(for Asia, Middle Near East, South America and Af rica)
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
10 BACK BOARD CIRCUIT OPERATION
11 TROUBLESHOOTING GUIDE
10
12
13
13
14
16
16
17
20
23
23
30
31
3
4
4
5
5
5
5
5
5
6
6
6
7
8
8
9
11.1. INTRUDUCTION
11.2. TYPICAL EXAMPLE
11.3. MPR CARD
11.4. ERROR LOG
12 DIAGNOSIS
12.1. DIAGNOSIS FEATURES
12.2. DIAGNOSIS TEST
13 IC DATA
13.1. IC101
14 TER MINAL GUIDE OF ICS, TR ANSISTO RS AND DIODES
15 HOW TO REPLACE A FLAT PACKAGE IC
15.1. PREPARATION
15.2. PROCEDURE
15.3. REMOVING SOLDER FROM BETWEEN PINS
16 CABINET AND ELECTRICAL PARTS LOCATION
16.1. EXTENSION BOARDS FOR SERVICING
17 ACCESSORIES AND PACKING MATERIALS
18 REPLACEMENT PARTS LIST
18.1. CABINET AND ELECTRICAL PARTS
18.2. ACCESSORIES AND PACKING MATERIALS
18.3. MPR CARD PARTS
18.4. BACK/LED BOARD PARTS
18.5. FIXTURES AND TOOLS
19 FOR THE SCHEMATIC DIAGRAM
20 SC HEMATIC DIAGRAM
20.1. MPR CARD
20.2. BACK/LED BOARD
20.3. WAVEFORM
21 PRINTED CIRCUIT BOARD
21.1. MPR CARD
21.2. BACK/LED BOARD
31
32
33
50
55
55
59
64
64
68
69
69
69
69
70
71
72
73
73
73
74
79
80
81
82
82
87
90
92
92
94
2
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
·If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
KX-TDA100BX
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-TDA100BX
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
(Component View)
R251R240
J113
BATALM
LED103
LED101
SDIN
SGSG
RES
R176
R164
R148
QA103
QA101
1
11
R243
R239
R242
R241
C208
2536
C213
R244
CN211
10
1
6
24
37
R21
(Component View)
B45
A45B45
A45
B45
L105
L104
L106 L110 L111
1
B
CN113
RA202
13
IC205
48
9
1812
R211
1
6
C204
R318
R312
121
X202
C212
R550
R342
R340
9
1
R218L210
R220
1
6
R311
C203
R317
R316
R310
L112
L107
R248
C217
1
R
C202
L108
L109
CN114
C218
R247
481
L207
L208 R233
R232R209
FIL205
IC1
R313 R306
R307
R308
R314
R315
R309
L101
L103
L102
3
PSUP1317ZB
25
IC303
24
PbF
L204 R229
L206 R231
L205
R230
FIL204
14
R304
R301
R303
R302
R305
C201
R338
C206
R10
R10
C209
C210
R348
R345
C207
R333
R332
R337
481
R12
CN107
R347
R344
R343
R346
C208
CN112
R12R12
IC304
R335
R330
R331
R336
Marked PbF (PbF is marked around here)
RA308
25
24
RA309
302
4423
IC302
221
1
44
IC
CN206
R307J314
R306
129
14
17
IC311
8
16
18
IC310
9
1
IC1
Marked PbF (PbF is marked around here)
PbF
R326
R334
R323
R329
R328
R325
R327
R324
B
C205
PSUP1367Z-B
PSUP1367Z-A
RUN
LED201
LED202
ALM
D407
C408
L401
C402
14
B1
A1B1
A1B1
31
CN201
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
4
KX-TDA100BX
3 CAUTION
3.1. NOTE
When you note the serial number, write down all of the 11 digits.
The serial number may be found on the label affixed to the bottom of the unit.
3.2. SAFETY PRECAUTIONS
1. Before servicing, unplug the power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer´s recommended components for safety.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
3.3. INSULATION RESISTANCE TEST
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as
screw threads, control shafts, handle brackets, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired and
rechecked before it is returned to the customer.
3.4. BATTERY CAUTION
1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.
2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location
when replacing it and soldering the replacement lithium battery in.
3.5. CAUTION
The power socket wall outlet should be located near this equipment and be easily accessible.
5
KX-TDA100BX
4 SPECIFICATIONS
4.1. GENERAL DESCRIPTION
Control BusOriginal bus (16 bit, 8 MHz,10 megabytes per second)
Communication BusH.100 bus conformity (1024 time slot)
SwitchingNon Blocking Distributed Time Switch
Power InputPSU-S
External Battery+36 V DC (+12 V DC x 3, battery capacity of 28 Ah or below recommended for 1 external
Maximum Power Failure Tolerance300 ms (without using backup battery)
Memory Backup Duration7 years
DiallingTrunkDial Pulse (DP) 10 pps, 20 pps
Mode ConversionDP-DTMF, DTMF-DP
Ring Frequency20 Hz/25 Hz (selectable)
Trunk Loop Limit1600 Ω maximum
Operating
Environment
Conference Call TrunkFrom 10 x 3-party conference call to 4 x 8-party conference call
Music on Hold (MOH)2 ports (Level Control: -11 dB to +11 dB in 1 dB steps)
PagingInternalLevel Control: -6 dB to +3 dB in 3 dB steps
Serial Interface PortRS-232C1 (max 115.2 kbps)
Extension Connection CableSLT1 pair wire (T, R)
DimensionKX-TDA100334 mm (W) x 390 mm (H) x 270 mm (D)
Weight (when fully mounted) KX-TDA100Under 12 kg (26.5 lb)
Minimum Leakage Resistance15000 Ω maximum
Maximum Number of Extension
Instruments per Line
Ring Voltage75 Vrms at 20 Hz/25 Hz depending on the Ringing Load
Trunk Loop Limit1600 Ω maximum
Hookswitch Flash/Recall Timing Range24 ms to 2032 ms
BRI Cards Internal ISDN ModeSupply Voltage: 40 V
Door Opener Current Limit24 V DC/30 V AC, 1 A maximum
Paging Terminal Impedance600 Ω
MOH (Music on Hold) Terminal Impedance10000 Ω
·PT: KX-T76xx series and KX-T7560/KX-T7565: 90 Ω; all other DPTs/APTs: 40 Ω
·SLT: 600 Ω including set
·Doorphone: 20 Ω
·CS: 130 Ω
1 for PT or SLT
2 by Parallel or eXtra Device Port connection of a PT and an SLT
Power Supply: 4.5 W per 1 line,10 W per 4 lines (BRI4)
4.5 W per 1 line, 20 W per 8 lines (BRI8)
Power Supply Method: Phantom Power Supply
6
4.3. SYSTEM CAPACITY
4.3.1. Maximum Trunk and Extension Cards
The following number of trunk and extension cards can be installed in the main unit (Hybrid IP-PBX) for expansion.
*1 When only T76xx series and T7560, T7565 DPTs and SLTs are connected. If other DPTs or APTs are connected, the
maximum number will decrease as each of these units is counted as 4 sets of SLTs or DPTs (T76xx series and T7560, T7565).
4.3.3. Power Supply Unit Selection
Main unit (Hybrid IP-PBX) needs an optional power supply unit (PSU) suitable for its configuration. Calculate the amount of
"load figures" from the type and number of equipment to be connected, and determine the type of PSU that will be required.
Load Figure Calculation
Equipment TypeLoad Figure
PTDPT (T76xx series and T7560, T7565)1
Other DPT/APT/DSS Console4
Extension Card *1DHLC88
SLC88
SLC1616
MSLC1616
CS4
ISDN Extension2
Voice Mail1
*1 Only the extension cards that can support SLTs count for the load figures.
PSU Capability
Each PSU supports a different amount of load figures.
PSU TypeMaximum Load Figures
PSU-S64
PSU-M *2128
*2 Available for the KX-TDA100 and KX-TDA200.
7
KX-TDA100BX
5 SYSTEM OVERVIEW
5.1. SYSTEM CONFIGURATIONS
8
5.2. SYSTEM COMPONENTS
ModelCard NameDescription
ShelfKX-TDA100BXBasic Shelf
Main Central Processing
Card
MPR Option CardKX-TDA0196XJRMTRemote Card
CO Line CardsKX-TDA0180X
Extension CardsKX-TDA0144XJ
Other CardsKX-TDA0161XJ
Power Supply Units
(PSUs)
Cell Stations (CS’s)KX-TDA0142CE4-Channel Cell Station Unit for DECT Portable Station
Proprietary EquipmentKX-A228XJ
8-Port Analogue Trunk Card
16-Port Analogue Trunk Card
8-Port E &M Trunk Card
E-1 Trunk Card
8-Port Caller ID Card
4-Port BRI Card
8-Port BRI Card
PRI Card
PRI Card
4-Channel VoIP Gateway Card
8 Cell Station Interface Card
8-Port Digital Hybrid Extension Card
8-Port Digital Extension C ard
16-Port Digital Extension Card
8-Port Single Line Telephone Extension Card
16-Port Single Line Telephone Extension Card
16-Port Single Line Telephone Extension with Message Lamp Card
4-Port Doorphone Card
16-Channel Echo Canceller Card
Optional 3-Slot Base Card
4-Channel Message Card
CTI Link Card
This main unit (Hybrid IP-PBX) does not support the following telephones:
·KX-T308xx series Proprietary Telephones and DSS consoles
·KX-T616xx series Proprietary Telephones and DSS consoles
·KX-T1232xx series Proprietary Telephones and DSS consoles
For the equipment (e.g., Add-on Key Module, USB Module, Headset) that can be connected to a particular telephone, refer to
the telephone’s manual.
Abbreviations in this manual
Proprietary telephone: PT
Digital proprietary telephone: DPT
Analog proprietary telephone: APT
Portable station: PS
Single line telephone: SLT
Note:
· There are some optional service cards and features that are not available for certain countries/areas. Consult your
authorized Panasonic dealer for detailed instructions.
· The power supply capacity of this main unit (Hybrid IP-PBX) may differ from the values described in this manual depending
on the model number. Please consult your dealer for detailed information.
9
KX-TDA100BX
5.3. SYSTEM CONNECTION DIAGRAM
10
KX-TDA100BX
*Only 1 Server PC can be connected to the main unit (Hybrid IP-PBX). Two or more Server PCs cannot be used simultaneously.
11
KX-TDA100BX
6 NAME AND LOCATIONS
· Null slot:
Null slot is not available for any optional service card.
OFF: Power OFF (inc. in normal resetting)
ON: Power ON & RUN (On-Line)
Flash (60/min.): Power ON & In starting
Flash (120/min.): Power ON & In resetting before system clear
RedDisplay of ALARM
OFF: Normal
ON: Alarm (CPU stop, Alarm for each card)
Flash: Alarm (MPR file error in restarting)
Extension Cards
OPB3 Card
CTL-LINK Card
12
7 DISASSEMBLY INSTRUCTIONS
7.1. DISASSEMBLY INSTRUCTION (MPR CARD)
1. Remove the Lib by sliding it in the direction of arrow 1.
2. This will be removed if the user attached a Pad Lock as shown in a
Fig.1.
3. Loosen the Screw.
4. Front Cover is removed in the direction of arrow 2.
KX-TDA100BX
5. Loosen the two Screws.
6. Remove the MPR Card.
13
KX-TDA100BX
7.2. DISASSEMBLY INSTRUCTION (BACK BOARD)
1. Remove four Screws (A).
2. Remove the Left Side Cover and the Right Side Cover.
3. Remove the Hook. Remove the Top Cover.
4. Remove nine Screws (B).
5. Remove the Back Cover.
14
6. Remove the RS-232C Connector and LED Connector from Back
Board 1.
7. Remove eight Screws (C).
8. Remove Back Board 1.
9. Remove the LED Connector from Back Board 2.
10. Remove the Screw (C).
11. Remove Back Board 2.
KX-TDA100BX
15
KX-TDA100BX
8 OUTLINE
8.1. GENERAL DESCRIPTION
The control system of the main unit is composed of the main central processing card (MPR card) controlling the entire system
and exchanging voice data, the circuit control section (LPR/LC) controlling various telephone lines and the power supply section
(POWER).
MPR card, LPR/LC and POWER are connected each other through the System BUS (ADDRESS BUS, DATA BUS and
CONTROL BUS). MPR card and LPR/LC are under I/O control (I/O Read/Write) by MPR card.
MPR card controls LPR which have a microprocessor by the lnter-Microprocessor Communication System supported by ASIC.
Those are, MPR card and LPR exchange controlling messages through bi-directional buffer and CPU controls LPR so that it
can manage multiple telephone lines. Since LC does not have a microprocessor, it is completely controlled through ASIC from
MPR card.
I/O address for LPR access is fixed for each free slot. CPU discriminates the sort of LPR through the inter-processor
communication system.
POWER detects the voltage drop of the AC input and the DC output and transfers it to MPR card.
8.1.1. MPR Card
This card is the main control section of main unit. It controls all the cards mounted on the free slots, and communication of RS232C ports.
There are two LED (BATT ALARM, SD ACCESS), one SD card slot, one push switch, one slide switch, one USB port, two MOH
jacks, and two EPG jacks in the front of MPR card. BATT ALARM LED light red if the output of the lithium battery in MPR card
is set to about 2.8V or less. During access to SD card, it green-blinks or SD ACCESS LED light and blink. Enclosed SD card
is used for SD card slot on a main part, putting in. The main program is stored in SD card. It connects with PC and a USB port
is used for a maintenance or a system setup. The external sound source for BGM or suspension sound is connected to a MOH
jack. A speaker with amplifier is connected to external paging at an EPG jack. Light Emitting Diode (RUN indicator,
ALARMindicator) arranged at the main part upper part is directly controlled from MPR card, and shows the state of a system
of operation.
This control circuit executes the control signals for the exchange process, and this card is composed of the following
(A) 32bit CPU (32bit data bus)
(B) SDRAMs, SRAMs
(C) Flash memorys
(D) Lithium Battery for back-up of clock IC and Static RAMs
8.1.2. Back Board
BB (back board) is the mother board of the basic shelf. This board connects each card/unit (POWER, MPR card, and optional
service cards) together. This board has one RS-232C connector.
8.1.3. Power Supply Unit
This unit is switching regulator power supply and supplies DC voltages to MPR card, and optional card (free slot). PSU (power
supply unit) has four outputs (40V, 30V, 15VPT, 15V). 15V output is supplied only in MPR card and option card. Other outputs
are mainly used as an object for the electric supply to a terminal. Refer to each S/M for the details of PSU.
16
8.2. SYSTEM CONTROL
8.2.1. System Control Block Diagram
KX-TDA100BX
17
KX-TDA100BX
8.2.2. Voice (TDM Highway) Bus Block Diagram
18
8.2.3. Voice Bus Logical Assignment
In the line card, the CT_D line number, which is output in accordance with the inserted slot, and the time slot are assigned by
software.
For the detail of output slot for each card (optional service card), refer to the service manual of the card (optional service card).
KX-TDA100BX
8.2.4. Back Board Signaling
Back board waveform of TDM bus for voice
19
KX-TDA100BX
8.3. BACK BOARD SIGNAL CONNECTION DIAGRAM
8.3.1. CT Bus System Connection Diagram
20
8.3.2. EC Bus System Connection Diagram
KX-TDA100BX
21
KX-TDA100BX
8.3.3. System Control and Analog Signal Connection Diagram
8.3.4. Power Supply System Connection Diagram
22
9 MPR CARD CIRCUIT OPERATION
9.1. MPR CARD
9.1.1. Outline
1) Function
·System Control
·Circuit Switching (includes gain adjustment function)
LED (BATALM): Lights when the lithium battery voltage drops below 2.8V.
LED (SD ACCES): Lights on when the SD card is being accessed.
SD card slot: Mounts the system program SD card.
Reset Switch: Press to reset the system.
System Initialize Switch:
On default startup, set the switch to the "SYSTEM INITIALIZE" position before turning the power ON. Return the switch to the
"NORMAL" position when the main power switch starts to flash. On normal startup, turn the power ON with this switch in the
"NORMAL" position.
USB connector: B-type connector. Used for PC programming.
MOH 1, 2: External music on hold input.
PAGING 1, 2: External PAGING output. Connect to a device with a built-in amplifier.
24
9.1.3. Block Diagram
IC403
+1.8V
+3.3V
+9V +5V
-9V
+15V
Series Reg.
SDRAM
Total:16 MB
IC413IC402
64Mbit*2
SW Reg.
Series Reg.
SW Reg.
(32bit bus)(16bit bus)(16bit bus)
90pin DIN
+15V
ASIC
CKE
CLK
nCAS
nRAS
RD/nWR
nCS_3
ADD2-15
D[31:0]
D0-D15
DQMLU,DQMLL
DQMUU,DQMUL
GND
DATA
+3.3V
IC102
ADD
A1-A23
EC_CLK
+3.3V_BB
(for B.B.)
Current
Limitter
EC_CLK
nCS
nCS_5
EC_nRST
EC_AD[15:0]
EC_nRST
EC_AD[15:0]
nWR
nRD
nWR
nRD
EC_CBE[1:0]
EC_nPAR
EC_nFRAME
EC_nTRDY
EC_bus
EC_nPAR
EC_nTRDY
EC_CBE[1:0]
EC_nFRAME
nBS
nBS
TCXO
16.384MHz
EC_nSTOP
EC_nPERR
EC_nCDET
Termination
EC_nSTOP
EC_nCDET
EC_nPERR
X103
EC_nINT
(EC_IDSEL)
EC_nINT
nBREQ
nBACK
nBREQ
nBACK
nIRQ
nIRQ
+3.3V
HALT, Mu/nA,MOH_SEL,
PIO[7:4]
MELODY_SEL
CT_NETREF
CT_D[7:0]
CT_FRAME
CT_C8
H100_bus
CT_D[7:0]
CT_FRAME
CT_NETREF
LDHW0,LUHW0
nF0,HW_CLK
SDI,SDO,CTS,RTS
Mu/nA
TXD1, RS1, ER1
+9V,-9V
DRV
IC120
CT_C8
CH_SEL[2:0]
DCALM
RXD1, CS1, DR1
TXD2
RXD2
+5V
RCV
IC121
CODEC
(+3.3V)
CH_SEL0
ACALM
POWTYPE[1:0]
to CPU(Input Port)
KX-TDA100BX
RINGER
nBATT
nLOS
nHALT
from ASIC
from ASIC(Output Port)
AGC
RING_SIN
RING_SYNC
Paging1
MOH1
LEDALM
from CPU(Output Port)LEDRUN
KX-TDA100 MPR CARD BLOCK DIAGRAM
FLASH
IC303
Total:512KB
SRAM
Total:1MB
IC301, IC302IC305, IC306
MEC Card
(Future option)
(Expansion Memory)
IC205
(MN5773)
SD Card Interface
SD Card
4Mbit
4Mbit*2
USB Interface
OSC
X202
20MHz
IC204
(ML60852A)
USB
CN209
Conn.
nCS_0
nRD
RD/nWR
ADD1-23
LD[15:0]
+3.3VB
nRD
RD/nWR
nCS_4
ADD1-19
LD[15:0]
+3.3VB
CKE
CKIO
nCAS
nRAS
RD/nWR
nCS_2 etc.
ADD[25:0]
LD[15:0]
D[31:0]
nRD
DQMLU,DQMLL
nCS_SDB
ADD0-7
LD[15:0]
X201
OSC
12MHz
DQMLU,DQMLL
DQMUU,DQMUL
LD[15:0]
DATA BUS
ADD BUS
CNT BUS
Dbus
+3.3V
+3.3VB
Buffer
LED101
IC404
Regulator
(+1.8V)
RTC
V
for
SDB, USB
Flash,SRAM,
CS Generation
A[25:0]
nWR, nRD
D[31:0]
IC123, IC124
+3.3V
SD-ACCESS
BATT ALARM
LED103
Battery
(+3.0V)
nCS0,3,4
nRASs, nCASs,etc
+1.8V
DC_ALM,nIRQ_USB, nIRQ_SDB
Interrupu
Bus Arbiter
nDREQ0,1
nDACK0,1
to Reset IC
Reset
(Manual Reset SW)
SW101
RTC
V
Controller
DMAC
+3.3V
32.768kHz
X102
RTC
GAIN0,GAIN1
nPRS_RMT
OSC
X101
16.384MHz
CLK
Modulation
to CPU
SW
Initialize
TxD,RxD,CTS,RTS(UART i/f)
UHW,DHW,CLK(4.096MHz)
DTR,DSR
30pin Connection
RMT card
(Option)
CoreCLK=131.072MHz
Local
Reset
IC107
IC103
CPU
IC101
SH7709S
SW103
IC406IC405
CODEC
(+3.3V)
CH_SEL1
+3.3V
Melody
CH_SEL2
IC
IC410
MELODY_SEL
(Software)
7pin Conn.
(Debug Interface)
(for RS232C port)
SIO(SCI0)
SIO with FIFO(SCI2)
SIO with FIFO(SCI1)
MOH-SEL
(Software)
(Checker Pad only)
JTAG Interface
PCMCIA Interface
DTR,RTS,LEDs,REG,BELTIME
AGC
+15V/GND
P-I/O Ports
IC409IC408
DSRs,DTRs, RTS, CTS,
nINIT, DIPSWs
AC_ALM,DC_ALM,nBATALM
Paging2
MOH2
POWTYPE[1:0],nBATT
MPR Card
25
KX-TDA100BX
9.1.4. Circuit Description
9.1.4.1. Outline of Block Description
· CPU block
Operates the main unit control. Also operates various controls, generation of select signal, DMA control and serial port control.
This contains the built-in clock function.
· ASIC block
Provides the communication between each optional service card, call control (TSW function), conference call, tone generation
and gain control function.
· Memory block
This is a work area used for the main unit control program storage, the system boot program storage, or the user configuration
data storage.
· USB block
Provides the USB I/F function. Connects to the PC to be used for PC programming or system data load/store.
· SD card block
Provides the SD card I/F function and loads the main unit program and the system data from the SD card containing the main
unit control program.
· MOH/PAGING block
Provides the external music on hold input x 2, and the external paging output x 2 port. Also this provides the external music on
hold input 1 system and exclusively the internal music on hold output.
· Power block
Consists of DC/DC converter circuit and various regulators.
9.1.4.2. Detail of Block Description
· CPU block
Configuration: IC101 (CPU), IC107 (reset IC), IC103 (spread clock IC), X101 (CPU source clock), X102 (clocking clock) etc.
Function: (IC101)
Generates the select signal in accordance with the memory map and operates read/write of data between each peripheral.
Controls the DMA transfer between USB I/F or built-in serial controller and memory.
Operates input/output control of each I/O signal in accordance with the program.
Contains the built-in clock function (battery backup) with the source clock X102 (32.768 kHz).
(IC107)
Monitoring the power voltage, it generates a reset signal when the voltage drops under the constant value (2.9Vtyp) or when
the reset switch is pressed down.
(IC103)
To reduce unnecessary radiation, it generates the clock with the constant blurring mainly X101 clock output (16.384 MHz).
Description of the Signal on MPR
Signal NameFunctions
+15VIN+15V DC
+15VFor Circuit +15V DC MOH
+9.4VFor Driver IC +9.4V DC RS-232C
+5VFor Driver IC +5V DC RS-232C
+5VRMTReserve
3.3V_BB+3.3V DC
+3.3VB+3.3V DC
+3.3V+3.3V DC
1.9VB+1.9V DC
1.8VFor Core +1.8V DC CPU (IC100)
A[0]-A[25]Address bus
nAC_ALMAC alarm signal: Indicates AC voltage cutoff. (L: Alarm condition)
nBACKBus Acknowledge: Indicates Bus Acknowledge.
nBATTIndicates whether external battery is connected or not. L: Connected
For pull-up of back board signal line
Battery backup
For SRAM (IC301, IC302) backup
Battery backup
For clock function of CPU (IC100)
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KX-TDA100BX
Signal NameFunctions
nBAT_ALMBattery Alarm Signal: Indicates the declined voltage of lithium battery. (L: Alarm condition)
nBREQBus Request: Bus request signal
nBSBus Cycle Start: Bus cycle start signal
nCASLLower Byte Address C olumn Address Strobe: CAS signal for SDRAM
nCASUUpper Byte Address Column Address Strobe: CAS signal for SDRAM
CH_SEL[0]Synchronous Signal for CODEC (For MOH#1/Page#1)
CH_SEL[1]Synchronous Signal for CODEC (For MOH#2/Page#2)
CH_SEL[2]Synchronous Signal for C ODEC (For RMT)
CKEClock Enable: CKE signal for SDRAM
CKIOClock I/O Terminal: For bus clock of SDRAM (IC305, IC306) and ASIC (IC101) CPU (IC100) outputs the clock of four
times frequency as Source clock (16.384MHz).
nCS0Chip Select 0: Chip select signal for flash memory
nCS2Chip Select 2: Chip select signal for the expanded SDRAM (Future Option, Reserve at present.)
nCS3Chip Select 3: Chip select signal for SDRAM
nCS4Chip Select 4: Chip select signal for SRAM
nCS5Chip Select 5: Chip select signal for ASIC
nCS6Chip Select 6: Chip select signal for USB I/F and SD card I/F
nCS_FLASH0Chip Select for Flash memory 0: CS signal for IC303
nCS_FLASH1Chip Select for Flash memory 1: CS signal for IC304 (reserve)
nCS_SDB0Chip Select for Sd card I/F
nCS_SDB1Reserve
nCS_SRAM0Chip Select for SRAM 0: CS signal for IC301
nCS_SRAM1Chip Select for SRAM 1: CS signal for IC302
nCS_USBChip Select for USB I/F
nCTS2Clear To Send from RS-232C connector
CTS_RMTClear to Send: Flow signal for modem
CT_C8Clock 8.192MHz clock outputted from PLL master
CT_D[0] -[7]CT Data Bus: Two-way serial data bus to which the drive from any card is possible in the system.
CT_FRAMEFrame Signal: 8KHz frame signal outputted from the master
CT_NETREFBackup Synchronous Signal (MAX 2MHz) 8KHz signal output from slave etc.
C_CS[0]Chip Select For RMT
D[0] -D[31]Data Bus
nDACK0-1DMA Acknowledge: For USB I/F
DCD2Data Carrier Detect
DCLK_RMTCodec Clock (8MHz): For RMT
nDC_ALMDC ALARM:DC alarm signal; Indicates the declined DC voltage. (L: Alarm condition)
DIN_RMTCodec Data Input: For RMT
DOUT_RMTCodec Data Output: For RMT
DQMLL (nWE0)
Data Input/Output Mask (Write Enable): DQM signal for SDRAM and WE signal for each memory IC and ASIC
DQMLU (nWE1)
DQMUL (nWE2)
DQMUU (nWE3)
nDREQ0-1DMA Request: For USB I/F
DSR2Data Set Ready from RS-232C connector
DSR_RMTData Set Ready from RS-232C connector
DTR2Data Terminal Ready to RS-232C connector
EC_AD[0] -[15]Address of EC Synchronous Bus, Data Bus (4MHz)
EC_nCBE[1]-[0]EC Bus Command/Byte Enable: The initiator drives as bus command in the address phase and as byte enable in the
data phase.
EC_nCDETEC Line Card Detection Signal Asynchronous interrupting signal
EC_CLKClock of EC Synchronous Bus (8MHz) All EC bus signals except nRESET/EC_INT operates in sync with this signal.
EC_nFRAMEEC Cycle Frame Signal: Indicates the drive by initiator and the execution of ECI bus cycle.
EC_nINTEC Interrupting Signal: Be asserted when slave interrupt occurs.
EC_PARParity Bit of EC Synchronous Bus: Drive by applying even parity to AD[15:0] and CBE[1:0]. (4MHz)
EC_nPERREC Parity Error: Flag indicating error status b y parity flag
EC_nRSTEC Reset Input: System reset input signal
EC_nSTOPEC Bus Stop Signal: Be asserted when target requests transaction halt to initiator.
EC_nTRDYEC Target Ready Signal: Indicates the drive by target and the possible data transfer.
nFAN_ALMFan Alarm: It goes Low at the error of the L Power Supply’s FAN. It goes High when the FAN is normal and, Power
Supply S and M, which does not carry the FAN, are used.
FSEL0Signal which switches the Flash Memory address of the MEX card. FSEL0 is set by hard jumper. L: The number of
Flash Memory chips on the MPR is 1pc. H: The number is 2pcs.
GAIN0-1Gain: Gain adjustment signal for the RMT card (Reserve)
HALTAlerts the occurrence of the declined DC voltage to line card. H: Active L: Normal
nINITSystem Initialization Switch Input: L: At system initialization, H: At normal start-up
nIRQ_ASICInterrupt Request f rom ASIC: Indicates ASIC requests interrupt.
nIRQ_SDBInterrupt Request from SD card I/F: Indicates SD card I/F requests interrupt.
nIRQ_USBInterrupt Request from USB I/F: Indicates USB I/F requests interrupt.
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KX-TDA100BX
Signal NameFunctions
LA[1] -[16]Address bus
nLBLower Byte Select: Indicates Lower byte select signal of SRAM
LD[0] -[15]Data Bus
LDHW[1] -[0]Down Highway: Data output terminal connected to codec etc. as down data signal of local highway
nLEDALMAlarm display L: On
nLEDRUNRUN display L: On
nLOSLoss of synchronous signal: Reserve at present
LHWCLK[0]Highway Clock Signal (8MHz): Bit clock of local highway and selectable among 2.048 / 4.096 / 8.192MHz.
LUHW[1] -[0]Up Highway: Data input terminal connected to codec etc. as up data signal of local highway.
MASTER/nSMaster/slave identification signal when SIC card (Future Option) as intersystem connection card is mounted. MPR
MD0-2Mode Control Terminal: Clock operation mode of CPU is set.MD2: L, MD1: L, MD0: H Fixed
MELODYSELMelody IC Tune Name Select L: Ju te veux H: Minuet
MEX_MODE[0] -[3]Information Bit to know the memory mounting capacity etc. of MEX card. Reserve at present.
MOHSELSwitching Signal between internal hold sound source and external hold sound H: Internal L: External
Mu/nASwitching Signal of Sound Compression Law H: Mu-Law, L: A-Law
M/nSTDA100, TDA200 Identification Signal set on the back board. The MPR inputs this signal and detects which the MPR
POWTYPE[0] -[1]
inputs this signal and detects which the MPR will be. H: Master L: Slave
will be. H: TDA200, L: TDA100
nPRS_MEXPress MEX: Information of MEX Card Attachment L: Attached, H: Not attached
nPRS_RMTPress RMT: Information of RMT Card Attachment L: Attached, H: Not attached
nPRS_SDBPress SD card: Information of SD Card Attachment L: Attached, H: Not attached
nRAS3LLower Byte Address Row Address Strobe: RAS signal for SDRAM
nRAS3UUpper Byte Address Row Address Strobe: RAS signal for SDRAM
nRDRead: USB I/F, SD card I/F, ASIC, SRAM, Read signal for flash memory
RD/nWRRead/nWrite: Read/Write signal for SDRAM
nRESOUTReset Out: Reset from CPU (IC101) to each card
nRESETReset: Power-on reset signal
nRESETMManual Reset: Manual reset request signal for CPU
RINGERRinger Signal: Outputs square-wave of 16Hz/20Hz/25Hz as source signal of ringer
RING_SYNCTrigger Signal of Ringer Signal generation timing to each internal line card
nRTS2Request To Send to RS-232C connector
RTS_RMTRequest to Send: Flow signal for modem
RXD2Receive Data from RS-232C connector
RXD_RMTSerial Data Output Terminal: ASIC
SDCDSD Card Detect Input
SDCLKSD Card Clock Out
SDCMDSD Command
SDDAT0-3SD Card Data
SDWPSD Card Write Protect Input
SHW_CLKIntersystem Highway Clock Signal (4MHz) Bit clock of intersystem highway and selectable between
SHW_FHIntersystem Highway Synchronous Signal (8KHz) 8KHz frame synchronous signal of intersystem highway
TXD2Transmit Data to RS-232C connector
TXD_RMTSerial Data Input Terminal: Data receiving terminal from RMT to UART in the ASIC
nUBUpper Byte Select: SRAM
USB_D+USB Data +
USB_D-USB Data -
VBUSBit indicating power source is supplied to USB bus [Host (PC etc.) is connected.] H: Host connected L: Host not
VREFReference Voltage for MOH Circuit Intermediate potential of +15V
nWAITWait: Hardware wait request signal for bus timing between CPU and ASIC
WDTCLRReserve
nWEWrite Enable: W E signal of SRAM
256KHz/512KHz/1.024MHz/2.048MHz/4.096MHz.
connected
· ASIC block
Configuration: IC102 (ASIC), IC111, X103 and so on.
Function: (IC102)
28
Functions as the bus master of EC bus (synchronous bus with 16 bit width, transmission rate max.10Mbps). Communicates
with ASIC mounted to each option card via EC bus and controls the option card.
Controls CT bus (HW clock 8.192MHz, 8 highway, 128 timeslot) for TSW function.
(A detailed description of TSW will be added later.)
Controls the conference call for 3 people x ~8 parties ~ 8 people x ~3 parties.
Generates single and DTMF tone in any highway and timeslot.
Provides the digital gain control function by data conversion.
Provides some I/O ports for CODEC channel pulse generation, modem encoding rule setting and music on hold switching
and is controlled by CPU.
· Memory block
Configuration: IC301, IC302 (SRAM), IC303 (FlashROM), IC305, IC306 (SDRAM), IC309, IC310, IC311 (logic IC) and so
on.
Function: (IC301, IC302)
Saves the user configuration data (such as key assign data per PT).
This memory is battery backup.
(IC303)
Saves (some of) the system boot program and the system data.
(IC305, IC306)
The main program is loaded from the SD card on the system start-up.
Used as the program area and the CPU work area after start-up.
Makes a direct bus connection to CPU due to high-speed action (bus clock 66MHz).
(IC309, IC310, IC311)
Generates each memory select signal from the memory area select signal and upper address. Generates the write signal
and upper/lower byte select signal.
· USB block
Configuration: IC204 (USB I/F), X201 (source clock: 12.000MHz), CN209 (USB connector) etc.
Function: Connects to the USB host system (mainly PC) via CN209 (B type connector) as a USB device and makes data
transfer by max.11Mbps. DMA function of CPU is utilized to transfer the data.
· SD card block
Configuration: IC205 (SD card I/F), IC209, X202(20MHz), CN211 (SD card connector) and so on.
Function: Loads the main program and the system data from the SD card connected to CN211 by 10Mbps. Restores the
(pin jack) etc.
Function: The external music on hold 1 is input from JK404 and is A/D converted in IC405 via AGC (Auto Gain Control)
circuit, which consists of IC408, Q407, Q409 and other CR, and then is connected to the call line HW. Likewise the external
music on hold 2 is input from JK403 and is made A/D conversion in IC406 via AGC (Auto Gain Control) circuit, which
consists of IC409, Q408, Q410 and other CR, and then is connected to the call line HW. The external music on hold 2 and
IC410 is exclusively connected to IC406 input (by software control).
The various tones & DTMF tone and the voice data generated in IC102 (ASIC) are made D/A conversion in IC405 and
IC406. They are output via JK402, JK401 respectively.
power regulator), Q403, Q404, Q405, Q411, Q412 (transistor), L401, C408, C453, C454, D406~D409, BAT401, IP401,
IP402 (circuit protection device) and so on.
Function:
+15V input is made step-down to +3.3V by DC/DC converter circuit that consists of IC402, L401, Q412 and C408, and is
supplied to each IC power. Also, it monitors +3.3V output voltage and turns ON Q411 to block +15V input when over voltage
is supplied.
+15V input is dropped to +9.4V by Q403 and is supplied to RS232C driver with the inverted voltage (about 9.1V) generated
in IC413, C453 and C454.
+3.3V generated in DC/DC converter is converted to 1.8V in the back board or IC403 and Q405 via Q404 and supplied to
IC101 core power, and also is converted to 1.9V in IC404 via the back-flow prevention diode D407 and supplied to IC101
KX-TDA100BX
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