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TX-22LT2F
Schematics
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User Manual
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Table of contents
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PANASONIC TX-22LT2F Schematics

22lt2f.html

Table Of Contents
COVER 1 Safety Precautions
1.1 General Guidelines
1.2 Touch-Current Check 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 3 About lead free solder (PbF) 4 Self Check 5 Chasis Board Layout 6 Servicing method
6.1 Removing tilt base
6.2 Removing rear panel
6.3 Removing speaker unit
6.4 Removing chassis
6.5 Removing A-Board
6.6 Removing B-Board (with tuner assembly)
6.7 Removing DG-Board
6.8 Removing H1-Board and H2-Board
6.9 Removing P1-Board
6.10 Removing P2-Board
6.11 Removing K-Board
6.12 Removing V-Board
6.13 A-Board servicing 7 Service Mode Function
7.1 How to enter SERVICE 1
7.2 How to enter SERVICE 2
7.3 Option Description 8 Conductor Views
8.1 A-Board
8.2 B, H1, H2, K, P1 and P2-Board
8.3 DG-Board 9 Block and Schematic Diagrams
9.1 Schematic Diagram Notes
9.2 Power Block Diagram
9.3 Signal Block Diagram
9.4 Interconnection Schematic Diagram
9.5 A-Board (1 of 7) and H1-Board Schematic Diagram
9.6 A-Board (2 of 7) and H2-Board Schematic Diagram
9.7 A-Board (3 of 7) Schematic Diagram
9.8 A-Board (4 of 7), B-Board, K-Board and V-Board Schematic Diagram
9.9 A-Board (5 of 7), P1-Board and P2-Board Schematic Diagram
9.10 A-Board (6 of 7) and P1-Board Schematic Diagram
9.11 A-Board (7 of 7) Schematic Diagram
9.12 DG-Board (1 of 7) Schematic Diagram
9.13 DG-Board (2 of 7) Schematic Diagram
9.14 DG-Board (3 of 7) Schematic Diagram
9.15 DG-Board (4 of 7) Schematic Diagram
9.16 DG-Board (5 of 7) Schematic Diagram
9.17 DG-Board (6 of 7) Schematic Diagram
9.18 DG-Board (7 of 7) Schematic Diagram 10 Parts Location & Mechanical Replacement Parts List
Service Manual
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ORDER NO. ITD0203006C2
22” Diagonal LCD TV
● TX-22LT2F
LH4 Chassis
Specifications
Power Source
AC 100~240V, 50/ 60Hz
Power Consumption
Average use: 67W Stand-by condition: 5W TV set: DC 15V, 4.1 A max.
LCD
22-inch(558mm), 16:9 aspect ratio LCD panel
Screen Size
19.17-inch (486.7mm)(W) x 10.77-inch (273.6mm)(H) x 22-inch (558mm)(Diagonal)
Sound
Speaker
Tweeter (4 x 7cm 2pcs, 8Ω ), Woofer (Ø 5cm 2pcs, 4Ω )
Audio Output
9W (2.5W+ 2.5W+ 4.0W (Woofer)), 10% THD
Headphones
M3(3.5 mm) Jack x 1 8Ω impedance
FEATURES
Aero-Hammer ® Double Woofer System (2Way 4Speaker System)
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10.1 Parts Location
10.2 Packing Exploded View
10.3 Mechanical Replacement Parts List 11 Replacement Parts List
11.1 Replacement Parts List Notes
11.2 Electrical Replacement Parts List 12 Schematic Diagram for printing with A4 size
Receiving Systems/ Band name
PAL B,G,H, SECAM B,G SECAM L/ L’
VHF E2-E12 VHF H1-H2 (ITALY) VHF A-H (ITALY) UHF E21-E69 CATV (S01-S05) CATV S1-S10 (M1-M10) CATV S11-S20
(U1-U10)
CATV S21-S41 (Hyperband)
PAL 525/ 60
Playback of NTSC tape from some PAL video recorders (VCR)
M.NTSC
Playback from M.NTSC Video recorders (VCR)
NTSC
Playback from NTSC Video recorders (VCR) (AV INPUT ONLY)
Aerial-Rear
UHF-VHF
Operating Conditions
Temperature: 41° F-95° F(5-35° C) Humidity: 5% -90% RH (non-condensing)
Connection Terminals
AV1
21Pin socket (Audio/ Video in, TV out, RGB in)
AV2
21Pin socket (Audio/ Video in, Audio/ Video out, S-Video, Q-Link)
AV3
VIDEO
RCA PIN Type x 1
S-VIDEO
Mini DIN 4-pin
AUDIO L-R
RCA PIN Type x 2
Dimensions (W x H x D)
Including TV Stand
586mm x 424mm x 240mm
TV Set Only
586mm x 388mm x 67mm
Weight (Mass)
11.5kg Net
Note:
Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
© 2002 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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1 Safety Precautions
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1.1 General Guidelines
1.2 Touch-Current Check
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1.1 General Guidelines
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1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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1.2 Touch-Current Check
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1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values
0.7 mA (peak) a. c. and 2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
Figure 1
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2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices
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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, whichshould be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).
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3 About lead free solder (PbF)
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Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
● Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~
70 °F (30~40°C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
● Pb free solder will tend to splash when heated too high (about 1100 °F or600°C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
● After applying PbF solder to double layered boards, please check the component side for excess
solder which may flow onto the opposite side. (see figure below)
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Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also beused.
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4 Self Check
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1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2. To get into the Self -Check mode press the Down (
) button on the customer controls at the front of the set, at the same time pressing the Recall
button on the remote control, andthe screen will show :
If the CCU ports have been checked and found to be incorrect or not located then “--” will appear in place of “O.K.”.
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5 Chasis Board Layout
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6 Servicing method
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6.1 Removing tilt base
6.2 Removing rear panel
6.3 Removing speaker unit
6.4 Removing chassis
6.5 Removing A-Board
6.6 Removing B-Board (with tuner assembly)
6.7 Removing DG-Board
6.8 Removing H1-Board and H2-Board
6.9 Removing P1-Board
6.10 Removing P2-Board
6.11 Removing K-Board
6.12 Removing V-Board
6.13 A-Board servicing
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6.1 Removing tilt base
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6.2 Removing rear panel
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6.3 Removing speaker unit
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6.4 Removing chassis
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6.5 Removing A-Board
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6.6 Removing B-Board (with tuner assembly)
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6.7 Removing DG-Board
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6.8 Removing H1-Board and H2-Board
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6.9 Removing P1-Board
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6.10 Removing P2-Board
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6.11 Removing K-Board
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6.12 Removing V-Board
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6.13 A-Board servicing
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