Philips tda8765 DATASHEETS

INTEGRATED CIRCUITS
DATA SH EET
TDA8765
10-bit high-speed Analog-to-Digital Converter (ADC)
Preliminary specification Supersedes data of 1998 May 08 File under Integrated Circuits, IC02
1999 Jan 06
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital Converter (ADC)

FEATURES

10-bit resolution
Sampling rate up to 55 MHz
•−3 dB bandwidth of 200 MHz
5 V power supplies
Binary or twos-complement CMOS outputs
In-range CMOS-compatible output
TLL- CMOS-compatible static digital inputs
3 to 5 V CMOS-compatible digital outputs
Differential clock input; Positive Emitter Coupled Logic
(PECL) compatible
Power dissipation 325 mW (typical)
Low analog input capacitance (typical 2 pF), no buffer
amplifier required
Integrated sample-and-hold amplifier
Differential analog input
External amplitude range control
Voltage controlled regulator included.
TDA8765

APPLICATIONS

High-speed analog-to-digital conversion for – Video signal digitizing – High Definition TV (HDTV) – Imaging (camera scanner) – Medical imaging – Telecommunication – Base-station receiver.

GENERAL DESCRIPTION

The TDA8765 is a bipolar 10-bit Analog-to-Digital Converter (ADC) optimized for telecommunications and professional imaging. It converts the analog input signal into 10-bit binary coded digital words at a maximum sampling rate of 55 MHz. All static digital inputs (SH, and OTC) are TTL and CMOS compatible and all outputs are CMOS compatible. A sine wave clock input signal can also be used.
CE

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CCA
V
CCD
V
CCO
I
CCA
I
CCD
I
CCO
INL integral non-linearity f DNL differential non-linearity f f
CLK(max)
analog supply voltage 4.75 5.0 5.25 V digital supply voltage 4.75 5.0 5.25 V output supply voltage 3.0 3.3 5.25 V analog supply current 33 tbf mA digital supply current 30 tbf mA output supply current f
= 4 MHz; fi= 400 kHz 3.2 tbf mA
CLK
= 4 MHz; fi= 400 kHz −±0.5 ±1.75 LSB
CLK
= 4 MHz; fi= 400 kHz −±0.3 ±0.5 LSB
CLK
maximum clock frequency
TDA8765H/4 40 −−MHz TDA8765H/5 55 −−MHz
P
tot
total power dissipation 325 tbf mW

ORDERING INFORMATION

TYPE
NUMBER
TDA8765H/4 TDA8765H/5 55
NAME DESCRIPTION VERSION
QFP44
plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm
PACKAGE
SOT307-2
SAMPLING
FREQUENCY (MHz)
40
1999 Jan 06 2
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital Converter (ADC)

BLOCK DIAGRAM

V
V
V
handbook, full pagewidth
V
ref
V V
SH
n.c.
V
CCA1
2
11
43
I
42
I
sample-
and-hold
39
1, 5 to 8, 12 to 14, 16, 31 and 32
CCA2
AMP
CCA3
3
9
TDA8765
ANALOG-TO-DIGITAL
CCA4
41
CONVERTER
CLK
35
CLK
CLOCK DRIVER
V
CCD1
36
LATCHES
OVERFLOW/
UNDERFLOW
LATCH
TDA8765
V
CCD2
37
15
OUTPUTS
OUTPUT
18
CMOS
CMOS
CEOTC
19
D9
21 22 23 24 25 26 27 28
29 30
33
20
D8 D7 D6 D5 D4 D3 D2 D1 D0
MSB
data outputs
LSB
V
CCO
IR
44
AGND1
10
AGND2
4
AGND3
40
AGND4
DGND1
Fig.1 Block diagram.
38
17
DGND2
34
MGK801
OGND
1999 Jan 06 3
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital Converter (ADC)

PINNING

SYMBOL PIN DESCRIPTION
n.c. 1 not connected V
CCA1
V
CCA3
AGND3 4 analog ground 3 n.c. 5 not connected n.c. 6 not connected n.c. 7 not connected n.c. 8 not connected V
CCA2
AGND2 10 analog ground 2 V
ref
n.c. 12 not connected n.c. 13 not connected n.c. 14 not connected V
CCD2
n.c. 16 not connected DGND2 17 digital ground 2 OTC
CE
IR 20 in-range output D9 21 data output; bit 9 (MSB) D8 22 data output; bit 8
2 analog supply voltage 1 (+5 V) 3 analog supply voltage 3 (+5 V)
9 analog supply voltage 2 (+5 V)
11 reference voltage input
15 digital supply voltage 2 (+5 V)
control input twos complement
18
output; active HIGH chip enable input
19
(CMOS level; active LOW)
TDA8765
SYMBOL PIN DESCRIPTION
D7 23 data output; bit 7 D6 24 data output; bit 6 D5 25 data output; bit 5 D4 26 data output; bit 4 D3 27 data output; bit 3 D2 28 data output; bit 2 D1 29 data output; bit 1 D0 30 data output; bit 0 (LSB) n.c. 31 not connected n.c. 32 not connected V
CCO
OGND 34 output ground CLK
CLK 36 clock input V
CCD1
DGND1 38 digital ground 1 SH 39 sample-and-hold enable input
AGND4 40 analog ground 4 V
CCA4
V
I
V
I
AGND1 44 analog ground 1
33 output supply voltage (3 to 5.25 V)
complementary clock input; active
35
LOW
37 digital supply voltage 1 (+5 V)
(CMOS level; active HIGH)
41 analog supply voltage 4 (+5 V) 42 positive analog input voltage 43 negative analog input voltage
1999 Jan 06 4
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital Converter (ADC)
handbook, full pagewidth
I
VIV
AGND1 44
43
42
n.c.
1 V V
AGND3
V
AGND2
CCA1 CCA3
n.c. n.c.
n.c. n.c.
CCA2
V
ref
2
3
4
5
6
7
8
9
10 11
CCA4
AGND4
V
41
40
TDA8765H
SH 39
DGND1
V
38
CCD1
37
CLK 36
CLK
35
OGND 34
TDA8765
V
33
CCO
n.c.
32 31
n.c. D0
30 29
D1
28
D2 D3
27 26
D4 D5
25 24
D6 D7
23
12 n.c.
13
14
15
16
17
n.c.
n.c.
CCD2
V
n.c.
DGND2
Fig.2 Pin configuration.
18
OTC
19 CE
20
21
22
IR
D9
D8
MGK800
1999 Jan 06 5
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital
TDA8765
Converter (ADC)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V V
V V
I
O
T T T
CCA CCD CCO
CC
I i(p-p)
stg amb j
analog supply voltage note 1 0.3 +7.0 V digital supply voltage note 1 0.3 +7.0 V output supply voltage note 1 0.3 +7.0 V supply voltage difference
V
V V V
CCA CCD CCA
V
V
CCD CCO CCO
input voltage at pins 42 and 43 referenced to AGND 0.3 V input voltage at pins 35 and 36 for
1.0 +1.0 V
1.0 +4.0 V
1.0 +4.0 V
CCA
V
CCD
differential clock drive (peak-to-peak value)
output current 10 mA storage temperature 55 +150 °C operating ambient temperature 0 +85 °C junction temperature 150 °C
V V
Note
1. The supply voltages V
CCA
, V
CCD
and V
may have any value between 0.3 and +7.0 V provided that the supply
CCO
voltage differences VCC are respected.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITION VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 75 K/W
1999 Jan 06 6
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