23.2. Cassette Deck (RAA4402-1S) & Traverse Deck Part
Location
23.3. Packaging
24 Replacement Parts List
65
65
66
68
69
70
71
73
73
74
75
76
77
78
78
79
79
81
83
83
84
85
87
3
SA-PM33DBEB
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installe d.
3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩ and 5.2Ω.
When the exposed metal does not have a return path to the chassis, the reading must be
.
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned
to the customer.
4
1.2. Caution for AC Cord
SA-PM33DBEB
5
SA-PM33DBEB
1.3. Before Repair and Adjustment
Disconnect AC power, discharge Power Supply Capacitors C501, C601, C807, C813, C814, C831, C839, C840, C909, C910,
C911, C923 & C966 through a 10Ω, 1W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
· Current consumption at AC 230-240 V, 50 Hz in NO SIGNAL mode at (volume minimal) should be ~160 mA.
1.4. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
·No sound is heard when the power is turned on.
·Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
6
SA-PM33DBEB
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handlin g any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applyin g power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium
foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
SA-PM33DBEB
3 Precaution of Laser Diode
CAUTION:
This unit utilizes a class 1 laser.
Invisible laser radiation is emitted from the optical pickup lens.
When the unit is turned on:
1. Do not look directly into the pick up lens.
2. Do not use optical instruments to look at the pick up lens.
3. Do not adjust the preset variable resistor on the pickup lens.
4. Do not disassemble the optical pick up unit.
5. If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.
6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous radiation
exposure.
CAUTION!
THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
8
4 Handling Precautions For Traverse Deck
The laser diode in the traverse deck (optical pickup) may break
down due to potential difference caused by static electricity of
clothes or human body.
So, be careful of electrostatic breakdown during repair of the
traverse deck (optical pickup).
l Handling of CD traverse deck (optical pickup)
1. Do not subject the traverse deck (optical pickup) to
static electricity as it is extremely sensitive to electrical
shock.
2. The short land between the No.4 (LD) and No.5 (GND)
pins on the flexible board (FFC) is shorted with a solder
build-up to prevent damage to the laser diode.
3. Take care not to apply excessive stress to the flexible
board (FFC board) (Fig 4.1).
4. Do not turn the variable resistor (laser power
adjustment). It has already been adjusted.
SA-PM33DBEB
Fig 4.1
l Grounding for electrostatic breakdown prevention
1. Human body grounding (Fig 4.2)
Use the anti-static wrist strap to discharge the static
electricity from your body.
2. Work table grounding (Fig 4.2)
Put a conductive material (sheet) or steel sheet on the
area where the traverse deck (optical pickup) is placed,
and ground the sheet.
Caution :
The static electricity of your clothes will not be grounded
through the wrist strap. So, take care not to let your
clothes touch the traverse deck (optical pickup).
Fig 4.2
Caution when Replacing the Optical Pickup :
The traverse has a short point shorted with solder to protect
the laser diode against electrostatics breakdown. Be sure to
remove the solder from the short point before making
connections.
9
SA-PM33DBEB
5 Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufacture d) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please
use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700 ± 20°F (370 ±
10°C).
·Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
·W hen soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until it melts enough.
10
6 Accessories
Note : Refer to Packing Materials & Accessories (Section 24) for part number.
Remote control
AC cord
SA-PM33DBEB
FM indoor
antenna
AM loop antenna
Antenna
plug
adaptor
DAB antenna
11
SA-PM33DBEB
7 Operating Instructions Procedures
7.1. Main Unit Operation
12
7.2. Remote Control Operation
SA-PM33DBEB
7.3. Disc Information
13
SA-PM33DBEB
8 Self diagnosis and special mode setting
This unit is equipped with features of self-diagnostic & special mode setting for checking the functions & reliability.
8.1. Special Mode Table
Below is the various special modes for checking:-
ItemFL DisplayKey Operation
Mode NameDescriptionFront Key
Self -Diagnostic
Mode
Doctor ModeTo enter into Doctor
FL Display Test TochecktheFL
CD to Tape
Recording Test
Mode
Tape Recording
and Playing
CD Tray and
Tape Door Open
Volume Setting To Forced Volume
Toenterintoself
diagnostic checking for
main unit.
Mode for checking of
various items and
displaying EEPROM and
firmware version.
(For more information,
refer to section 8.1.2)
Note: The microprocessor version as
shown is an example. It
will be revise when there
is an updates.
segmentsdisplay(All
segments will light up)
To Inspect the recording
process from CD to
TAPE for the unit.
(For more information,
refer to section 8.1.3)
To Inspect the Tape
recording and playing is
process for unit.
(For more information,
refer to section 8.1.4)
To check CD Tray and
Tape Door Open.
Setting.
1.
2.
The Check Sum of EEPROM and firmware
version will be display for 1 sec.
* ROM correction
** Firmware version No:
1.
2.
1. Select [] for CD mode (Ensure no
tape or CD inserted).
2. Press and hold [
seconds follow by [
To exit, press
remote control.
In any mode:
1. Press [
by [4] and [7] on remote control.
To exit, press [ENTER] button on remote
control or
control.
In doctor mode:
1. Press [DIMMER] button on remote control.
To exit, press [ENTER] button on remote
control or
control.
In doctor mode:
1. Press [4] button on remote control.
To exit, press [ENTER] button on remote
control or
control.
In doctor mode:
1. Press [5] button on remote control.
To exit, press [ENTER] button on remote
control or
control.
In doctor mode:
1. Press [6] button on remote control.
To exit, press [ENTER] button on remote
control or
control.
In doctor mode:
1. Press [7] button on remote control.
2. Press [8] button on remote control.
3. Press [9] button on remote control.
To exit, press [ENTER] button on remote
control or
control.
button on main unit or
] button on main unit follow
button on main unit or remote
button on main unit or remote
button on main unit or remote
button on main unit or remote
button on main unit or remote
button on main unit or remote
]button for 2
].
Traverse TestTodeterminethe
reliability of CD unit.
3.
14
In doctor Mode:
1. Press [
To exit, press
remote control.
], [1], [2] button on remote control.
button on main unit or
ItemFL DisplayKey Operation
Mode NameDescriptionFront Key
TPSTo check FF TPS for
deck.
(For more information,
refer to section 8.1.5)
Cold StartTo activate cold start ipon
next AC power up.
In doctor mode:
1. Press [
control.
To exit, press [ENTER] button on remote
control or
control.
In doctor mode:
1. Press [SLEEP] button on remote control.
To exit, press [ENTER] button on remote
control or
control.
8.1.1. Cassette Mechanism Self-Diagnostic Mode
Below is information of the checking of cassette deck mechanism
NORMAL type cassette with the recording tab
on the left side removed.
3[] key is pressed, after loading a
NORMAL, CrO2, METAL type cassette with
the recording tab on the right side removed.
4[TAPE] Key is pressed, after loading in a
NORMAL, CrO2, METAL type cassette (
cassette for TPS checking purposes and with
both recording tabs intact ).
5[REC] key is pressed, after loading in a
NORMAL type cassette ( with both recording
tabs intact )
6Self-diagnostic mode is stopped by pressing
the [n] Key.
7To clear all the abnormalities in the memory,
press the [n] Key for more than 5 Sec while
the self-diagnostic mode is stopped.
8To cancel the self-diagnostic mode press the
Key.
Check that all DECK mechanism leaf SW is in OFF state.
FF shall be executed for 2 sec, after which STOP.
Check the following.
{ F.REC INH SW } is OFF
{ HALF SW } is ON
Reel pulse toggles between H & L.
REW shall be executed for 2 sec, after which STOP.
Check the following.
{ F.REC INH SW } is ON
{ HALF SW } is ON
Reel pulse toggles between H & L.
TPS operation is executed. Check the following.
{ F.REC INH SW } is ON
{ HALF SW } is ON
TPS signal changes.
After checking TPS, it shall STOP.
If TPS checking is completed at TAPE END, it is considered as TPS
abnormal.
REC operation shall not be executed.
Check the following.
{ F.REC INH SW } is ON
{ HALF SW } is ON
LCD shall display the abnormality item code, when the STOP key is pressed,
it shall display the abnormality item code in the following sequence.
[ TEST H 0 1] [ TEST H 0 2] [ TEST H 0 3]
At this time, all the abnormalities item in the memory is cleared and is
displayed on the LCD.[ C L E A R ] display for 1 Sec. then,[ TEST ] is
displayed.
POWER is OFF.At the next POWER ON, normal operation shall be executed.
SA-PM33DBEB
] button on remote
button on main unit or remote
button on main unit or remote
· If RAM check error occurs during microcomputer reset, COLDSTART shall be executed and all the error memory shall be
cleared during RAM initialization.
8.1.2. EEPROM Checksum (ROM correction)
Purpose : To check for micro-processor firmware version & EEPROM check (ROM correction).
Below is the procedures for this mode.
Step 1: Enter into Doctor mode (For more information refer to section 8.1 on key operation to enter into this mode.
Step 2: Check for firmware version & EEPROM checksum.
· W hen entering into DOCTOR MODE the firmware version & checksum of EEPROM (if applicable) will appear on FL display.
Below is information on the EEPROM IC (Rom correction) under 3 examples:
1. When EEPROM IC is detected and there is no ROM correction:
2. When EEPROM IC is detecte d and has ROM correction:
15
SA-PM33DBEB
3. When EEPROM IC is detected and has ROM correction but NG:
Note: Micro-processor firmware version refers to version No. (Eg.MS079_12) for micro-processor IC.
It is subject to change which would update accordingly.
· Rom correction checksum refers to the hex code that is display upon key buttons pressed if an EEPRO M is loaded in the unit.
(Main P.C.B)
8.1.3. CD to Tape Recording Inspection
Purpose : To check the recording function from CD to Tape.
Below is the procedures for this mode.
Procedure :
Step 1: Enter into Doctor mode (Refer section 8.1 Special Mode Table)
Step 2: Insert CDT-018 (Ensure TOC is completed) to CD unit before proceeding.
Step 3: Press [4] button on remote control. Enter into CD to Tape Test mode. (During this mode, volume is set to [VOLUME 50],
Bass & Treble is set to 0dB & EQ is switch off).
Note : When in CD to Tape Recording Test mode, the following process is perform :
a) Deck will rewind to start point (point at the start of recording) & Stop. During rewinding of Tape, CD tray remains open.
b) Recording begins (at constant analogue recording speed) for 3 seconds & Stop.
· However, “Error” would be display if there is no tracks to access to, no tape inserted, no test CD inserted or when the tape
erasure prevention tab for FWD side is not suitable for recording.
· When in this mode, if
button is pressed the process will stops automatically.
8.1.4. Tape Recording and Playing
Purpose : To check the Tape function.
Assuming the recording to TAPE has been done in test 3, only playing TAPE is made.
Below is the procedures for this mode.
Procedure :
Step 1: Enter into Doctor mode (Refer section 8.1 Special Mode Table)
Step 2: Press [5] button on remote control. Enter into Tape recording Test mode. (During this mode, Tape function is set to
automatically, volume is set to [VOLUME 50], Bass & Treble is set to 0dB & EQ is switch off).
Step 3: FWD play is made for 3 seconds after setting the above-mentioned, TAPE is stopped 3 seconds later. Tape should open.
Note : When in CD to Tape Recording Test mode, the following process is perform :
a) If the erasure prevention tab for FWD side the tape is broken, it is judged as an error and the recording operation does not start.
b) If tape stops by detecting a tape end while recording, it becomes an error.
c) If STOP key is pressed while recording or playing, the operation shall be terminated by stopping TAPE. In this case, the doctor
mode is not released.
d) DMT is output with the same timing as usual.
16
SA-PM33DBEB
8.1.5. TPS Inspection
Purpose : To check the TPS.
Below is the procedures for this mode.
Procedure :
Step 1: Enter into Doctor mode (Refer section 8.1 Special Mode Table)
Step 2: Press [
·Software will start checking for existence of cassette in Deck.
·If the Deck does not contain any cassette, it shall end the test and displays the result of the test.
·The test will start by playing the Deck in forward direction for 1 sec and then FF TPS.
·If TPS signal is OK, the Deck shall be ejected. Below is information on the TPS under 3 examples.
1. If ERROR Flag is set "ERROR" shall be displayed. TPS check result shall not be shown in this case.
2. If Deck TPS check = OK
3. If Deck TPS check = NG
] button on remote control. Enter into TPS Test mode. (During this mode)
17
SA-PM33DBEB
8.2. Error Code Table
Self-Diagnosis Function provides information on any problems occuring for the unit and its respective components by displaying
error codes. Thesed error code such as U**, H** and F** are stored in memory and held unless it is cleared.
The error code is automatically display after entering into self-diagnostic mode.
Error Code Diagnosis Contents Description of errorAutomatic FL DisplayRemarks
H01MODE SW abnormalFor deck mechanism unit.
H02REC INH SW
abnormal
H03HALF SW abnormalFor deck mechanism unit.
Press [
error.
For deck mechanism unit.
Press [
error.
Press [
error.
] on main unit for next
] on main unit for next
] on main unit for next
18
Error Code Diagnosis Contents Description of errorAutomatic FL DisplayRemarks
F01
Reel pulse abnormal
For deck mechanism unit.
Press [
error.
SA-PM33DBEB
] on main unit for next
F02
TPS abnormal
F15CDRESTSW
Abnormal
F26Communication
between CD servo
LSI and micro-p
abnormal.
POWER
AMP output
abnormal
CD traverse position intial
setting operation failsafe
counter (1000 ms) waiting
for REST SW toturn on.
Error No. shall be clear by
force or during cold start.
CDfunctionDTMS
command,aftersystem
setting, If SENSE = ´L´
cannotbedetected.
Memory shall contain F26
code. After Power on, CD
functionshallcontinue,
error display shall be "NO
DISC". Error No. shall be
clear by force or cold start.
During normal operation, if
DCDETbecomes"L",
normalPOWEROFF
processshallnotbe
executed, PCONT shall be
switchedto"L"
immediately. "GOODBYE"
shall not be display but the
errordisplayF61is
displayedinstead.2
seconds after the F61
displayed, ECONO shall be
set to "L" and FL display
shall be turned off. The
errorcontentshallbe
memorizedwhenthe
abnormality occurs and can
be display in the C-mecha
self-diagnosticmode
described later.
For CD unit (For Traverse).
Press [
] on main unit for next
error.
For CD unit (For Traverse).
Press [
] on main unit for next
error.
For Power Supply Related Error
Detection.
Press [
] on main unit for next
error.
19
SA-PM33DBEB
9 Assembling and Disassembling
9.1. Caution
“ATTENTION SERVICER”
Some chassis components may be have sharp edges. Be careful when disassembling and servicing.
1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main
components.
2. For reassembly after operation checks or replacement, reverse the respective procedures.
Special reassembly procedures are described only when required.
3. Select items from the following index when checks or replacement are required.
Warning:
This product uses a laser diode. Refer to “Precaution of Laser Diode”.
Below is the list of disassembly sections
·Disasse mbly of Side Panel L & R
·Disasse mbly of Top Cabinet Unit
·Disasse mbly of Deck Mechanism and Tape Eject P.C.B.
·Disasse mbly of Headphone P.C.B.
·Disasse mbly of Front Panel
·Disasse mbly of DAB P.C.B.
·Disasse mbly of Panel P.C.B.
·Disasse mbly of Rear Panel
·Disasse mbly of Tuner Pack
·Disasse mbly of Main P.C.B.
·Disasse mbly of Power P.C.B.
·Disasse mbly of Speaker Terminal P.C.B.
·Disasse mbly of Transformer P.C.B.
·Disasse mbly of CD Mechanism
·Disasse mbly of Cassette Lid
·Disasse mbly of Traverse Unit, Driving Gear, and Cam Gear (CD Mechanism Unit)
·Disasse mbly of Optical Pickup (CD Mechanism Unit)
·Disasse mbly of Traverse Gear A and Traverse Gear B (CD Mechanism Unit)
·Disasse mbly of Pinch Roller and Head Block (Deck Mechanism Unit)
·Disasse mbly of Motor, Capstan Belt A, Capstan Belt B, and Winding Belt (Deck Mechanism Unit)
·Disasse mbly of Deck Mechanism P.C.B.
·Handling of cassette tape jam
20
SA-PM33DBEB
9.2. Disassembly flow chart
The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the
servicing.
To assemble the unit, reverse the steps shown in the chart below.
21
SA-PM33DBEB
9.3. Main Parts Location Diagram
22
SA-PM33DBEB
9.4. Disassembly of Side Panel L &
R
· Disasse mbly of Side Panel (R)
Step 1: Remove 5 screws.
Step 2: Remove the side panel (R) as arrow shown.
9.5. Disassembly of Top Cabinet
Unit
Step 1: Remove 3 screws.
·Disasse mbly of Side Panel (L)
Step 3: Remove 5 screws.
Step 4: Remove the side panel (L) as arrow shown.
Step 2: Remove 3 screws.
Step 3: Lift up the top cabine t unit, push backward
as arrow shown and flip top cabinet unit sideway.
(Be careful of the catch)
23
SA-PM33DBEB
Step 4: Disconnect FFC cable (CN804).
Step 5: Detach connector (CN504A).
Step 6: Remove top cabinet unit.
9.6. Disassembly of Deck
Mechanism and Tape Eject
P.C.B.
Step 4: Remove 4 screws.
Step 5: Push the lever as arrow shown to open the
cassette lid.
Step 6: Remove the Deck Mechanism.
9.7. Disassembly of Headphone
P.C.B.
·Follow the (Step 1) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 6) of Item 9.5.
·Disasse mbly of Tape Eject P.C.B.
Step 1: Remove 1 screw.
Step 2: Releas e the clutch.
Step 3: Remove the Tape Eject P.C.B.
Step 1: Remove 1 screw.
Step 2: Releas e the clutch.
Step 3: Remove the Headphone P.C.B.
9.8. Disassembly of Front Panel
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Disasse mbly of Deck Mechanism.
24
Step 1: Detach connector (CN900B).
SA-PM33DBEB
Step 2: Disconnect FFC cable (CN802 and CN809 ).
Step 3: Disconnect F-Connector.
Step 4: Releas e 3 claws.
Step 5: Remove the Front Panel as arrow shown.
9.9. Disassembly of DAB P.C.B.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 5) of Item 9.8.
25
SA-PM33DBEB
Step 1: Remove 2 screws.
Step 2: Remove the DAB P.C.B.
Step 1: Remove 5 screws.
Step 2: Remove 1 nut.
Step 3: Remove the Rear Panel as arrow shown.
9.12. Disassembly of Tuner Pack
9.10. Disassembly of Panel P.C.B.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 5) of Item 9.8.
·Follow the (Step 1) - (Step 2) of Item 9.9.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 3) of Item 9.11.
Step 1: Detach the connector CN401A and remove
the tuner pack as arrow shown.
9.13. Disassembly of Main P.C.B.
Step 1: Remove 8 screws.
Step 2: Remove the Volume Knob.
Step 3: Releas e 2 catches.
Step 4: Remove the Panel P.C.B.
9.11. Disassembly of Rear Panel
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (step 5) of Item 9.8.
·Follow the (Step 1) - (step 3) of Item 9.11.
26
Step 1: Detach the FFC CN801.
SA-PM33DBEB
Step 1: Detach the connector CN505B.
Step 2: Detach connector CP800 .
Step 3: Detach connector CN803 B and CN808B.
Step 4: Remove the Main P.C.B. as arrow shown.
9.14. Disassembly of Power P.C.B.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 3) of Item 9.11.
Step 2: Remove 1 screw.
Step 3: Detach the connector CN501A, CN508A
and CN503A.
Step 4: Remove the Power P.C.B. as arrow shown.
·Replacement of Power Amplifier IC
27
SA-PM33DBEB
Step 5: Remove 3 screws.
Step 6: Unsold er the terminal of Power Amp IC
(IC300) and replace the component.
Step 7: Unsold er the terminal of Transistor (Q503)
and replace the component.
9.15. Disassembly of Speaker
Terminal P.C.B.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (step 3) of Item 9.11.
·Follow the (Step 3) of Item 9.13.
·Follow the (Step 1) - (step 4) of Item 9.14.
Step 1: Remove 1 screw.
Step 2: Releas e the clutch.
Step 3: Remove the Speaker Terminal P.C.B. as
arrow shown.
9.16. Disassembly of Transformer
P.C.B.
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (Step 3) of Item 9.11.
·Follow the (Step 1) - (Step 4) of Item 9.14.
28
Step 1: Remove 4 screws.
Step 2: Remove the Main P.C.B. support.
Step 3: Remove CD Mechanism as arrow shown.
SA-PM33DBEB
Step 1: Detach the connector CN900B.
Step 2: Remove 4 screws.
Step 3: Remove the Transformer P.C.B. as arrow
shown.
9.17. Disassembly of CD
Mechanism
·Follow the (Step 1) - (Step 4) of Item 9.4.
·Follow the (Step 3) - (step 6) of Item 9.5.
·Follow the (Step 1) - (step 5) of Item 9.8.
·Follow the (Step 1) - (step 3) of Item 9.11.
·Follow the (Step 1) - (step 4) of Item 9.13.
9.18. Disassembly of Cassette Lid
·Follow the (Step 1) - (Step 2) of Item 9.4.
·Follow the (Step 3) - (Step 6) of Item 9.5.
·Follow the (Step 1) - (step 4) of Item 9.6.
29
Step 1: Using screwdriver to remove Damper gear
as arrow shown.
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