Philips PLUS173BA, PLUS173BN, PLUS173DA, PLUS173DN Datasheet
Philips Semiconductors Programmable Logic Devices Product specification
PLUS173B/D
Programmable logic arrays
(22 × 42 × 10)
33
October 22, 1993 853–1298 11164
DESCRIPTION
The PLUS173 PLDs are high speed,
combinatorial Programmable Logic Arrays.
The Philips Semiconductors state-of-the-art
Oxide Isolated Bipolar fabrication process is
employed to produce propagation delays as
short as 12ns.
The 24-pin PLUS173 devices have a
programmable AND array and a
programmable OR array. Unlike PAL
devices, 100% product term sharing is
supported. Any of the 32 logic product terms
can be connected to any or all of the 10
output OR gates. Most PAL ICs are limited to
7 AND terms per OR function; the PLUS173
devices can support up to 32 input wide OR
functions.
The polarity of each output is userprogrammable as either Active-High or
Active-Low, thus allowing AND-OR or
AND-NOR logic implementation. This feature
adds an element of design flexibility,
particularly when implementing complex
decoding functions.
The PLUS173 devices are userprogrammable using one of several
commercially available, industry standard
PLD programmers.
FEATURES
•I/O propagation delays (worst case)
– PLUS173B – 15ns max.
– PLUS173D – 12ns max.
•Functional superset of 20L10 and most
other 24-pin combinatorial PAL devices
•Two programmable arrays
– Supports 32 input wide OR functions
•12 inputs
•10 bi-directional I/O
•42 AND gates
– 32 logic product terms
– 10 direction control terms
•Programmable output polarity
– Active-High or Active-Low
•Security fuse
•3-State outputs
•Power dissipation: 750mW (typ.)
•TTL Compatible
APPLICATIONS
•Random logic
•Code converters
•Fault detectors
•Function generators
•Address mapping
•Multiplexing
PIN CONFIGURATIONS
1234
5
6
7
8
9
10
11
12 13 14 15 16 17 18
19
20
21
22
23
24
25
262728
1
2
3
4
5
6
7
8
9
10
11
12 13
14
15
16
17
18
19
20
21
22
23
24
N Package
I0
I1
I2
I3
I4
I5
I6
I7
I8
I9
I10
V
CC
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
I11
GND
A Package
N = Plastic Dual In-Line (300mil-wide)
I0I1I2I3
V
CC
B9 B8
NC
I4
I5
I6
I7
I8
NC
I9 I10 GND I11 B0 B1 B2
NC
B3
B7
B6
B5
B4
NC
A = Plastic Leaded Chip Carrier
ORDERING INFORMATION
DESCRIPTION tPD (MAX) ORDER CODE DRAWING NUMBER
24-Pin Plastic Dual In-Line 300mil-wide 15ns PLUS173BN 0410D
24-Pin Plastic Dual In-Line 300mil-wide 12ns PLUS173DN 0410D
28-Pin Plastic Leaded Chip Carrier 15ns PLUS173BA 0401F
28-Pin Plastic Leaded Chip Carrier 12ns PLUS173DA 0401F
PAL is a registered trademark of Advanced Micro Devices Corporation.
Philips Semiconductors Programmable Logic Devices Product specification
PLUS173B/D
Programmable logic arrays
(22 × 42 × 10)
October 22, 1993
34
LOGIC DIAGRAM
NOTES:
1. All programmed ‘AND’ gate locations are pulled to logic “1”.
2. All programmed ‘OR’ gate locations are pulled to logic “0”.
3. Programmable connection.
(LOGIC TERMS–P) (CONTROL TERMS)
1
2
3
4
5
6
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
I0
I1
I2
I3
I4
I5
I6
I7
I8
I9
I10
I11
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
31 24 23 16 15 8 7 0
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
X9
X8
X7
X6
X5
X4
X3
X2
X1
X0
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
Philips Semiconductors Programmable Logic Devices Product specification
PLUS173B/D
Programmable logic arrays
(22 × 42 × 10)
October 22, 1993
35
FUNCTIONAL DIAGRAM
P31 P0 D0 D9
I0
I11
B0
B9
B9
B0
S0
S9
X9
X0
ABSOLUTE MAXIMUM RATINGS
1
THERMAL RATINGS
RATING
SYMBOL PARAMETER MIN MAX UNIT
V
CC
Supply voltage +7 V
DC
V
IN
Input voltage +5.5 V
DC
V
OUT
Output voltage +5.5 V
DC
I
IN
Input currents –30 +30 mA
I
OUT
Output currents +100 mA
T
amb
Operating free-air temperature range 0 +75 °C
T
stg
Storage temperature range –65 +150 °C
NOTES:
1. Stresses above those listed may cause malfunction or permanent damage to the device. This
is a stress rating only. Functional operation at these or any other condition above those
indicated in the operational and programming specification of the device is not implied.
TEMPERATURE
Maximum junction 150°C
Maximum ambient 75
°C
Allowable thermal rise 75
°C
ambient to junction
Loading...