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DISCRETE SEMICONDUCTORS
DATA SH EET
halfpage
M3D087
BAT160 series
Schottky barrier double diodes
Product specification
Supersedes data of 1999 Mar 26
1999 Sep 20
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Philips Semiconductors Product specification
Schottky barrier double diodes BAT160 series
FEATURES
• Low switching losses
• Capability of absorbing very high
surge current
• Fast recovery time
• Guard ring protected
• Plastic SMD package.
APPLICATIONS
• Low power switched-mode power
supplies
• Rectification
• Polarity protection.
DESCRIPTION
PlanarSchottkybarrierdoublediodes
encapsulated in a SOT223 plastic
SMD package.
MARKING
PINNING
BAT160
PIN
ACS
1k
1
a
1
2 n.c. n.c. n.c.
3k
4a
ge
1
123
Top view
2
, a2k1, k
a
2
2
4
MSB002 - 1
a
1
k
2
k1, a
2
age
13
4
2 n.c.
Fig.2 BAT160A diode
configuration (symbol).
age
13
4
2 n.c.
Fig.3 BAT160C diode
configuration (symbol).
MGL171
MGL172
TYPE NUMBER
MARKING
CODE
BAT160A AT160A
BAT160C AT160C
BAT160S AT160S
Fig.1 Simplified outline
(SOT223) and pin
configuration.
age
13
4
2 n.c.
Fig.4 BAT160S diode
configuration (symbol).
MGL173
1999 Sep 20 2
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Philips Semiconductors Product specification
Schottky barrier double diodes BAT160 series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
V
R
I
F
I
FSM
I
RSM
T
stg
T
j
ELECTRICAL CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
continuous reverse voltage − 60 V
continuous forward current − 1A
non-repetitive peak forward current tp= 8.3 ms; half sinewave;
− 10 A
JEDEC method
non-repetitive peak reverse current tp= 100 µs − 0.5 A
storage temperature −65 +150 °C
junction temperature − 150 °C
SYMBOL PARAMETER CONDITIONS MAX. UNIT
Per diode
V
F
I
R
forward voltage see Fig.5
= 100 mA 400 mV
I
F
I
= 1 A 650 mV
F
I
= 2 A 850 mV
F
reverse current VR= 60 V; note 1; see Fig.6 350 µA
V
= 60 V; Tj= 100 °C; note 1;
R
8mA
see Fig.6
C
d
diode capacitance f = 1 MHz; VR= 4 V; see Fig 7 60 pF
Note
1. Pulse test: t
= 300 µs; δ = 0.02.
p
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to ambient note 1 100 K/W
Note
1. Refer to SOT223 standard mounting conditions.
1999 Sep 20 3