VHF 0 to 12PAL B
UHF 21 to 69PAL G
S’1 to S’3HYPER TUNER
S1 to S41
Receiving Channels
(Regular TV) (PV600H/M/MT)
VHF BANDUHF BANDCATV
2-12(PAL/SECAM B,K1)21-69(PAL,G,H,I/SECAM G,K,K1) S1-S20(OSCAR)
0-12(PAL B AUST.)28-69(PAL B AUST.)1-125(USA CATV)
1-9(PAL B N.Z.)13-57(PAL D,K)C13-C49(JAPAN)
1-12(PAL/SECAM D)13-62(NTSC M Japan)S21-S41(HYPER)
1-12(NTSC M Japan)14-69(NTSC M USA)Z1-Z37(CHINA)
2-13(NTSC M USA)5A,9A(AUST.)
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U
For a. c.: U
For d. c.: U
= 35 V (peak) and U2= 0.35 V (peak);
1
=1.0V,
1
Note:
The limit value of U
= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
mA d. c.
The limit value U
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
When assembling the P-Board, the position of each hole of
the insulation sheets (A and B) is set to the position of each
hole of the P-Board, then assemble them. (
indicate setting positions.)
1. Remove the plasma panel section from the servicing stand
and lay on a fiat surface such as a table (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right)fastening screws (×6
each) and remove the stand brackets (left, right).
6.24. Remove the C4-Board
1. Remove the stand bracket (left). (See section 6.20.)
2. Remove the flexible cables holder fastening screws (×8
).
3. Disconnect the flexible cables (CB8, CB9, CB10 and
CB11).
4. Disconnect the flexible cables (C41 and C42).
5. Disconnect the couplers (C43 and C44).
6. Remove the screws (×5
) and remove the C4-Board.
6.25. Remove the C5-Board
1. Remove the flexible cables holder fastening screws (×8
).
2. Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3. Disconnect the flexible cables (C50, C51 and C52).
4. Remove the screws (×5
) and remove the C5-Board.
6.26. Remove the C6-Board
1. Remove the stand bracket (right). (See section 6.20.)
2. Remove the flexible cables holder fastening screws (×6
).
3. Disconnect the flexible cables (CB1, CB2 and CB3).