1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MW and 5.2MW.
When the exposed metal does not have a return path to the
chassis, the reading must be
Figure 1
.
1.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the ACplugintheAC outlet andrepeateach of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Warning
2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
4
TC-32LX50 / TC-26LX50
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
5
TC-32LX50 / TC-26LX50
3 Location of Controls and Components
Board NameFunction
H-BoardAV Switch, Audio, AV connector
V-BoardRemote Reciever, LED
K-BoardPower switch
AP-BoardDC-DC
G-BoardFront Terminal
DG-BoardMCU, Gobal Core, MEMORY
DV-BoardHDMI I/F
Power UnitPower (AC/DC),
None serviceable.
Power Unit should be exchange for service.
6
TC-32LX50 / TC-26LX50
4 Service Mode
4.1. How to enter into adjustment mode
While pressing [VOLUME-] button of the main unit, press [RECALL] button of the remote control three times in a row (within 2
seconds).
4.1.1. Adjustment method.....Use the remote control.
“1” button...Main items Selection in forward direction
“2” button...Main items Selection in reverse direction
“3” button...Sub items Selection in forward direction
“4” button...Sub items Selection in reverse direction
“VOL” button...Value of sub items change in forward direction (
), in reverse direction ()
4.2. Cancellation
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
4.3. Contents of adjustment mode
·Value is shown as a hexadecimal number.
·Preset value differs depending on models.
·After entering the adjustment mode, take note of the value in each item before starting adjustment.
When phenomena like "the power fails from time to time" or "the video/audio fails from time to time" can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to limit the scope for the defective circuits.Also,
when "the power fails from time to time", display on the screen can be used to confirm the occurrence and to limit the scope for
the defective circuits.
Any programmed channels, channels caption data and some other user defined settings will be erased and return to factory setting.
5.1.1. How to access
5.1.1.1. Access
Produce TV reception screen and, while pressing [VOLUME-] button on the main unit, press [SLEEP] button on the remote
controller unit simultaneously.
5.1.1.2. Exit
When one of the buttons for channel selection etc. is pressed, the display returns to the normal screen.
1. 1. Lay down the unit so that the rear cover faces upward.
2. 2. Remove the 4 screws.
3. 3. Remove the pedestal.
1. Remove the 9 screws.
2. Remove the back cover.
10
6.5. Removing the sp box
1. Remove the 6 screws.
2. Remove the sp box.
TC-32LX50 / TC-26LX50
6.7. Removing the rear support
MTG
1. Remove the 4 screws.
2. Remove the rear support MTG.
6.6. Removing the rear AV bracket
1. Remove the 2 screws.
2. 2. Remove the screw.
3. 3. Remove the rear AV bracket.
11
TC-32LX50 / TC-26LX50
6.8. Removing the font bracket and
G-Board
1. Remove the 2 screws.
2. Disconnect the coupler(G1, G2, and G4).
3. 3. Remove the front bracket assembly.
4. Remove the front bracket and G-Board
6.9. Removing the K-Board and VBoard
1. Remove the 4 screws.
2. Disconnect the coupler (K2 and V1).
3. Remove K-Board, V-Board.
6.10. Removing the LVDS metal
bracket and DV-DG shield
1. Remove the 3 screws.
2. Remove the LVDS metal bracket.
3. Remove the screw.
4. Remove the DV-DG shield.
12
6.11. Removing the tuner cover, DVBoard, AP-Board, DG-Board,
and H-Board
1. Remove the screw.
2. Remove the tuner cover.
3. Remove the 3 screws.
4. Remove the DV-Board.
5. Remove the 15 screws.
6. Disconnect the coupler (AP1-H1, AP2-CN101, AP3-CN201,
AP4-DG4, AP5-DG5, DG2-H2, DG3-H3, DG6-INV and
DG7-PANEL).
7. Remove the AP-Board, DG-Board, and H-Board.
TC-32LX50 / TC-26LX50
6.13. Removing the chassis
1. Remove the 3 screws.
2. Remove the chassis.
6.12. Removing the power unit
1. Remove the 4 screws.
2. Remove the power unit.
6.14. Removing the LCD panel ass´y
and LCD L/R MTG
1. Remove the 4 screws.
2. Remove the LCD panel ass´y and LCD L/R MTG.
13
TC-32LX50 / TC-26LX50
6.15. Removing the LCD panel and
LCD T/B MTG
1. Remove the 4 screws.
2. Remove the LCD panel and LCD T/B MTG.
6.17. Lead Wiring (2)
6.16. Lead Wiring (1)
6.18. Lead Wiring (3)
14
7 Measurements and Adjustments
7.1. Picture level adjustment
7.1.1. NTSC Picture RF
Instrument NameConnect toRemarks
Remote controller
Ex. Signal (Sprit color bar)
1. Receive the sprit color bar.
(Screen mode: ZOOM or FULL Picture mode: DINAMIC AI: OFF AI Picture:OFF)
*BACK LIGHT +30
2. Enter Factory adjustment mode, and select MAIN_ADJ PICTURE.
2-1 Y signal check
Volume UP/DOWN key makes GAIN displayed under PICTURE to set.
Pushing the remote controller “OK” key for about 3 seconds, GAIN is suited tothe adjustment
value automatically.
RF input
ProcedureRemarks
TC-32LX50 / TC-26LX50
The Micon changes automatically to the mode
of the following in the adjustment mode.
At the factory trial purposes and pre-production,
the value of YMAX and GAIN are recorded.
15
TC-32LX50 / TC-26LX50
7.1.2. NTSC Picture VBS
Instrument NameConnect toRemarks
Remote controller
Video signal generator
1. Receive the 100% color bar.
(Screen mode: ZOOM or FULL Picture mode: DINAMIC AI: OFF AI Picture:OFF)
*BACK LIGHT +30
2. Enter Factory adjustment mode, and select MAIN_ADJ PICTURE.
2-1 Y signal check
Volume UP/DOWN key makes GAIN displayed under PICTURE to set.
Pushing the remote controller “OK” key for about 3 seconds, GAIN is suited to the
adjustment value automatically.
Video input
ProcedureRemarks
The Micon changes automatically to the mode
of the following in the adjustment mode.
At the factory trial purposes and pre-production,
the value of YMAX and GAIN are recorded.
16
7.1.3. Component Picture 1125i input
Instrument NameConnect toRemarks
Remote controller
Video signal generator
1. Receive the 100% color bar.
(Screen mode: ZOOM or FULL Picture mode: DINAMIC AI: OFF AI Picture: OFF)
*BACK LIGHT +30
2. Enter Factory adjustment mode, and select MAIN_ADJ PICTURE.
2-1 Y signal check
Volume UP/DOWN key makes GAIN displayed under PICTURE to set.
Pushing the remote controller “OK” key for about 3 seconds, GAIN is suited to the
adjustment value automatically.
Y, Pb, Pr input
ProcedureRemarks
TC-32LX50 / TC-26LX50
The Micon changes automatically to the mode
of the following in the adjustment mode.
At the factory trial purposes and pre-production,
the value of YMAX and GAIN are recorded.
17
TC-32LX50 / TC-26LX50
7.2. MTS Adjustment
7.2.1. Input level adjustment
Instrument NameConnect toRemarks
Filter Jig
RMS voltage meter
RF signal generator
1. Apply following RF at Antenna input.
Video: Flat field, 30% modulation
Audio: 300Hz, 100% modulation, monaural
(70dB ±5dB, 75W OPEN, P/S 10dB)
Note: Make sure 75us Pre -Emphasis is off.
2. Select MTSIN of MTS adjust in factory adjust mode
3. Adjust “MTSIN” data (input level) until RMS voltage meter indicates 106±6mVrms.
Monitor out L
Filter Jig
RF ANT. Input
ProcedureRemarks
*Need to min 30 minutes aging.
18
7.2.2. Stereo separation adjustment
Instrument NameConnect toRemarks
Oscilloscope
RF signal generator
1. Select stereo mode in the audio menu.
2. Apply following RF signal at Antenna input.
Video: Flat field, 30% modulation
Audio: 300Hz, 30% modulation, stereo (Left only)
(70dB ±5dB ,75W OPEN ,P/S 10dB)
Note: After setting 30% modulation with P.L. SW
And N.R. SW off, TURN P.L. SW and N.R. SW on.
3. Select SEPAL of MTS Adjust in factory Adjust mode
4. Adjust “SEPAL” data (Low-level separation) until the amplitude
5. Apply following RF signal at Antenna input.
Video: Flat field, 30% modulation
Audio: 3kHz, 30% modulation, stereo (Left only)
(70dB±5dB ,75W OPEN ,P/S 10dB)
Note: After setting 30% modulation with P.L. SW
And N.R. SW off, TURN P.L. SW and N.R. SW on.
6. Select SEPAH of MTS adjust in factory adjust mode
7. Adjust “SEPAH” data (High-level separation) until the the amplitude of the waveform on the
oscilloscope minimum.
8. Repeat steps 2. to 7. until Low-level separation and High-level separations satisfy abovementioned conditions.
Monitor out R
RF ANT. Input
ProcedureRemarks
TC-32LX50 / TC-26LX50
*Need to min 30 minutes aging.
Need to more than 20dB separation at 300Hz