Preliminary specification
File under Integrated Circuits, <Handbook>
1999 Jul 20
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog
front-end
FEATURES
• 48 pin LQFP (SOT313) small body SMD package and low external component count results in minimal PCB space
requirement
• 12-bit sigma delta audio codec with programmable sample rate, input and outputvoltagelevels,capableofconnecting
directly to speaker and microphone, including digitally controlled mute, loopback and clip detection functions
• 14-bit sigma delta telecom codec with programmable sample rate, including digitally controlled input voltage level,
mute, loopback and clip detection functions. The telecom codec can be directly connected to a Data Access
Arrangement (DAA) and includes a built in sidetone suppression circuit
• 10-bit successive approximation ADC with internal track and hold circuit and analog multiplexer for touch screen
read-out and monitoring of four external high voltage (7.5V) analog voltages
• High speed, 4 wire serial interface data bus (SIB) for communication to the system controller
• 3.3V supply voltage and built in power saving modes make the UCB1300 optimal for portable and battery powered
applications
• Maximum operating current 25 mA
• 10 general purpose IO pins
APPLICATIONS
• Handheld Personal Computers, Personal Intelligent Communicators, Personal Digital Assistants
• Smart Mobile Phones
• Screen/Web Phones
• Internet Access Terminal
• Modems
UCB1300
GENERAL DESCRIPTION
The UCB1300 is a single chip, integrated mixed signal audio and telecom codec. The single channel audio codec is
designed for direct connection of a microphone and a speaker. The built-in telecom codec can directly be connected to
a DAA and supports high speed modem protocols. The incorporated analog to digital converter and the touch screen
interface provides complete control and read-out of an 4 wire resistive touch screen. The 10 general purpose I/O pins
provide programmable inputs and/or outputs to the system.
The UCB1300 has a serial interface bus (SIB) intended to communicate to the system controller. Both the codec input
data and codec output data and the control register data are multiplexed on this SIB interface.
7analog speaker driver ground-S
SPKRN8negative speaker outputhi ZO
SPKRP9positive speaker outputhi ZO
V
DDA2
10analog speaker driver supply-S
TOUTP11positive telecom codec outputhi ZO
TOUTN12negative telecom codec outputhi ZO
TEST13test mode protection‘0’I
TINN14negative telecom codec inputhi ZI
TINP15positive telecom codec inputhi ZI
VREFBYP16external reference voltage inputhi ZI/O
V
V
DDA1
SSA1
17analog supply-S
18analog ground-S
n.c19not connected-MICGND20microphone ground switch inputhi ZI
MICP21microphone signal inputhi ZI
AD322analog voltage inputshi ZI
AD223analog voltage inputshi ZI
AD124analog voltage inputshi ZI
AD025analog voltage inputshi ZI
V
1. I/OC= CMOS bidirectional; ID= digital input; S = supply; OA= analog output; IC= CMOS input; IA= analog input;
I/OA= analog bidirectional; OC= CMOS output.
2. V
(pins 5 and 37) and V
SSD
(pin 18) are connected internally within the UCB1300.
SSA1
3. SKPRN/SPKRP (pins 8 and 9), TINN/TINP (pins 14 and 15) and TOUTP/TOUTN are differential pairs
4. TEST (pin 13) is connected to an internal pull-down resistor. This pin should be held LOW during normal operation
of the circuit.
5. The not connected pins (pins 6, 19, 31 and 44) are reserved for future applications and should be left floating.
6. SIBDOUT reset state is 1 until the SIB bus is running. SIBDOUT will be active once the SIB bus has started.
1999 Jul 205
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
book, full pagewidth
IO7
IO8
IO9
ADCSYNC
V
SSD
n.c.
V
SSA2
SPKRN
SPRKP
V
DDA2
TOUTP
TOUTN
DDD
V
1
2
3
4
5
6
7
8
9
10
11
12
TEST
IO5
IO6
48
47
46
13
14
15
TINP
TINN
n.c.
IO4
45
44
UCB1300
16
17
DDA1VSSA1
V
IRQOUT
43
XXX
18
VREFBYP
SIBCLK
SIBDIN
42
41
19
20
n.c.
MICGND
SIBDOUT
40
21
MICP
RESET
SIBSYNC
39
38
22
23
AD3
AD2
SSD
V
37
24
AD1
36
35
34
33
32
31
30
29
28
27
26
25
MXXxxx
IO3
IO2
IO1
IO0
V
DDD
n.c.
TSPX
TSMY
TSMX
TSPY
V
SSA3
AD0
Fig.2 Pin configuration.
1999 Jul 206
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
FUNCTIONAL DESCRIPTION
The UCB1300 consists of several analog and digital sub circuits which can be programmed via the Serial Interface Bus
(SIB). This enables the user to set the UCB1300 functionality according to actual application requirements.
AUDIO CODEC
Theaudiocodeccontainsaninputchannel,built up with an 64 timesoversampling sigma delta analog to digitalconverter
(ADC) with digital decimation filters and a programmable gain microphone preamplifier. The programmable gain
microphone amplifier features a built-in offset cancellation stage, which reduces the distortion of this stage at high gain
settings, caused by the offset voltages of the internal amplifiers or leakage on the board. It can be deactivated (reg13,
bit 13) for improved performance at low gain settings. A general rule is that below a gain setting of 16 (24dB gain) the
offset cancellation circuit will reduce THD and signal bandwidth and should then be deactivated.
The output path consists of a digital up sample filter, a 64 time oversampling 4 bit digital to analog converter (DAC) circuit
followed by a BTL speaker driver, capable of driving a 16 Ω speaker. The output path features a digital programmable
attenuation and a mute function.
The audio codec also incorporates a loopback mode, in which codec output path and the input path are connected in
series.
1999 Jul 207
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
AUD_GAIN[4,3]AUD_OFF_CAN AUD_LOOP AUD_GAIN[2..0]
MICP
MICGND
VCCSPKR
SPKRP
SPKRN
VSSSPKR
AUD_MUTE AUD_ATT[2..0]
Fig.3 Audio codec block diagram.
4bit DAC
1bit ADC
DIGITAL
ATTENUATOR
AUD_ATT[4,3]
DIGITAL
DECIMATION
FILTER
AUD_IN_ENA
AUD_OUT_ENA
DIGITAL
NOISE
SHAPER
12
12
The audio sample rate (fsa) is derived from the SIB interface clock pin (SIBCLK) and is programmable through the SIB
interface using AUD_DIV[n]. The audio sample rate is given by the following equation:
For example, a serial clock of 9.216 MHz, with a divisor of 12, results in an audio sample rate of 24.0 kHz. Both the rising
and the falling edges of SIBCLK are used in case AUD_DIV[n] is set to an odd number, which demands a 50% duty cycle
of SIBCLK to obtain time equidistant sampling.
1999 Jul 208
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
V
DDA1
17
MICP
21
MICGND
20
V
SSA1
18
PASSIVE
UCB1300UCB1300
V
DDA1
MICGND
17
MICP
21
20
V
SSA1
18
ACTIVE
Fig.4 Possible microphone connections.
The UCB1300 audio codec input path accepts microphone signals directly, only a DC blocking capacitor is needed since
the MICP input is biased around 1.4V. The ‘ground’ side of the microphone is either connected to the analog ground
(V
)or to the MICGND pin. The latter will decrease the current consumption ofactive microphones, since the MICGND
ssa1
pin is made Hi-Z when the audio codec input path is disabled.
The full scale input voltage of the audio input path is programmable in 1.5 dB steps by setting the appropriate number in
AUDIO_GAIN[n] in the audio control register A. Using very high gains may require the use of the internal offset
cancellation circuit programmable in reg 13 to avoid clipping in the ADC.
A clip detection circuit will inform the user whenever the input voltage exceeds the maximum input voltage, since this will
lead to a high distortion. In that case AUD_CLIP_STAT in the audio control register B is set. When ACLIP_RIS_INT is
set, an interrupt is generated on the IRQOUT pin on the rising edge of the clip detect signal. When ACLIP_FAL_INT is
set, an interrupt is generated on the falling edge of the clip detect signal.
The frequency response of the audio codec depends mainly on the selected sample rate, since the bandwidth is limited
in the down and up sampling filters. These digital filters both contain several FIR and IIR low pass filters and a DC
removal filter (high pass filter). A 3rd order smoothing filter is implemented in the DAC path, between DAC and speaker
driver stage to reduce the spurious frequencies at the speaker outputs.
1999 Jul 209
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
48dB
24dB
0dB
21dB
0dB
24dB
programmed attenuation
48dB69dB
Fig.5 Analog and digital attenuation settings audio output path.
The output level can be attenuated in 3 dB steps down to -69 dB. The first 8 attenuation steps (0 to 21 dB) are
implemented in the analog domain. The digital up sample filter contains a 24 dB and a 48 dB attenuation setting. This
arrangement preserves the resolution, thus the ‘audio quality’ of the audio output signal for attenuation settings till 21 dB.
The speaker driver is muted when AUDIO_MUTE in the audio control register B is set. The speaker driver will remain
activated in that case, however no signal is produced by the speaker driver circuit.
The speaker driver is designed to directly drive a bridge tied load (BTL). This yields the highest output power and this
arrangementdoes not require external DC blocking capacitors. Thespeaker driver also accepts single ended connection
of a speaker, in which case the maximum output power is reduced to a quarter of the BTL situation. Consequently this
way of connecting the speaker to the speaker driver reduces the power consumption of the speaker driver in the
UCB1300 by a factor of 2. Fig.6 shows possible ways to connect a speaker to the driver. Loading the amplifiers with a
capacitive load may cause high frequency oscillations and should be done cautiously.
1999 Jul 2010
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
BRIDGE TIED
SPEAKER LOAD
UCB1300UCB1300UCB1300
SPKRP
9
+
8
SPKRN
SINGLE ENDED SPEAKER CONNECTIONS
SPKRP
9
8
SPKRN
SPKRP
9
8
SPKRN
+
+
Fig.6 Possible speaker connections.
The audio input and output path are activated independently; the input path is enabled when AUDIO_IN_ENA is set, the
output path is enabled when AUD_OUT_ENA is set in the audio control register B. This provides the user the means to
reduce the current consumption of the UCB1300 if one part of the audio codec is not used in the application.
The audio codec has a loopback mode for system test purposes, which is activated when the AUDIO_LOOP bit in the
audio control register B is set. This is an analog loopback which internally connects the output of the audio output path
to the input of the audio input path, (see Fig.3). In this mode the normal microphone input is ignored, but the speaker
driver can be operated normally.
+
1999 Jul 2011
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
TELECOM CODEC
The telecom codec contains an input channel, built up from a 64 times oversampling sigma delta analog to digital
converter (ADC) with digital decimation filters, programmable attenuationgain and built-in sidetone suppression circuit.
The output path consist of a digital up sample filter, a 64 time oversampling 4 bit digital to analog converter (DAC) circuit
followed by a differential output driver, capable of directly driving a 600 Ω isolation transformer. The output path includes
a mute function. The telecom codec also incorporates a loopback mode, in which codec output path and the input path
are connected in series.
TOUTP
TOUTN
TINP
TINN
TEL_SIDE_ENA
SIDETONE
SUPPRESSION
CIRCUIT
TEL_MUTE
TEL_ATTATT TEL_GAIN
1bit ADC
4bit DAC
DIGITAL
DECIMATION
FILTER
TEL_IN_ENA
TEL_OUT_ENA
DIGITAL
NOISE
SHAPER
14
14
Fig.7 Telecom codec block diagram.
The telecom sample rate (fst) is derived from the SIB interface clock pin (SIBCLK) and is programmable through the SIB
interface. The telecom sample rate is given by the following formula:
For example, a SIBCLK of 9.216 MHz, with a divisor of 40, results in a telecom sample rate of 7.2 kHz. Both the rising
and the falling edges of the SIBCLK are used in case TEL_DIV[n] is set to an odd number. In that case a 50% duty cycle
of the SIBCLK signal is mandatory to obtain time equidistant sampling.
The input path of the telecom codec has a programmable attenuationgain. It also implements a voice band filter, which
consists of an digital low pass filter, which is a part of the decimation filter. Therefore the pass band of the voice band
1999 Jul 2012
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
filter is determined by the selected telecom codec sample rate. This voice band filter is activated by setting
TEL_VOICE_ENA in the telecom control register B. The resulting telecom input filter curves are given in Fig.37 and
Fig.38.
The output section of the telecom codec is designed to interface with a 600 Ω line through an isolation transformer. The
built in mute function is activated by TEL_MUTE in the telecom control register B. The output driver remains active in the
mute mode, however no output signal is produced. Loading the drivers with a capacitive load may cause high frequency
oscillations and should be done cautiously.
1999 Jul 2013
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
TOUCH SCREEN MEASUREMENT MODES
The UCB1300 contains an on chip interface for a 4 wire resistive touch screen. This interface supports three modes of
touch screen measurements: position, pressure and plate resistance.
POSITION MEASUREMENT
Twoposition measurements are needed to determine the location ofthe pressed spot. First an X measurement, secondly
a Y measurement. The X plate is biased during the X position measurement of the X plate and the voltage on one or both
Y terminals (TSPY, TSMY) measured. The circuit can then be represented by a potentiometer, with the TSPY and/or
TSMY electrode being the ‘wiper’. The measured voltage on the TSPY/TSMY terminal is proportional to the X position
of the pressed spot of the touch screen.
Vposition
Vtscbias
tspx
tsmy
tspy
tsmx
Fig.8 Touch screen setup for position measurement.
In the Y position mode the X plate and Y plate terminals are interchanged, thus the Y plate is biased while the voltage
on the TSPX and/or TSMX terminal is measured.
1999 Jul 2014
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
PRESSURE MEASUREMENT
Thepressure used to press the touch screen canbe determined. In fact the contact resistance between the X and Y plate
is measured, which is a good indication of the size of the pressed spot and the applied pressure. A soft stylus, e.g. a
finger, leads to a rather large contact area between the two plates when a large pressure is applied. A hard stylus, e.g.
a pen, leads to less variation in measured contact resistance since the contact area is rather small.
Vtscbias
ipressure
tspx
tsmy
tspy
tsmx
Fig.9 Touch screen setup for pressure measurement.
One plate is biased at one or both terminals during this pressure measurement, whereas the other plate is grounded,
again on one or both terminals. The current flowing through the touch screen is a direct indication for the resistance
between both plates. A compensation for the series resistance, formed by the touch screen plates itself will improve the
accuracy of this measurement. The measurement is done with a resistive voltage divider. The internal resistor should be
taken into account to evaluate the settling time of the pressure measurement given the board capacitors connected to
the ADC tap point in pressure mode.
Vtscbias
Switch matrix
Fig.9 Pressure measurement scheme.
1999 Jul 2015
Measured resistor
To ADC
Internal resistor (about 1kΩ)
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
PLATE RESISTANCE MEASUREMENT
Theplate resistance of a touchscreen varies typically a lotdue to processing spread. Knowingthe actual plate resistance
makes it possible to compensate for the plate resistance effects in pressure resistance measurements. The plate
resistance decreases when two or more spots on the touch screen are pressed. In that case a part of one plate, e.g. the
X plate is shorted by the other plate, which decreases the actual plate resistance
Vtscbias
iplate
tspx
tsmy
tspy
tsmx
Fig.10 Touch screen setup for plate resistance.
The plate resistance measurement is executed in the same way as the pressure resistance measurement. In this case
only one of the two plates is biased and the other plate is kept floating. The current through the connected plate is again
a direct indication of the connected resistance.
1999 Jul 2016
Philips SemiconductorsPreliminary specification
Advanced modem/audio analog front-endUCB1300
TOUCH SCREEN INTERFACE
The UCB1300 contains a universal resistive touch screen interface for 4-wire resistive touch screen, capable of
performing position, pressure and plate resistance measurements. In addition the touch screen can be programmed to
generate interrupts when the touch screen is pressed. The last mode is also active when the UCB1300 is set in the
stand-by mode.
ts..power
ts..ground
tsc_mode
(pressure)
vssa3
adc_input[2:0]
tspx
tsmx
tspy
tsmy
1kΩ
analog mux
Fig.11 Block diagram of the touch screen interface.
tsc_mode (interrupt)
vdda1
touch screen
bias voltage
vssa1
tsc_bias_ena
Current sense input
tsc_mode_sel
to adc input
The touch screen interface connects to the touch screen by four wires: TSPX, TSMX, TSPY and TSMY. Each of these
pinscan be programmed to be floating, powered or grounded in the touch screenswitch matrix. The setting of eachtouch
screen pin is programmable through the touch screen control register. Possible conflicting settings (grounding and
powering of a touch screen pin at the same time) are detected by the UCB1300. In that case the touch screen pin will be
grounded.
In position mode, opening the TS..gnd switch can take a long time. To avoid unpredictable delays after changing the
plates configuration, the touch screen interface should be programmed to pressure mode for the duration 1 SIB frame
before resuming a position measurement.
TheUCB1300’s internal voltage reference(V
the touch screen biasing independent of supply voltage and temperature variations. Four low pass filters, one on each
touch screen terminal, are built in to minimize the noise coupled from the LCD into the touch screen signals. An LCD
typically generates large noise glitches on the touch screen, since they are closely coupled. The influence of the glitches
1999 Jul 2017
)is used as referencevoltage for the touch screen bias circuit. This makes
ref
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