1999 Nov 11 5
Philips Semiconductors Product specification
Satellite ZERO-IF QPSK down-converter TDA8060TS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
T
amb
=25°C; VCC= 5 V; unless otherwise specified.
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
supply voltage −0.3 +6.0 V
V
i(max)
maximum input voltage on all pins −0.3 V
CC
V
t
sc(max)
maximum short-circuit time − 10 s
T
amb
ambient temperature −20 +85 °C
T
stg
storage temperature −55 +150 °C
T
j
junction temperature − 150 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 120 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
supply voltage 4.75 5.00 5.25 V
I
CC
supply current PEN = 5 V 63 73 83 mA
PEN=0V 607080mA
Conversion stage
V
I(RFA)
DC input voltage on pin RFA − 0.9 − V
V
I(RFB)
DC input voltage on pin RFB − 0.9 − V
V
O(IOUT)
DC output voltage on pin IOUT − 2.0 − V
V
O(QOUT)
DC output voltage on pin QOUT − 2.0 − V
Quadrature generator
V
O(LOOUT)
DC output voltage on pin LOOUT − 4.7 − V
V
O(LOOUTC)
DC output voltage on pin LOOUTC − 4.7 − V
Baseband stage
V
I(IBBIN)
DC input voltage on pin IBBIN − 2.5 − V
V
I(QBBIN)
DC input voltage on pin QBBIN − 2.5 − V
V
O(IBBOUT)
DC output voltage on pin IBBOUT − 2.5 − V
V
O(QBBOUT)
DC output voltage on pin QBBOUT − 2.5 − V