Philips Semiconductors Product specification
74F862, 74F863
Bus transceivers (3-State)
2
2000 Mar 24 853-0881 23378
FEA TURES
•Provide high performance bus interface buffering for wide
data/address paths or buses carrying parity
•High impedance NPN base inputs for reduced loading (20µA in
High and Low states)
•I
IL
is 20µA vs. 1000µA for AM29861 series
•Buffered control inputs for light loading, or increased fan-in as
required with MOS microprocessors
•Positive and negative over-shoots are clamped to ground
•3-State outputs glitch free during power-up and power-down
•Slim dual In-line (DIP) 300mil package
•Broadside pinout compatible with AMD AM29862–29863
•Outputs sink 64mA
DESCRIPTION
The 74F862 and 74F863 bus transceivers provide high performance
bus interface buffering for wide data/address paths of buses carrying
parity. The 74F863 9-bit bus transceiver has NOR-ed transmit and
receive output enables for maximum control flexibility.
TYPE
TYPICAL
PROPAGATION
DELA Y
TYPICAL SUPPL Y
CURRENT
(TOT AL)
74F862 6.0ns 150mA
74F863 6.0ns 115mA
ORDERING INFORMATION
PACKAGES
COMMERCIAL RANGE
V
CC
= 5V±10%;
T
a
= 0°C to +70°C
PKG DWG #
24-pin Plastic Slim
Dual In-line (300mil)
Package
N74F862N, N74F863N SOT222-1
24-pin Plastic Small
Outline Large
1
N74F862D, N74F863D SOT137-1
NOTE:
1. Thermal mounting techniques are recommended. See SMD
Process Applications for a discussion of thermal considerations for
surface mounted devices.
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
18
24
OEAB
B
0
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
V
CC
13
23
22
21
20
19
17
16
15
14
TOP VIEW
OEBA
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
GND
SF00518