Philips tda8776a DATASHEETS

INTEGRATED CIRCUITS

DATA SH EET

TDA8776A

10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)

Product specification
Supersedes data of 1995 May 11
File under Integrated Circuits, IC02

1996 Jun 04

Philips Semiconductors Product specification

10-bit, 1000 Msps Digital-to-Analog

TDA8776A

Converter (DAC)

FEATURES

• 10-bit resolution

• Conversion rate up to 1000 MHz

• 10K/100K ECL input levels

• Internal reference voltage generator

• No deglitching circuit required

• Internal input register

• Power dissipation only 925 mW (typical)

• Internal 50 Ω output load (connected to the analog

ground)

• Very few external components required.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
V
V

EEA
EED
EEI

analog supply voltage −5.46 −5.20 −4.94 V
digital supply voltage −5.46 −5.20 −4.94 V
input stages digital supply

note 1 −5.46 −5.20 −4.94 V

voltage

I

EEA

I

EED

I

EEI

analog supply current note 1 − 108 145 mA
digital supply current note 1 − 60 85 mA
input stages digital supply

note 1 − 10 15 mA

current

V

OUT

− V

OUT

full-scale analog output voltage

notes 1 and 2; ZL=50Ω 1.7 2.0 2.5 V

(peak-to-peak value)
INL DC integral non-linearity note 3 −±0.3 ±0.5 LSB
DNL DC differential non-linearity note 3 −±0.2 ±0.45 LSB
f

clk(max)

t

S1

P

tot

maximum clock frequency 1000 −−MHz

settling time (differential) 10% to 90% full scale; Fig.9 − 0.5 − ns

total power dissipation − 925 − mW

APPLICATIONS

High-speed digital-to-analog conversion for:

• High resolution video and graphics

• Direct digital synthesis (DDS)

• Telecommunication

• High-speed modems.

GENERAL DESCRIPTION

The TDA8776A is a 10-bit Digital-to-Analog Converter
(DAC) for high resolution video and other high frequency
applications. It converts the digital input signal into an
analog output voltage at a maximum conversion rate of
1000 Msps. No external reference voltage is required and
all digital inputs are 10K/100K-ECL compatible.

Notes

1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and

2. The analog output voltages (V

OUT

and V

) are negative with respect to AGND (see Table 1). The external output

OUT

CLK is LOW.

resistance between AGND and each of these outputs is typically 50 Ω.

3. A warm-up time is necessary to reach optimal performances.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA8776AK PLCC28 plastic leaded chip carrier; 28 leads SOT261-2

1996 Jun 04 2

Philips Semiconductors Product specification

10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)

BLOCK DIAGRAM

D9 D8 D7 D6 D5 D4 D3 D2

22 21 20 19 18 17 16 15 14 13 12

ECL BUFFERS

COLUMN DECODER

ROW

DECODER

TDA8776A

D1 D0 IGND

DELAY

R-2R DIVIDER

TDA8776A

25

V

EEI

28

DGND2

10

AGND2

11

V

EED3

24

V

EEA

25 34 9 86 7 27

DGND1

AGND1

V

EED1VEED2

V

OUT2

V

OUT1VOUT1VOUT2

Fig.1 Block diagram.

26

MBE581

CLK CLK

1996 Jun 04 3

Philips Semiconductors Product specification

10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
DGND1 2 digital ground 1
V

EED1

V

EED2

AGND1 5 analog ground 1
V

OUT1

V

OUT2

V

OUT1

V

OUT2

AGND2 10 analog ground 2
V

EED3

IGND 12 input ground for ECL input buffers
D0 13 data input; bit 0 (LSB)
D1 14 data input; bit 1

3 digital supply voltage 1 (−5.2 V)
4 digital supply voltage 2 (−5.2 V)

6 analog voltage output 1
7 analog voltage output 2
8 complementary analog voltage

output 1

9 complementary analog voltage

output 2

11 digital supply voltage 3 (−5.2 V)

TDA8776A

SYMBOL PIN DESCRIPTION

D2 15 data input; bit 2
D3 16 data input; bit 3
D4 17 data input; bit 4
D5 18 data input; bit 5
D6 19 data input; bit 6
D7 20 data input; bit 7
D8 21 data input; bit 8
D9 22 data input; bit 9 (MSB)
n.c. 23 not connected
V

EEA

V

EEI

CLK 26 complementary clock input
CLK 27 clock input
DGND2 28 digital ground 2

24 analog supply voltage (−5.2 V)
25 input supply voltage for ECL input

buffers (−5.2 V)

AGND1
V

OUT1

V

OUT2

V

OUT1

V

OUT2
AGND2
V

EED3

EED2VEED1

V

4

3

2

5
6
7
8

9
10
11

12

IGND

TDA8776A

13

14

D0

Fig.2 Pin configuration.

n.c.

DGND1

DGND2

1

28

15

16

D1D2D3

CLK

27

17
D4

CLK
26

18
D5

25
24
23
22
21
20
19

MBE582

V
V

n.c.
D9
D8
D7

D6

EEI
EEA

1996 Jun 04 4

Philips Semiconductors Product specification

10-bit, 1000 Msps Digital-to-Analog

TDA8776A

Converter (DAC)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

EEA

V

EED

V

EEI

V

− V

EEA

EED

AGND − DGND ground voltage differential −0.1 +0.1 V
V

I

I

OUT/IOUT

T

stg

T

amb

T

j

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

analog supply voltage −7.0 ±0.3 V
digital supply voltage −7.0 ±0.3 V
input stages digital supply voltage −7.0 ±0.3 V
supply voltage differential −0.5 +0.5 V

input voltage V

EEI

±0.3 V
total output current ZL=50Ω−5 +50 mA
storage temperature −55 +150 °C
operating ambient temperature 0 70 °C
junction temperature − 150 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 55 (typ.) K/W

1996 Jun 04 5

Philips Semiconductors Product specification

10-bit, 1000 Msps Digital-to-Analog

TDA8776A

Converter (DAC)

CHARACTERISTICS

V

EEA=V24

V

EEI=V25

shorted together; V
V

EEA=VEED

Supply

V

EEA

V

EED

V

EEI

I

EEA

I

EED

I

EEI

AGND − DGND ground voltage differential −0.1 − +0.1 V

Inputs

D

IGITAL INPUTS (D9 TO D0) AND CLOCK INPUTS (CLK AND CLK)

V

IL

V

IH

I

IL

I

IH

f

clk(max)

Outputs (referenced to AGND); notes 1 and 2
V

OUT

Z

O

Transfer function

INL DC integral non-linearity note 3 −±0.3 ±0.5 LSB
DNL DC differential non-linearity note 3 −±0.2 ±0.45 LSB

to V5and V10= −5.46 to −4.94 V; V

to V12= −5.46 to −4.94 V; V

− V

OUT

= −5.2 V and T

= 2 V (p-p); ZL=50Ω; unless otherwise specified (typical values measured at

OUT

=25°C).

amb

EED

and V

EED=V3,V4

shorted together; T

EEI

and V11to V2and V28= −5.46 to −4.94 V;

=0to+70°C; AGND, DGND and IGND

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

analog supply voltage −5.46 −5.20 −4.94 V
digital supply voltage −5.46 −5.20 −4.94 V
input stages digital supply voltage note 1 −5.46 −5.20 −4.94 V
analog supply current note 1 − 108 145 mA
digital supply current note 1 − 60 85 mA
input stages digital supply current note 1 − 10 15 mA

LOW level input voltage −1.9 −1.8 −1.6 V
HIGH level input voltage −1.2 −0.9 −0.8 V
LOW level input current VI= −1.8 V −−10 µA
HIGH level input current VI= −0.9 V −−20 µA
maximum clock frequency 1000 −−MHz

− V

OUT(p-p)

full-scale analog output voltage

ZL=50Ω 1.7 2.0 2.5 V

(peak-to-peak value)
output impedance − 50 −Ω

Spurious free dynamic range (f

= 1000 MHz); V

clk

EEA=VEED

SFDR spurious free dynamic range

= 10 MHz −65 −69 − dB

f

OUT

f

= 50 MHz −−60 − dB

OUT

f

= 100 MHz −52 −57 − dB

OUT

= 200 MHz −−46 − dB

f

OUT

1996 Jun 04 6

= 5.2 V; T

=25°C; note 4; see Fig.3

amb