Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
CONTENTS
Page Page
1 Safety Precautions 4
1.1. General Guidelines
1.2. Touch-Current Check
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
3 About Lead Free Solder (PbF)
4 Self Check Function
4.1. Self Check
4
4
5
6
7
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4.2. Power LED Blinking Timing Chart
4.3. LED and Remote Controller Receiver Check
5 Chassis Board
5.1. Chassis Installation
6 Location of Lead Wiring
6.1. Wire Dressing
6.2. Wire Dressing and Connections
7 Disassembly for Service
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10
11
12
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9
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7.1. AC Code dressing for 2-Pin 12
7.2. AC Code dressing for 3-Pin
7.3. Chassis Rail Installation
7.4. VESA and Pedesdal Bracket Installation
7.5. Pedestal Assembly Preparation
7.6. LED Panel Installation
7.7. LCD Panel Assembly Installation
7.8. Back Cover and Model Name Plate Installation
8 Service Mode Adjustment
8.1. SERVICE 1
8.2. SERVICE 2
8.3. Self Check Mode
8.4. Hotel Mode Adjustment
9 Adjustment
9.1. Voltage Chart of A Board
9.2. Voltage Chart of P board
10 Conductor Views
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10.1. A-Board
10.2. A-Board
11 Schem atic Diagr am
11.1. Schematic Diagram Notes
11.2. A Board
11.3. G Board
11.4. K Board
11.5. P Board
11.6. SW Board
11.7. V Board
12 Parts Locat ion & Mechanica l Repla ceme nt Parts List
12.1. Parts Location
13 Packi ng Explo ded View
14 Repla ceme nt Parts List
14.1. Electrical Replacement Parts List
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1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe as shown in Figure 1.
3. Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part and measure the voltage at each point.
5. The potential at any point (touch current) expressed as voltage U
For AC: U
For DC: U
= 35 V (peak) and U2= 0.35 V (peak);
1
= 1.0 V,
1
and U2, do not exceed the following values:
1
NOTE :
The limit value of U
The limit value U
6. Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
= 0.35 V (peak) for AC and U1= 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA DC.
2
= 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.
1
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2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some fieldeffect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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3 About Lead Free Solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.
The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu).
Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.
This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest
the use of PbF as well, although Pb may be used.
PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.
Caution
• PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 20°F (370 10°C).
• PbF will tend to splash when heated too high (about 1100°F or 600°C).
If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is
not practical, be sure to heat the PbF until it melts, before applying Pb.
• After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the
opposite side (see Figure 2).
Figure 2
Suggested PbF
There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However,
Sn+Cu (tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.
Figure 3
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4 Self Check Function
4.1. Self Check
1. Self Check is used to automatically check the bus lines and hexadecimal codes of the TV set.
2. To get into the Self Check mode, press the “DOWN” button on the customer’s controls at the front of the set, at the same time
pressing the “MENU” button on the remote control. The screen that will show is represented by Figure 4.
3. Press both “OFF TIMER” button on the remote control and “DOWN” key button on the control panel.
Figure 4
4.2. Power LED Blinking Timing Chart
1. Subject
Information of LED blinking timing chart.
2. Contents
When an abonormality has occurred in the unit, the protection circuit operates and resets to standby mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
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4.3. LED and Remote Controller Receiver Check
1. Turn on the set using the power switch.
Check that the LED on the front panel is as shown below.
Green lamp lit = Receiving
2. Turn off the power supply using the remote controller and check that the LED is as shown below.
Red lamp lit = Standby
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5 Chassis Board
5.1. Chassis Installation
1. Fix 12 screws to ‘A-board’ and ‘P-board’.
Tightening torque should be 50 Ncm to 80 Ncm (5 kgf cm to 8 kgf cm).
2. Fix connectors G1, G2 and G3 to AT G-board.
3. Fix 2 screws to the side of AV bracket assembly.
Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
4. Fix 1 screw to cabinet with power switch PCB bracket.
Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
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6 Location of Lead Wiring
6.1. Wire Dressing
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6.2. Wire Dressing and Connections
CONNECTION123456789101112
1INV - P 2
2A2~P4
3A1~P3
1. Put pedestal mounting and fix with 4 pcs screw.
2. Fix 3 pcs chassis frame and fix 6 pcs screw to bottom and top mounting.
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7.4. VESA and Pedesdal Bracket Installation
1. Stick 2 pieces of felt on each part of the VESA bracket.
2. Fix 4 screws to VESA bracket.
Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
3. Slot pedestal assembly and fix 4 screws to cabinet.
Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
= SCREW-XTB4 + 15JFJ (4 pcs)
= SCREW-XYN4 + F10FJK (4 pcs)
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7.5. Pedestal Assembly Preparation
7.5.1. Pedestal Rotation Base
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7.5.2. Pedestal Stand Base
7.5.3. Pedestal Stand Cover
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7.6. LED Panel Installation
1. Put PCB to LED panel and ensure hook is properly locked on the PCB.
2. Fix LED panel to cabinet with 3 screws.
Tightening torgue should be 0.5 N m ~ 0.8 N m (5 to 8 kgf cm).
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= Screw - XTW3 + 10TFJ (3 pcs)
3. Fix wires at cabinet slit and make sure all wires are fully inserted to avoid contact with the pedestal metal.
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7.7. LCD Panel Assembly Installation
1. Put LCD panel to cabinet assembly.
2. Put LCD top mounting, LCD bottom mounting and LCD side mounting to cabinet assembly.
3. Fix screw into LCD top mounting, LCD side mounting and LCD bottom mounting.
Tightening torque should be 100 N cm ~ 130 N cm (10 kgf cm to 13 kgf cm).
4. Stick sponges at top mounting and bottom mounting.