Philips PCA8581CT-F6, PCA8581T-F6, PCA8581T-F6L, PCF8581CT-F4 Datasheet

DATA SH EET

Product specification
Supersedes data of 1996 Aug 19
File under Integrated Circuits, IC12

1997 Apr 02

INTEGRATED CIRCUITS

PCA8581; PCA8581C

128 × 8-bit EEPROM with I

2

C-bus

interface

1997 Apr 02 2

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 PINNING
7 CHARACTERISTICS OF THE I2C-BUS

7.1 Bit transfer

7.2 Start and stop conditions

7.3 System configuration

7.4 Acknowledge

7.5 I2C-bus protocol
8 LIMITING VALUES
9 HANDLING
10 DC CHARACTERISTICS
11 AC CHARACTERISTICS
12 APPLICATION INFORMATION

12.2 Application example

12.2 Slave address

12.3 Diode protection
13 PACKAGE OUTLINES
14 SOLDERING

14.1 Introduction

14.2 DIP

14.2.1 Soldering by dipping or by wave

14.2.2 Repairing soldered joints

14.3 SO

14.3.1 Reflow soldering

14.3.2 Wave soldering

14.3.3 Repairing soldered joints
15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS

1997 Apr 02 3

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

1 FEATURES

• Operating supply voltage:
– 4.5 to 5.5 V (PCA8581)
– 2.5 to 6.0 V (PCA8581C)

• Integrated voltage multiplier and timer for writing
(no external components required)

• Automatic erase before write

• Low standby current; maximum 10 µA

• 8-byte page write mode

• Serial input/output bus (I2C-bus)

• Address by 3 hardware address pins

• Automatic word address incrementing

• Designed for minimum 10000 write cycles per byte

• 10 years minimum non-volatile data retention

• Infinite number of read cycles

• Pin and address compatibility to PCF8570C and

PCF8582

• Operating ambient temperature: −25 to +85 °C.

2 GENERAL DESCRIPTION

The PCA8581 and PCA8581C are low power CMOS
EEPROMs with standard and wide operating voltages:

4.5 to 5.5 V (PCA8581)

2.5 to 6.0 V (PCA8581C).

In the following text, the generic term ‘PCA8581’ is used to
refer to both types in all packages except when otherwise
specified.

The PCA8581 is organized as 128 words of 8-bytes.
Addresses and data are transferred serially via a two-line

bidirectional bus (I2C-bus). The built-in word address
register is incremented automatically after each written or
read data byte. All bytes can be read in a single operation.
Up to 8 bytes can be written in one operation, reducing the
total write time per byte. Three address pins, A0, A1 and
A2 are used to define the hardware address, allowing the
use of up to 8 devices connected to the bus without
additional hardware.

3 QUICK REFERENCE DATA

4 ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

supply voltage

PCA8581 4.5 5.5 V
PCA8581C 2.5 6.0 V

I

DD

supply current (standby) f

SCL

= 0 Hz − 10 µA

T

amb

operating ambient temperature −25 +85 °C

T

stg

storage temperature without EEPROM retention −65 +150 °C

with EEPROM retention −65 +85 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

PCA8581P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA8581CP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA8581T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
PCA8581CT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

1997 Apr 02 4

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

5 BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MLB887

TIMER

WORD

ADDRESS

REGISTER

SHIFT

REGISTER

POWER

ON

RESET

INPUT

FILTER

VOLTAGE

MULTIPLIER

ROW

SELECT

MEMORY

CELL

ARRAY

COLUMN

SELECT

MULTIPLEXER

R/W

CONTROL

I C BUS

CONTROL

2

6
5

SCL

SDA

3

A2

2

A1

1

A0

8

V

DD

4

V

SS

7

TEST

PCA8581

PCA8581C

7

8

6 PINNING

SYMBOL PIN DESCRIPTION

A0 1 hardware address input 0
A1 2 hardware address input 1
A2 3 hardware address input 2
V

SS

4 negative supply
SDA 5 serial data input/output
SCL 6 serial clock input
TEST 7 test output can be connected to V

SS

, VDD or left

open-circuit

V

DD

8 positive supply

Fig.2 Pin configuration.

page

1
2
3
4

8
7
6
5

MLB888

PCA8581

PCA8581C

SCL
SDA

A2

A1

A0

V

DD

V

SS

TEST

1997 Apr 02 5

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

7 CHARACTERISTICS OF THE I2C-BUS

The I2C-bus is for bidirectional, two-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor. Data transfer may be initiated only when the bus
is not busy.

7.1 Bit transfer

One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data line
at this time will be interpreted as a control signal.

Fig.3 Bit transfer.

MBA607

data line

stable;

data valid

change

of data

allowed

SDA

SCL

7.2 Start and stop conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is
defined as the stop condition (P).

Fig.4 Definition of START and STOP conditions.

MBA608

SDA

SCL

P

STOP condition

SDA

SCL

S

START condition

1997 Apr 02 6

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

7.3 System configuration

A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls
the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’.

Fig.5 System configuration.

MBA605

MASTER

TRANSMITTER /

RECEIVER

SLAVE

RECEIVER

SLAVE

TRANSMITTER /

RECEIVER

MASTER

TRANSMITTER

MASTER

TRANSMITTER /

RECEIVER

SDA
SCL

7.4 Acknowledge

The number of data bytes transferred between the start
and stop conditions from transmitter to receiver is
unlimited. Each byte of eight bits is followed by an
acknowledge bit. The acknowledge bit is a HIGH level
signal put on the bus by the transmitter during which time
the master generates an extra acknowledge related clock
pulse. A slave receiver which is addressed must generate
an acknowledge after the reception of each byte. Also a
master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the
slave transmitter.

The device that acknowledges must pull down the SDA
line during the acknowledge clock pulse, so that the SDA
line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times
must be taken into consideration). A master receiver must
signal an end of data to the transmitter by not generating
an acknowledge on the last byte that has been clocked out
of the slave. In this event the transmitter must leave the
data line HIGH to enable the master to generate a stop
condition.

Fig.6 Acknowledgement on the I2C-bus.

handbook, full pagewidth

MBA606 - 1

START

condition

S

SCL FROM

MASTER

DATA OUTPUT

BY TRANSMITTER

DATA OUTPUT

BY RECEIVER

clock pulse for

acknowledgement

1

2

8

9

1997 Apr 02 7

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

7.5 I2C-bus protocol

Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is
always carried out with the first byte transmitted after the start procedure. The I2C-bus configuration for the different
PCA8581 WRITE and READ cycles is shown in Figs 7, 9 and 10.

After the word address, one-to-eight data bytes can be sent. The address is automatically incremented, but the four
highest address bits (row) are internally latched. Therefore all bytes are written in the same row.

An example of writing eight bytes with word address X 0 0 00000 and six bytes with word address X 0010101 is
shown in Fig.8.

Fig.7 Master transmits to slave receiver (WRITE) mode.

handbook, full pagewidth

S 0AXSLAVE ADDRESS WORD ADDRESS A ADATA P

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

WRITING

R/W

don't
care

auto increment

memory word address

MLB889

n bytes

t

WR

Fig.8 Writing eight and six bytes with different word addresses.

(1) X = don’t care.

handbook, full pagewidth

MLB890

Word Address

(1)

Row

0
1
2
3

column

1

4

2

5

3

6

4 5 6

1

7

2

8

3

01234567

X0000000
X0001...
X0010101
X0011...

1997 Apr 02 8

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

To transmit eight bytes in sequential order, begin with the lowest address bits 0 0 0. The data is written after a stop is
detected. The data is only written if complete bytes have been received and acknowledged. Writing takes a time t

WR

(6 to 10 ms) during which the device will not respond to its slave address. Note that to write the next row, a new write
operation is required (start, slave address, row address, data and stop).

An unlimited number of data bytes can be read in one operation. The address is automatically incremented. If a read
without setting the word address is performed after a write operation, the address pointer may point at a byte in the row
after the previously written row. This occurs if, during writing, the three lowest address bits (column) rolled over.

Fig.9 Master reads after setting word address (WRITE word address; READ data).

handbook, full pagewidth

S 0ASLAVE ADDRESS WORD ADDRESS A ASLAVE ADDRESS

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

R/WXdon't

care

acknowledgement

from master

ADATA

auto increment

memory word address

MLB891

P

no acknowledgement

from master

1DATA

auto increment

memory word address

last byte

R/W

S1

n bytes

at this moment master ­transmitter becomes
master - receiver and
PCA8581(C) slave - receiver
becomes slave - transmitter

Fig.10 Master reads slave immediately after first byte (READ mode).

handbook, full pagewidth

S

1A

SLAVE ADDRESS DATA

A1DATA

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

R/W

auto increment

word address

MBD824

auto increment

word address

n bytes last bytes

P

1997 Apr 02 9

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

9 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under

“Handling MOS Devices”

.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

supply voltage (pin 8) −0.3 +7.0 V

V

I

input voltage (any input) measured via a 500 Ω resistor −0.8 VDD+ 0.8 V

I

I

DC input current −±10 mA

I

O

DC output current −±10 mA

P

tot

total power dissipation per package − 150 mW

P

O

power dissipation per output − 50 mW

T

amb

operating ambient temperature −25 +85 °C

T

stg

storage temperature without EEPROM retention −65 +150 °C

with EEPROM retention −65 +85 °C

1997 Apr 02 10

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

10 DC CHARACTERISTICS

V

DD

= 2.5 to 6.0 V (PCA8581C); VDD= 4.5 to 5.5 V (PCA8581); VSS= 0 V; T

amb

= −25 to +85 °C; note 1; unless

otherwise specified.

Note

1. The PCA8581C is guaranteed to be programmed with all locations ‘FF’ (hexadecimal) provided the device has been
stored within the temperature limits −65 to +85 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DD

supply voltage

PCA8581C 2.5 − 6.0 V
PCA8581 4.5 − 5.5 V

I

DD

supply current

standby mode f

SCL

= 0 Hz; VIL = 0 V; VIH= V

DD

−−10 µA

during read cycle f

SCL

= 100 Hz; VIL = 0 V; VIH= V

DD

−−400 µA

during write cycle V

IL

= 0 V; VIH= V

DD

−−1000 µA

Inputs A0, A1, A2, SDA and SCL

V

IL

LOW level input voltage −−0.3V

DD

V

V

IH

HIGH level input voltage 0.7V

DD

−−V

I

LI

input leakage current VI=VDDor V

SS

−−1µA

C

i

input capacitance VI=V

SS

−−7pF

Output SDA

I

OL

LOW level output current VOL= 0.4 V 3 −−mA

Erase/write data

t

WR

write time − 710ms

t

RET

data retention time 10 −−years

1997 Apr 02 11

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

11 AC CHARACTERISTICS

All timing values are valid within the operating supply voltage and ambient temperature range and reference to V

IL

and

V

IH

with an input voltage swing of VSS to VDD.

Note

1. A detailed description of the I

2

C-bus specification, with applications, is given in brochure

“The I2C-bus and how to

use it”

. This brochure may be ordered using the code 9398 393 40011.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

I

2

C-bus timing (see Fig.11; note 1)

f

SCL

SCL clock frequency −−100 kHz

t

SP

tolerable spike width on bus −−100 ns

t

BUF

bus free time 4.7 −−µs

t

SU;STA

START condition set-up time 4.7 −−µs

t

HD;STA

START condition hold time 4.0 −−µs

t

LOW

SCL LOW time 4.7 −−µs

t

HIGH

SCL HIGH time 4.0 −−µs

t

r

SCL and SDA rise time −−1.0 µs

t

f

SCL and SDA fall time −−0.3 µs

t

SU;DAT

data set-up time 250 −−ns

t

HD;DAT

data hold time 0 −−ns

t

VD;DAT

SCL LOW to data out valid −−3.4 µs

t

SU;STO

STOP condition set-up time 4.0 −−µs

Fig.11 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.

handbook, full pagewidth

PROTOCOL

SCL

SDA

MBD820

BIT 0

LSB

(R/W)

t

HD;STA

t

SU;DAT

t

HD;DAT

t

VD;DAT

t

SU;STO

t

f

r

t

t

BUF

t

SU;STA

t

LOW

t

HIGH

1 / f

SCL

START

CONDITION

(S)

BIT 7
MSB

(A7)

BIT 6

(A6)

ACKNOWLEDGE

(A)

STOP

CONDITION

(P)

1997 Apr 02 12

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

12 APPLICATION INFORMATION

12.1 Application example

handbook, full pagewidth

MLB893

SCL

SDA

V

SS

A1

A0

A2

TEST

PCA8581/PCA8581C

'1010'

SDA

SCL

MASTER

TRANSMITTER/

RECEIVER

V

DD

SDA SCL

RR

V

DD

(I C bus)

2

R: pull up resistor
R =

r

t

C

BUS

V

DD

SCL

SDA

V

SS

A1

A0

A2

TEST

PCA8581/PCA8581C

'1010'

V

DD

V

DD

SCL

SDA

V

SS

A1

A0

A2

TEST

PCA8581/PCA8581C

'1010'

V

DD

1

V

DD

1

V

DD

1

V

DD

1

0

0

0

0

0

Fig.12 Application diagram.

Inputs A0, A1 and A2 must be connected to VDD of VSS but not left open-circuit.

1997 Apr 02 13

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

12.2 Slave address

The PCA8581 has a fixed combination 1 0 1 0 as group 1, while group 2 is fully programmable (see Fig.13).

12.3 Diode protection

Fig.13 Slave address.

handbook, halfpage

MLB892

1 0 1 0 A2A1A0R/W

group 1

group 2

Fig.14 Device diode protection.

There is no connection between SCL and VDD, and SDA and VDD; this allows powering down the device without affecting I2C-bus operation.

handbook, halfpage

MLB894

SCL

SDA

A2

A1

A0

V

DD

V

SS

TEST

substrate

1997 Apr 02 14

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

13 PACKAGE OUTLINES

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT97-1

92-11-17
95-02-04

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

1.154.2 0.51 3.2

inches

0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12

0.010.10 0.30

0.32

0.31

0.39

0.33

0.0450.17 0.020 0.13

b

2

050G01 MO-001AN

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

8

1

5

4

b

E

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

1997 Apr 02 15

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(2)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

4

5

pin 1 index

1

8

y

076E03S MS-012AA

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15

0.050

0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

95-02-04
97-05-22

1997 Apr 02 16

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus
interface

PCA8581; PCA8581C

14 SOLDERING

14.1 Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

14.2 DIP

14.2.1 SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

14.2.2 R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

14.3 SO

14.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

14.3.2 W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.3.3 R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Apr 02 17

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

15 DEFINITIONS

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

17 PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1997 Apr 02 18

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

NOTES

1997 Apr 02 19

Philips Semiconductors Product specification

128 × 8-bit EEPROM with I2C-bus interface

PCA8581; PCA8581C

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
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Philippines: Philips Semiconductors Philippines Inc.,
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Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
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Portugal: see Spain
Romania: see Italy
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Slovakia: see Austria
Slovenia: see Italy
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Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
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Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

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220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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Czech Republic: see Austria
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Tel. [phone], Fax. [phone]
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Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
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Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 417067/1200/03/pp20 Date of release: 1997 Apr 02 Document order number: 9397 750 01747