Panasonic TH-42PA50, TH-37PA50 Service manual

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ORDER NO.ITD0506034CE
Progressive Plasma Television
TH-42PA50A TH-42PA50H TH-42PA50M TH-37PA50H TH-37PA50M
GP8DA Chassis
Specifications
Power Consumption
Plasma Display panel
Drive method
Aspect Ratio 16:9
Contrast Ratio 4000:1
Screen size (No.of pixels) 818 mm (W) × 461 mm (H) × 939 mm (diagonal) (37-inch)
Sound
Speaker 12 cm × 6 cm × 2 pcs, 6 W
Audio Output 16 W (8 W + 8 W ), 10% THD
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(50Hz), 720p(60Hz), 1080i(50Hz), 1080i(60Hz),
Receiving Systems / Band name (PA50H/M)
C 220-240 V, 50 / 60 Hz
verage use : 245 W (37-inch)
verage use : 315 W (42-inch)
Standby condition : 0.3 W (37-inch)
Standby condition : 0.3 W (42-inch)
C type
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal) (42-inch)
408,960 (852 (W) × 480 (H)) [2,556 × 480 dots]
1152i(50Hz) (42PA50A)
© 2005 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
Receiving Systems / Band name (PA50A)
Receiving Channels (PA50H/M) Regular TV
VHF BAND UHF BAND CATV
2-12 (PAL/SECAM B, K1) 21-69 (PAL G, H, I/SECAM G, K, K1) S1-S20 (OSCAR)
0-12 (PAL B AUST.) 28-69 (PAL B AUST.) 1-125 (USA CATV)
1-9 (PAL B N.Z.) 13-57 (PAL D, K) C13-C49 (JAPAN)
1-12 (PAL/SECAM D) 13-62 (NTSC M Japan) S21-S41 (HYPER)
1-12 (NTSC M Japan) 14-69 (NTSC M USA) Z1-Z37 (CHINA)
2-13 (NTSC M USA) 5A, 9A (AUST.)
Receiving Channels (PA50A) VHF 0 to 12 PAL B
UHF 21 to 69 PAL G
S’1 to S’3 HYPER TUNER
S1 to S41 (One tuner)
Aerial - Rear UHF / VHF
Operating Conditions Temperature : 0 °C - 40 °C
Humidity : 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input
AUDIO L - R RCA PIN Type × 2 0.5 Vrms VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W) S VIDEO MINI DIN 4-pin Y: 1.0 Vp-p (75 W) C: 0.286 Vp-p (75 W)
AV2 Input
AUDIO L - R RCA PIN Type × 2 0.5 Vrms VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
COMPONENT Y
/, PR/C
P
B/CB
R
AV3 Input
AUDIO L - R RCA PIN Type × 2 0.5 Vrms VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
COMPONENT Y
/, PR/C
P
B/CB
R
OUTPUT
AUDIO L - R RCA PIN Type × 2 0.5 Vrms (high impedance) VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
Dimensions ( W × H × D ) 968 mm × 641 mm × 97 mm (37-inch)
1,068 mm × 701 mm × 97 mm (42-inch)
Weight 29.0 kg Net (37-inch)
33.0 kg Net (42-inch)
1.0 Vp-p (including synchronization)
±0.35 Vp-p
1.0 Vp-p (including synchronization)
±0.35 Vp-p
Notes:
·
· Design and Specifi cations are subject to change without notice. Weight and Dimensions shown are approximate.
· ·
CONTENTS
Page Page
1 Applicable signals 5 2 Safety Precautions 5
2
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 Service Hint
6 Plasma panel replacement method
6.1. Remove the Back cover.
6.2. Remove the P-Board.
6.3. Remove the PB-Board
6.4. Remove the D-Board
6.5. Remove the rear terminal cover
6.6. Remove the metal frame
6.7. Remove the DG-Board
6.8. Remove the H-Board and TA-Board
6.9. Remove the PA-Board
6.10. Remove the Z-Board
6.11. Remove the SU-Board
6.12. Remove the SD-Board
6.13. Remove the SC-Board
6.14. Remove the SS-Board
6.15. Remove the C1-Board
6.16. Remove the C2-Board
6.17. Remove the K-Board
6.18. Remove the S-Board
6.19. Remove the Speaker L, R
6.20. Remove the Plasma panel section from the Front frame
(glass)
6.21. Replace the plasma panel (finished).
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
7.2. Lead of Wiring (2)
7.3. Lead of Wiring (3)
8 Self Check
8.1. Power LED Blinking timing chart
8.2. No Power
8.3. No Picture
8.4. Local screen failure
9 Service Mode Function
9.1. How to enter SERVICE 1
9.2. How to enter SERVICE 2
9.3. Option Description
9.4. Option Code Setting
10 Adjustment Procedure
10.1. Driver Set-up
10.2. Initialization Pulse Adjust
10.3. P.C.B. (Printed Circuit Board) exchange
10.4. Adjustment Volume Location
10.5. Test Point Location
11 Adjustment
11.1. PAL panel white balance adjustment
11.2. 1080i white balance adjustment
11.3. Sub bright adjustment
11.4. ABL adjustment
12 Hotel mode
13 Conductor View
13.1. P-Board
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9
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14
13.2. PA-Board
13.3. PB-Board
13.4. H-Board
13.5. DG-Board
13.6. TA-Board
13.7. TB-Board
13.8. Z-Board
13.9. D-Board
13.10. C1-Board (37 inch)
13.11. C1-Board (42 inch)
13.12. C2-Board (37 inch)
13.13. C2-Board (42 inch)
13.14. SC-Board
13.15. SU-Board (37 inch)
13.16. SU-Board (42 inch)
13.17. SD-Board (37 inch)
13.18. SD-Board (42 inch)
13.19. SS-Board
13.20. K and S-Boa rd
14 Block and Schematic Diagram
14.1. Schematic Diagram Notes
14.2. Main Block Diagram
14.3. P-Board Block Diagram
14.4. P-Board (1 of 6) Schematic Diagram
14
15
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25
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34
14.5. P-Board (2 of 6) Schematic Diagram
14.6. P-Board (3 of 6) Schematic Diagram
14.7. P-Board (4 of 6) Schematic Diagram
14.8. P-Board (5 of 6) Schematic Diagram
14.9. P-Board (6 of 6) Schematic Diagram
14.10. PA and PB-Bo ard Block Diagra m
14.11. PA-Board Schematic Diagram
14.12. PB-Board Schematic Diagram
14.13. H, TA and TB-Board Block Diagram
14.14. K, S and Z-Board Block Diagra m
14.15. H Board (1 of 3) Schematic Diagram
14.16. H-Board (2 of 3) Schematic Diagram
14.17. H-Board (3 of 3) Schematic Diagram
14.18. TA and TB-Board Schem atic Diagram
14.19. K and S-Boa rd Schematic Diagram
14.20. Z-Board Schematic Diagram
14.21. DG-Board (1 of 2) Block Diagra m
14.22. DG-Board (2 of 2) Block Diagra m
14.23. DG-Board (1 of 12) Schematic Diagram
14.24. DG-Board (2 of 12) Schematic Diagram
14.25. DG-Board (3 of 12) Schematic Diagram
14.26. DG-Board (4 of 12) Schematic Diagram
14.27. DG-Board (5 of 12) Schematic Diagram
14.28. DG-Board (6 of 12) Schematic Diagram
14.29. DG-Board (7 of 12) Schematic Diagram
14.30. DG-Board (8 of 12) Schematic Diagram
14.31. DG-Board (9 of 12) Schematic Diagram
14.32. DG-Board (10 of 12) Schematic Diagram
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TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
14.33. DG-Board (11 of 12) Schematic Diagram 97
14.34. DG-Board (12 of 12) Schematic Diagram
14.35. D-Board Block Diagram
14.36. D-Board (1 of 6) Schematic Diagram
14.37. D-Board (2 of 6) Schematic Diagram
14.38. D-Board (3 of 6) Schematic Diagram
14.39. D-Board (4 of 6) Schematic Diagram
14.40. D-Board (5 of 6) Schematic Diagram
14.41. D-Board (6 of 6) Schematic Diagram
14.42. C1 and C2-Bo ard Block Diagram
14.43. C1-Board (1 of 2) Schematic Diagram (37 inch)
14.44. C1-Board (2 of 2) Schematic Diagram (37 inch)
14.45. C1-Board (1 of 2) Schematic Diagram (42 inch)
14.46. C1-Board (2 of 2) Schematic Diagram (42 inch)
14.47. C2-Board (1 of 2) Schematic Diagram (37 inch)
14.48. C2-Board (2 of 2) Schematic Diagram (37 inch)
14.49. C2-Board (1 of 2) Schematic Diagram (42 inch)
14.50. C2-Board (2 of 2) Schematic Diagram (42 inch)
14.51. SC-Board Block Diagram
14.52. SC-Board (1 of 2) Schematic Diagram
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14.53. SC-Board (2 of 2) Schematic Diagram
14.54. SU-Board Block Diagram
14.55. SU-Board Schematic Diagram (37 inch)
14.56. SU-Board Schematic Diagram (42 inch)
14.57. SD-Board Block Diagram
14.58. SD-Board Schematic Diagram (37 inch)
14.59. SD-Board Schematic Diagram (42 inch)
14.60. SS-Board Block Diagram
14.61. SS-Board Schematic Diagram
15 Parts Location & Mechanical Replacement Parts List
15.1. Parts Location
15.2. Packing Exploded Views (1)
15.3. Packing Exploded Views (2)
15.4. Packing Exploded Views (3)
15.5. Mechanical Replacement Parts List
16 Electrical Replacement Parts List
16.1. Replacement Parts List Notes
16.2. Electrical Replacement Parts List (37inch)
16.3. Electrical Replacement Parts List (42inch)
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1 Applicable signals
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MW and 5.2MW.
When the exposed metal does not have a return path to the chassis, the reading must be
Figure 1
.
2.1.2. Leakage Current Hot Check (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
5
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
6
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
7
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
5 Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Left) PA DC-DC Converter, Power SOS C2 Data Driver (Right) PB Audio Power SC Scan Drive
H AV Terminal, AV Switch, MSP SU Scan out (Upper)
TA (PA50A) Tuner SD Scan out (Lower)
TB (PA50H/M) Tuner SS Sustain Drive
DG Digital Signal Processor K Remote receiver, Keyscan
Z Speaker AMP S Power Switch
D Format Converter, Plasma AI Processor
8
6 Plasma panel replacement method
6.1. Remove the Back cover.
1. See Service Hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23 and P25).
2. Remove the screws (×5
) and remove the P-Board.
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5 and PB7).
3. Remove the screws (×3 metal frame.
4. Remove the screws (× 4
) and remove the PB-Board
) and remove the PB-Board.
6.4. Remove the D-Board
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D33 and D34).
4. Remove the screws (×4
) and remove the D-Board.
9
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
6.5. Remove the rear terminal cover
1. Remove the screws (×4 ), and rhe screw (×7 ).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
6.7. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2
) and remove the DG-Board.
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-R, SP-L).
3. Remove the screws (×4
) remove the metal frame.
6.8. Remove the H-Board and TA­Board
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×2
3. Disconnect the coupler (H53).
4. Disconnect the flexible ables (H1, H2, H30 and H50).
5. Remove the screws (×3
) and remove the TA-Board.
) and remove the H-Board.
10
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
6.9. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4
) and remove the PA-Board.
6.11. Remove the SU-Board
1. Remove the screws (×2 )
2. Slide the SU-Board to the left to disconnect from a coupler (SC41 - SU41) on the SC-Board and disconnect a coupler (SU45 or SC45).
6.10. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2
) and remove the Z-Board.
3. Disconnect the flexible cables (SU1, SU2, SU3) connected to the SU-Board, and remove the SU-Board.
11
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
6.12. Remove the SD-Board
1. Remove the screws (×2 )
2. Slide the SD-Board to the left to disconnect from a coupler (SC42 - SD42) on the SC-Board and disconnect a coupler (SD46 or SC46).
6.13. Remove the SC-Board
1. Disconnect the couplers (SC2, SC20 and SC23).
2. Remove the screws (×6
) and remove the SC-Board.
3. Disconnect the flexible cables (SD1, SD2 and SD3) connected to the SU-Board, and remove the SD-Board.
6.14. Remove the SS-Board
1. Disconnect the couplers (SS11, SS12, SS23 and SS34).
2. Disconnect the flexible cables (SS41, SS42, SS43 and SS44).
3. Remove the screws (×6
) and remove the SS-Board.
12
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
6.15. Remove the C1-Board
1. Remove the flexible cables holder fastening screws (×6 ).
2. Disconnect the flexible cables (CB1, CB2 and CB3).
3. Disconnect the flexible cable (C11).
4. Disconnect the coupler (C12).
5. Remove the screws (×3
) and remove the C1-Board.
6.17. Remove the K-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (H53 and SS34).
3. Remove the screws (×3
) and remove the K-Board.
6.18. Remove the S-Board
1. Remove the screw (×2 ) and remove the S-Board unit.
6.16. Remove the C2-Board
1. Remove the flexible cables holder fastening screws (×8 ).
2. Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3. Disconnect the flexible cable (C21).
4. Disconnect the couplers (C22 and C23).
5. Remove the screws (×3
left and remove the C2-Board.
) and slide the C2-Board to the
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TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
2. Unlock the cable clampers to free the cable.
3. Disconnect the couplers (S1 and S2).
4. Remove the screws (×2
) and remove the S-Board.
6.20. Remove the Plasma panel section from the Front frame (glass)
1. Remove the front frame and the plasma panel fastening
screw (×8
2. Remove the front frame and the stand brackets fastening
screw (×6
).
).
6.19. Remove the Speaker L, R
1. Remove the screw (×8 ) and remove the Speaker L, R.
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
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6.21. Replace the plasma panel (finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×7) from the Plasma panel to the C1-Board and C2­Board, and fix the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow any debris, dust or handling residues to remain between the front glass and plasma panel.
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
15
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
16
7.2. Lead of Wiring (2)
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
17
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
7.3. Lead of Wiring (3)
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TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
8 Self Check
1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2. To get into the Self -Check mode press the Down (
timepressingtheRecall buttonontheremotecontrol,andthescreenwillshow:
) button on the customer controls at the front of the set, at the same
If the CCU ports have been checked and found to be incorrect or not located then “--” will appear in place of “O.K.”.
Display Ref.No Description P.C.B. MEM IC1107 EEPROM DG-Board GC3FS IC4013 Global Core for Sub DG-Board GC4P IC4054 Global Core for Main DG-Board HAD IC4012 OSD RGB A/D DG-Board AVSW1 IC2105 Audio SW H-Board AVSW2 IC3005 Video SW H-Board Tun1 TU001 Tuner TA/TB-Board Tun2 TU002 Tuner TB-Board DAC1 IC1106 Ext. DAC DG-Board DAC3 IC3006 Ext. I/O H-Board DAC4 IC4016 Ext. I/O DG-Board MSP IC2106 Multi Sound Processor H-Board SOUND IC2300 Sound Control Z-Board PANEL IC9003 Panel D-Board ADV IC4005 10bit A/D DG-Board
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TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
8.1. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
8.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
1. No lit
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8.3. No Picture
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
21
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
8.4. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
Fig - 1
22
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
9 Service Mode Function
MPU controls the functions switching for each IICs through IIC bus in this chassis. The following setting and adjustment can be adjusted by remote control in Service Mode.
9.1. How to enter SERVICE 1
1. In sound menu, set BASS to MAXIMUM, and set TREBLE to MINIMUM.
2. Simultaneously press INDEX button on remote control and DOWN button [
9.2. How to enter SERVICE 2
1. Set the channel to CH99.
2. Select the SPL Gain.
3. Press HOLD button on remote control.
Note:
To exit to Service mode, press N or Power button on remote control.
] on the TV set.
23
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
24
9.3. Option Description
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
25
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
26
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
9.4. Option Code Setting
If the memory IC (IC1107) or DG Board is replaced, option code should be re-memorized.
Spare part of IC1107 is already memorized all Data for TH-37/42PA50M.
If you use for other model, you should re-memorized the different option code in SERVICE 2 mode.
Option No. PA50A PA50H PA50M
OPTION1 40 0F 0F OPTION2 22 E2 E2 OPTION3 3A 1E 1B OPTION4 D8 48 48 OPTION5 0B 1B 1B OPTION6 00 00 00 OPTION7 93 A1 B1 OPTION8 40 40 40
OPTION9 06 FF FF OPTION10 08 6F 6F OPTION11 C4 C4 C4 OPTION12 09 09 09 OPTION13 00 00 00
27
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
10 Adjustment Procedure
10.1. Driver Set-up
10.1.1. Item / Preparation
1. Input an APL 100 % white signal.
2. Set the picture controls: -
Picture mode: Normal
White balance: Cool
Aspect: 16:9
10.1.2. Adjustments
Adjust driver section voltages referring the panel data on the panel data label.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS) Ve TPVE (SS) Ve ± 1V VR6074 (SS) * Vset TPVSET
(SC) Vad TPVAD (SC) -90V ± 1V VR6477
Vscn TPVSCN
(SC) Vda TPVDA (SS) 67V ± 1V R665 (P) PFC C448 (+)(-) 395V ± 0.5V R443 (P) Vlow C557 (+)(-) 73V ± 0.1V R661 (P) load
Csus TPVsus 164V ± 0.5V R671 (P) load
Vsus ± 1V R628 (P) *
232V ± 6V Fixed
(SC)
Vad +120V ±3VFixed
current :
0.4A
current :
1.45A
*See the Panel label.
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10.2. Initialization Pulse Adjust
1. Input a Cross hatch signal.
2. Set the picture controls: -
Picture mode: Normal
White balance: Cool
Adjust the indicated test point for the specified wave form.
Test point Volume Level T1 TPSC1 (SC) --- 15 ± 10µ Sec T2 TPSS1 (SS) VR6557 (SC) 184 + 5µ / - 10µ Sec
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
29
TH-42PA50A / TH-42P A50H / TH-42P A50M / TH-37PA50H / TH-37PA50M
10.3. P.C.B. (Printed Circuit Board) exchange
10.3.1. Caution
1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
10.3.2. Quick adjustment after P.C.B. exchange
P.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS (SS) Vsus ± 1V R628 (P) *
Vda TPVDA (SS) 67V ± 1V R665 (P) PFC C446 (+) (-) (P) 395V ± 0.5V R443 (P) Vlow C557 (+) (-) (P) 73V ± 0.1V R661 (P) load current : 0.4A
Csus TPVSUS (SS) 164V ± 0.5V R671 (P) load current : 1.45A SC Board Vad TPVAD (SC) -90V ± 1V VR6477 (SC) SS Board Ve TPVE (SS) Ve ± 1V VR6074 (SS) * D, DG Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
10.4. Adjustment Volume Location
10.5. Test Point Location
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