Panasonic TG2323AG Service Manual

ORDER NO. KM40501578CE

Telephone Equipment

KX-TG2323AGB KX-TGA231AGB

2.4GHz Digital Cordless Answering System

Black Version (for Argentina)

KX-TG2323AGB / KX-TGA231AGB

Note:

Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without notice. Please refer to the original Operating Instructions for further information.

CONTENTS

Page Page

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4

1.1. Suggested PbF Solder

1.2. How to Recognize that Pb Free Solder is Used

2 FOR SERVICE TECHNICIANS 3 CAUTION 4 BATTERY

4.1. Battery Charge

4.2. Battery Recharge

4.3. Battery Information

4.4. Battery Replacement

5 LOCATION OF CONTROLS

5.1. Base Unit

5.2. Handset

6 DISPLAY

6.1. Base Unit Display

7 SETTINGS

7.1. Connections

7.2. Connecting an Optional Headset

7.3. Time and Day

7.4. Dialing Mode

7.5. Voice Enhancer Technology

7.6. Ringer Tone

8 OPERATION

8.1. Answering System

8.2. For Call Waiting Service Users

8.3. FLASH Button

8.4. Remote Operation from a Touch Tone Phone

9 TROUBLESHOOTING 10 DISASSEMBLY INSTRUCTIONS

10.1. Base Unit

10.2. Handset

11 TROUBLESHOOTING GUIDE

11.1. Check Power

11.2. Error Message Table

11.3. Check Record

11.4. Check Playback

11.5. Check Battery Charge

12 13 13 14 14 14

15 17 18 18

22 25

25 26

28 28 29 30 30

4 5

6 6 7

7 7 7 8

11.6. Check Link

11.7. Check the RF Part

11.8. Check Handset Transmission

11.9. Check Handset Reception

12 TEST MODE

12.1. Test Mode Flow Chart for Base Unit

12.2. Test Mode Flow Chart for Handset

12.3. X801 (Base Unit), X201 (Handset) Check

12.4. Adjust Battery Low Detector Voltage (Handset)

12.5. Base Unit Reference Drawing

12.6. Handset Reference Drawing

12.7. Frequency Table

12.8. How to Clear User Setting

13 DESCRIPTION

13.1. Frequency

13.2. FHSS (Frequency Hopping Spread Spectrum)

13.3. Signal Flowchart in the Whole System

14 EXPLANATION OF LINK DATA COMMUNICATION

14.1. Calling

14.2. To Terminate Communication

14.3. Ringing

15 B LOCK DIAGRAM (Base Unit) 16 CIRCUIT OPERATION (Base Unit)

16.1. DSP (Digital Speech/Signal Processing: IC501)

16.2. Flash Memory (IC701)

16.3. Power Supply Circuit

16.4. Reset Circuit

16.5. Locator Mode

16.6. Telephone Line Interface

16.7. Auto Disconnect Circuit

16.8. Parallel Connection Detect Circuit

17 B LOCK DIAGRAM (Handset) 18 CIRCUIT OPERATION (Handset)

18.1. Construction

18.2. Power Supply Circuit

18.3. Charge Circuit

18.4. Ringer and Handset SP-Phone

31 32 36 36

37 40 44 44 45 47 48 49

50 50 52

53 53 53

54 55

55 56 56 58 59 59 60 61

62 63

63 64 65 65

KX-TG2323AGB / KX-TGA231AGB

18.5. Sending Signal 66

18.6. Reception Signal

19 SIGNAL ROUTE 20 CPU DATA (Base Unit)

20.1. IC501

21 CPU DATA (Handset)

21.1. IC201

22 EXPLANATION OF IC TERMINALS (RF Unit)

22.1. IC901

23 HOW TO REPLACE A FLAT PACKAGE IC

23.1. Preparation

23.2. Procedure

23.3. Removing Solder from Between Pins

24 CABINET AND ELECTRICAL PARTS (Base Unit) 25 CABINET AND ELECTRICAL PARTS (Handset) 26 ACCESSORIES AND PACKING MATERIALS 27 TER MINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

27.1. Base Unit

27.2. Handset

28 REPLACEMENT PARTS LIST 67 68

71 71 71

72 73 74

28.1. Base Unit

28.2. Handset

28.3. Accessories and Packing Materials

29 FOR SCHEMATIC DIAGRAM

29.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit))

29.2. Handset (SCHEMATIC DIAGRAM (Handset))

30 SCHEMATIC DIAGRAM (Base Unit)

30.1. Main

30.2. Operation

31 SCHEMATIC DIAGRAM (Handset)

32 SC HEMATIC DIAGRAM (RF PART)

33 CIRCUIT BOARD (BASE UNIT)

33.1. Main

33.2. Operation

34 CIRCUIT BOARD (HANDSET) 75

34.1. Component View

34.2. Flow Solder Side View

76 78 80

81 81

82 84

86 88 89

89 91

93 94

KX-TG2323AGB / KX-TGA231AGB

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

•

• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with

• •

temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please be careful not to heat too long.

•

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).

• •

•

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

• •

and be sure that any remaining is melted prior to applying the Pb solder.

•

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

• •

opposite side (See the figure below).

1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.