INTEGRATED CIRCUITS
74ABT32
Quad 2-input OR gate
Product specification |
1995 Sep 22 |
IC23 Data Handbook
m n r
Philips Semiconductors |
Product specification |
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Quad 2-input OR gate |
74ABT32 |
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QUICK REFERENCE DATA
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CONDITIONS |
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SYMBOL |
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PARAMETER |
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Tamb = 25°C; |
TYPICAL |
UNIT |
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GND = 0V |
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tPLH |
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Propagation |
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2.3 |
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delay |
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ns |
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tPHL |
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An, Bn to Yn |
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CL = 50pF; |
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1.9 |
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VCC = 5V |
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tOSLH |
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Output to |
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0.4 |
ns |
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tOSHL |
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Output skew |
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CIN |
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Input |
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VI = 0V or VCC |
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3 |
pF |
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capacitance |
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ICC |
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Total supply |
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Outputs disabled; |
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50 |
μA |
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current |
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VCC = 5.5V |
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PIN CONFIGURATION |
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A0 |
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1 |
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14 |
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VCC |
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B0 |
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B3 |
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2 |
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13 |
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Y0 |
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A3 |
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3 |
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12 |
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A1 |
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Y3 |
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4 |
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11 |
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B1 |
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B2 |
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5 |
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10 |
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Y1 |
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A2 |
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6 |
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9 |
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GND |
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Y2 |
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7 |
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8 |
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SA00354 |
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PIN DESCRIPTION |
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PIN |
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SYMBOL |
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NAME AND FUNCTION |
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NUMBER |
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1, 2, 4, 5, 9, |
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An, Bn |
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Data inputs |
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10, 12, 13 |
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3, 6, 8, 11 |
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Yn |
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Data outputs |
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7 |
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GND |
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Ground (0V) |
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14 |
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VCC |
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Positive supply voltage |
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LOGIC SYMBOL |
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1 |
2 |
4 |
5 |
9 |
10 |
12 |
13 |
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A0 |
B0 |
A1 |
B1 |
A2 |
B2 |
A3 |
B3 |
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Y0 |
Y1 |
Y2 |
Y3 |
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VCC = Pin 14 |
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3 |
6 |
8 |
11 |
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GND = Pin 7 |
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SA00355 |
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LOGIC DIAGRAM
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A0 |
1 |
3 |
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2 |
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B0 |
Y0 |
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A1 |
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6 |
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5 |
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B1 |
Y1 |
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A2 |
9 |
8 |
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B2 |
10 |
Y2 |
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A3 |
12 |
11 |
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VCC = Pin 14 |
13 |
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B3 |
Y3 |
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GND = Pin 7 |
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SA00356 |
LOGIC SYMBOL (IEEE/IEC)
1 |
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1 |
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2 |
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3 |
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4
6
5
9
8
10
12
11
13
SF00041
FUNCTION TABLE
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INPUTS |
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OUTPUT |
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An |
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Bn |
Yn |
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L |
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L |
L |
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L |
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H |
H |
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H |
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L |
H |
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H |
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H |
H |
NOTES: |
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H |
= |
High voltage level |
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L |
= |
Low voltage level |
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ORDERING INFORMATION
PACKAGES |
TEMPERATURE RANGE |
OUTSIDE NORTH AMERICA |
NORTH AMERICA |
DWG NUMBER |
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14-Pin Plastic DIP |
±40°C to +85°C |
74ABT32 N |
74ABT32 N |
SOT27-1 |
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14-Pin plastic SO |
±40°C to +85°C |
74ABT32 D |
74ABT32 D |
SOT108-1 |
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14-Pin Plastic SSOP Type II |
±40°C to +85°C |
74ABT32 DB |
74ABT32 DB |
SOT337-1 |
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14-Pin Plastic TSSOP Type I |
±40°C to +85°C |
74ABT32 PW |
74ABT32PW DH |
SOT402-1 |
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1995 Sep 22 |
2 |
853-1812 15793 |
Philips Semiconductors |
Product specification |
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Quad 2-input OR gate |
74ABT32 |
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ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL |
PARAMETER |
CONDITIONS |
RATING |
UNIT |
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VCC |
DC supply voltage |
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±0.5 to +7.0 |
V |
IIK |
DC input diode current |
VI < 0 |
±18 |
mA |
VI |
DC input voltage3 |
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±1.2 to +7.0 |
V |
IOK |
DC output diode current |
VO < 0 |
±50 |
mA |
V |
DC output voltage3 |
output in Off or High state |
±0.5 to +5.5 |
V |
OUT |
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IOUT |
DC output current |
output in Low state |
40 |
mA |
Tstg |
Storage temperature range |
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±65 to 150 |
°C |
NOTES:
1.Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2.The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3.The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL |
PARAMETER |
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LIMITS |
UNIT |
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MIN |
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MAX |
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VCC |
DC supply voltage |
4.5 |
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5.5 |
V |
VI |
Input voltage |
0 |
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VCC |
V |
VIH |
High-level input voltage |
2.0 |
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V |
VIL |
Low-level input voltage |
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0.8 |
V |
IOH |
High-level output current |
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±15 |
mA |
IOL |
Low-level output current |
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20 |
mA |
t/ v |
Input transition rise or fall rate |
0 |
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10 |
ns/V |
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Tamb |
Operating free-air temperature range |
±40 |
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+85 |
°C |
DC ELECTRICAL CHARACTERISTICS
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LIMITS |
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SYMBOL |
PARAMETER |
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TEST CONDITIONS |
Tamb = +25°C |
Tamb = ±40°C |
UNIT |
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to +85°C |
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MIN |
TYP |
MAX |
MIN |
MAX |
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VIK |
Input clamp voltage |
VCC = 4.5V; IIK = ±18mA |
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±0.9 |
±1.2 |
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±1.2 |
V |
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VOH |
High-level output voltage |
VCC = 4.5V; IOH = ±15mA; VI = VIL or VIH |
2.5 |
2.9 |
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2.5 |
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V |
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VOL |
Low-level output voltage |
VCC = 4.5V; IOL = 20mA; VI = VIL or VIH |
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0.35 |
0.5 |
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0.5 |
V |
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II |
Input leakage current |
VCC = 5.5V; VI = GND or 5.5V |
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±0.01 |
±1.0 |
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±1.0 |
μA |
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IOFF |
Power-off leakage current |
VCC = 0.0V; VO or VI ≤ 4.5V |
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±5.0 |
±100 |
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±100 |
μA |
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ICEX |
Output High leakage current |
VCC = 5.5V; VO = 5.5V; VI = GND or VCC |
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5.0 |
50 |
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50 |
μA |
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I |
Output current1 |
V |
= 5.5V; V = 2.5V |
±50 |
±75 |
±180 |
±50 |
±180 |
mA |
O |
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CC |
O |
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ICC |
Quiescent supply current |
VCC = 5.5V; VI = GND or VCC |
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2 |
50 |
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50 |
μA |
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ICC |
Additional supply current per |
VCC = 5.5V; One data input at 3.4V, other |
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0.25 |
500 |
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500 |
μA |
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input pin2 |
inputs at VCC or GND |
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NOTES:
1.Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2.This is the increase in supply current for each input at 3.4V.
3.For valid test results, data must not be loaded into the flip-flop or latch after applying the power.
1995 Sep 22 |
3 |