Panasonic TH-50PX600U Service manual

Digital High Definition Plasma Television
r
GP9DU Chassis
Specifications
Power Source Power Consumption
Maximum 525 W Standby condition 0.2 W (Without CableCARDTM)
Plasma Displaypanel
Drive method Aspect Ratio 16 : 9 Contrast Ratio (max) 10000 : 1
isible screen size (W × H × Diagonal) (No. of pixels)
Sound
Speake
Audio Output 31 W [13 W + 2.5 W, 13 W + 2.5 W] (10 % THD)
PC signals VGA, SVGA, XGA
Channel Capability (Digital/Analog) VHF/UHF: 2 - 69, CATV: 1 - 135 Operating Conditions Temperature: 32 °F - 104 °F (0 °C - 40 °C)
Connection Terminals
INPUT 1-3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 W)
C 120 V, 50/60 Hz
14.5 W (With CableCARDTM)
C type
130 cmV
44.4 ” × 25.5 ” × 51.3 ” (1,130 mm × 650 mm × 1,303 mm) 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Woofer 3.2 ” (80 mm) × 2 pcs, 8 W Speaker0.9 ” × 4.0 ” (23 mm × 100 mm) × 2 pcs, 8W
SXGA (compressed) Horizontal scanning frequency31 - 69 kHz Vertical scanning frequency59 - 86 Hz
Humidity: 20 % - 80 % RH (non-condensing)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 W) C: 0.286 V [p-p] (75 W )
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
ORDER NO. MTNC060476CE
B19 Canada: B07
© 2006 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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TH-50PX600U
COMPONENTVIDEO INPUT 1-2
HDMI 1-2 TYPE A Connector
PC D-SUB 15 PIN: R, G, B/0.7 V [p-p] (75 W)
IR Blaste Card slot SD CARD slot × 1, CableCARDTMslot × 1 AVPROG. OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 W)
DIGITAL AUDIO OUT PCM/DolbyDigital, FiberOptic
FEATURES 3D Y/C FILTER CableCARDTMslot
Dimensions (W × H × D)
Including pedestal 49.9 ” × 34.3 ” × 15.7 ” (1,266 mm × 870 mm × 399 mm) TV Set only 49.9 ” × 31.6 ” × 5.5 ” (1,266 mm × 802 mm × 138 mm)
Weight
Including pedestal 123.5 lb. (56 kg) TV Set only 94.8 lb. (43 kg)
Y: 1.0 V [p-p] (including synchronization) PB,PR: ± 0.35 V [p-p]
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
HD, VD/1.0 - 5.0 V [p-p] (high impedance)
UDIO L-R: Stereo Mini Jack ( 3.5 mm) × 1
G-LINK Jack × 1
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
CLOSED CAPTION V-Chip Split-Screen BBE VIVA 3D Photo Viewer TV GUIDE
Note:
Design and Specifications are subject change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
1 Applicable signals 5 2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Plasma panel replacement method
6.1. Remove the Back cover
6.2. Remove the fan
6.3. Remove the Speaker box ass’y (left)
6.4. Remove the Speaker box ass’y (right)
6.5. Remove the rear terminal cover
6.6. Remove the P-Board
6.7. Remove the PA-Board
6.8. Remove the tuner unit
6.9. Remove the DT-Board
6.10. Remove the DG-Board
6.11. Remove the H-Board
6.12. Remove the HC-Board
10
10 10 10 10 10 11 12 12 12 13 13 13
6
6
7 8 9
6.13. Remove the D-Board
6.14. Remove the SU-Board
6.15. Remove the SD-Board
6.16. Remove the SC-Board
6.17. Remove the SS2-Board
6.18. Remove the SS3-Board
6.19. Remove the SS-Board
6.20. Remove the C1-Board
6.21. Remove the C2-Board
6.22. Remove the C3-Board
6.23. Remove the stand brackets
6.24. Remove the C4-Board
6.25. Remove the C5-Board
6.26. Remove the C6-Board
6.27. Remove the front bracket
6.28. Remove the G-Board and GK-Board
6.29. Remove the S-Board
6.30. Remove the GS-Board
6.31. Remove the Plasma panel section from the Front frame (glass)
14 14 14 14 15 15 15 15 16 16 16 16 17 17 17 17 18 18
18
2
6.32. Remove the squawker speaker 19
6.33. Remove the K-Board
6.34. Replace the plasma panel (finished)
7 Caution statement
7.1. Caution statement.
8 Location of Lead Wiring
8.1. Lead of Wiring (1)
8.2. Lead of Wiring (2)-1
8.3. Lead of Wiring (2)-2
8.4. Lead of Wiring (3)-1
8.5. Lead of Wiring (3)-2
8.6. Lead of Wiring (4)-1
8.7. Lead of Wiring (4)-2
8.8. Lead of Wiring (5)
9 Self-check Function
9.1. Check of the IIC bus lines
9.2. Power LED Blinking timing chart
9.3. No Power
9.4. No Picture
9.5. Local screen failure
10 Serviceman Mode
10.1. How to enter into Serviceman Mode
10.2. Contents of adjustment mode
10.3. Memory edit mode
10.4. Device data mode
11 Adjustment Procedure
11.1. Driver Set-up
11.2. Initialization Pulse Adjust
11.3. P.C.B. (Printed Circuit Board) exchange
11.4. Adjustment Volume Location
11.5. Test Point Location
12 Adjustment
12.1. White balance adjustment
12.2. Sub bright adjustment
12.3. ABL operation level adjustment
13 Hotel mode 14 Conductor Views
14.1. P-Board
14.2. PA-Board
14.3. H-Board
14.4. G and GS-Board
14.5. GK, HC, K and S-Board
14.6. DG-Board
14.7. DT-Board
14.8. D-Board
14.9. C1-Board
14.10. C2-Board
14.11. C3-Board
14.12. C4-Board
14.13. C5-Board
14.14. C6-Board
14.15. SC-Board
14.16. SU-Board
14.17. SD-Board
14.18. SS-Board 19 20
21
21
22
22 23 24 25 26 27 28 29
30
30 32 33 34 35
36
36 36 37 38
39
39 40 40 41 41
42
42 44 45
46 47
47 50 52 54 55 56 58 60 62 63 64 65 66 67 68 71 72
14.19. SS2 and SS3-Board
15 Block and Schematic Diagram
15.1. Schematic Diagram Note
15.2. Main Block Diagram
15.3. P-Board Block Diagram
15.4. P-Board (1 of 2) Schematic Diagram
15.5. P-Board (2 of 2) Schematic Diagram
15.6. PA-Board (1 of 2) Block Diagram
15.7. PA-Board (2 of 2) Block Diagram
15.8. PA-Board (1 of 3) Schematic Diagram
15.9. PA-Board (2 of 3) Schematic Diagram
15.10. PA-Board (3 of 3) Schematic Diagram
15.11. H-Board Block Diagram
15.12. H-Board (1 of 3) Schematic Diagram
15.13. H-Board (2 of 3) Schematic Diagram
15.14. H-Board (3 of 3) Schematic Diagram
15.15. G, GK, HC, K and S-Board Block Diagram
15.16. G-Board Schematic Diagram
15.17. GK, K, HC and S-Board Schematic Diagram
15.18. DG-Board (1 of 3) Block Diagram
15.19. DG-Board (2 of 3) Block Diagram
15.20. DG-Board (3 of 3) Block Diagram
15.21. DG-Board (1 of 8) Schematic Diagram
15.22. DG-Board (2 of 8) Schematic Diagram
15.23. DG-Board (3 of 8) Schematic Diagram
15.24. DG-Board (4 of 8) Schematic Diagram
15.25. DG-Board (5 of 8) Schematic Diagram
15.26. DG-Board (6 of 8) Schematic Diagram
15.27. DG-Board (7 of 8) Schematic Diagram
15.28. DG-Board (8 of 8) Schematic Diagram
15.29. DT and GS-Board Block Diagram
15.30. DT-Board (1 of 7) Schematic Diagram
15.31. DT-Board (2 of 7) Schematic Diagram
15.32. DT-Board (3 of 7) Schematic Diagram
15.33. DT-Board (4 of 7) and GS-Board Schematic Diagram
15.34. DT-Board (5 of 7) Schematic Diagram
15.35. DT-Board (6 of 7) Schematic Diagram
15.36. DT-Board (7 of 7) Schematic Diagram
15.37. D-Board (1 of 2) Block Diagram
15.38. D-Board (2 of 2) Block Diagram
15.39. D-Board (1 of 8) Schematic Diagram
15.40. D-Board (2 of 8) Schematic Diagram
15.41. D-Board (3 of 8) Schematic Diagram
15.42. D-Board (4 of 8) Schematic Diagram
15.43. D-Board (5 of 8) Schematic Diagram
15.44. D-Board (6 of 8) Schematic Diagram
15.45. D-Board (7 of 8) Schematic Diagram
15.46. D-Board (8 of 8) Schematic Diagram
15.47. C1, C2, C5 and C6-Block Diagram
15.48. C3, C4, SS, SS2 and SS3-Board Block Diagram
15.49. C1-Board (1 of 2) Schematic Diagram
15.50. C1-Board (2 of 2) Schematic Diagram
15.51. C2-Board (1 of 3) Schematic Diagram
TH-50PX600U
73 75
77
77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98
99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127
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15.52. C2-Board (2 of 3) Schematic Diagram 128
15.53. C2-Board (3 of 3) Schematic Diagram
15.54. C3-Board (1 of 2) Schematic Diagram
15.55. C3-Board (2 of 2) Schematic Diagram
15.56. C4-Board (1 of 2) Schematic Diagram
15.57. C4-Board (2 of 2) Schematic Diagram
15.58. C5-Board (1 of 3) Schematic Diagram
15.59. C5-Board (2 of 3) Schematic Diagram
15.60. C5-Board (3 of 3) Schematic Diagram
15.61. C6-Board (1 of 2) Schematic Diagram
15.62. C6-Board (2 of 2) Schematic Diagram
15.63. SS, SS2 and SS3-Board Schematic Diagram
15.64. SC, SU and SD-Board Block Diagram
129 130 131 132 133 134 135 136 137 138 139 140
15.65. SC-Board (1 of 2) Schematic Diagram
15.66. SC-Board (2 of 2) Schematic Diagram
15.67. SU-Board (1 of 2) Schematic Diagram
15.68. SU-Board (2 of 2) Schematic Diagram
15.69. SD-Board (1 of 2) Schematic Diagram
15.70. SD-Board (2 of 2) Schematic Diagram
16 Parts Location & Mechanical Replacement Parts List
16.1. Parts Location
16.2. Packing Exploded Views
16.3. Mechanical Replacement Parts List
17 Electr ical Replacemen t Parts List
17.1. Replacement Parts List Notes
17.2. Electrical Replacement Parts List
141 142 143 144 145 146
147
147 148 149
150
150 151
4
1 Applicable signals
TH-50PX600U
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2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MW and 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be
Figure 1
.
2.1.2. Leakage Current Hot Check (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the ACpluginthe AC outlet andrepeat each ofthe
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
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TH-50PX600U
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices.(Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
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TH-50PX600U
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
8
5 Service Hint
TH-50PX600U
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Upper Right)
PA DC-DC Converter
Speaker out, Audio AMP, Fan Control
H AV Terminal, AV Switch C4 Data Driver (Lower Left) DG Digital Signal Processor, Micom, HDMI Interface C5 Data Driver (Lower Center) DT ATSC Interface C6 Data Driver (Lower Right)
D Format Converter, Plasma AI, Sub-Field Processor SC Scan Drive GS SD Card Slot SU Scan out (Upper)
K Remote receiver, Power LED SD Scan out (Lower)
S Power Switch SS Sustain Drive
G Front Terminal SS2 Sustain Connector (Upper) GK Key Switch SS3 Sustain Connector (Lower) HC Jig Connection
C2 Data Driver (Upper Center) C3 Data Driver (Upper Left)
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6 Plasma panel replacement method
6.1. Remove the Back cover
1. See Service Hint (Section 5)
6.2. Remove the fan
1. Disconnect the relay couplers.
2. Remove the screws (×3
each) and remove the fans.
6.4. Remove the Speaker box ass’y (right)
1. Unlock the cable clampers to free the cable.
2. Disconnect the relay coupler.
3. Remove the Speaker box ass’y (right).
6.5. Remove the rear terminal cover
6.3. Remove the Speaker box ass’y (left)
1. Unlock the cable clampers to free the cables.
2. Disconnect the relay coupler.
3. Remove the Speaker box ass’y (left).
1. Remove the screws (×6 ,×6 ,×2 ).
2. Remove the rear terminal cover.
10
6.6. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23 and P25).
2. Remove the screws (×6
) and remove the P-Board unit.
4. Remove the screws (×5 ).
5. Remove the molding props (×8
6. Remove the P-Board.
Note:
When assembling the P-Board, the position of each hole of the insulation sheets (A and B) is set to the position of each hole of the P-Board, then assemble them. ( indicate setting positions.)
).
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marks
3. Remove the screws (×9 ) on the back side.
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6.7. Remove the PA-Board
6.9. Remove the DT-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA1, PA2, PA5, PA10, PA31, PA32, PA33, PA34 and PA40).
3. Disconnect the flexible cable (PA20).
4. Remove the screws (×4
5. Remove the PA-Board.
) and remove the earth cable.
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (HC06 and DT10).
3. Remove the screws (×5 (Be careful the coupler (DT12-DG22) when remove the DT-
Board unit.)
) remove the DT-Board unit.
6.8. Remove the tuner unit
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG5, G51, GS52, PA40 and earth cable).
3. Disconnect the flexible cables (DG3 and PA20).
4. Remove the screws (×4
) remove the tuner unit.
4. Disconnect the coupler (DT07)
5. Remove the screws (×2
6. Remove the DT-Board metal cover and DT-Board.
).
12
6.10. Remove the DG-Board
TH-50PX600U
6.11. Remove the H-Board
1. Remove the DT-Board. (See section 6.9.)
2. Remove the screws (×8 metal frame.
) and remove the DT-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (H2, H40 and H51).
3. Disconnect the flexible cable (H1).
4. Remove the screws (×6
) and remove the H-Board.
3. Disconnect the coupler (DG2).
4. Disconnect the flexible cables (DG1, DG15 and DG20).
5. Remove the screw (×1
) remove the DG-Board.
6.12. Remove the HC-Board
1. Disconnect the couple (HC06).
2. Disconnect the flexible cable (HC15).
3. Remove the screws (×2
) and remove the HC-Board.
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6.13. Remove the D-Board
6.15. Remove the SD-Board
1. Remove the tuner unit. (See section 6.8.)
2. Disconnect the couplers (D5, D20 and D25).
3. Disconnect the flexible cables (D3, D31, D32, D33 and D34).
4. Remove the screws (×4
) and remove the D-Board.
1. Remove the screws (×3 ).
2. Remove the flexible cables (SD1, SD2, SD3 and SD4) and remove the bridge connector (SD46).
3. Slide the SD-Board to the left to disconnect from a coupler (SC42-SD42) on the SC-Board and remove the SD-Board.
6.14. Remove the SU-Board
1. Remove the screws (×3 ).
2. Remove the flexible cables (SU1, SU2, SU3 and SU4) and remove the bridge connector (SU45).
3. Slide the SU-Board to the left to disconnect from a coupler (SC41-SU41) on the SC-Board and remove the SU-Board.
6.16. Remove the SC-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (SC2, SC20 and SC23).
3. Remove the screws (×9
) and remove the SC-Board.
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6.17. Remove the SS2-Board
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6.19. Remove the SS-Board
1. Disconnect the coupler (SS23) and disconnect the flexible cable (SS55).
2. Remove the screws (×2
) and remove the SS2-Board.
6.18. Remove the SS3-Board
1. Disconnect the coupler (SS22) and disconnect the flexible cable (SS56).
2. Remove the screws (×2
) and remove the SS3-Board.
1. Remove the SS2-Board and SS3-Board. (See section 6.17. and 6.18)
2. Disconnect the couplers (SS11, SS12, SS33, SS43 and SS44).
3. Disconnect the flexible cables (SS51, SS52, SS53 and SS54).
4. Remove the screws (×7
) and remove the SS-Board.
6.20. Remove the C1-Board
1. Remove the flexible cables holder fastening screws (×6
).
2. Disconnect the flexible cables (CA1, CA2 and CA3).
3. Disconnect the flexible cable (C10).
4. Remove the screws (×5
) and remove the C1-Board.
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6.21. Remove the C2-Board
6.23. Remove the stand brackets
1. Remove the flexible cables holder fastening screws (×8 ).
2. Disconnect the flexible cables (CA4, CA5, CA6 and CA7).
3. Disconnect the flexible cables (C20, C21 and C22).
4. Remove the screws (×5
) and remove the C2-Board.
6.22. Remove the C3-Board
1. Remove the flexible cables holder fastening screws (×8 ).
2. Disconnect the flexible cables (CA8, CA9, CA10 and
CA11).
3. Disconnect the flexible cables (C31 and C32).
4. Disconnect the coupler (C33).
5. Remove the screws (×5
) and remove the C3-Board.
1. Remove the plasma panel section from the servicing stand and lay on a fiat surface such as a table (covered) with the plasma panel surface facing downward.
2. Remove the stand brackets (left, right)fastening screws(×6
each) and remove the stand brackets (left, right).
6.24. Remove the C4-Board
1. Remove the stand bracket (left). (See section 6.23.)
2. Remove the flexible cables holder fastening screws (×8
).
3. Disconnect the flexible cables (CB8, CB9, CB10 and CB11).
4. Disconnect the flexible cables (C41 and C42).
5. Disconnect the couplers (C43 and C44).
6. Remove the screws (×5
) and remove the C4-Board.
16
6.25. Remove the C5-Board
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6.27. Remove the front bracket
1. Remove the flexible cables holder fastening screws (×8 ).
2. Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3. Disconnect the flexible cables (C50, C51 and C52).
4. Remove the screws (×5
) and remove the C5-Board.
6.26. Remove the C6-Board
1. Remove the stand bracket (right). (See section 6.23.)
2. Remove the flexible cables holder fastening screws (×6 ).
3. Disconnect the flexible cables (CB1, CB2 and CB3).
4. Disconnect the flexible cable (C60).
5. Remove the screws (×5
) and remove the C6-Board.
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (G1 and G51).
3. Remove the screws (×2
) and remove the front bracket.
6.28. Remove the G-Board and GK­Board
1. Remove the front bracket. (See section 6.27.)
2. Remove the screws (×3
metal frame.
) and remove the front side
3. Remove the screws (×3 ) and disconnect the couplers
(G3-GK3).
4. Remove the G-Board and GK-Board.
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6.29. Remove the S-Board
1. Disconnect the coupler (S1).
2. Remove the screws (×2 frame.
3. Remove the screws (×2
) and remove the S-Board metal
) and remove the S-Board.
6.30. Remove the GS-Board
6.31. Remove the Plasma panel section from the Front frame (glass)
1. Remove the front frame and the plasma panel fastening
screws (×12
2. Remove the front frame and the stand brackets fastening
screws (×2
).
).
1. Remove the stand bracket R. (See section 6.23.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the coupler (G52).
4. Remove the screws (×3
5. Remove the SD card unit.
6. Remove the screws (×2 ) and remove the GS-Board cover.
7. Remove the GS-Board.
).
3. For leaving the plasma panel from the front frame, pull the bottom of the front frame forward, lift, and remove.
18
6.32. Remove the squawker speaker
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6.33. Remove the K-Board
1. Remove the front frame. (See section 6.31.)
2. Remove the screws (×12
3. Remove the glass holder R and L.
4. Remove the screws (×2 ).
5. Remove the squawker speaker.
).
1. Remove the front frame. (See section 6.31.)
2. Remove the glass holder R and L. (See section 6.32.)
3. Remove the screws (×3
4. Remove the bottom shield.
5. Remove the screws (×5
6. Remove the glass holder bottom R and L.
7. Remove the screws (×9
8. Remove the glass holder bottom.
)
)
)
9. Remove the screws (×2 ).
10. Disconnect the couplers (K1 and K2).
11. Remove the K-board.
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6.34. Replace the plasma panel (finished)
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel surface facing downward.
2. Attach the C1, C2, C3, C4, C5 and the C6-Board, connect
the flexible cables (×22) from the Plasma panel to the C1, C2, C3, C4, C5 and the C6-Board, and fit the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (L,
R) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and each P.C.Board and so on, to
the new plasma panel.
* When fitting the front frame, be careful to allow any debris, dust or handling residue to remain between the front glass and plasma panel.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly. Also make sure that they are locked in the connectors. Verify by giving the flexible cables a very slight pull.
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8 Location of Lead Wiring
8.1. Lead of Wiring (1)
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8.2. Lead of Wiring (2)-1
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8.3. Lead of Wiring (2)-2
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8.4. Lead of Wiring (3)-1
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8.5. Lead of Wiring (3)-2
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8.6. Lead of Wiring (4)-1
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8.7. Lead of Wiring (4)-2
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8.8. Lead of Wiring (5)
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9 Self-check Function
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
9.1. Check of the IIC bus lines
9.1.1. How to access
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control for more than 3 seconds.
9.1.2. Exit
Disconnect the AC cord from wall outlet.
9.1.3. Screen display
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