Philips PCF8548U-2-F1 Datasheet

DATA SH EET
Product specification Supersedes data of 1999 Mar 22 File under Integrated Circuits, IC12
1999 Aug 16
INTEGRATED CIRCUITS
PCF8548
1999 Aug 16 2
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
CONTENTS
1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION
3.1 Packages 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING 7 PIN FUNCTIONS
7.1 R0 to R64: row driver outputs
7.2 C0 to C101: column driver outputs
7.3 V
SS1
and V
SS2
: negative power supply rails
7.4 V
DD1
to V
DD3
: positive power supply rails
7.5 V
LCDIN
: LCD power supply
7.6 V
LCDOUT
: LCD power supply
7.7 V
LCDSENSE
: voltage multiplier regulation input
(V
LCD
)
7.8 T1 to T12: test pads
7.9 SDAIN and SDAOUT: I2C-bus data lines
7.10 SCL: I2C-bus clock signal
7.11 SA0: slave address
7.12 OSC: oscillator
7.13 RES: reset 8 BLOCK DIAGRAM FUNCTIONS
8.1 Oscillator
8.2 I2C-bus interface
8.3 Display control logic
8.4 Display Data RAM (DDRAM)
8.5 Timing generator
8.6 LCD row and column drivers 9 INITIALIZATION 10 ADDRESSING
10.1 Display data RAM structure
10.2 RAM access 11 I2C-BUS INTERFACE
11.1 Characteristics of the I2C-bus
11.1.1 Bit transfer
11.1.2 START and STOP conditions
11.1.3 System configuration
11.1.4 Acknowledge
11.2 I2C-bus protocol
12 INSTRUCTIONS
12.1 External reset (RES)
12.2 Function set
12.2.1 Power-Down (PD)
12.2.2 V
12.2.3 H
12.2.4 MX
12.2.5 MY
12.3 Display control
12.3.1 D and E
12.4 Display configuration
12.4.1 TRS
12.4.2 BRS
12.5 Set Y address of RAM
12.6 Set X address of RAM
12.7 Set HV generator stages
12.7.1 S[1:0]
12.8 Temperature control
12.9 Bias system
12.10 Set VOP value 13 LIMITING VALUES 14 HANDLING 15 DC CHARACTERISTICS 16 AC CHARACTERISTICS 17 RESET 18 APPLICATION INFORMATION 19 CHIP INFORMATION 20 PAD INFORMATION 21 DEVICE PROTECTION DIAGRAM 22 TRAY INFORMATION 23 DEFINITIONS 24 LIFE SUPPORT APPLICATIONS 25 PURCHASE OF PHILIPS I2C COMPONENTS 26 BARE DIE DISCLAIMER
1999 Aug 16 3
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
1 FEATURES
Single-chip LCD controller/driver
65 row and 102 column outputs
Display data RAM 65 × 102 bits
On-chip:
– Configurable 5 (4, 3 and 2) × voltage multiplier
generating V
LCD
(external V
LCD
also possible) – Generation of intermediate LCD bias voltages – Oscillator requires no external components
(external clock also possible).
400 kbits/s fast I2C-bus interface
CMOS compatible inputs
Mux rate: 1 : 65
Logic supply voltage range V
DD1
to VSS:
– 1.9 to 5.5 V.
High voltage generator supply voltage range V
DD2
to
VSS and V
DD3
to VSS:
– 2.4 to 4.5 V with LCD voltage internally generated
(voltage generator enabled).
Display supply voltage range V
LCD
to VSS:
– 4.5 to 9.0 V
Low power consumption, suitable for battery operated systems
Temperature compensation of V
LCD
Slim chip layout, suitable for Chip-On-Glass (COG) applications
Programmable bottom row pads mirroring and top row pads mirroring, for compatibility with both Tape Carrier Package (TCP) and COG applications.
2 APPLICATIONS
Telecom equipment
Portable instruments
Point of sale terminals.
3 GENERAL DESCRIPTION
The PCF8548is a low power CMOS LCD controller driver, designed to drive a graphic display of 65 rows and 102 columns. All necessary functions for the display are provided in a single chip, including on-chip generation of LCD supply and bias voltages, resulting in a minimum of external components and low power consumption. The PCF8548 interfaces to most microcontrollers via an I2C-bus interface.
3.1 Packages
The PCF8548is available aschip with bumpsin tray;tape carrier package is available on request.
4 ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PCF8548U/2 Tray chip with bumps in tray PCF8548U/9 Bumped wafer quarter wafer
1999 Aug 16 4
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
5 BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGS393
DISPLAY DATA RAM
65 × 102 BITS
DATA LATCHES
COLUMN DRIVERS
SHIFT REGISTER
ROW DRIVERS
C0 to C101
PCF8548
R0 to R64
102
DISPLAY CONTROL LOGIC
T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12
TIMING
GENERATOR
OSCILLATOR
OSC
I
2
C-BUS
INTERFACE
SA0SDAOUT SDAIN SCL
V
LCDOUT
V
LCDSENSE
V
LCDIN
RES
V
SS2
V
SS1
V
DD1
V
DD2VDD3
HIGH
VOLTAGE
GENERATOR
4 STAGES
BIAS
VOLTAGE
GENERATOR
65
6 PINNING
SYMBOL PAD DESCRIPTION
RES 1 external reset input (active
LOW)
SDAOUT 2 I
2
C-bus data output
SDAIN 3 and 4 I
2
C-bus data input
SCL 5 and 6 I
2
C-bus clock input T2 7 test 2 output SA0 8 least significant bit of slave
address T7 to T5 9 to 11 test inputs T4 and T3 12 and 13 test input/output T1 14 test input V
SS1
15 to 20 negative power supply 1
V
SS2
21 to 26 negative power supply 2
V
LCDOUT
28 to 33 voltage multiplier output
V
LCDSENSE
34 voltage multiplier
regulation input (V
LCD
)
V
LCDIN
35 to 40 LCD supply voltage R32 to R19 41 to 54 LCD row driver outputs R0 to R18 57 to 75 LCD row driver outputs C0 to C101 76 to 177 LCD column driver outputs R50 to R33 178 to 195 LCD row driver outputs R51 to R64 198 to 211 LCD row driver outputs T12 to T9 212 to 215 test outputs OSC 216 oscillator T8 217 test input V
DD1
218 to 223 supply voltage 1
V
DD3
224 to 226 supply voltage 3
V
DD2
227 to 233 supply voltage 2 27, 55, 56,
196 and 197
dummy pads
SYMBOL PAD DESCRIPTION
1999 Aug 16 5
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
7 PIN FUNCTIONS
7.1 R0 to R64: row driver outputs
These pads output the row signals.
7.2 C0 to C101: column driver outputs
These pads output the column signals.
7.3 V
SS1
and V
SS2
: negative power supply rails
V
SS2
is related to V
DD2
and V
DD3
and V
SS1
is related to
V
DD1
.
7.4 V
DD1
to V
DD3
: positive power supply rails
V
DD2
and V
DD3
are the supply voltages for the internal voltage generator. Both have to be at the same voltage and must beconnected together outside of the chip. If the internal voltagegenerator isnot used, they should bothbe connected to power or to the V
DD1
pad.
V
DD1
is used as the power supply for the rest of the chip.
This voltage can be a different voltage than V
DD2
and
V
DD3
.
7.5 V
LCDIN
: LCD power supply
Internally generated positive power supply for the liquid crystal display. An external LCD supply voltage can be supplied using the V
LCDIN
pad. In this case, V
LCDOUT
has to be connected to ground, and the internal voltage generator has to be programmed to zero. If the PCF8548 is in power-down mode, the external LCD supply voltage must be switched off.
7.6 V
LCDOUT
: LCD power supply
Positive power supply for the liquid crystal display. If the internal voltage generator is used, the two supply rails V
LCDIN
and V
LCDOUT
must be connected together and an
external capacitor must be connected (see Fig.19).
7.7 V
LCDSENSE
: voltage multiplier regulation input
(V
LCD
)
V
LCDSENSE
is the input voltage for the internal voltage
multiplier regulation. If the internal voltage generator is used then V
LCDSENSE
must be connected to V
LCDOUT
. If an external supply
voltage is used then V
LCDSENSE
must be connected to
ground.
7.8 T1 to T12: test pads
T1 and T3 to T7 must be connected to V
SS1
. T8 must be
connected to V
DD1
. T2 and T9 to T12 must be left
open-circuit; not accessible to user.
7.9 SDAIN and SDAOUT: I
2
C-bus data lines
Serial data and acknowledge lines for the I2C-bus. By connecting SDAINto SDAOUT,the SDA linebecomes fully I2C-bus compatible. Having the acknowledge output (SDAOUT) separated from the serial data line is advantageous in Chip-On-Glass (COG) applications. In COG applications where the track resistance from the SDAOUT padto the system SDA line can besignificant, a potential divider is generated by the bus pull-up resistor and the Indium Tin Oxide (ITO) track resistance. It is possible that during the acknowledge cycle the PCF8548 will not be able to create a valid logic 0 level. By splitting the SDA input from the output thedevice could be used in a mode that ignores the acknowledge bit. In COG applications wherethe acknowledge cycleis required, it is necessary to minimize the track resistance from the SDACK pad to the system SDA line to guarantee a valid LOW level.
7.10 SCL: I
2
C-bus clock signal
I2C-bus serial clock signal input.
7.11 SA0: slave address
Two different slave addresses can be selected using the SA0 pad. This allows two PCF8548 LCD drivers to be connected to the same I2C-bus.
7.12 OSC: oscillator
When the on-chip oscillator is used this input must be connected to V
DD1
. An external clock signal, if used, is
connected to this input.
7.13 RES: reset
This signalis used toreset the device.The signal isactive LOW.
1999 Aug 16 6
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
8 BLOCK DIAGRAM FUNCTIONS
8.1 Oscillator
The on-chip oscillator provides the clock signal for the display system.No external componentsare required and the OSC input must be connected to V
DD1
. An external
clock signal (if used), is connected to this input.
8.2 I
2
C-bus interface
The I2C-bus interface receives and executes the commands sent viathe I2C-bus. It alsoreceives RAMdata and sends it to the RAM.
8.3 Display control logic
The display control logic generates the control signals to read from the RAM via the 102 bits parallel port. It also generates the control signals for the row and column drivers.
8.4 Display Data RAM (DDRAM)
The PCF8548 contains a 65 × 102 bit static RAM which storesthe displaydata. TheRAM is dividedinto 8 banksof 102 bytes and 1 bank of 102 bits [(8 × 8+1)×102 bits]. DuringRAM access,data istransferred tothe RAMvia the I2C-bus interface. There is a direct correspondence between the X address and column output number.
8.5 Timing generator
The timing generator produces the various signals required to drive the internal circuitry. Internal chip operation is not disturbed by operations on the I
2
C-bus.
8.6 LCD row and column drivers
The PCF8548 contains 65 row and 102 column drivers, which connect the appropriate LCD bias voltages to the display in accordance with the data to be displayed. Figure 2shows typicalwaveforms.Unused outputsshould be left unconnected.
9 INITIALIZATION
Immediately following Power-on, all internal registers and theRAM contentare undefined.A resetpulse mustfirst be applied.
Reset isaccomplished by applying an external RES pulse (active LOW).When reset occurswithin the specified time allinternal registersareinitialized, howeverthe RAM isstill undefined. The state after reset is described in Section 12.1.
The RES input must be 0.3 VDD when VDD reaches V
DD(min)
(or higher)within a maximumtime t
VHRL
after V
DD
goes HIGH (see Fig.17).
1999 Aug 16 7
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
MGS671
ROW 0 R0 (t)
ROW 1 R1 (t)
COL 0 C0 (t)
COL 1 C1 (t)
0 V
0 V
V3 V
SS
frame n frame n + 1
012345678... ... 64 012345678... ... 64
V
state1
(t)
V
state1
(t)
V
state2
(t)
V
LCD
V
2
V
3
V
4
V
5
V
SS
V
LCD
V
2
V
3
V
4
V
5
V
SS
V
LCD
V
2
V
3
V
4
V
5
V
SS
V
LCD
V
2
V
3
V
4
V
5
V
SS
V
LCD
V
SS
V
LCD
V
2
V4 V
5
VSS V
5
V4 V
LCD
V3 V
SS
V
SS
V
LCD
0 V
0 V
V3 V
SS
V
state2
(t)
V
LCD
V
SS
V
LCD
V
2
V4 V
5
V4 V
LCD
V3 V
SS
VSS V
5
V
SS
V
LCD
Fig.2 Typical LCD driver waveforms.
V
state1
(t) = C1(t) R0(t).
V
state2
(t) = C1(t) R1(t).
1999 Aug 16 8
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
Fig.3 DDRAM to display mapping.
top of LCD
MGS395
DDRAM
bank 0
bank 1
bank 2
bank 3
bank 7
bank 8
LCD
1999 Aug 16 9
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
10 ADDRESSING
The Display Data RAM (DDRAM) of the PCF8548 is accessed as indicated in Figs 3, 6, 7, 8 and 9. The DDRAM has a matrix of 65 × 102 bits. The RAM cells are addressed by the X and Y address pointers. The address ranges are X0 to X101 (1100101b) and Y0 to Y8(1000b). Addressesoutside ofthese rangesare not allowed. In verticaladdressing mode (V = 1) the Y address increments after each byte (see Fig.5). After the last Y address (Y = 8), Y wraps around to 0 and X incrementsto addressthe nextcolumn. Inthe horizontaladdressing mode (V = 0)the X addressincrements aftereach byte (see Fig.4). After thelast X address(X = 101), X wraps around to 0 andY increments toaddress thenext row. After the very last address (X = 101 and Y = 8) the address pointers wrap around to address X = 0 andY=0.
10.1 Display data RAM structure
Fig.4 Sequence of writing data bytes into RAM with horizontal addressing (V = 0).
handbook, full pagewidth
MGS396
012 102 103 104 204 205 206 306 307 308 408 409 410 510 511 512 612 613 614 714 715 716 816 817 818
0
8917
0 101X address
Y address
1999 Aug 16 10
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
The DO bit defines the bit order (MSB on top or MSB on bottom) for writing to the RAM (see Figs 6 and 7).
Fig.5 Sequence of writing data bytes into RAM with vertical addressing (V = 1).
handbook, full pagewidth
MGS397
09
110
2
3
4
5
6
7
8
0
8917
0 101X address
Y address
Fig.6 RAM byte organization, if DO = 0.
handbook, full pagewidth
MGS398
MSB
LSB
MSB
LSB
1999 Aug 16 11
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
The MX bit allows a horizontal mirroring; when MX = 1, the X address space is mirrored. The address X = 0 is then located at the right side (column 101) of the display(see Fig.9). When MX = 0 the mirroringis disabled and the address X = 0 is located at the left side (column 0) of the display (see Fig.8).
Fig.7 RAM byte organization, if DO = 1.
handbook, full pagewidth
MGS399
LSB
MSB
LSB
MSB
Fig.8 RAM format addressing (MX = 0).
handbook, full pagewidth
MGS400
0
8
0 101X address
Y address
1999 Aug 16 12
Philips Semiconductors Product specification
65 × 102 pixels matrix LCD driver PCF8548
10.2 RAM access
If the D/C bit is logic 1 the RAM can be written to. The data is written to the RAM during the acknowledge cycle.
Fig.9 RAM format addressing (MX = 1).
handbook, full pagewidth
MBL044
0
8
101 0X address
Y address
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