This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1.Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
Attention:
A nickel metal hydride battery that is recyclable powers the product you have purchased.
Please call 1-800-8-BATTERY (1-800-822-8837) for information on how to recycle this battery.
2.2.About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 F ± 20 F (370 C ± 10 C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
6
Page 7
3Specifications
Rechargeable Ni-MH battery
AAA (R03) size (1.2 V 400 mAh)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator
13.824 MHz ±100 Hz
Frequency Modulation
40 bit
Tone (DTMF)/Pulse
Up to 48 digits
Up to 24 digits
(Phonebook)
8 days at Standby,
10 hours at Talk
8 days at Standby,
10 hours at Talk
Approx. 130
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 54
mm x 31 mm x
171
mm
Approx. 130 g
Power source
Receiving Method
Oscillation Method
Detecting Method
Tolerance of OSC Frequency
Modulation Method
ID Code
Ringer Equivalence No. (REN)
Dialing Mode
Redial
Speed Dialer
Power Consumption
Operating Conditions
Dimensions (W x D x H)
Mass (Weight)
AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator
10.368 MHz ±41 Hz
Frequency Modulation
40 bit
0.1B
Tone (DTMF)/Pulse
Up to 48 digits
Up to 24 digits (Phonebook)
Base Unit*1
Standby: Approx. 1.0 W
Maximum: Approx. 4.3 W
Base Unit*2
Standby: Approx. 1.0 W
Maximum: Approx. 4.3 W
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 197 mm x 88 mm x 83 mm
Approx. 270 g
Base Unit
Handset
Charger
AC Adaptor
(PNLV233AZ, 120 V AC, 60 Hz)
Standby: Approx 0.1 W
Maximum: Approx 1.8 W
Standby: Approx 0.1 W
Maximum: Approx 1.8 W
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 72 mm x 72 mm x 38 mm
Approx. 90 g
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.59).
4.1.1.TDD Frame Format
5 ms5 ms
Up Link ( Handset -> Base Unit )Down Link ( Base Unit -> Handset )
RX1RX2RX3RX4RX5RX6TX1TX2TX3TX4TX5TX6
DATA rate : 1.152 Mbps
417 μs (available) 417 μs (blind)
4.1.2.TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 s, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic BearerDummy bearer
Base unit
Handset 1
(Stand by)
Handset 2
(Link)
Handset 3
(Link)
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
A voice signal from TEL line is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC501).
The RF signal, after which is amplified in BBIC, is fed to selected antenna.
Handset:
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
Handset:
A voice signal from microphone is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC1).
The RF signal, after which is amplified in BBIC, is fed to an antenna.
Base unit:
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
ADPCM
ADPCM
Caller ID
Modem
Digital TAM System
Flash Memory IC601
Digital
Speech
Processor
Analog
Front
End
&
Multiplexer
TEL
Line
Interface
SP
RF part
EEPROM
IC611
TDD & TDMA
with FHSS
Processor
Keys/ LEDs
/ Charge
Host CPU
BBIC (IC501)
Flash Memory
(Program)
IC502
4.5.1.BBIC (Base Band IC: IC501)
• Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
14
Page 15
4.5.5.1.Charge Circuit
R372
D362
R371
CHARGE+
R373
C351
F301
DCP
CHARGE-
+5.5V
DCM
K A
The voltage from the AC adaptor is supplied to the charge circuits.
Bell (RINGING) signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
L1T C105 R103 R110 R11 1 R112 BBIC pin18(RINGING)
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T D101 Q141 Q161 R163 D101 P101 R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.
Pulse Dial Circuit:
Pin 19 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 32 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 17 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
4.5.8.Calling Line Identification (Caller ID)/Call Waiting Caller ID
Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
Single message format
"1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
CAS: CPE Alerting Signal
Dual Tone of 2130 Hz, 2750 Hz
-15 dBm (900 ohm load)
80 5 ms
MARK
DATA
0~500 ms
58~75 msabout 300 ms
(be changed by
Information Volume)
Continuance Signal
of 1200 Hz (Data "1")
"FSK"
ACK: Acknowledged Signal
DTMF
"D"
ACK
0~100 ms
60 5 ms
Telephone Exchange
Cordless phone
Cordless phone
Signal Flow
Signal Flow
Telephone Exchange
Call Waiting Format
Call Waiting Caller ID
Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line P101 C105, C104 R103, R104 RA101 IC501(23, 21).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.20).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, EEPROM, LCD)
• EEPROM: IC3
- Setting data is stored. (e.g. ID, user setting)
4.8.2.Power Supply Circuit/Reset Circuit
Circuit Operation:
When powering on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) F1 BBC1 (IC1) 10 pin
The Reset signal generates IC1 (54 pin) and 1.8 V.
When charging the handset on the Base Unit, the charge current is as follows;
DCP(5.5V) F301 R371 R372 D362 CHARGE+(Base) CHARGE+(Handset) R8 Q3 F1 BATTERY+...
Battery...
BATTERY- R45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.14).
4.8.4.Battery Low/Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
In case that the power from AC adaptor is lost and lose radio waves, BBIC (IC1) turns Q11 ON since handset presumes that
base unit's power is falied.
Base unit detects that power voltage of AC adaptor +5.5V is OFF, then turns Q351 ON.
It's possible to use the units during the power failure, supplying power to VBAT of base unit from battery of handset through
Q10, CHG terminal and Q351.
Handset
Base Unit
BATT+
BATT_
R45
CHG+
Power Supply
at AC failure
(Q10,Q11,Q12)
CHG-
3
BBIC
IC1
Q351
Power Down
DET
(Q352,Q353,Q354)
(pin101-IC501)
+5.5V
R351
R352
PDN_DET
4.10.Circuit Operation (Charger Unit)
Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.22)
TP1
J1
TP2
AC Adaptor
VBAT
The route for this is as follows: DC+pin of J1(+) CHARGE+pad Handset CHARGE-pad DC-pin of J1(-)
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Make sure the link between Base and Handset before that. Then in case using not original Handset,
you need to deregister Handset.
Note: Refer to Registering a Handset to a Base Unit in the Operating Instructions.
{OFF}
Dial keypad
{FLASH}
H/S key operation
{CALL WAIT}
1). Press {MENU}.
{^}
2). Select "Settings" using or
then press
{SELECT} or {>}.
Select "Set tel line" using or
then press
{SELECT} or {>}.
{V}
{^} {V}
3). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Check Power (P.32)
Check Record (P.33)
Check Playback (P.36)
Check Battery Charge (P.36)
Check Link (P.37)
Check the RF part (P.39)
Check Handset Transmission (P.44)
Check Handset Reception (P.44)
Check Caller ID (P.44)
Note:
(*1) When a user claims that the unit disconnects a call right
after the greeting message and no incoming messages can
be recorded, this symptom can not reappear with TEL
simulator in the service center. In this case, try to change
the Auto disconnect activation time and Vox level.
<How to change the Auto Disconnect activation time
and VOX level> (P.34) item (A) and (B).
5) Back to "standby" mode automatically after step 4).
You can hear beep sound which is a confirmation tone.
Service ready
:731
Service ready
:
LCD (H/S)
last digit
"0"
Auto disconnect & CPC
: enable
㨇default㨉
(*1)
(*1)
Auto disconnect & CPC
: disable
(*2)
"1"
"2"
Auto disconnect : enable
CPC : disable
Note:
(*1) Both Auto Disconnect and CPC don't detect for the first 2 seconds.
(*2) If the "Disable" is selected, even if the parallel-connected telephone is OFF HOOK,
the line isn't disconnected.
CLEAR
BACK
<How to change the Auto Disconnect activation time and VOX level>
A) Auto Disconnect activation time:
Some Telephone Company lines (fiber or cable) ON Hook and OFF Hook voltages are lower than conventional lines, which may
cause a malfunction of Auto Disconnect detection. To solve this problem, try changing the Auto Disconnect activation through
the procedures below.
It makes easier to detect a small voice (caller) by raising the sensitivity of VOX level. Therefore, the recording of TAM is not
turned off during detection.
1) ~ 2) are same as (A).
3) Press "5","1","1".
Service ready
:511
CLEAR
4) Then enter the below last digit;
last digit
default setting
"0"
: normal
6dB up
"1"
5) Back to "standby" mode automatically after step 4.
You can hear beep sound which is a confirmation tone.
2. a. Re-register regular HS (Normal mode) to base unit (to be checked).
If this operation fails in some ways, the base unit is defective.
b. Re-register handset (to be checked) to regular BU (Normal mode).
If this operation fails in some ways, the handset is defective.
Base unit is defectiveHandset is defective
START
Registration of
Regular HS to
base unit
Registration of
handset to
Regular BU
(other checkings)
Registration of handset to base unit
(checked ones)
Registration of Regular HS to Regular BU
Yes
NoNo
Yes
10.1.6.Check the RF part
10.1.6.1.Finding out the Defective part
After All the Checkings or Repairing
1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Circuit block which range is defective can be found by the following check.
ItemBU (Base Unit) CheckHS (Handset) Check
Range Confirmation TX TEST
(TX Power check)
HS, BU setting
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1)
Range Confirmation RX TEST
(RX sensitivity check)
HS, BU setting
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1)
1. Register Regular HS to BU (to be checked).
2. Set TX Power of the BU and the Regular HS
according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK.
No Link = TX Power of the BU is NG.
1. Register Regular HS to BU (to be checked).
2. Set TX Power of the BU and the Regular HS
according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK.
No Link = RX Sensitivity of the BU is NG.
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (to be checked)Regular_HS
TX PowerTX Power
BU (Base Unit) TX Power CheckLowHig h
BU (Base Unit) RX Sensitivity CheckHighLow
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the HS and the Regular BU
according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK = TX Power of the HS is OK.
No Link = TX Power of the HS is NG.
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the Checking HS and the Regular BU according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the HS is NG
HS (Handset) TX Power CheckLowHigh
HS (Handset) RX Sensitivity CheckHighLow
Note:
(*1) Refer to Commands (P.55).
HS (to be checked)Regular_BU
TX PowerTX Power
42
Page 43
10.1.7.Registering a Handset to the Base Unit
L
{OFF}
{ }
A handset can cancel its own registration to the base unit, or other handsets
registered to the same base unit. This allows the handset to end its wireless
connection with the system.
1
All handsets registered to the base unit are displayed.
2: Select the handset you want to cancel. i{SELECT}
3: “Yes” i{SELECT}
4
{MENU} i# 1 3 1
{ }
The supplied handset and base unit are pre-registered. If for some reason the
handset is not registered to the base unit, re-register the handset.
1 Handset:
{MENU}i # 1 3 0
2 Base unit:
Press and hold {LOCATOR} for about 5 seconds until the registration tone
sounds.
If all registered handsets start ringing, press {LOCATOR} again to stop, then
L
repeat this step.
The next step must be completed within 90 seconds.
L
3 Handset:
Press {OK}, then wait until a long beep sounds.
Note:
While registering, “Base in registering” is displayed on all registered
L
handsets.
When you purchase an additional handset, refer to the additional handset’s
Peel off the FFC (Flexible Flat Cable) from
the LCD, in the direction of the arrow. Take
care to ensure that the foil on the P.C. board
is not damaged.
Fit the heatseal of a new LCD.
Heatweld with the tip of the soldering
iron about 5 to 8seconds
(in case of 60W soldering iron).
0.2 mm
0.2 mm
P. C . board
New LCD
Tip of Soldering Iron
(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
Horizontal Interval
Tolerance
Vertical Interval
Tolerance
OK
NG
NG
NG
(Horizontal interval tolerance is
more than 0.2 mm.)
(Vertical interval tolerance is
more than 0.2 mm.)
(Inclined)
Note:
The illustrations are simplified in this page.
They may differ from the actual product.
This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.31)
12.1.Equipment Required
• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2.The Setting Method of JIG
<Preparation>
• Serial JIG cable: PQZZ1CD300E*
• PC which runs in DOS mode
• Batch file CD-ROM for setting: PNZZTGE230M
12.2.1.Connections (Base Unit)
Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of
resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
ResistorOld value (k)New value (k)
R2223.3
R3223.3
R4224.7
R74.710
Note:
*: COM port names may vary depending on what your PC calls it.
52
Page 53
12.2.2.Connections (Handset)
DC Power
or Battery
2
GND
(black)
3
To Serial Port
(com port 1*)
JIG Cable
PC
URX (red)
3
UTX (yellow)
Handset P. C. board
1
BATT-BATT+
GND
UTX
URX
Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
C: >Documents and Settings>D:
D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
ޓCreateFile error
ERROR 10: Can't open serial port
D: >PNZZTG ****>
<Example for Windows>
On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
12.2.3.How to install Batch file into P.C.
Note:
• “*****” varies depending on the country or models.
rdeepromRead the data of EEPROMType “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readidRead ID (RFPI)Type “readid”, and the registered ID is read out.
writeidWrite ID (RFPI)Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
hookoffOff-hook mode on BaseType “hookoff”.
hookonOn-hook mode on BaseType “hookon”.
getchk (Base unit)Read checksumType “getchk”.
How to use of
"getchk"
in Handset
wreepromWrite the data of EEPROMType “wreeprom 01 23 45”. “01 23” is address and “45”
bursttxBurst TX modeType “bursttx”
testrxBurst RX modeType “testrx”
tphKeep TX power highType"tph"
tplKeep TX power lowType"tpl"
1.rdeeprom Read EEPROMType “RdEeprom 03 7D 04”, and the data from address
If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.5.1.How to download the data
12.5.1.1.Base Unit
First, operate the PC setting according to The Setting Method of JIG (P.52).
Then download the appropriate data according to the following procedures.
ItemsHow to download/Required adjustment
BBIC(IC501)Programming data is stored in memory.1) System Clock adjustment.
EEPROM (IC611)Adjusted parameter data is stored in memory.
(country version batch file, default batch file,
etc.)
X'tal (X1)System clockClock adjustment data is in EEPROM, adjust the data again
1) Change the address “0001” of EEPROM to “AA” to download
the data.
2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TG49WW_US_US_RevXXX_YYY.bat”. (*1)
4) System Clock adjustment
after replacing it.
1) Apply 5.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(10.368MHz ± 41Hz).
4) If the frequency is not 10.368MHz ±41Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 10.368MHz ±5Hz.
"XXX_YYY” and "ZZZ" vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The
Setting Method of JIG (P.52).
12.5.1.2.Handset
First, operate the PC setting according to The Setting Method of JIG (P.52).
Then download the appropriate data according to the following procedures.
ItemsHow to download/Required adjustment
BBIC(IC1)Programming data is stored in memory.1) System Clock adjustment.
EEPROM (IC3)Adjusted parameter data is stored in memory.
(country version batch file, default batch file,
etc.)
X'tal (X1)System clock1) Apply 2.6V between BATT+ and BATT- with DC power.
1) Default batch file: Execute the command “default.bat”.
2) Default batch file (remaining): Execute the command
“TGEA20_US_DEF_RevXXX_YYY.bat”. (*2)
3) Country version batch file: Execute the command
“TGEA20_US_US_RevXXX_YYY.bat”. (*2)
4) System Clock adjustment
5) 2.35 V setting and battery low detection
2) Input Command " sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 5 Hz.
Note:
(*2) XXX_YYY: revision number
"XXX_YYY" vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.52).
13.1.How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description only applies to the model with Shield case.
13.1.1.Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 F ± 20 F (370 C ± 10 C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 F ± 68 F (320 C ± 20 C)
13.1.2.Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.1.3.How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P.C.Board.
IC
P.C.Board
Hot Air Desoldering Tool
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
Tweezers, etc.
IC
P.C.Board
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P. C .B o ar d .
P.C.Board
Hot Air Desoldering Tools
3. After removing the IC, clean the P.C.Board of residual solder.
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.2.1.Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 F ± 20 F (370 C ± 10 C)Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
•Flux
Recommended Flux: Specific Gravity 0.82.
Typ e RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.5)
13.2.2.How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
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13.2.3.How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
Important Safety Notice:
Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
14 Schematic Diagram
14.1.For Schematic Diagram
14.1.1.Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2.Handset (Schematic Diagram (Handset_Main))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
CUSHION RUBBER
*STICK IT WITH IN THE FRAME WORK ON P. C.B.
Note:
101
102
110
104
103
111
112
105
106
113
107
109
E104
E105
108
116
E106
PCB 100
E107
E108
MIC 100
122
E101
E102
E103
123
B
117
Ref.No.
B
118
106
115
114
B
Figure
119
2 8 mm
(*2)
(*1) This cable is fixed by heat-sealing. Refer to How to Replace the Handset LCD (P.51).
(*2) The rechargeable Ni-MH battery HHR-4DPA is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 120) to the exact location described above.
The “RTL” marking indicates that its Retention Time is
Limited.
When production is discontinued, this item will
continue to be available only for a specific period of
time.
This period of time depends on the type of item, and
the local laws governing parts and product retention.
At the end of this period, the item will no longer be
available.
2. Important safety notice
Components identified by the mark indicates special
characteristics important for safety. When replacing any
of these components, only use specified manufacture's
parts.
3. The S mark means the part is one of some identical parts.
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column
shows quality of the material and a flame resisting grade
about plastics.
5. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms () k=1000, M=1000k
All capacitors are in MICRO FARADS (F) p=F
*Type & Wattage of Resistor
(*1) When replacing IC501, IC611 or X501, make the
adjustment using PNZZTGE230B. Refer to How todownload the data (P.58) of Things to Do after Replacing
IC or X'tal.
(*2) When replacing IC501 or IC721, refer to How to
(*1) Reconfirm the model No. written on the handset's name
plate when replacing PCB100. Because the model No. of
the optional handset may differ from the included handset.
(*2) When replacing IC1, IC3 or X1, make the adjustment
using PNZZTGE230M. Refer to Handset (P.58) of Things
to Do after Replacing IC or X'tal.
(*3) When replacing the handset LCD, See How to Replace the Handset LCD (P.51).
(*4) Backside of this IC has a ground plate. Refer to How toReplace the Flat Package IC (P.62).
(*5) Supplied IC is Flat Package Type.