “at” can be detected (neither “At” nor “aT”).  The Unsolicited Result Codes like “RDY”, “+CFUN: 1” and “+CPIN: READY” will not be

indicated when the module is turned on with autobauding enabled and not be synchronized.

 Any other Unsolicited Result Codes will be sent at the previous baud rate before the module

detects the new baud rate by receiving the first “AT” or “at” string. The DTE may receive

unknown characters after switching to new baud rate.

 It is not recommended to switch to autobauding from a fixed baud rate.  If autobauding is active it is not recommended to switch to multiplex mode

Note: To assure reliable communication and avoid any problems caused by undetermined baud rate between DCE and DTE, it is strongly recommended to configure a fixed baud rate and save it instead of using autobauding after start-up. For more details, please refer to Section “AT+IPR” in document [1].

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M10 Hardware Design

3.8.1.2. The connection of UART

The connection between module and host via UART port is very flexible. Three connection styles

are illustrated as below.

UART Port connection is shown as below when it is applied in modulation-demodulation.

Figure 18: Connection of all functional UART port

Three lines connection is shown as below.

Figure 19: Connection of three lines UART port

UART Port with hardware flow control is shown as below. This connection will enhance the

M10_HD_V3.0 - 42 -

M10 Hardware Design

reliability of the mass data communication.

Figure 20: Connection of UART port with hardware flow control

3.8.1.3. Software upgrade

The TXD and RXD can be used to upgrade software. The PWRKEY pin must be pulled down

before the software upgrade. Please refer to the following figure for software upgrade.

Module (DCE)

IO Connector

UART port

TXD

RXD

GND

PWRKEY

TXD

RXD

GND

PWRKEY

Figure 21: Connection of software upgrade

3.8.2. Debug Port

Debug Port:

 Two lines: DBG_TXD and DBG_RXD  It outputs log information automatically.  Debug Port is only used for software debugging and its baud rate must be configured as

M10_HD_V3.0 - 43 -

M10 Hardware Design

460800bps.

Figure 22: Connection of software debug

3.8.3. UART Port 3

UART3:

 Two data lines: TXD3and RXD3  UART3 port is used for AT command only and does not support GPRS data, CSD FAX,

Multiplexing function etc.

 Support the communication baud rates as the following:

4800, 9600, 14400, 19200,28800,38400,57600,115200.

 The default baud rate setting is 115200bps, and does not support autobauding. The baud rate

can be modified by AT+QSEDCB command. For more details, please refer to document [1].

Figure 23: Connection of Auxiliary UART port

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M10 Hardware Design

3.8.4. UART Application

The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM

system is 3V, the divider resistor should be changed from 5.6K to 10K.

Figure 24: 3.3V level match circuit

The reference design of 5V level match is shown as below.

The construction of dotted line can

refer to the construction of solid line. Please pay attention to direction of connection. Input dotted

line of module should refer to input solid line of the module. Output dotted line of module should

refer to output solid line of the module.

MCU/ARM

/TXD

/RXD

/RTS /CTS GPIO

EINT

GPIO

VCC_MCU

4.7k

VCC_MCU

4.7k

VDD_EXT

4.7k 1K

VDD_EXT

MODULE

VBAT GND

RXD

TXD

RTS CTS DTR RI

STATUS

Voltage level: 5V

Figure 25: 5V level match circuit

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M10 Hardware Design

The following picture is an example of connection between module and PC. A RS_232 level

shifter IC or circuit must be inserted between module and PC, since these three UART ports do

not support the RS_232 level, while support the CMOS level only.

SP3238

MODULE

DCD TXD CTS

RI

RXD DTR RTS

GND

3V

28 25 1 3 24

23 22 19

17 16

21 20 18

13

C1+ C1C2+ C2T1IN

T2IN T3IN T4IN

T5IN /R1OUT

R1OUT R2OUT R3OUT

ONLINE

/STATUS

/SHUTDOWN

V+ GND VCC

V-

T4OUT T2OUT T3OUT T1OUT T5OUT

R1IN R2IN R3IN

27 2 26

4

10 6 7 5 12

8 9

11

15 14

Figure 26: RS232 level match circuit

GND

3V

GND

TO PC serial port

6 7 8 9

1

2 3 4 5

GND

3.9. Audio interfaces

The module provides two analogy input channels and two analogy output channels.

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M10 Hardware Design

Table 11: Pin definition of Audio interface

Interface Name Pin Function

MIC1P 23 Microphone1 input +

MIC1N 24 Microphone1 input -

(AIN1/AOUT1)

SPK1P 22 Audio1 output+

SPK1N 21 Audio1 output-

MIC2P 25 Microphone2 input +

MIC2N 26 Microphone2 input -

(AIN2/AOUT2)

SPK2P 20 Audio2 output+

AGND 19 Suggested to be used in audio circuit. Do not

connect to digital GND in host PCB as it could

produce TDD noise.

 AIN1 and AIN2, which may be used for both microphone and line inputs. An electret

microphone is usually used. AIN1 and AIN2 are both differential input channels.

 AOUT1 and AOUT2, which may be used for both receiver and speaker outputs. AOUT1

channel is typically used for a receiver built into a handset, while AOUT2 channel is typically

used with headset or hands-free speaker. AOUT1 channel is a differential channel and

AOUT2 is a single-ended channel. SPK2P and AGND can establish a pseudo differential

mode. If customer needs to play Melody or Midi ringtone for incoming call, AOUT2 Channel

should always be used.

 These two audio channels can be swapped by “AT+QAUDCH” command. For more details,

please refer to

document [1].

Use AT command “AT+QAUDCH” to select audio channel:

0--AIN1/AOUT1 (normal audio channel), the default value is 0. 1--AIN2/AOUT2 (aux audio channel).

For each channel, customer can use AT+QMIC to adjust the input gain level of microphone.

Customer can also use “AT+CLVL” to adjust the output gain level of receiver and speaker.

“AT+QECHO” is to set the parameters for echo cancellation control. “AT+QSIDET” is to set the

side-tone gain level. For more details, please refer to

document [1].

3.9.1. Decrease TDD noise and other noise

The 33pF capacitor is applied for filtering out 850MHz/900MHz RF interference when the

module is transmitting at GSM900MHz. Without placing this capacitor, TDD noise could be

heard. Moreover, the 10pF capacitor here is for filtering out 1800MHz/1900MHz RF interference.

However, the resonant frequency point of a capacitor largely depends on the material and

production technique. Therefore, customer would have to discuss with its capacitor vendor to

choose the most suitable capacitor for filtering out GSM850MHz, GSM900MHz, DCS1800MHz

and PCS1900MHz separately.

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M10 Hardware Design

The severity degree of the RF interference in the voice channel during GSM transmitting period

largely depends on the application design. In some cases, GSM850/GSM900 TDD noise is more

severe; while in other cases, DCS1800/PCS1900 TDD noise is more obvious. Therefore, customer

can have a choice based on test results. Sometimes, even no RF filtering capacitor is required.

The capacitor which is used for filtering out RF noise should be close to RJ11 or other audio

interfaces. Audio alignment should be as short as possible.

In order to decrease radio or other signal interference, the position of RF antenna should be kept

away from audio interface and audio alignment. Power alignment and audio alignment should not

be parallel, and power alignment should be far away from audio alignment.

The differential audio traces have to be placed according to the differential signal layout rules.

3.9.2. Microphone interfaces configuration

AIN1/IN2 channels come with internal bias supply for external electret microphone. A reference

circuit is shown in Figure27.

Close to Microphone

Module

MICxP

Differential layout

10pF

GND

33pF

GND

ESD

Electret

Microphone

MICxN

ESD

GND

AGND

10pF

GND

33pF

GND

Figure 27: Microphone interface configuration of AIN1&AIN2

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M10 Hardware Design

3.9.3. Receiver and speaker interface configuration

Close to speaker

GND

Differential layout

10pF

33pF

ESD

Module

SPK1P

SPK1N

SPK1P

10pF

SPK1N

10pF

Figure 28: Speaker interface configuration of AOUT1

Differential layout

Amplifier

circuit

10pF

33pF

GND

Close to speaker

GND

33pF

ESD

10pF

33pF

GND

ESD

Figure 29: Speaker interface with amplifier configuration of AOUT1

Texas Instruments TPA6205A1is recommended for a suitable differential audio amplifier. There

are plenty of excellent audio amplifiers in the market.

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M10 Hardware Design

Close to speaker

GND

Module

SPK2P

AGND

SPK2P

Differential layout

10pF

22uF

Figure 30: Speaker interface configuration of AOUT2

Close to speaker

Differential layout

C1

Amplifier

circuit

10pF

33pF

GND

33pF

ESD

AGND

C2

10pF

33pF

GND

Figure 31: Speaker interface with amplifier configuration of AOUT2

Note: The value of C1 and C2 depends on the input impedance of audio amplifier

ESD

.

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M10 Hardware Design

3.9.4. Earphone interface configuration

Close to Socke t

Differential layout

4.7uF

GND GND

GND

68R

33pF

AGND

3

4 2 1

Amphenol

9001-8905-050

Module

MIC2N

MIC2P

SPK2P

AGND

22uF

33pF

33pF 10pF

GND

Figure 32: Earphone interface configuration

Table 12: Typical electret microphone characteristic

Parameter Min Type Max Unit

Working Voltage 1.2 1.5 2.0 V

Working Current 200 500 uA

External Microphone Load Resistance 2.2 k Ohm

Table 13: Typical speaker characteristic

Parameter Min Typ Max Unit

Normal

Output(SPK1)

Single

Ended

Load resistance 28 32 Ohm

Ref level 0 2.4 Vpp

Differential Load resistance 28 32 Ohm

Ref level 0 4.8 Vpp

Auxiliary

Output(SPK2)

Maxim driving

current limit of

Single

Ended

Load resistance 16 32 Ohm

Ref level 0 2.4 Vpp

50 mA

SPK1 and SPK2

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M10 Hardware Design

3.10. SIM card interface

3.10.1. SIM card application

The SIM interface supports the functionality of the GSM Phase 1 specification and also supports

the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is

intended for use with a SIM application Tool-kit.

The SIM interface is powered from an internal regulator in the module. Both 1.8V and 3.0V SIM

Cards are supported.

Table 14: Pin definition of the SIM interface

Name Pin Function

SIM_VDD 12 Supply power for SIM Card. Automatic detection of

SIM card voltage. 3.0V±10% and 1.8V±10%.

Maximum supply current is around 10mA.

SIM_DATA 13 SIM Card data I/O

SIM_CLK 14 SIM Card Clock

SIM_RST 15 SIM Card Reset

SIM_PRESENCE 11 SIM Card Presence

Figure 33 is the reference circuit for SIM interface, and here an 8-pin SIM card holder is used.

The pin SIM_PRESENCE is used to detect whether the tray of the Molex SIM socket, which is

used for holding SIM card, is present in the card socket. When the tray is inserted in the socket,

SIM_PRESENCE is at low level. Regardless of the SIM card is in the tray or not, the change of

SIM_PRESENCE level from high to low level prompts the module to reinitialize SIM card. In

default configuration, SIM card detection function is disabled. Customer’s application can use

“AT+QSIMDET=1,0 ” to be switched on and “AT+QSIMDET=0,0 ” to switch off the SIM card

detection function. For detail of this AT command, please refer to

document [1]. When

“AT+QSIMDET=1,0” is set and the tray with SIM card is removed from SIM socket, the

following URC will be presented.

+CPIN: NOT READY

When the tray with SIM card is inserted into SIM socket again and the module finishes

re-initializing SIM card, the following URC will be presented.

Call Ready

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M10 Hardware Design

VDD_EXT

Module

SIM_VDD

SIM_RST

SIM_CLK

SIM_PRESENCE

SIM_DATA

10K

22R

ESDA6V8V6

100nF SIM_CARD

VCC

RST

CLK IO

GND

VPP

GNDPRESENCE

GND

Figure 33: Reference circuit of the 8 pins SIM card

Note: Please do not use “AT+QSIMDET=1,1” which causes to initialize SIM card when Figure 33 circuit is adopted.

If customer does not need the SIM card detection function, keep SIM_PRESENCE open. The

reference circuit using a 6-pin SIM card socket is illustrated as the following figure.

Figure 34: Reference circuit of the 6 pins SIM card

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M10 Hardware Design

In SIM interface designing, in order to ensure good communication performance with SIM card,

the following design principles should be complied with.

 Place the SIM card holder close to module as close as possible. Ensure the trace length of

SIM signals do not exceed 20mm.

 Keep the SIM signals far away from VBAT power and RF trace.  The width of SIM_VDD trace is not less than 0.5mm. Place a bypass capacitor close to SIM

card power pin. The value of capacitor is less than 1uF.

 To avoid possible cross-talk from the SIM_CLK signal to the SIM_DATA signal be careful

that both lines are not placed closely next to each other. A useful approach is to use GND to

shield the SIM_DATA line from the SIM_CLK line.

 In order to ensure good ESD protection, it is recommended to add TVS such as WILL

(http://www.willsemi.com) ESDA6V8AV6. The capacitance of ESD component is less than

50pF. The 22Ω resistors should be added in series between the module and the SIM card so

as to suppress the EMI spurious transmission and enhance the ESD protection. Note that the

SIM peripheral circuit should be close to the SIM card socket.

3.10.2. Design considerations for SIM card holder

For 6-pin SIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit

http://www.amphenol.com for more information.

Figure 35: Amphenol C707 10M006 512 2 SIM card holder

M10_HD_V3.0 - 54 -

M10 Hardware Design

Table 15: Pin description of Amphenol SIM card holder

Name Pin Function

SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock GND C5 Ground VPP C6 Not Connect SIM_DATA C7 SIM Card data I/O

For 8-pin SIM card holder, it is recommended to use Molex 91228. Please visit

http://www.molex.com for more information.

Figure 36: Molex 91228 SIM card holder

Table 16: Pin description of Molex SIM card holder

Name Pin Function

SIM_VDD C1 SIM Card Power supply

SIM_RST C2 SIM Card Reset

SIM_CLK C3 SIM Card Clock

SIM_PRESENCE C4 SIM Card Presence Detection

GND C5 Ground

M10_HD_V3.0 - 55 -

M10 Hardware Design

VPP C6 Not Connect

SIM_DATA C7 SIM Card Data I/O

SIM_DETECT C8 Pulled down GND with external circuit. When the tray is

present, C4 is connected to C8.

3.11. Keypad interface

The keypad interface consists of 5 keypad column inputs and 5 keypad row outputs. The basic

configuration is 5 keypad columns and 5 keypad rows, giving 25 keys.

Table 17: Pin definition of the keypad interface

Name Pin Function

KBC0 33

KBC1 34

KBC2 35

KBC3 36

KBC4 37

KBR0 28

KBR1 29

KBR2 30

KBR3 31

KBR4 32

Keypad matrix column

Keypad matrix row

The keypad interface allows a direct external matrix connection. A typical recommended circuit

about the keypad is shown in the following figure.

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M10 Hardware Design

Module

KBC0

KBC1 KBC2 KBC3 KBC4

GPIO1_KBC5

KBR0

KBR1

KBR2

KBR3

KBR4

Figure 37: Reference circuit of the keypad interface

If a 5*5 matrix does not provide enough keys, GPIO1 could be multiplexed as KBC5 to configure

a 5*6 keypad matrix. Then, the keypad interface consists of 5 keypad row outputs and 6 keypad

column inputs. The basic configuration is 5 keypad rows and 6 keypad columns, giving 30 keys.

Note: This function is not supported in the default firmware.

3.12. ADC

The module provides two auxiliary ADC interfaces to measure the values of two analog inputs.

AT command “AT+QADC?” is used to read the voltage value present on ADC0 pin. AT

command “AT+QEADC?” is used to read the voltage value present on ADC1 pin. For details of

this AT command, please refer to

Table 18: Pin definition of the ADC

document [1].

Name Pin Function

ADC0 41 Analog to digital converter.

ADC1 40 Analog to digital converter

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M10 Hardware Design

Table 19: Characteristic of the ADC

Item Min Typ Max Units

Voltage range 0 2.8 V

ADC Resolution 10 bits

ADC accuracy 2.7 mV

3.13. Behaviors of the RI

Table 20: Behaviors of the RI

State RI response

Standby HIGH

Voice calling Changed to LOW, then:

1. Changed to HIGH when call is established.

2. Use ATH to hang up the call, RI changes to HIGH.

3. Calling part hangs up, RI changes to HIGH first, and changes to LOW

for 120ms indicating “NO CARRIER” as an URC, then changes to

HIGH again.

4. Change to HIGH when SMS is received.

Data calling Changed to LOW, then：

1. Changed to HIGH when data connection is established.

2. Use ATH to hang up the data calling, RI changes to HIGH.

3. Calling part hangs up, RI changes to HIGH first, and changes to LOW

for 120ms indicating “NO CARRIER” as an URC, then changes to

HIGH again.

4. Changed to HIGH when SMS is received.

SMS When a new SMS comes, the RI changes to LOW and holds low level for

about 120 ms, then changes to HIGH.

URC Certain URCs can trigger 120ms low level on RI. For more details, please

refer to the

document [10]

If the module is used as a caller, the RI would maintain high except the URC or SMS is received.

On the other hand, when it is used as a receiver, the timing of the RI is shown below.

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M10 Hardware Design

Figure 38: RI behaviour of voice calling as a receiver

Figure 39: RI behaviour of data calling as a receiver

Figure 40: RI behaviour as a caller

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M10 Hardware Design

Figure 41: RI behaviour of URC or SMS received

3.14. Network status indication

The NETLIGHT signal can be used to drive a network status indicator LED. The working state of

this pin is listed in Table 21.

Table 21: Working state of the NETLIGHT

State Module function

Off The module is not running.

64ms On/ 800ms Off The module is not synchronized with network.

64ms On/ 2000ms Off The module is synchronized with network.

64ms On/ 600ms Off GPRS data transfer is ongoing.

A reference circuit is shown in following figure.

Figure 42: Reference circuit of the NETLIGHT

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M10 Hardware Design

3.15. Operating status indication

The STATUS pin is set as an output pin and can be used to judge whether module is power-on,

please refer to

used to drive an LED in order to judge the module’s operation status. A reference circuit is shown

in figure 43.

Table 22: Pin definition of the STATUS

Name Pin Function

STATUS 54 Indicate module’s operating status

Chapter 3.4. In customer design, this pin can be connected to a GPIO of DTE or be

Figure 43: Reference circuit of the STATUS

3.16. General purpose input & output (GPIO)

The module provides a limited number of General Purpose Input/Output signal pins. The driving

capability of these pins is 4mA. Every GPIO can be configured as input or output, and set to high

or low when working as an output pin by “AT+CEQGPIO” command. Before using these GPIO

pins, customer should configure them with “AT+CEQGPIO=1,x,x,x,x” first. For details, please

refer to

document [1].

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M10 Hardware Design

Table 23: Pin definition of the GPIO interface

Name Pin PU/PD Function

GPIO0 64 Pulled up internally

to 75K resistor

GPIO1_KBC5 38 Pulled up internally

to 75K resistor

General Purpose Input/Output Port

Keypad interface KBC5

3.17. Open drain output (LIGHT_MOS)

The module provides an open drain output pin to control keyboard backlight. The output

LIGHT_MOS can sink 60mA. This open-drain output switch is high impedance when disabled.

Table 24: Pin definition of the LIGHT_MOS

Name Pin Function

LIGHT_MOS 27 Open drain output port

Note: This function is not supported in the default firmware. There must be special firmware if customer needs this function. Please contact Quectel for more details.

VBAT

Module

300R

LIGHT_MOS

Figure 44: Reference circuit of the LIGHT_MOS

M10_HD_V3.0 - 62 -

M10 Hardware Design

3.18. SD card interface

The module provides SD card interface that supports many types of memory, such as Memory

Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD

card interface.

 Only supports 1bit serial mode  Dose not support the SPI mode SD/MMC memory card  Dose not support multiple SD memory cards  Dose not support hot plug  The data rate up to 26MHz in serial mode  Up to 32GB maximum memory card capacity

With the SD card interface features and reference circuit shown in figure 45, the users can easily

design the SD card application circuit to enhance the memory capacity of the module. The users

can store some high-capacity files to external memory card. Such as in the automotive application

system, the module can record and store the audio file to the SD card, and also can play the audio

files in SD card.

Table 25: Pin definition of the SD card interface

Name Pin Function

SD_DATA 1 Data output and input signal of SD card

SD_CLK 2 Clock signal of SD card output

SD_CMD 3 Command signal of SD card output

Figure 45

M10_HD_V3.0 - 63 -

: Reference circuit of SD card

M10 Hardware Design

Table 26: Pin name of the SD card and T-Flash(Micro SD) card

Pin NO. Pin name of SD card Pin name of T-Flash(Micro SD) card

1 CD/DATA3 DATA2

2 CMD CD/DATA3

3 VSS1 CMD

4 VCC VCC

5 CLK CLK

6 VSS2 VSS

7 DATA0 DATA0

8 DATA1 DATA1

9 DATA2

In SD card interface designing, in order to ensure good communication performance with SD card,

it should be complied with following design principles.

 Route SD card signals as short as possible. Ensure the length of trace do not exceed 20mm.  In order to offer good ESD protection, it is recommended to add TVS on signals with the

capacitance is less than 15pF.

 Reserve external pull-up resistor for other data lines except the DATA0.  The SD_CLK and SD_DATA line must be shielded by GND in order to avoid interference.  The SD_CLK and SD_DATA and SD_CMD trace should be routed together and keep each

trace as close as possible.

M10_HD_V3.0 - 64 -

M10 Hardware Design

4. Antenna interface

The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50Ω. A reference circuit

is shown in following figure. By default, the resistor R1 is 0 ohm and capacitor C1 and C2 are not

mounted.

R1 0R

RF_ANT

MODULE

C1

NM

Figure 46: Reference circuit of RF interface

C2

NM

4.1. Antenna installation

M10 provides an RF antenna PAD for customer’s antenna connection. The RF trace in host PCB

connecting to the module RF antenna pad should be micro-strip line or other types of RF trace,

whose characteristic resistance should be close to 50Ω. M10 comes with two grounding pads

which are next to the antenna pad in order to give a better grounding.

Table 27: Pin definition of the RF_ANT

Name Pin Function

RF_ANT 43 RF antenna pad

GND 42 Ground

GND 44 Ground

To minimize the loss on the RF trace and RF cable, they should be designed carefully. It is

recommended that the insertion loss should try to meet the following requirements:

 GSM850/EGSM900<1dB 

DCS1800/PCS1900<1.5dB

M10_HD_V3.0 - 65 -

M10 Hardware Design

4.2. RF output power

Table 28: The module conducted RF output power

Frequency Max Min

GSM850 33dBm ±2dB 5dBm±5dB

EGSM900 33dBm ±2dB 5dBm±5dB

DCS1800 30dBm ±2dB 0dBm±5dB

PCS1900 30dBm ±2dB 0dBm±5dB

Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in chapter 13.16 of 3GPP TS 51.010-1.

4.3. RF receiving sensitivity

Table 29: The module conducted RF receiving sensitivity

Frequency Receive sensitivity

GSM850 < -108.5dBm

EGSM900 < -108.5dBm

DCS1800 < -108dBm

PCS1900 < -108dBm

4.4. Operating frequencies

Table 30: The module operating frequencies

Frequency Receive Transmit ARFCH

GSM850 869~894MHz 824~849MHz 128~251

EGSM900 925~960MHz 880~915MHz 0~124, 975~1023

DCS1800 1805~1880MHz 1710~1785MHz 512~885

PCS1900 1930~1990MHz 1850~1910MHz 512~810

4.5. Recommendation of RF pad welding

If external antenna is connected with RF cable welded on the RF pads, please refer to figure 47.

Any incorrect welding type may cause poor performance both in transmitting power and receiving

sensitivity.

M10_HD_V3.0 - 66 -

M10 Hardware Design

Figure 47: Recommendation of RF pad welding

M10_HD_V3.0 - 67 -

M10 Hardware Design

5. Electrical, reliability and radio characteristics

5.1. Absolute maximum ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of module are

listed in the following table:

Table 31: Absolute maximum ratings

Parameter Min Max Unit

VBAT -0.3 4.7 V

Peak current of power supply 0 2 A

RMS current of power supply (during one TDMA- frame) 0 0.7 A

Voltage at digital pins -0.3 3.3 V

Voltage at analog pins -0.3 3.0 V

Voltage at digital/analog pins in POWER DOWN mode -0.25 0.25 V

5.2. Operating temperature

The operating temperature is listed in the following table:

Table 32: Operating temperature

Parameter Min Typ Max Unit

Normal temperature -35 25 +80 ℃

Restricted operation* -45 to -35 +80 to +85 ℃

Storage temperature -45 +90 ℃

*

When the module works in this temperature range, the deviation from the GSM specification

may occur. For example, the frequency error or the phase error could increase.

M10_HD_V3.0 - 68 -

M10 Hardware Design

5.3. Power supply ratings

Table 33: The module power supply ratings

Parameter Description Conditions Min Type Max Unit

VBAT Supply

voltage

Voltage must stay within the

min/max values, including

voltage drop, ripple, and spikes.

3.3 4.0 4.6 V

Voltage drop

during

Maximum power control level

on GSM850 and GSM900.

transmitting

burst

Voltage

ripple

Maximum power control level

on GSM850 and GSM900

@ f<200kHz

@ f>200kHz

I

VBAT

Average

supply

current

POWER DOWN mode

SLEEP mode @ DRX=5

Minimum functionality mode

AT+CFUN=0

IDLE mode

SLEEP mode

AT+CFUN=4

IDLE mode

SLEEP mode

IDLE mode

GSM850/EGSM900

DCS1800/PCS1900

TALK mode

GSM850/EGSM900

DCS1800/PCS1900

DATA mode, GPRS (3 Rx,2Tx)

GSM850/EGSM900

DCS1800/PCS1900

DATA mode, GPRS(2 Rx,3Tx)

GSM850/EGSM900

DCS1800/PCS1900

DATA mode, GPRS (4 Rx,1Tx)

GSM850/EGSM900

DCS1800/PCS1900

DATA mode, GPRS(1Rx,4Tx)

GSM850/EGSM900

400 mV

50

2

29

1.1

13

0.84

13

0.83

13

1)

2)

209/208

191/202

1)

2)

341/347

318/335

1)

2)

394/408

377/396

1)

2)

225/226

210/219

1)

449/464

mA

mV

uA

mA

M10_HD_V3.0 - 69 -

M10 Hardware Design

Parameter Description Conditions Min Type Max Unit

DCS1800/PCS19002) 423/445 mA

Peak supply

current

Maximum power control level

on GSM900.

1.6 1.8 A

(during

transmission

slot)

1)

Power control level PCL 5

2)

Power control level PCL 0

5.4. Current consumption

The values of current consumption are shown in Table 34.

Table 34: The module current consumption

Condition Current Consumption

Voice Call

GSM850 @power level #5 <300mA,Typical 209mA

@power level #12,Typical 96mA

@power level #19,Typical 73mA

GSM900 @power level #5 <300mA,Typical 208mA

@power level #12,Typical 96mA

@power level #19,Typical 73mA

DCS1800 @power level #0 <250mA,Typical 191mA

@power level #7,Typical 93mA

@power level #15,Typical 70mA

PCS1900 @power level #0 <250mA,Typical 202mA

@power level #7,Typical 95mA

@power level #15,Typical 71mA

GPRS Data

DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 12

GSM850 @power level #5 <350mA,Typical 199mA

@power level #12,Typical 87mA

@power level #19,Typical 63mA

EGSM 900 @power level #5 <350mA,Typical 200mA

@power level #12,Typical 96mA

@power level #19,Typical 70mA

DCS 1800 @power level #0 <300mA,Typical 184mA

@power level #7,Typical 82mA

@power level #15,Typical 66mA

PCS 1900 @power level #0 <300mA,Typical 192mA

@power level #7,Typical 82mA

M10_HD_V3.0 - 70 -

M10 Hardware Design

@power level #15,Typical 66mA

DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12

GSM850 @power level #5 <550mA,Typical 341mA

@power level #12,Typical 135mA

@power level #19,Typical 85mA

EGSM 900 @power level #5 <550mA,Typical 347mA

@power level #12,Typical 156mA

@power level #19,Typical 103mA

DCS 1800 @power level #0 <450mA,Typical 318mA

@power level #7,Typical 118mA

@power level #15,Typical 84mA

PCS 1900 @power level #0 <450mA,Typical 335mA

@power level #7,Typical 128mA

@power level #15,Typical 95mA

DATA mode, GPRS ( 2 Rx, 3 Tx ) CLASS 12

GSM850 @power level #5 <600mA,Typical 394mA

@power level #12,Typical 176mA

@power level #19,Typical 102mA

EGSM 900 @power level #5 <600mA,Typical 408mA

@power level #12,Typical 189mA

@power level #19,Typical 110mA

DCS 1800 @power level #0 <490mA,Typical 377mA

@power level #7,Typical 147mA

@power level #15,Typical 97mA

PCS 1900 @power level #0 <480mA,Typical 396mA

@power level #7,Typical 146mA

@power level #15,Typical 98mA

DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12

GSM850 @power level #5 <350mA,Typical 225mA

@power level #12,Typical 87mA

@power level #19,Typical 62mA

EGSM 900 @power level #5 <350mA,Typical 226mA

@power level #12,Typical 97mA

@power level #19,Typical 69mA

DCS 1800 @power level #0 <300mA,Typical 210mA

@power level #7,Typical 82mA

@power level #15,Typical 66mA

PCS 1900 @power level #0 <300mA,Typical 219mA

@power level #7,Typical 82mA

@power level #15,Typical 66mA

DATA mode, GPRS ( 1 Rx, 4 Tx ) CLASS 12

GSM850 @power level #5 <660mA,Typical 449mA

@power level #12,Typical 207mA

M10_HD_V3.0 - 71 -

M10 Hardware Design

@power level #19,Typical 109mA

EGSM 900 @power level #5 <660mA,Typical 464mA

@power level #12,Typical 221mA

@power level #19,Typical 117mA

DCS 1800 @power level #0 <530mA,Typical 423mA

@power level #7,Typical 166mA

@power level #15,Typical 99mA

PCS 1900 @power level #0 <530mA,Typical 445mA

@power level #7,Typical 165mA

@power level #15,Typical 100mA

Note: GPRS Class 12 is the default setting. The module can be configured from GPRS Class 1 to Class 12 by “AT+QGPCLASS”. Setting to lower GPRS class would make it easier to design the power supply for the module.

5.5. Electro-static discharge

Although the GSM engine is generally protected against Electrostatic Discharge (ESD),

precautions about ESD protection should still be emphasized. Proper ESD handling and packaging

procedures must be applied throughout the processing, handling and operation of any applications

using the module.

The measured ESD values of module are shown as the following table:

Table 35: The ESD endurance (Temperature:25℃,Humidity:45 %)

Tested point Contact discharge Air discharge

VBAT,GND ±5KV ±12KV

PWRKEY ±4KV +8KV/-6 KV

SIM Card Interface ±4KV +8KV/-6 KV

Antenna port ±5KV ±10KV

SPK1P/1N, SPK2P/2N,

MIC1P/1N, MIC2P/2N

±4KV +8KV/-6 KV

M10_HD_V3.0 - 72 -

M10

_

M

s

e

_

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e

o

4

c

d

a

h

m

n

Hardware D

6.

Thi

chapter des

6.1.

Mechanic

echani

sign

cal dim

ribes the me

al dimensi

nsions

hanical dim

ns of mo

ensions of t

ule

e module.

M10

HD_V3.0

Figure

8: M10 top

nd side di

ensions（U

it: mm）

- 73 -

M10 Hardware Design

test point

Figure 49: M10 bottom dimensions（Unit: mm）

Figure 50: PAD bottom dimensions（Unit: mm）

M10_HD_V3.0 - 74 -

M10 Hardware Design

6.2. Footprint of recommendation

single pad

M10_HD_V3.0 - 75 -

M10 Hardware Design

safe area line

module dimension

keepout area

Note1 Note2

Note3

Figure 51: Footprint of recommendation（Unit: mm）

：

Keep out the area below the test point in the host PCB. Place solder mask.

：

In order to maintain the module, keep about 3mm between the module and other components in host PCB.

：

Keep out area in above figure in which is forbid to pour GND copper. Since the RF test point in this area, avoid generating parasitic capacitance between RF test point and GND.

M10_HD_V3.0 - 76 -

M10

_

e

_

d

m

F

o

l

Hardware D

6.3.

Top view

sign

of the mo

ule

6.4.

Bottom vi

ew of the

Figure 52:

odule

Top view of

the module

igure 53: B

M10

HD_V3.0

ottom view

f the modu

e

- 77 -

M10 Hardware Design

k

N

k

Appendix A: GPRS coding schemes

Four coding schemes are used in GPRS protocol. The differences between them are shown in

Table 36.

Table 36: Description of different coding schemes

Scheme Code

rate

USF Pre-coded

USF

Radio

Block

excl.USF

BCS Tail Coded

bits

Punctured

bits

Data

rate

Kb/s

and BCS

CS-1 1/2 3 3 181 40 4 456 0 9.05

CS-2 2/3 3 6 268 16 4 588 132 13.4

CS-3 3/4 3 6 312 16 4 676 220 15.6

CS-4 1 3 12 428 16 - 456 - 21.4

Radio block structure of CS-1, CS-2 and CS-3 is shown as Figure 54:

USF BCS

Radio Bloc

Rate 1/2 convolutional coding

Puncturing

456 bits

Figure 54: Radio block structure of CS-1, CS-2 and CS-3

Radio block structure of CS-4 is shown as Figure 55:

USF BCS

Radio Bloc

Block

Code

o coding

456 bits

Figure 55: Radio block structure of CS-4

M10_HD_V3.0 - 78 -

M10 Hardware Design

Appendix B: GPRS multi-slot classes

Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification.

Multi-slot classes are product dependant, and determine the maximum achievable data rates in

both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the

amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.

The active slots determine the total number of slots the GPRS device can use simultaneously for

both uplink and downlink communications. The description of different multi-slot classes of the

M10 module support is shown in Table 37.

Table 37: GPRS multi-slot classes

Multislot class Downlink slots Uplink slots Active slots

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5

M10_HD_V3.0 - 79 -

Shanghai Quectel Wireless Solutions Co., Ltd.

Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China 200233

Tel: +86 21 5108 6236

Mail: info@quectel.com

Quectel Wireless Solutions 201202M10 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual