Philips TDA8050T-C1 Datasheet

DATA SH EET
Product specification Supersedes data of 1999 Jun 21 File under Integrated Circuits, IC02
1999 Dec 14
INTEGRATED CIRCUITS
TDA8050
1999 Dec 14 2
Philips Semiconductors Product specification
QPSK transmitter TDA8050
FEATURES
Programmable gain
PLL controlled carrier frequency
3-wire transmission bus
5 V supply voltage.
APPLICATIONS
QPSK modulation.
GENERAL DESCRIPTION
The QuadraturePhaseShift Keying(QPSK) transmitter is a monolithic bipolar IC dedicated for quadrature modulation of the I and Q signals. It includes:
Two double-balanced mixers
Symmetrical Voltage Controlled Oscillator (VCO) with
0 to 90 degree signal generation for modulation
Phase-Locked Loop (PLL) for IF frequency control
Conversion mixer
PLL for RF frequency control
Gain controlled output amplifier
3-wire bus and an output buffer.
Two PLLs are incorporated, the first PLL includes:
Fixed main divider
Crystal oscillator and its programmable reference
divider
Phase/frequency detector combined with afixed charge pump.
The second PLL includes:
Divide-by-four preamplifier
12-bit programmable divider
Crystal oscillator and its programmable reference
divider
Phase/frequency detector combined with a ‘clever’ chargepump which drivesthe tuning amplifier,including 9 V output.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
CC
supply voltage 4.75 5.00 5.25 V
f
c
output centre frequency 5 40 MHz
V
o(max)
maximum output level 55 dBmV
f
xtal
crystal frequency 1 4 MHz
f
ref(MOD)
reference frequency for modulator synthesizer 250 kHz
f
step
frequency step size for convertor synthesizer 50 500 kHz
T
amb
operating ambient temperature 0 70 °C
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA8050T SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
1999 Dec 14 3
Philips Semiconductors Product specification
QPSK transmitter TDA8050
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BLOCK DIAGRAM
handbook, full pagewidth
FCE181
1/2
90° 0°
×
×
Σ
27
×
TDA8050
MODULATOR CONVERTER
2524 28
1 3
2
30 31
RF_OUT
OUTEN
BUF_OUT
BUF_OUTC
26
AVCC1
4
AGND2
18
DVCC13DGND
9
AGND1
32
SW_CAP
29
AVCC2
8
7
6
5
CLK
I_IN
I_INC
Q_IN
Q_INC
15
14
DATA
16
EN
RF_OUTC
RF_INIF_FILT
RF_INCIF_FILTC
FIXED
MAIN DIVIDER
DAC
3-WIRE BUS TRANCEIVER
DIGITAL
PHASE
COMPARATOR
DIGITAL
PHASE
COMPARATOR
CHARGE
PUMP
PROGRAM-
MABLE
CHARGE
PUMP
PROGRAMMABLE
REF DIVIDER
PROGRAMMABLE
MAIN DIVIDER
PROGRAMMABLE
REF DIVIDER
101211 17 22 21
20 19
CP_MOD
TKAMOD
TKBMOD TKACONV
OSC_IN TKBCONV
TUNECONV CP_CONV
23
LOCK
Fig.1 Block diagram.
1999 Dec 14 4
Philips Semiconductors Product specification
QPSK transmitter TDA8050
PINNING
SYMBOL PIN DESCRIPTION
OUTEN 1 output enable BUF_OUT 2 output amplifier balanced output BUF_OUTC 3 output amplifier balanced output AGND2 4 converter analog ground 2 I_IN 5 I balanced input I_INC 6 I balanced input Q_IN 7 Q balanced input Q_INC 8 Q balanced input AGND1 9 modulator analog ground 1 TKAMOD 10 modulator VCO tank circuit input 2 TKBMOD 11 modulator VCO tank circuit input 1 CP_MOD 12 modulator charge pump output for
PLL loop filter DVCC 13 digital supply voltage CLK 14 3-wire bus serial control clock DATA 15 3-wire bus serial control data input EN 16 3-wire bus serial control enable OSC_IN 17 crystal oscillator input DGND 18 digital ground CP_CONV 19 converter charge pump output for
PLL loop filter TUNECONV 20 tuning voltage output for converter
VCO TKBCONV 21 converter VCO tank circuit input 1 TKACONV 22 converter VCO tank circuit input 2 LOCK 23 lock detect signal IF_FILT 24 IF balanced output to filter IF_FILTC 25 IF balanced output to filter AVCC1 26 modulator analog supply voltage RF_OUTC 27 RF balanced output to filter RF_OUT 28 RF balanced output to filter AVCC2 29 converter analog supply voltage RF_IN 30 RF balancedinputto programmable
amplifier RF_INC 31 RF balanced input toprogrammable
amplifier SW_CAP 32 switch capacitor
Fig.2 Pin configuration.
handbook, halfpage
TDA8050
FCE182
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
OUTEN
BUF_OUT
BUF_OUTC
AGND2
I_IN
I_INC
Q_IN
Q_INC
AGND1 TKAMOD TKBMOD CP_MOD
DVCC
CLK
SW_CAP RF_INC RF_IN AVCC2
RF_OUTC AVCC1
RF_OUT
IF_FILTC IF_FILT LOCK TKACONV TKBCONV TUNECONV CP_CONV
DATA
DGND OSC_IN
EN
1999 Dec 14 5
Philips Semiconductors Product specification
QPSK transmitter TDA8050
FUNCTIONAL DESCRIPTION
The I and Q are balanced analog signals at a level of 400 mV (p-p). These are mixed by two double balanced mixers with the output signal generated by a first local oscillator providing the modulated signal.
The modulated signal is then filtered by an IF filter. This filteredsignal together with asignalgenerated by asecond local oscillator is converted by a balanced mixer to produce the QPSK signal.
TheQPSK signal isamplified by again controlled amplifier to a level suitable for transmission. The gain of the controlled amplifier is buscontrolled and this amplifier can be disabled when not transmitting to provide signal attenuation.
The amplified signal is applied to an on-chip amplifier having two balanced outputs (open collector) linked totwo chip resistors (values 150 ), and 9 V. The balanced outputs are designed to drive a 2 : 1 transformer (Siemens V944) with a 75 load giving an output level of 55 dBmV.The output frequencyrange of the transmitter is 5 to 40 MHz.
The frequency of the first local oscillator operates at twice the frequency (i.e. 280 MHz) fixed by a Phase-Locked Loop (PLL) implemented in the circuit.
Thefrequencyof the second localoscillatoroperatesin the bandwidth 145 to 180 MHz and programmable due to a PLL implemented in the circuit.
The VCO of both first and secondlocal oscillatorsrequires an external LC tank circuit with two varicap diodes.
The data to the PLL is loaded in bursts framed by the signal EN. Programming rising clock edges and their appropriate data bits are ignored until EN goes active (LOW). The internal latches are updated with the latest programming data when EN returns inactive (HIGH). The last 14 bits are stored in the programming register.
No check is made on the number of clock pulses received during the time programming is enabled. A wrong active
clock edge will be generated causing a shift of data bits, if EN goes HIGH while CLK is still LOW. At power
up, EN should beHIGH. The lock detector output LOCK is HIGH when both PLLs are in lock.
The main divider ratio and the reference divider ratios are provided via the serial bus. A control register controls the Digital-to-Analog Converter (DAC), the output amplifier and the charge pump currents (Tables 1, 2 and 3).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
supply voltage 0.3 +6.0 V
t
sc
short-circuit time (every pin to VCCor GND) 10 s
V
max
voltage on all pins except BUF_OUT, BUF_OUTC and TUNECONV 0.3 V
CC
V
V
o(tune)
output tuning voltage 0.3 +30 V
V
o(buf)
output buffer voltage on pins BUF_OUTand BUF_OUTC 10 V
P
tot
maximum power dissipation 800 mW
T
amb
operating ambient temperature 0 70 °C
T
stg
storage temperature 40 +150 °C
T
j(max)
junction temperature 150 °C
1999 Dec 14 6
Philips Semiconductors Product specification
QPSK transmitter TDA8050
THERMAL CHARACTERISTICS
HANDLING
Human Body Model (HBM): The IC pins withstand 2 kV except pins 27 and 28 (1750 V). Machine Model (MM): The IC pins withstand 100 V.
CHARACTERISTICS
Measured in application circuit (see Fig.9) with the following conditions: V
CC
=5V; T
amb
=25°C; all AC units are RMS
values; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 63 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
CCA(mod)
modulator analog supply voltage 4.75 5 5.25 V
I
CCA(mod)
modulator analog supply current 41 mA
V
CCA(conv)
converter analog supply voltage 4.75 5 5.25 V
I
CCA(conv)
converter analog supply current 48 mA
I
CC(buf)
buffer output supply current 44 mA
V
CCD
digital supply voltage 4.75 5 5.25 V
I
CCD
digital supply current 22 mA
V
CC(tune)
tuning supply voltage −−9V
Quadrature modulator I and Q inputs
V
I(DC)
input DC level over the complete range of
temperature
0.5VCC− V
V
i(p-p)
signal input level (balanced) (peak-to-peak value)
indicative 400 500 mV
f
i(max)
I and Q maximum input frequency indicative 10 MHz
Z
i(dif)
differential input impedance 4.4 k
B
(1dB)
1 dB amplifier bandwidth indicative 10 MHz MODULATOR f
c
output centre frequency −−140 MHz
A amplitude imbalance see Fig.3 −−±1dB ∆Φ phase imbalance −−±2 deg
LO
(sup)
LO suppression see Fig.3 −−28 dBc Z
o(dif)
differential output impedance 1.8 k MODULATOR VOLTAGE CONTROLLED OSCILLATOR f
osc(mod)
oscillation frequency VCO −−280 MHz
1999 Dec 14 7
Philips Semiconductors Product specification
QPSK transmitter TDA8050
Converter output
V
o
output level fi= 30 MHz; V
i(dif)
= 100 mV
at I and Q inputs
37.5 40 42.5 dBmV
V
o
output flatness fi= 5 to 40 MHz;
V
i(dif)
= 100 mV at I and Q
inputs
−−2dB
f
c
output centre frequency 5 40 MHz Z
o(dif)
differential output impedance 150 −Ω IM3 3rd-order intermodulation distortion see Fig.4 −−−35 dBc H
2
2nd-order harmonic of 5 to 40 MHz
signal
fi= 10 to 80 MHz; V
i(dif)
= 100 mV at I and Q
inputs
−−−45 dBc
H
3
3rd-order harmonic of 5 to 40 MHz
signal
fi= 15 to 120 MHz; V
i(dif)
= 100 mV at I and Q
inputs
−−−45 dBc
S
o
mixer spurious outputs of
5 to 40 MHz signal
fi= 5 to 40 MHz; V
i(dif)
= 100 mV at I and Q
inputs
−−−50 dBc
Converter voltage controlled oscillator
f
osc(min)
minimum oscillation frequency −−145 MHz f
osc(max)
maximum oscillation frequency 180 −−MHz Programmable gain and output buffer; note 1 Z
i(dif)
differential input impedance 5.6 k
G output level step size −−2dBBuf
o
output level adjust range Vi= 30 dBmV sine wave;
40 MHz at pin RF_IN and RF_INC; DAC = 0 to 31
32 −−dB
V
o
output level 55 dBmV V
o
output flatness fi= 5 to 40 MHz;
Vi= 30 dBmV sine wave; DAC = 28
−−2dB
V
O(ENL)
output controlled enable LOW output buffer on −−0.8 V V
O(ENH)
output controlled enable HIGH output buffer off 2.4 −−V ISO disable isolation V
i(dif)
= 100 mV; Vo= 55 dBmV; DAC = 28; fi= 40 MHz; OE = 0.5
35 −−dBc
G
(max)
maximum gain see Fig.5 22 dB
V
o(1dB)
1 dB compression point see Fig.5 60 −−dBmV
H
2
2nd-order harmonic of 5 to 40 MHz signal
see Fig.6
f
i
=10to40MHz −−−45 dBc
f
i
= 54 to 120 MHz −−−35 dBc
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1999 Dec 14 8
Philips Semiconductors Product specification
QPSK transmitter TDA8050
H
3
3rd-order harmonic of 5 to 40 MHz signal
Fig.6
f
i
=15to40MHz −−−45 dBc
f
i
= 54 to 120 MHz −−−35 dBc
Overall; note 1
Φ
osc
phase noise note 2;
at 10 kHz −−70 dBc/Hz at 100 kHz −−90 dBc/Hz
S
o
spurious signals of 5 to 40 MHz signal
fi= 5 to 40 MHz; V
i(dif)
= 100 mV at I and Q inputs; Vo= 30 to 55 dBmV
−−−50 dBc
ISO
tot
total isolation at I/Q mid-range see Fig.7 −−−65 dBc
C/N carrier to noise ratio at final output
at 2 MHz from carrier
V
i(dif)
= 100 mV Vo= 35 to 55 dBmV; fi= 26.5 MHz
113 dBc/Hz
Crystal oscillator
f
xtal
crystal frequency note 3 1 4 MHz
Z
i
input impedance f
xtal
= 4 MHz 600 1200 −Ω
V
I(DC)
DC input level 2.9 V
Modulator synthesizer
f
ref(mod)
reference frequency 250 kHz
RDR1 reference divider ratio
programmable
4 16
ND1 fixed main divider ratio 1120 I
cp
charge-pump current fixed 0.30 mA
Converter synthesizer
f
step
frequency step size 50 500 kHz RD2 fixed reference divider ratio 2 RDR2 reference divider ratio
programmable
see Table 4 4 160
ND2 fixed main divider ratio 4 NDR2 programmable main divider ratio see Table 4 290 3600
Three wire bus
V
IL
LOW-level input voltage −−0.8 V V
IH
HIGH-level input voltage 2.4 −−V
Lock detect pin
V
o(lock)
output voltage (lock) 5 V V
o(unlock)
output voltage (unlock) 0.02 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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