Philips tda8765 DATASHEETS
INTEGRATED CIRCUITS
DATA SH EET
TDA8765
10-bit high-speed Analog-to-Digital
Converter (ADC)
Preliminary specification
Supersedes data of 1998 May 08
File under Integrated Circuits, IC02
1999 Jan 06
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital
Converter (ADC)
FEATURES
• 10-bit resolution
• Sampling rate up to 55 MHz
•−3 dB bandwidth of 200 MHz
• 5 V power supplies
• Binary or twos-complement CMOS outputs
• In-range CMOS-compatible output
• TLL- CMOS-compatible static digital inputs
• 3 to 5 V CMOS-compatible digital outputs
• Differential clock input; Positive Emitter Coupled Logic
(PECL) compatible
• Power dissipation 325 mW (typical)
• Low analog input capacitance (typical 2 pF), no buffer
amplifier required
• Integrated sample-and-hold amplifier
• Differential analog input
• External amplitude range control
• Voltage controlled regulator included.
TDA8765
APPLICATIONS
• High-speed analog-to-digital conversion for
– Video signal digitizing
– High Definition TV (HDTV)
– Imaging (camera scanner)
– Medical imaging
– Telecommunication
– Base-station receiver.
GENERAL DESCRIPTION
The TDA8765 is a bipolar 10-bit Analog-to-Digital
Converter (ADC) optimized for telecommunications and
professional imaging. It converts the analog input signal
into 10-bit binary coded digital words at a maximum
sampling rate of 55 MHz. All static digital inputs (SH,
and OTC) are TTL and CMOS compatible and all outputs
are CMOS compatible. A sine wave clock input signal can
also be used.
CE
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CCA
V
CCD
V
CCO
I
CCA
I
CCD
I
CCO
INL integral non-linearity f
DNL differential non-linearity f
f
CLK(max)
analog supply voltage 4.75 5.0 5.25 V
digital supply voltage 4.75 5.0 5.25 V
output supply voltage 3.0 3.3 5.25 V
analog supply current − 33 tbf mA
digital supply current − 30 tbf mA
output supply current f
= 4 MHz; fi= 400 kHz − 3.2 tbf mA
CLK
= 4 MHz; fi= 400 kHz −±0.5 ±1.75 LSB
CLK
= 4 MHz; fi= 400 kHz −±0.3 ±0.5 LSB
CLK
maximum clock frequency
TDA8765H/4 40 −−MHz
TDA8765H/5 55 −−MHz
P
tot
total power dissipation − 325 tbf mW
ORDERING INFORMATION
TYPE
NUMBER
TDA8765H/4
TDA8765H/5 55
NAME DESCRIPTION VERSION
QFP44
plastic quad flat package; 44 leads
(lead length 1.3 mm); body 10 × 10 × 1.75 mm
PACKAGE
SOT307-2
SAMPLING
FREQUENCY (MHz)
40
1999 Jan 06 2
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital
Converter (ADC)
BLOCK DIAGRAM
V
V
V
handbook, full pagewidth
V
ref
V
V
SH
n.c.
V
CCA1
2
11
43
I
42
I
sample-
and-hold
39
1, 5 to 8,
12 to 14, 16, 31 and 32
CCA2
AMP
CCA3
3
9
TDA8765
ANALOG-TO-DIGITAL
CCA4
41
CONVERTER
CLK
35
CLK
CLOCK DRIVER
V
CCD1
36
LATCHES
OVERFLOW/
UNDERFLOW
LATCH
TDA8765
V
CCD2
37
15
OUTPUTS
OUTPUT
18
CMOS
CMOS
CEOTC
19
D9
21
22
23
24
25
26
27
28
29
30
33
20
D8
D7
D6
D5
D4
D3
D2
D1
D0
MSB
data outputs
LSB
V
CCO
IR
44
AGND1
10
AGND2
4
AGND3
40
AGND4
DGND1
Fig.1 Block diagram.
38
17
DGND2
34
MGK801
OGND
1999 Jan 06 3
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital
Converter (ADC)
PINNING
SYMBOL PIN DESCRIPTION
n.c. 1 not connected
V
CCA1
V
CCA3
AGND3 4 analog ground 3
n.c. 5 not connected
n.c. 6 not connected
n.c. 7 not connected
n.c. 8 not connected
V
CCA2
AGND2 10 analog ground 2
V
ref
n.c. 12 not connected
n.c. 13 not connected
n.c. 14 not connected
V
CCD2
n.c. 16 not connected
DGND2 17 digital ground 2
OTC
CE
IR 20 in-range output
D9 21 data output; bit 9 (MSB)
D8 22 data output; bit 8
2 analog supply voltage 1 (+5 V)
3 analog supply voltage 3 (+5 V)
9 analog supply voltage 2 (+5 V)
11 reference voltage input
15 digital supply voltage 2 (+5 V)
control input twos complement
18
output; active HIGH
chip enable input
19
(CMOS level; active LOW)
TDA8765
SYMBOL PIN DESCRIPTION
D7 23 data output; bit 7
D6 24 data output; bit 6
D5 25 data output; bit 5
D4 26 data output; bit 4
D3 27 data output; bit 3
D2 28 data output; bit 2
D1 29 data output; bit 1
D0 30 data output; bit 0 (LSB)
n.c. 31 not connected
n.c. 32 not connected
V
CCO
OGND 34 output ground
CLK
CLK 36 clock input
V
CCD1
DGND1 38 digital ground 1
SH 39 sample-and-hold enable input
AGND4 40 analog ground 4
V
CCA4
V
I
V
I
AGND1 44 analog ground 1
33 output supply voltage (3 to 5.25 V)
complementary clock input; active
35
LOW
37 digital supply voltage 1 (+5 V)
(CMOS level; active HIGH)
41 analog supply voltage 4 (+5 V)
42 positive analog input voltage
43 negative analog input voltage
1999 Jan 06 4
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital
Converter (ADC)
handbook, full pagewidth
I
VIV
AGND1
44
43
42
n.c.
1
V
V
AGND3
V
AGND2
CCA1
CCA3
n.c.
n.c.
n.c.
n.c.
CCA2
V
ref
2
3
4
5
6
7
8
9
10
11
CCA4
AGND4
V
41
40
TDA8765H
SH
39
DGND1
V
38
CCD1
37
CLK
36
CLK
35
OGND
34
TDA8765
V
33
CCO
n.c.
32
31
n.c.
D0
30
29
D1
28
D2
D3
27
26
D4
D5
25
24
D6
D7
23
12
n.c.
13
14
15
16
17
n.c.
n.c.
CCD2
V
n.c.
DGND2
Fig.2 Pin configuration.
18
OTC
19
CE
20
21
22
IR
D9
D8
MGK800
1999 Jan 06 5
Philips Semiconductors Preliminary specification
10-bit high-speed Analog-to-Digital
TDA8765
Converter (ADC)
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
V
∆V
V
V
I
O
T
T
T
CCA
CCD
CCO
CC
I
i(p-p)
stg
amb
j
analog supply voltage note 1 −0.3 +7.0 V
digital supply voltage note 1 −0.3 +7.0 V
output supply voltage note 1 −0.3 +7.0 V
supply voltage difference
− V
V
V
V
CCA
CCD
CCA
− V
− V
CCD
CCO
CCO
input voltage at pins 42 and 43 referenced to AGND 0.3 V
input voltage at pins 35 and 36 for
−1.0 +1.0 V
−1.0 +4.0 V
−1.0 +4.0 V
CCA
− V
CCD
differential clock drive (peak-to-peak
value)
output current − 10 mA
storage temperature −55 +150 °C
operating ambient temperature 0 +85 °C
junction temperature − 150 °C
V
V
Note
1. The supply voltages V
CCA
, V
CCD
and V
may have any value between −0.3 and +7.0 V provided that the supply
CCO
voltage differences ∆VCC are respected.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITION VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 75 K/W
1999 Jan 06 6
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