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INTEGRATED CIRCUITS
SL2 FCS20
Product Specification
Philips
ADDENDUM
I-CONNECT SLI
Flip Chip Package Specification
Revision 3.0
Public
Semiconductors
January 2003
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Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
CONTENTS
1 SCOPE...................................................................................................................................... 3
2 SPECIFICATIONS...................................................................................................................... 4
2.1 Chip........................................................................................................................................... 4
2.2 ABSOLUTE MAXIMUM RATINGS
2.3 OPERATING CONDITIONS ........................................................................................................ 4
2.4 Electrical Characteristics ............................................................................................................. 5
3 ORDERING INFORMATION....................................................................................................... 5
4 DEFINITIONS ............................................................................................................................ 6
5 DISCLAIMERS........................................................................................................................... 6
1, 2
........................................................................................... 4
5.1 Life support applications .............................................................................................................. 6
5.2 Licence Policy............................................................................................................................ 6
6 REVISION HISTORY.................................................................................................................. 7
I•CODE is a registered trademark of Philips Electronics N.V.
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Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
1 SCOPE
This document gives specifications for the product SL2FCS20; the I-CONNECT SLI.
• The SL2FCS2001DV/DH is the integrated circuit SL2ICS2001 in the package SOT732AA1.
• The SL2FCS2001DV/DC is the integrated circuit SL2ICS2001 in the package SOT732BB1.
Therefore this document encompasses all information not covered by the specification of the package and/or
the functional specification of the integrated circuit.
• Detailed information on the package is given in the specification FCP 2.1 Flip Chip Package.
• Functionality of the integrated circuit is described in the Functional Specification I•CODE SLI Smart
Label IC SL2ICS2001.
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Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
2 SPECIFICATIONS
2.1 Chip
Functionality of the integrated circuit is described in the I•CODE SLI Smart Label IC SL2ICS2001 Functional
Specification.
2.2 ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS TEST
1, 2
MIN TYP
1
MAX UNIT
CONDITIONS
ESD Voltage Immunity
MIL-STD-883D,
Method 3015.7,
Human Body Model
± 2
kV
peak
Input Peak Current -60 +60 mApeak
Processing temperature: refer to specification “FCP 2.1 Flip Chip Package”
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and
Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
2.3 OPERATING CONDITIONS
SYMBOL PARAMETER
T
j op
I
LA-LB
Operating Junction Temperature - 25 + 85 °C
Input Current
2
TEST
CONDITIONS
MIN TYP
1
Minimum Supply Voltage
V
LA-LB
f
op
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter I
3. Bandwidth limitation (±7 kHz) according to ISM band regulations.
for READ/WRITE/EAS
Operating Frequency
3
± 2.5 ± 2.6 ± 2.9
13.553 13.560 13.567 MHz
4
MAX UNIT
30
LA-LB
mA
rms
V
rms
).
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Philips Semiconductors Product Specification Rev 3.0 January 2003
V -
V
I-CONNECT Specification SL2 FCS 20
2.4 Electrical Characteristics
T
= - 25 to +85 °C
jop
SYMBOL PARAMETER
C
res
P
min
Input Capacitance between LA - LB
Minimum Operating Supply Power
TEST
CONDITIONS
2
V
= 2 V
LA-LB
3
rms
MIN TYP
22,7 23,5 25,1 pF
1
MAX UNIT
280 µW
m
t
P sm
t
R
mod
t
ret
n
write
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. Measured with an HP4285A LCR meter at 13.56 MHz.
3. Including losses in resonant capacitor and rectifier.
** : refer to ISO/IEC 15693-2 and 15693-3 including pulse shapes and tolerances; proper coil design assumed
Modulation of RF Voltage for
Demodulator Response
Modulation Pulse Length
of RF Voltage
Demodulator Response Time m ≥ 10 %, 100% ** ** ** µs
D
Load Modulation ** ** ** Ω
EEPROM Data Retention
EEPROM Write Endurance 100 000 Cycles
m
T
max min
=
V + V
max min
≤ 55 °C
amb
** ** **
** ** ** µs
10 Years
%
3 ORDERING INFORMATION
Ordering Name Description Ordering Code
SL2FCS2001DV/DH I-CONNECT SLI,
Hot laminated backside tape
SL2FCS2001DV/DC I-CONNECT SLI,
Cold laminated backside tape
12NC: 9352 725 07118
12NC: 9352 725 06118
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Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
4 DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be
published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress
above one or more of the limiting values may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or at any other conditions above those given in the
Characteristics section of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
5 DISCLAIMERS
5.1 Life support applications
These products are not designed for use in life support appliances, devices, or systems where malfunction of
these products can reasonably be expected to result in personal injury. Philips customers using or selling
these products for use in such applications do so on their own risk and agree to fully indemnify Philips for
any damages resulting from such improper use or sale.
5.2 Licence Policy
Purchase of this Philips IC with a functionally according to ISO/IEC 15693 Standard does not convey an
implied license under any patent right on this standard. A license for the Philips portfolio of patents on the
ISO/IEC 15693 Standard can be obtained via the Philips Intellectual Property and Standards department.
For more information please contact the nearest Philips Semiconductors sales office.
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I-CONNECT Specification SL2 FCS 20
6 REVISION HISTORY
Table 1 Addendum Flip Chip Package Specification Revision History
REVISION DATE CPCN PAGE DESCRIPTION
3.0 Jan. 2003 Product version
2.1 Oct. 2002 - 5 typo of 12NC ordering code
2.0 Sept. 2002 Preliminary version
1.0 May 2002 Initital version.
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I-CONNECT Specification SL2 FCS 20
NOTES
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Philips Semiconductors - a worldwide company
Philips
Contact Information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002 SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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