Panasonic SAPM-33-DBEB Service manual

A
4
A
CD Stereo System
SA-PM33DBEB
Colour
(S)... Silver Type
ORDER NO. MD0603068C2
Specification
RMS OUTPUT POWER both channel driven simultaneously
10% total harmonic distortion 20 W per channel (6 Ω)
Input impedance
MUSIC PORT 250 mV 12 k
Output impedance
HEADPHONE 16 to 32
Phone jack
Terminal Stereo, 3.5 mm
Terminal Stereo, 3.5 mm
DAB External antenna
Terminal F-Connector (75 Ω)
n FM Tuner Section
Frequency range 87.50 MHz to 108.00 MHz
(50 kHz step)
Sensitivity 3.2 µV (IHF)
S/N 26 dB 1.2 µV
ntenna terminals 75 (unbalanced)
Preset station FM 15 stations
AM 15 stations
n AM Tuner Section
Frequency range 522 kHz to 1629 kHz
(9 kHz steps)
Sensitivity
S/N 20 dB (at 999 kHz) 1122 µV/m
n DAB Section
Frequency Band (Wavelength)
Band III (UK only) 11B to 12D (218.640 MHz to
229.072 MHz)
Band III (Europe) 5A to 13F (174.928 MHz to
239.200 MHz)
Intermediate frequency 1st : 38.912 MHz, 2nd : 2.048
Sensitivity *BER 4x10
MAX. Input Power 0dBm
Min Requirement -98 dBm
Selectivity
djacent Channel (Band III) 33 dB
Far-Off Channel (Band III) 45 dB
DAB memories 20 channels
n Cassette Deck Section
Track system 4-track, 2-channel
Heads
Record/playback Solid permalloy head
Erasure Double gap ferrite head
Motor DC servo motor
Recording system AC bias 100 kHz
Erase system AC erase 100 kHz
-
MHz
© 2006 Matsushita Electric Industrial Co. Ltd.. All rights reserved. Unauthorized copying and distribution is a violation of law.
A
SA-PM33DBEB
Tape speed 4.8 cm/s
Overall frequency response (+3 dB, -6 dB) at DECK OUT
Normal 35 Hz to 14 kHz
S/N RATIO 47 dB (A weighted)
Wow and flutter 0.09% (WRMS)
Fast-forward and rewind time Approx. 120 seconds with C-60
cassette tape
n CD Section
Disc played [8 cm or 12 cm]
(1) CD-Audio (CD-DA)
(2) CD-R/RW (CD-DA, MP3 formatted disc)
(3) MP3
Sampling frequency
CD 44.1 kHz
MP3 32 kHz, 44.1 kHz, 48 kHz
Bit rate
MP3 32 kbps to 384 kbps
Decoding 16/20/24 bit linear
Pickup
Beam source Semiconductor laser
Wavelength 785 nm
Laser power CLASS 1
udio output (Disc)
Number of channels 2 channel
Frequency response 20 Hz to 20 kHz (+1, -2dB)
Wow and flutter Below measurable limit
Digital filter 8fs
D/A converter MASH (1 bit DAC)
n General
Power supply AC 230 to 240 V, 50 Hz
Power consumption 64 W
Dimensions (W x H x D) 165 mm x 227 mm x 327 mm
Mass 3.6 kg
Operating temperature range +5°C to +35°C
Operation humidity range 5% to 90% RH (no condensation)
Power consumption in standby mode
Notes :
1. Specifications are subject to change without notices. Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum analyzer.
n System : SC-PM33DBEBS
Music center: SA-PM33DBEBS
Speaker: SB-PM33DBEBM
0.8 W
CONTENTS
Page Page
1 Safety Precautions 4
1.1. General Guidelines
1.2. Caution for AC Cord
1.3. Before Repair and Adjustment
1.4. Protection Circuitry
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
3 Precaution of Laser Diode
4 Handling Precautions For Traverse Deck
5 Handling the Lead-free Solder
5.1. About lead free solder (PbF)
6 Accessories
7 Operating Instructions Procedures
7.1. Main Unit Operation
7.2. Remote Control Operation
7.3. Disc Information
8 Self diagnosis and special mode setting
8.1. Special Mode Table
8.2. Error Code Table
9 Assembling and Disassembling
9.1. Caution
9.2. Disassembly flow chart
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9.3. Main Parts Location Diagram
9.4. Disassembly of Side Panel L & R
9.5. Disassembly of Top Cabinet Unit
9.6. Disassembly of Deck Mechanism and Tape Eject P.C.B.
9.7. Disassembly of Headphone P.C.B.
9.8. Disassembly of Front Panel
9.9. Disassembly of DAB P.C.B.
9.10. Disassembly of Panel P.C.B.
9.11. Disassembly of Rear Panel
9.12. Disassembly of Tuner Pack
9.13. Disassembly of Main P.C.B.
9.14. Disassembly of Power P.C.B.
9.15. Disassembly of Speaker Terminal P.C.B.
9.16. Disassembly of Transforme r P.C.B.
9.17. Disassembly of CD Mechanism
9.18. Disassembly of Cassette Lid
9.19. Disassembly of Traverse Unit, Driving Gear, and Cam
Gear (CD Mechanism Unit)
9.20. Disassembly of Optical Pickup (CD Mechanism Unit)
9.21. Disassembly of Traverse Gear A and Traverse Gear B
(CD Mechanism Unit)
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SA-PM33DBEB
9.22. Disassembly of Pinch Roller and Head Block (Deck
Mechanism Unit)
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9.23. Disassembly of Motor, Capstan Belt A, Capstan Belt B,
and Winding Belt (Deck Mechanism Unit)
9.24. Disassembly of Deck Mechanism P.C.B.
9.25. Handling of cassette tape jam
10 Service Fixture and Tools
11 Service Positions
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39
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11.1. Checking and Repairing of Deck, Deck Mechanism,
Headphone P.C.B. and Tape Eject P.C.B.
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11.2. Checking and Repairing of DAB P.C.B. and Panel P.C.B.
11.3. Checking and Repairing of Transformer P.C.B.
11.4. Checking and Repairing of Main P.C.B.
11.5. Checking and Repairing of CD Mechanism P.C.B.
11.6. Checking and Repairing of Speaker Terminal P.C.B.
11.7. Checking and Repairing of Power P.C.B.
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43
44
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12 Procedure for Checking Operation of Individual Parts of Deck
Mechanism Unit
12.1. Operation Check with Cassette Tape
12.2. Operation Check without Cassette Tape
13 Measurement And Adjustments
13.1. Cassette Deck Section
14 Voltage Measurement and Waveform Chart
14.1. Voltage Measurement
14.2. Waveform
15 Wiring Connection Diagram
16 Block Diagram
17 Notes of Schematic Diagram
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18 Schematic Diagram
18.1. CD Servo Circuit
18.2. Main Circuit and Tuner Extent Circuit
18.3. Panel Circuit
18.4. Deck Circuit, Deck Mechanism Circuit and Tape Eject
Circuit
18.5. Power Circuit
18.6. Transformer Circuit, Headphone Circuit and Speaker
Terminal Circuit
19 Printed Circuit Board
19.1. CD Servo P.C.B and Panel P.C.B
19.2. Main P.C.B and Tuner Extent P.C.B
19.3. Deck P.C.B, Deck Mechanism P.C.B, Tape Eject P.C.B,
Speaker Terminal P.C.B and Headphone P.C.B
19.4. Power P.C.B and Transformer P.C.B
20 Illustration of IC's, Transistors and Diodes
21 Terminal Function of IC's
21.1. IC7001 (MN6627954MA) IC SERVO
PROCESSOR/DIGITAL SIGNAL PROCESSOR/DIGITAL
FILTER D/A CONVERTER
21.2. IC7002 (BA5948FPE2) IC 4CH Drive
21.3. IC401 (C2CBYY000223) MICROPROCESSOR
22 Troubleshooting Flowchart (CD Section Circuit)
23 Exploded Views
23.1. Cabinet Parts Location
23.2. Cassette Deck (RAA4402-1S) & Traverse Deck Part
Location
23.3. Packaging
24 Replacement Parts List
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SA-PM33DBEB
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installe d.
3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2Ω. When the exposed metal does not have a return path to the chassis, the reading must be
.
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned to the customer.
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1.2. Caution for AC Cord
SA-PM33DBEB
5
SA-PM33DBEB
1.3. Before Repair and Adjustment
Disconnect AC power, discharge Power Supply Capacitors C501, C601, C807, C813, C814, C831, C839, C840, C909, C910, C911, C923 & C966 through a 10, 1W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
· Current consumption at AC 230-240 V, 50 Hz in NO SIGNAL mode at (volume minimal) should be ~160 mA.
1.4. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
· No sound is heard when the power is turned on.
· Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are "shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
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SA-PM33DBEB
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handlin g any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applyin g power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
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SA-PM33DBEB
3 Precaution of Laser Diode
CAUTION:
This unit utilizes a class 1 laser.
Invisible laser radiation is emitted from the optical pickup lens.
When the unit is turned on:
1. Do not look directly into the pick up lens.
2. Do not use optical instruments to look at the pick up lens.
3. Do not adjust the preset variable resistor on the pickup lens.
4. Do not disassemble the optical pick up unit.
5. If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.
6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
CAUTION!
THIS PRODUCT UTILIZES A LASER. USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.
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4 Handling Precautions For Traverse Deck
The laser diode in the traverse deck (optical pickup) may break down due to potential difference caused by static electricity of clothes or human body.
So, be careful of electrostatic breakdown during repair of the traverse deck (optical pickup).
l Handling of CD traverse deck (optical pickup)
1. Do not subject the traverse deck (optical pickup) to static electricity as it is extremely sensitive to electrical shock.
2. The short land between the No.4 (LD) and No.5 (GND) pins on the flexible board (FFC) is shorted with a solder build-up to prevent damage to the laser diode.
3. Take care not to apply excessive stress to the flexible board (FFC board) (Fig 4.1).
4. Do not turn the variable resistor (laser power adjustment). It has already been adjusted.
SA-PM33DBEB
Fig 4.1
l Grounding for electrostatic breakdown prevention
1. Human body grounding (Fig 4.2)
Use the anti-static wrist strap to discharge the static electricity from your body.
2. Work table grounding (Fig 4.2)
Put a conductive material (sheet) or steel sheet on the area where the traverse deck (optical pickup) is placed, and ground the sheet.
Caution :
The static electricity of your clothes will not be grounded through the wrist strap. So, take care not to let your clothes touch the traverse deck (optical pickup).
Fig 4.2
Caution when Replacing the Optical Pickup :
The traverse has a short point shorted with solder to protect the laser diode against electrostatics breakdown. Be sure to remove the solder from the short point before making connections.
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SA-PM33DBEB
5 Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufacture d) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please
use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700 ± 20°F (370 ± 10°C).
· Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
· W hen soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until it melts enough.
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6 Accessories
Note : Refer to Packing Materials & Accessories (Section 24) for part number.
Remote control
AC cord
SA-PM33DBEB
FM indoor
antenna
AM loop antenna
Antenna
plug
adaptor
DAB antenna
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SA-PM33DBEB
7 Operating Instructions Procedures
7.1. Main Unit Operation
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7.2. Remote Control Operation
SA-PM33DBEB
7.3. Disc Information
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SA-PM33DBEB
8 Self diagnosis and special mode setting
This unit is equipped with features of self-diagnostic & special mode setting for checking the functions & reliability.
8.1. Special Mode Table
Below is the various special modes for checking:-
Item FL Display Key Operation
Mode Name Description Front Key
Self -Diagnostic
Mode
Doctor Mode To enter into Doctor
FL Display Test To check the FL
CD to Tape
Recording Test
Mode
Tape Recording
and Playing
CD Tray and
Tape Door Open
Volume Setting To Forced Volume
To enter into self diagnostic checking for main unit.
Mode for checking of various items and displaying EEPROM and firmware version. (For more information, refer to section 8.1.2)
Note: The micro­processor version as shown is an example. It will be revise when there is an updates.
segments display (All segments will light up)
To Inspect the recording
process from CD to
TAPE for the unit.
(For more information,
refer to section 8.1.3)
To Inspect the Tape
recording and playing is
process for unit.
(For more information,
refer to section 8.1.4)
To check CD Tray and
Tape Door Open.
Setting.
1.
2.
The Check Sum of EEPROM and firmware version will be display for 1 sec.
* ROM correction ** Firmware version No:
1.
2.
1. Select [ ] for CD mode (Ensure no tape or CD inserted).
2. Press and hold [ seconds follow by [
To exit, press remote control.
In any mode:
1. Press [ by [4] and [7] on remote control.
To exit, press [ENTER] button on remote control or control.
In doctor mode:
1. Press [DIMMER] button on remote control.
To exit, press [ENTER] button on remote control or control.
In doctor mode:
1. Press [4] button on remote control.
To exit, press [ENTER] button on remote control or control.
In doctor mode:
1. Press [5] button on remote control.
To exit, press [ENTER] button on remote control or control.
In doctor mode:
1. Press [6] button on remote control.
To exit, press [ENTER] button on remote control or control.
In doctor mode:
1. Press [7] button on remote control.
2. Press [8] button on remote control.
3. Press [9] button on remote control.
To exit, press [ENTER] button on remote control or control.
button on main unit or
] button on main unit follow
button on main unit or remote
button on main unit or remote
button on main unit or remote
button on main unit or remote
button on main unit or remote
button on main unit or remote
]button for 2
].
Traverse Test To determine the
reliability of CD unit.
3.
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In doctor Mode:
1. Press [
To exit, press remote control.
], [1], [2] button on remote control.
button on main unit or
Item FL Display Key Operation
Mode Name Description Front Key
TPS To check FF TPS for
deck. (For more information, refer to section 8.1.5)
Cold Start To activate cold start ipon
next AC power up.
In doctor mode:
1. Press [ control.
To exit, press [ENTER] button on remote control or control.
In doctor mode:
1. Press [SLEEP] button on remote control.
To exit, press [ENTER] button on remote control or control.
8.1.1. Cassette Mechanism Self-Diagnostic Mode
Below is information of the checking of cassette deck mechanism
No. Operation Procedures Micon operation & processing
1 C-mecha Abnormal Detection shall be
executed for DECK.
2 [ ] key is pressed, after loading in a
NORMAL type cassette with the recording tab on the left side removed.
3 [ ] key is pressed, after loading a
NORMAL, CrO2, METAL type cassette with the recording tab on the right side removed.
4 [TAPE ] Key is pressed, after loading in a
NORMAL, CrO2, METAL type cassette ( cassette for TPS checking purposes and with both recording tabs intact ).
5 [REC] key is pressed, after loading in a
NORMAL type cassette ( with both recording tabs intact )
6 Self-diagnostic mode is stopped by pressing
the [n] Key.
7 To clear all the abnormalities in the memory,
press the [n] Key for more than 5 Sec while the self-diagnostic mode is stopped.
8 To cancel the self-diagnostic mode press the
Key.
Check that all DECK mechanism leaf SW is in OFF state.
FF shall be executed for 2 sec, after which STOP. Check the following. { F.REC INH SW } is OFF { HALF SW } is ON Reel pulse toggles between H & L.
REW shall be executed for 2 sec, after which STOP. Check the following. { F.REC INH SW } is ON { HALF SW } is ON Reel pulse toggles between H & L.
TPS operation is executed. Check the following. { F.REC INH SW } is ON { HALF SW } is ON TPS signal changes. After checking TPS, it shall STOP. If TPS checking is completed at TAPE END, it is considered as TPS abnormal.
REC operation shall not be executed. Check the following. { F.REC INH SW } is ON { HALF SW } is ON
LCD shall display the abnormality item code, when the STOP key is pressed, it shall display the abnormality item code in the following sequence. [ TEST H 0 1] [ TEST H 0 2] [ TEST H 0 3]
At this time, all the abnormalities item in the memory is cleared and is displayed on the LCD.[ C L E A R ] display for 1 Sec. then,[ TEST ] is displayed.
POWER is OFF.At the next POWER ON, normal operation shall be executed.
SA-PM33DBEB
] button on remote
button on main unit or remote
button on main unit or remote
· If RAM check error occurs during microcomputer reset, COLDSTART shall be executed and all the error memory shall be
cleared during RAM initialization.
8.1.2. EEPROM Checksum (ROM correction)
Purpose : To check for micro-processor firmware version & EEPROM check (ROM correction).
Below is the procedures for this mode.
Step 1: Enter into Doctor mode (For more information refer to section 8.1 on key operation to enter into this mode.
Step 2: Check for firmware version & EEPROM checksum.
· W hen entering into DOCTOR MODE the firmware version & checksum of EEPROM (if applicable) will appear on FL display.
Below is information on the EEPROM IC (Rom correction) under 3 examples:
1. When EEPROM IC is detected and there is no ROM correction:
2. When EEPROM IC is detecte d and has ROM correction:
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SA-PM33DBEB
3. When EEPROM IC is detected and has ROM correction but NG:
Note: Micro-processor firmware version refers to version No. (Eg.MS079_12) for micro-processor IC.
It is subject to change which would update accordingly.
· Rom correction checksum refers to the hex code that is display upon key buttons pressed if an EEPRO M is loaded in the unit.
(Main P.C.B)
8.1.3. CD to Tape Recording Inspection
Purpose : To check the recording function from CD to Tape.
Below is the procedures for this mode.
Procedure :
Step 1: Enter into Doctor mode (Refer section 8.1 Special Mode Table)
Step 2: Insert CDT-018 (Ensure TOC is completed) to CD unit before proceeding.
Step 3: Press [4] button on remote control. Enter into CD to Tape Test mode. (During this mode, volume is set to [VOLUME 50], Bass & Treble is set to 0dB & EQ is switch off).
Note : When in CD to Tape Recording Test mode, the following process is perform :
a) Deck will rewind to start point (point at the start of recording) & Stop. During rewinding of Tape, CD tray remains open.
b) Recording begins (at constant analogue recording speed) for 3 seconds & Stop.
· However, “Error” would be display if there is no tracks to access to, no tape inserted, no test CD inserted or when the tape
erasure prevention tab for FWD side is not suitable for recording.
· When in this mode, if
button is pressed the process will stops automatically.
8.1.4. Tape Recording and Playing
Purpose : To check the Tape function.
Assuming the recording to TAPE has been done in test 3, only playing TAPE is made.
Below is the procedures for this mode.
Procedure :
Step 1: Enter into Doctor mode (Refer section 8.1 Special Mode Table)
Step 2: Press [5] button on remote control. Enter into Tape recording Test mode. (During this mode, Tape function is set to automatically, volume is set to [VOLUME 50], Bass & Treble is set to 0dB & EQ is switch off).
Step 3: FWD play is made for 3 seconds after setting the above-mentioned, TAPE is stopped 3 seconds later. Tape should open.
Note : When in CD to Tape Recording Test mode, the following process is perform :
a) If the erasure prevention tab for FWD side the tape is broken, it is judged as an error and the recording operation does not start.
b) If tape stops by detecting a tape end while recording, it becomes an error.
c) If STOP key is pressed while recording or playing, the operation shall be terminated by stopping TAPE. In this case, the doctor mode is not released.
d) DMT is output with the same timing as usual.
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SA-PM33DBEB
8.1.5. TPS Inspection
Purpose : To check the TPS.
Below is the procedures for this mode.
Procedure :
Step 1: Enter into Doctor mode (Refer section 8.1 Special Mode Table)
Step 2: Press [
· Software will start checking for existence of cassette in Deck.
· If the Deck does not contain any cassette, it shall end the test and displays the result of the test.
· The test will start by playing the Deck in forward direction for 1 sec and then FF TPS.
· If TPS signal is OK, the Deck shall be ejected. Below is information on the TPS under 3 examples.
1. If ERROR Flag is set "ERROR" shall be displayed. TPS check result shall not be shown in this case.
2. If Deck TPS check = OK
3. If Deck TPS check = NG
] button on remote control. Enter into TPS Test mode. (During this mode)
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8.2. Error Code Table
Self-Diagnosis Function provides information on any problems occuring for the unit and its respective components by displaying error codes. Thesed error code such as U**, H** and F** are stored in memory and held unless it is cleared.
The error code is automatically display after entering into self-diagnostic mode.
Error Code Diagnosis Contents Description of error Automatic FL Display Remarks
H01 MODE SW abnormal For deck mechanism unit.
H02 REC INH SW
abnormal
H03 HALF SW abnormal For deck mechanism unit.
Press [ error.
For deck mechanism unit. Press [ error.
Press [ error.
] on main unit for next
] on main unit for next
] on main unit for next
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Error Code Diagnosis Contents Description of error Automatic FL Display Remarks
F01
Reel pulse abnormal
For deck mechanism unit. Press [ error.
SA-PM33DBEB
] on main unit for next
F02
TPS abnormal
F15 CD REST SW
Abnormal
F26 Communication
between CD servo LSI and micro-p abnormal.
POWER AMP output abnormal
CD traverse position intial setting operation failsafe counter (1000 ms) waiting for REST SW toturn on. Error No. shall be clear by force or during cold start.
CD function DTMS command, after system setting, If SENSE = ´L´ cannot be detected. Memory shall contain F26 code. After Power on, CD function shall continue, error display shall be "NO DISC". Error No. shall be clear by force or cold start.
During normal operation, if DCDET becomes "L", normal POWER OFF process shall not be executed, PCONT shall be switched to "L" immediately. "GOODBYE" shall not be display but the error display F61 is displayed instead. 2 seconds after the F61 displayed, ECONO shall be set to "L" and FL display shall be turned off. The error content shall be memorized when the abnormality occurs and can be display in the C-mecha self-diagnostic mode described later.
For CD unit (For Traverse). Press [
] on main unit for next
error.
For CD unit (For Traverse). Press [
] on main unit for next
error.
For Power Supply Related Error Detection. Press [
] on main unit for next
error.
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SA-PM33DBEB
9 Assembling and Disassembling
9.1. Caution
“ATTENTION SERVICER”
Some chassis components may be have sharp edges. Be careful when disassembling and servicing.
1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main components.
2. For reassembly after operation checks or replacement, reverse the respective procedures. Special reassembly procedures are described only when required.
3. Select items from the following index when checks or replacement are required.
Warning:
This product uses a laser diode. Refer to “Precaution of Laser Diode”.
Below is the list of disassembly sections
· Disasse mbly of Side Panel L & R
· Disasse mbly of Top Cabinet Unit
· Disasse mbly of Deck Mechanism and Tape Eject P.C.B.
· Disasse mbly of Headphone P.C.B.
· Disasse mbly of Front Panel
· Disasse mbly of DAB P.C.B.
· Disasse mbly of Panel P.C.B.
· Disasse mbly of Rear Panel
· Disasse mbly of Tuner Pack
· Disasse mbly of Main P.C.B.
· Disasse mbly of Power P.C.B.
· Disasse mbly of Speaker Terminal P.C.B.
· Disasse mbly of Transformer P.C.B.
· Disasse mbly of CD Mechanism
· Disasse mbly of Cassette Lid
· Disasse mbly of Traverse Unit, Driving Gear, and Cam Gear (CD Mechanism Unit)
· Disasse mbly of Optical Pickup (CD Mechanism Unit)
· Disasse mbly of Traverse Gear A and Traverse Gear B (CD Mechanism Unit)
· Disasse mbly of Pinch Roller and Head Block (Deck Mechanism Unit)
· Disasse mbly of Motor, Capstan Belt A, Capstan Belt B, and Winding Belt (Deck Mechanism Unit)
· Disasse mbly of Deck Mechanism P.C.B.
· Handling of cassette tape jam
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SA-PM33DBEB
9.2. Disassembly flow chart
The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the servicing.
To assemble the unit, reverse the steps shown in the chart below.
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9.3. Main Parts Location Diagram
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9.4. Disassembly of Side Panel L & R
· Disasse mbly of Side Panel (R)
Step 1: Remove 5 screws.
Step 2: Remove the side panel (R) as arrow shown.
9.5. Disassembly of Top Cabinet Unit
Step 1: Remove 3 screws.
· Disasse mbly of Side Panel (L)
Step 3: Remove 5 screws.
Step 4: Remove the side panel (L) as arrow shown.
Step 2: Remove 3 screws.
Step 3: Lift up the top cabine t unit, push backward as arrow shown and flip top cabinet unit sideway. (Be careful of the catch)
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SA-PM33DBEB
Step 4: Disconnect FFC cable (CN804).
Step 5: Detach connector (CN504A).
Step 6: Remove top cabinet unit.
9.6. Disassembly of Deck Mechanism and Tape Eject P.C.B.
Step 4: Remove 4 screws.
Step 5: Push the lever as arrow shown to open the cassette lid.
Step 6: Remove the Deck Mechanism.
9.7. Disassembly of Headphone P.C.B.
· Follow the (Step 1) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 6) of Item 9.5.
· Disasse mbly of Tape Eject P.C.B.
Step 1: Remove 1 screw.
Step 2: Releas e the clutch.
Step 3: Remove the Tape Eject P.C.B.
Step 1: Remove 1 screw.
Step 2: Releas e the clutch.
Step 3: Remove the Headphone P.C.B.
9.8. Disassembly of Front Panel
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Disasse mbly of Deck Mechanism.
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Step 1: Detach connector (CN900B).
SA-PM33DBEB
Step 2: Disconnect FFC cable (CN802 and CN809 ).
Step 3: Disconnect F-Connector.
Step 4: Releas e 3 claws.
Step 5: Remove the Front Panel as arrow shown.
9.9. Disassembly of DAB P.C.B.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 5) of Item 9.8.
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Step 1: Remove 2 screws.
Step 2: Remove the DAB P.C.B.
Step 1: Remove 5 screws.
Step 2: Remove 1 nut.
Step 3: Remove the Rear Panel as arrow shown.
9.12. Disassembly of Tuner Pack
9.10. Disassembly of Panel P.C.B.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 5) of Item 9.8.
· Follow the (Step 1) - (Step 2) of Item 9.9.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 3) of Item 9.11.
Step 1: Detach the connector CN401A and remove the tuner pack as arrow shown.
9.13. Disassembly of Main P.C.B.
Step 1: Remove 8 screws.
Step 2: Remove the Volume Knob.
Step 3: Releas e 2 catches.
Step 4: Remove the Panel P.C.B.
9.11. Disassembly of Rear Panel
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (step 5) of Item 9.8.
· Follow the (Step 1) - (step 3) of Item 9.11.
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Step 1: Detach the FFC CN801.
SA-PM33DBEB
Step 1: Detach the connector CN505B.
Step 2: Detach connector CP800 .
Step 3: Detach connector CN803 B and CN808B.
Step 4: Remove the Main P.C.B. as arrow shown.
9.14. Disassembly of Power P.C.B.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 3) of Item 9.11.
Step 2: Remove 1 screw.
Step 3: Detach the connector CN501A, CN508A and CN503A.
Step 4: Remove the Power P.C.B. as arrow shown.
· Replacement of Power Amplifier IC
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Step 5: Remove 3 screws.
Step 6: Unsold er the terminal of Power Amp IC (IC300) and replace the component.
Step 7: Unsold er the terminal of Transistor (Q503) and replace the component.
9.15. Disassembly of Speaker Terminal P.C.B.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (step 3) of Item 9.11.
· Follow the (Step 3) of Item 9.13.
· Follow the (Step 1) - (step 4) of Item 9.14.
Step 1: Remove 1 screw.
Step 2: Releas e the clutch.
Step 3: Remove the Speaker Terminal P.C.B. as arrow shown.
9.16. Disassembly of Transformer P.C.B.
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (Step 3) of Item 9.11.
· Follow the (Step 1) - (Step 4) of Item 9.14.
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Step 1: Remove 4 screws.
Step 2: Remove the Main P.C.B. support.
Step 3: Remove CD Mechanism as arrow shown.
SA-PM33DBEB
Step 1: Detach the connector CN900B.
Step 2: Remove 4 screws.
Step 3: Remove the Transformer P.C.B. as arrow shown.
9.17. Disassembly of CD Mechanism
· Follow the (Step 1) - (Step 4) of Item 9.4.
· Follow the (Step 3) - (step 6) of Item 9.5.
· Follow the (Step 1) - (step 5) of Item 9.8.
· Follow the (Step 1) - (step 3) of Item 9.11.
· Follow the (Step 1) - (step 4) of Item 9.13.
9.18. Disassembly of Cassette Lid
· Follow the (Step 1) - (Step 2) of Item 9.4.
· Follow the (Step 3) - (Step 6) of Item 9.5.
· Follow the (Step 1) - (step 4) of Item 9.6.
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Step 1: Using screwdriver to remove Damper gear as arrow shown.
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