GENERAL QUIDE LINES....................................................................................................................................................2
TOUCH – CURRENT CHECK
PREVENTION OF ELECTROSTATIC DISCHARGE (ESD) TO ELEC
ABOUT LEAD FREE SOLDER (PBF).......................................................................................................................................4
SUGGESTED PB FREE SOLDER
SERVICE HINT
SETTING INSPECTION
REPLACEMENT PARTS LIST................................................................................................................................................12
SCHEMATIC DIAGRAMS
CONDUCTOR VIEWS
S ......................................................................................................................................................................5
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated
or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock
hazards.
4. Always ensure panel TKKL5290 is correctly replaced before returning to customer (see Fig.1).
Fig. 1
TOUCH-CURRENT CHECK
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a go od earth
ground such as a water pipe, as shown in Fig. 2.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
NOTE:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and
2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100
kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should
be repaired and rechecked before it is returned to the customer.
2
A
Ω
Ω
Ω
COLD
Ω
WATER PIPE
(EARTH GROUND)
Measuring network for TOUCH CURRENTS
Fig. 2
CS=500µF
10k
U
1
0.022µF
V
U2 (V)
RS=500
TO
PPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Ω)
V: Voltmetr or oscilloscope
(r.m.s. or peak reading)
NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms
Input resistance: ≥ 1M
Input capacitance: ≤ 200pF
Frequency range: 15Hz to 1Mhz and d.c.respectively
R0=500
PREVENTION OF ELECTROSTATIC DISCHARGE (ESD) TO
ELECTROSTATICALLY SENSITIVE (ES) DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on
your body by touching a known earth ground. Alternatively, obtain and wear a commerciall y av ailable discharging ESD
wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD
protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical char ges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
CAUTION
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity
(ESD) sufficient to damage an ES device).
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety.
These parts are marked by
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do
not modify the original design without permission of manufacturer.
in schematic diagrams, exploded views and replacement parts list. It is essential that
3
ABOUT LEAD FREE SOLDER (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead s
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,
we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
CAUTION
•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~ 40°C)
higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free so
applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
•After applying PbF solder to double layered boards, please check the component sid e for excess solder which may
flow onto the opposite side. (see Fig.3)
older, and PbF will refer to Lead Free Solder.
lder on the pins or solder area before
Fig.3
SUGGESTED Pb FREE SOLDER
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
Fig.4
4
SERVICE HINTS
HOW TO REMOVE THE BACK COVER
Lay the main unit face down as shown in Fig.5.
Remove the 4 fixing screws as shown in Fig.6.
Remove the stand assembly.
Fig.5
e the 8 fixing screws as shown in Fig.7.
Remov
Remove the back cover.
SCREWS
SCREWS
Fig.6
SCREWS
Fig.7
5
SETTING INSPECTION
A
VOLTAGE CONFIRMATION
Confirm the following voltages:
A boardNormal modeStandby mode
Self-check is used to automatically check the bus lines and hexadecimal code of the TV set. To enter Self-Check mode, keep
pressing the STATUS button on the remote control and press the down (-/v) button on the customer controls at the front
the TV set. To exit Self Check, switch off the TV set at the power button.
(The figures below are nominal and used for representative purposes only.)
1. Set the Bass to maximum position, set the Treble to minimum position then keep pressing the INDEX button on the
remote control and press the down button (-/v) on the customer controls at the front of the TV, this will place the TV into
the Service Mode 1.
2. Press the RED/GREEN buttons to step up / down through the functions.
3. Press the YELLOW/BLUE buttons to alter the function values.
4. Press the OK button after each adjustment has been made to store the required values.
5. To exit the Service Mode, press the "N" button.
Alignment Function
Horizontal Position
Vertical Position
DVCO
Highlight
Lowlight
Sub-Brightness
Setting indication
Note: All setting val
H-Pos
V-Pos
DVCO
High 0885 0851 0954
Low0060 0096 0062
Sub-Brightness
ues are approximate
0
0
3
0
Settings / Special features
Optimum setting.
Optimum setting.
Receive a PAL Colour Bar Pattern. For
DVCO ali
until the figure colour is changed from red
gnment press "Blue" button, wait
to black colour.
Optimum setting.
Optimum setting.
7
R
L
3
4
1
2
Z2
13
14
17
TUNER
R2351
R2350
45
17623
R
L
HEADPH
JK2350
B - BOARD
B1
A12
SDA5550M
IC1100
21 TXT CVBS
57 OSD R
58 OSD G
59 OSD B
Q1500
Q1502
8
9
11
8
9
11
Q202Q201
61 TXT CVBS
52 TVCVBS
AD_656.0 ÷ AD_656.7
Z - BOARD
IC1500
VSP9405BVKC4
Z1
A2
4
L OUT
1 L IN
AV1CVBS 53
AV1 V OUT 63
R EXT 39
G EXT 40
B EXT 41
AV2 V
AV2 Y
AV2 C 56
3
3
57
55
IC250
TDA1517N3
5
5
R OUT 6
9 R IN
20 VIDEO IN
19 VIDEO OUT
15 R IN
11 G IN
7 B IN
6 L IN
3 L OUT
AV1 21 PIN SCART
IC2000
MSP3410GAB83
SPK L OUT 28
SPK R OUT 27
AV1 L IN 56
AV1 L OUT 37
AV1 R IN 57
AV1 R OUT 36
AV2 R IN 51
AV2 L IN 50
60 AM IN
AD_656.7
OSD R IN1 131
OSD B IN1 133
OSD G IN1 132
AD_656.0
VIDEO & STEREO AUDIO BLOCK DIAGRAM
48 TX0-
IC1701
LVDS DRIVER
47 TX0+
46 TX1-
DPS9450A
IC1700
B1.0 ÷ B1.7
B1.7
B1.0
45 TX1+
42 TX2-
R1.0 ÷ R1.7
G1.0 ÷ G1.7
G1.7
R1.7
R1.0
G1.0
41 TX2+
38 TX3-
37 TX3+
67 SIF
A - BOARD
9
3
1
11
13
15
17
19
A50
TO LCD PANEL
8
2 R IN
1 R OUT
JK3000
R
L
V
Y
C
AV2 terminal
r
r
SERVICE
Y
Y
A6
1
33V
5,0V
IC250
IC1103
IC1102
2,5V_SB
2,5V_A_SBY
LC filter
2
REG
IC862
1
LVDS DRIVER
1,9,26,34,44
LC filter
3,3V_SB
3,3V_LVDS
3,3V_LVDS
3,3V
3,3V_D_SBY
4
REG
IC866
1
A - BOARD
IC1701
LCD PANEL
5V
5V
6
REG
IC883
1
IC1104
IC1105
IC860
Q868
5
A4
1
24V_INV
DPS_1,8DIG
24,62,91,118
DPS_3,3ANA
129,139
DPS_1,8ANA
75,134,143
5V
A50
5,0V
IC1700
DPS9450A
2
4
Q1700
8V
5
DPS_3,3DIG
REG
IC871
4
5,20,32,40,48,57,68,78,86,96,104,112,123
SBY3,3V
RESET IC
RESET IC
33V
REG
Q867
354
SBY3,3V_D
2
24V
2
24V
12V
24V_INV
Q866
12V
7
TDA1517
SBY2,5V_D
6,73
IC2000
SBY3,3V_D
32,1
EPROM
32
SDRAM
3,3V
2,5V_D_SBY
LC filter
LC filter
SBY3,3V_D
Q890
IC1100
3,3V_A
3,3V_D
LC filter
LC filter
SDA5550M
8,40,75,92
22,56
1,8V
Q880
SBY3,3V_D
1,8V_A
LC filter
SBY2,5V_A
IC1101
1,8V_D
LC filter
IC1500
11,12,13,65,66
MSP3410
39
8
EAROM
VSP9405
5,0V
8,0V
SBY3,3V_D
1,8V_VSP
68
1,8V_D
5,28,34,66
3,3V_D
7,12,25,72
1,8V_A
35,42,50,64
F861
3,3V_A
24V
3
4
10
A12
A3
3
5
1
A13
1,44,59,75,78
B1
33V
10
33V
4
5V
5V
V1
3
SBY3,3V
P4
19
17
24V
P - BOARD
D851
V - BOARD
REMOTE
RM1050
SN1063
CC
LF803
LF802
Line
Line
+
D801
-
Filte
Filte
POWER SUPPLY BLOCK DIAGRAM
3
15
TUNER
B - BOARD
SW800
F800
164
15
A
REG
D852
T801
D853
7
14
6
8
13
1
3
4
Q805
Q803
20
23
POWER
SUPPLY
IC801
IC850
K
IC803
16
19
15
11
IC802
7
10
Q851
4
1
P1
MAINS IN
9
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