Panasonic EB-GD30 User Manual

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Service Manual

GD30/GD50 Personal Cellular Telephone

Frequency range Tx: 890 - 915MHz

Tx/Rx frequency separation 45MHz 95MHz RF channel bandwidth 200 kHz Number of RF channels 124 374 Speech coding Full rate/Half rate/Enhanced

Operating temperature -10°C to +55°C Type Class 4 Handheld Class 1 Handheld RF Output Power 2W maximum 1W maximum Modulation GMSK (BT = 0.3) Connection 8 ch/TDMA Voice digitizing 13kbps RPE-LTP / 13kps ACLEP / 5.6kps CELP / VSLEP Transmission speed 270.3 kbps Diversity Frequency hopping Signal Reception Double superheterodyne Intermediate Frequencies 282MHz and 45MHz Antenna Terminal Impedance 50 Ω Antenna VSWR <2.1 : 1 Dimensions Height: 135mm

Volume 123cc (150cc with EB-BLD30 Battery) Weight GD30:130g (170g with EB-BLD30 Battery)

Display Graphical chip on glass liquid crystal, Alphanumeric,

Illumination 4 LEDs for the LCD(Green)

Keypad 17 keys, Navigation key SIM Plug-in type only External DC Supply Voltage 3.6V Battery EB-BSD30:3.6V nominal, 670mAh, Ni-MH

Standby Battery Life DRX 9

Conversation Battery Life PL 7, DTX 50%

OrderNumber:MCUK991001C8

HandheldPortable

EB-GD30 EB-GD50

Specification

900MHz 1800MHz

Rx: 935 - 960MHz

Full rate

Width: 45mm Depth: 20.5mm (30mm with EB-BLD30 Battery)

GD50:115g (170g with EB-BLD30 Battery)

16x3characters, 5icons and 6x1 characters

8 LEDs for the keypad(Green) 1 LED Incoming call(Green) 1 Charging LED(Red)

EB-BSD50:3.6V nominal, 670mAh, Li-Ion EB-BLD30:3.6V nominal, 1340mAh, Ni-MH

EB-BSD30/EB-BSD50:95hrs maximum EB-BLD30:190hrs maximum

EB-BSD30/EB-BSD50:180minutes EB-BLD30:360minutes

Tx: 1710 - 1785MHz Rx: 1805 - 1880MHz

Full rate/Half rate

Battery life figures are dependent on network conditions.

WARNING

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a product. Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the product or products dealt with in this service manual by anyone else could result in serious injury or death.

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This Service Manual is copyright and issued on the strict understanding that it is not to be reproduced, copied, or disclosed to any third party, either in whole or part, without the prior written consent of Matsushita Communication Industrial UK Ltd.

Every care has been taken to ensure that the contents of this manual give an accurate representation of the equipment. However, Matsushita Communication Industrial UK Ltd. accepts no responsibility for inaccuracies which may occur and reserves the right to make changes to specification or design without prior notice.

The information contained in this manual and all rights in any designs disclosed therein, are and remain the exclusive property of Matsushita Communication Industrial UK Ltd.

Other patents applying to material contained in this publication: BULL CP8 PATENTS

Comments or correspondence concerning this manual should be addressed to: Customer Support Department, Matsushita Communication Industrial UK Ltd., Colthrop,Thatcham, Berkshire. RG19 4ZD. ENGLAND

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WARNINGS AND CAUTIONS

WARNING

The equipment described in this manual contains polarized capacitors utilising liquid electrolyte. These devices are entirely safe provided that neither a short-circuit nor a reverse polarity connection is made across the capacitor terminals. FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN HANDLING THESE DEVICES.

Caution

The equipment described in this manual contains electrostatic sensitive devices (ESDs). Damage can occur to these devices if the appropriate handling procedure is not adhered to.

ESD Handling precautions

A working area where ESDs may be safely handled without undue risk of damage from electrostatic discharge, must be available. The area must be equipped as follows:

Working Surfaces - All working surfaces must have a dissipative bench mat, SAFE for use with live equipment, connected via a 1M2 resistor (usually built into the lead) to a common ground point.

Wrist Strap - A quick release skin contact device with a flexible cord, which has a built in safety resistor of approximately 1MΩ shall be used. The flexible cord must be attached to a dissipative earth point.

Containers - All containers and storage must be of the conductive type.

Batteries

This equipment may contain an internal battery in addition to the external battery packs. These batteries are recyclable and should be disposed of in accordance with local legislation. They must not be incinerated, or disposed of as ordinary rubbish.

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CONTENTS

1 INTRODUCTION

1.1 Purpose of this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 Structure of the Manual . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Servicing Responsibilities . . . . . . . . . . . . . . . . . . . . . . . . 1

2 GENERAL DESCRIPTION

2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2 Handportable Main Kit . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3 OPERATING INSTRUCTIONS

3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.2 LCD Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

3.3 Location of Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.4 Concept of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.5 Alpha Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.6 Incoming Calling Line Identification (CLI) . . . . . . . . . . . . 7

3.7 Hot Key Dial Source List . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.8 Features Menu Structure . . . . . . . . . . . . . . . . . . . . . . . . 8

3.9 Public Man Machine Interface (MMI) . . . . . . . . . . . . . . . 9

3.10 Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.11 Important Error Messages . . . . . . . . . . . . . . . . . . . . . . 12

3.12 Security Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.13 SIM Personalisation . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.14 GSM Services Supported by PC Card . . . . . . . . . . . . . 14

3.15 GSM Network Codes and Names . . . . . . . . . . . . . . . . . 14

3.16 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4 DISASSEMBLY / REASSEMBLY INSTRUCTIONS

4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.2 Disassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.3 Reassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5 TECHNICAL SPECIFICATIONS

5.1 Tx Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.2 Rx Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6 TEST AND MEASUREMENT

6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.2 External Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.3 Complete Unit Test Setup . . . . . . . . . . . . . . . . . . . . . . . 32

6.4 Channel Box Test Commands . . . . . . . . . . . . . . . . . . . 36

6.5 Adjustment Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

6.6 Lock Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

7 CIRCUIT DIAGRAMS

7.1 Main PCB: Top Level Diagram . . . . . . . . . . . . . . . . . . . 55

7.2 Main PCB: Baseband Overview . . . . . . . . . . . . . . . . . . 56

7.3 Main PCB: RF Overview . . . . . . . . . . . . . . . . . . . . . . . . 57

7.4 Main PCB: PSU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

7.5 Main PCB: Processor . . . . . . . . . . . . . . . . . . . . . . . . . . 59

7.6 Main PCB: Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

7.7 Main PCB: Receiver and Tx Modulator . . . . . . . . . . . . . 61

7.8 Main PCB: Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . 62

7.9 Main PCB: PSU and Synthesizer . . . . . . . . . . . . . . . . . 63

7.10 Keypad PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

8 LAYOUT DIAGRAMS

8.1 Main PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

8.2 Keypad PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

9 REPLACEMENT PARTS LIST

9.1 Case Parts and Sub-Assemblies . . . . . . . . . . . . . . . . . 67

9.2 Printed Circuit Boards (PCBs) . . . . . . . . . . . . . . . . . . . 70

9.3 Refurbishment Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

9.4 Repair Jigs and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . 80

9.5 Printed Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

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INTRODUCTION

1 INTRODUCTION

1.1 Purpose of this Manual

This Service Manual contains the information and procedures required for installing, operating and servicing the Panasonic GSM Personal Cellular Mobile Telephone system operating on the GSM Digital Cellular Network.

1.2 Structure of the Manual

The manual is structured to provide service engineering personnel with the following information and procedures:

1. General and technical information - provides a basic understanding of the equipment, kits and options, together with detailed information for each of the major component parts.

2. Installation and operating information - provides instructions for unpacking, installing and operating the equipment.

3. Servicing information - provides complete instructions for the testing, disassembly, repair and reassembly of each major

component part. Step-by-step troubleshooting information is given to enable the isolation and identification of a malfunction, and thus determine what corrective action should be taken. The test information enables verification of the integrity of the equipment after any remedial action has been carried out.

4. Illustrated parts list - provided to enable the identification of all equipment components, for the ordering of spare/ replacement parts.

1.3 Servicing Responsibilities

The procedures described in this manual must be performed by qualified service engineering personnel, at an authorised service centre.

The service engineering personnel are responsible for fault diagnosis and repair of all equipment described in this manual.

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INTRODUCTION

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GENERAL DESCRIPTION

2 GENERAL DESCRIPTION

2.1 General

This section provides a general description and kit composition details for the GSM Handportable Telephone system and optional kits.

Panasonic Model Numbers GD30 and GD50 are high performance, small, light, business GSM telephones. The following features are included as standard:

1. Triple Rate which includes Full Rate, Half Rate and Enhanced Full Rate (EFR) speech, codec.

2. Dual Band, GSM900 and GSM1800 operation.

In addition, GD50 has a Desktop Handsfree function comprising integral echo cancellation and noise suppression.

2.2 Handportable Main Kit

The handportable main kit provides a standalone Class4 GSM telephone. The plug-in SIM contains the subscriber and network information necessary to operate the phone on a GSM network.

2.2.1 GD30 Contents

NUMBER DESCRIPTION PART NUMBER

1 Main unit GD30 EB-GD30 2 Battery, Standard

3 AC Adaptor EB-CAD70 — Documentation See Section9

2.2.2 GD50 Contents

NUMBER DESCRIPTION PART NUMBER

1 Main unit GD50 EB-GD50 2 Battery, Standard

3 AC Adaptor EB-CAD70 — Documentation See Section9

Figure 2.1: Handportable Main Unit Kit Contents

or: Battery, Large

EB-BSD30

EB-BLD30

EB-BSD50

EB-BLD30

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GENERAL DESCRIPTION

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OPERATING INSTRUCTIONS

3 OPERATING INSTRUCTIONS

3.1 General

This section provides a brief guide to the operation and facilities available on the GD30 and GD50 mobile telephones. Refer to the Operating Instructions supplied with the telephones for full operational information.

3.2 LCD Display

The handportable unit has a graphical chip on glass liquid crystal display in conjunction with the following icons:

Menu Number

Option Area

Figure 3.1: LCD display

T Indicates received signal strength: T strong signal area;\ weak signal area. S Indicates that it is possible to make an emergency call.

Menu Number

H Displays the battery charge level: H Battery is at full charge; K Battery requires recharging;

Menu Icon Displays a small icon related to the current status of the telephone:

p Indicates that the navigation key (g) can be pressed. Each arrow will light individually to indicate which direction is valid. Option Area Pressing the select key (B) will select the option displayed in the option area of the display.

The number of the feature pointed to by the pointer. To access a feature enter the menu number on the keypad.

G The battery icon flashes during charging. During car mount use, when the battery is fully charged, the battery icon will not light.

Y telephone is roaming on a non-home network; t using the “Call Divert” feature or the telephone has Call Divert set; ] shows that the vibration alert is switched on; [ shows that telephone is in silent mode - no tones: N indicates there are unread Short Text Messages (SMS.). Lit when SMS area is full; O the telephone is locked; U shows that normal character have been entered in Alpha Entry; V shows that Greek character have been entered in Alpha Entry; W shows that extended character have been entered in Alpha Entry; X shows that numbers have been entered in Alpha Entry.

Following some operations the display will automatically clear after three seconds or after pressing any key except E.

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OPERATING INSTRUCTIONS

3.3 Location of Controls

Incoming/Charge indicator: Green – incoming call. Red – charging battery pack.

External connector: Used to connect to external accessories or charging equipment.

B A

0 to 9

Figure 3.2: Location of controls for GD30/GD50

Navigation Key. Scrolls through options or features menu and increases or decreases volume. Select Key. Selects option shown in the Option Area of the display. Phonebook Key. Browses through the Phonebook or stores a number in the Phonebook.

Changes the type of characters entered during Alpha Entry. Send Key. Makes a call.

Clear Key. Clears the last digit entered, clears all digits when pressed and held or returns to the previous display.

End Key. Ends a call or switches the telephone on/off when pressed and held. Digit keys. Enter wild numbers or pauses when pressed and held. Where appropriate the 0

key scrolls up or down through abbreviated control names and then select to reveal the international access code “+”.

Vibrator enable/disable Key. Press and hold to enable or disable the vibrator.

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OPERATING INSTRUCTIONS

3.4 Concept of Operation

There is a close relationship between the Select Key, Navigation Key and display.

Figure 3.3: Concept of Operation

Pressing up and down (e) will move the pointer up and down and scroll through more information in the main area of the display.

Pressing left and right (f) will scroll through options in the option area of the display. To choose the option press the Select Key (B).

3.5 Alpha Entry

Alpha Entry is used to enter alphanumeric characters into Phonebook, Short Messages and the Greeting Message.

Key Character/Operation

U V W X 1 “ @ – , . ; : ! ¡ ? ¿ ( ) ‘ & % + – / < > = £ $ ¥ ¤ § 1 2 A B C a b c Α Β Γ A Ä Å Æ B C Ç a à b c 2 3 D E F d e f ∆ Ε Ζ D E É F d e è é f 3 4 G H I g h i Η Θ Ι G H I g h i ì 4 5 J K L j k l Κ Λ Μ J K L j k l 5 6 M N O m n o Ν Ξ Ο M N Ñ O Ö ø m n ñ o ò ö 6 7 P Q R S p q r s Π Ρ Σ P Q R S p q r s ß 7 8 T U V t u v Τ Υ Φ T U Ü V t u ù ü v 8 9 W X Y Z w x y z Ξ Ψ Ω W X Y Z w x y z 9 C Deletes the character above the cursor, deletes the character to the left when at the end of the line or clears the entire entry

when pressed and held.

Each time a key is pressed it will display the next character. When another key is pressed or no key is pressed for a short time the cursor will move to the next position.

To cycle between Greek characters (V), extended characters (W), numerals (X) and normal characters (U) press A.

3.5.1 Editing Alpha Entry

Pressing e will move the cursor up or down one line. Pressing f will move the cursor left or right one character. When the cursor is moved over a character and another key pressed this will insert the new character.

Pressing C will delete the character to the left of the cursor.

3.6 Incoming Calling Line Identification (CLI)

When a call is received the last 6 digits of the CLI information is matched with the phonebook. Therefore an incoming call could match to the wrong phonebook entry.

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OPERATING INSTRUCTIONS

3.7 Hot Key Dial Source List

The source for Hot Key Dial Numbers is normally ‘Phonebook’ or ‘Service Dial Numbers’. For some OEMs it may be a requirement to store these numbers in the EEPROM. When the source is the EEPROM and the telephone software is updated, the source numbers may be lost. Also, if the user changes the source of the Hot Key Dial numbers, it will not be possible to redirect the source back to the EEPROM. However, in the event that an OEM would like the Hot Key Dial source to be stored in the EEPROM, it is unlikely that the user will have the option to change the Hot Key Dial source.

3.8 Features Menu Structure

Figure 3.4: Features Menu Structure

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OPERATING INSTRUCTIONS

3.9 Public Man Machine Interface (MMI)

It is possible to operate all GSM telephones in the same way using the Public MMI. The following operations will work with all GSM telephones. However, this information is restricted to those operations that are supported by GD30 and GD50 telephones.

The * and # in the following procedures should be replaced by * and #, respectively. Also <SND> and <END> should be replaced with D and E keys.

3.9.1 Reading Phonebook Memory Location

# <MEMORY LOCATION> Leading zeros can be left out of the location number, e.g. 007 can be 7.

3.9.2 Presentation of IMEI

* # 0 6 #

3.9.3 Security

Change PIN * * 0 4 * <OLD PIN> * <NEW PIN> * <NEW PIN> #

Change PIN2 * * 0 4 2 * <OLD PIN2> * <NEW PIN2> * <NEW PIN2> #

Unblock PIN * * 0 5 * <PIN UNBLOCKING KEY> * <NEW PIN> * <NEW PIN> #

Unblock PIN2 * * 0 5 2 * <PIN2 UNBLOCKING KEY> * <NEW PIN2> * <NEW PIN2> #

3.9.4 Call Hold

Place a call on hold 2 <SND>

Recall a held call 2 <SND>

Make a second call <TELEPHONE NUMBER> <SND>

Swap between two held calls 2 <SND>

End held call O <SND>

End active call 1 <SND>

Reject incoming call 0 <SND>

3.9.5 Call Waiting

Enable Call Waiting * 4 3 * # <SND>

Disable Call Waiting # 4 3 * # <SND>

Call Waiting Status * # 4 3 * # <SND>

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OPERATING INSTRUCTIONS

3.9.6 Calling Line Identification

Calling Line Identification Feature Service Code

Calling Line Identification Presentation (CLIP) 30 Calling Line Identification Restriction (CLIR) 31 Connected Line Presentation (CLOP) 76 Connected Line Restriction (CLOR) 77

Enable * <SERVICE CODE> * # <SND>

Disable # <SERVICE CODE> * # <SND>

Temporary suppress identification # 3 1 # <TELEPHONE NUMBER> <SND>

Temporary display identification * 3 1 # <TELEPHONE NUMBER> <SND>

3.9.7 Telecommunication Services Used for Public MMI

Teleservice

Service MMI Service Code

All teleservices 10 Telephony 11 All data teleservices 12 Facsimile services 13 Short Message Services (SMS) 16 All teleservices except SMS 19 Voice group services 17

Bearer Service

Service MMI Service Code

All bearer services 20 All asynchronous services 21 All synchronous services 22 All data synchronous services 24 All data asynchronous services 25 All dedicated packet access 26 All dedicated PAD access 27

3.9.8 Call Divert

Call Divert Type Service Code

Divert all calls 21 Divert calls if busy 67 Divert calls if no reply 61 Divert if not reachable 62

Set (except “No Reply” Call Bar

* * <SERVICE CODE> * <FORWARD TELEPHONE NUMBER> * <TELECOMMUNICATION SERVICE> # <SND>

Set “No Reply” Call Bar

* * <SERVICE CODE> * <FORWARD TELEPHONE NUMBER> * <TELECOMMUNICATION SERVICE> * <TIME TO RING (seconds) # <SND>

Clear

# # <SERVICE CODE> * <TELECOMMUNICATION SERVICE> * # <SND>

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OPERATING INSTRUCTIONS

Status

* # <SERVICE CODE> * <TELECOMMUNICATION SERVICE> * # <SND>

Clear all Call Diverts

# # 0 0 2 #

3.9.9 Call Bar

Call Bar Type Service Code

All outgoing calls 33 Outgoing international calls 331 Outgoing international calls except those to the PLMN country 332 All incoming calls 35 Incoming international calls when roaming 351

Set * <PASSWORD> * <TELECOMMUNICATION SERVICE> # <SND>

Clear # <PASSWORD> * <TELECOMMUNICATION SERVICE> # <SND>

Status * # <TELECOMMUNICATION SERVICE> # <SND>

Clear all Call Bar Types # 3 3 0 * <PASSWORD> # <SND>

Change Call Bar Password * * 0 3 * * <OLD PASSWORD> * <NEW PASSWORD> * <NEW PASSWORD> # <SND>

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OPERATING INSTRUCTIONS

3.10Troubleshooting

The user is given the following information and advised to contact the dealer if the problems persist:

Problem Cause Remedy

Telephone will not switch on

Extremely short battery life for a new battery pack

Short battery life for an old battery pack

Short battery life for NiMH battery pack

The battery level indicator H does not light when charging

Calls cannot be made The telephone is locked. Unlock the telephone (Menu: Security: Phone Lock).

Calls cannot be made from Fixed Dial Store

Calls cannot be received The telephone is not switched on. Switch the telephone on.

Emergency calls cannot be made

Telephone numbers cannot be recalled

The network in use and the condition of the battery pack can affect battery life.

The battery pack was worn out. Replace with a new one.

The life of the battery pack is affected by improper charging, this is inherent in all NiMH batteries.

If a battery is deeply discharged it will take a short time before there is sufficient power in the telephone to light the battery level indicator H.

Outgoing calls are barred. Disable the outgoing call barring (Menu: Security: Call Bar). The telephone is not registered to a network. Move to a coverage area and operate the telephone after it

Incoming calls are barred. Disable the incoming call barring (Menu: Security: Call Bar). The telephone is not registered to a network. Move to a coverage area and operate the telephone after it

User’s phone is not in a GSM coverage area.

The telephone is locked. Unlock the telephone (Menu: Security: Phone Lock). Fixed Dial is switched on. Switch off Fixed Dial (Menu: Security: Fixed Dial).

Check that the battery pack is fully charged and correctly connected to the telephone.

Avoid areas of poor reception. Ensure batteries are fully charged. Additionally, for NiMH batteries, ensure batteries are also discharged fully before recharging.

To maintain maximum performance, always use until the Low Battery Warning appears and then fully recharge the battery pack. To revive a Battery Pack, use the telephone until the Low Battery Warning appears and then fully recharge three times. However, if the battery life still is short, the battery pack has eventually worn out. Replace with a new one.

Leave to charge for several minutes in temperatures between +5°C and +35°C.

has registered with a network. Check that SIM supports Fixed DialCheck if the Fixed Dial is

switched on (Menu: Security: Fixed Dial). Check the telephone number is stored in the Fixed Dial.

has registered with a network.

Check that the antenna symbol S is displayed. Move to a coverage area and operate the telephone when the antenna symbol is displayed.

3.11Important Error Messages

The following table is a list of error messages that may occur during use of the telephone, with a description and suggested course of action:

Area not Allowed Roaming in the selected area is not allowed.

Network not Allowed Roaming with the selected network is not allowed. Security Failure The network has detected authentication failure because the SIM is not registered with that network. Contact

SIM Blocked The SIM is blocked because the wrong PUK has been entered ten times. Contact the Service Provider. SIM Error The telephone has detected a problem with the SIM. Switch the telephone off and then back on. If the

Message Rejected Store Full

PIN2 Invalidated The PIN2 is blocked permanently because the wrong PUK2 has been entered 10 times. Services controlled by

Warning Store Full Continue?

Auto Redial List Full Redial list of unsuccessfully dialled numbers is full. Switch the telephone off and then on again.

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the Service Provider.

message does not disappear, contact the Service Provider. A message has been received but the message store is full. To receive messages, delete some of the

currently stored messages or set messages to automatically clear (Menu: Messages: Parameters: Auto Delete).

PIN2 cannot be used. Contact the Service Provider. The message area is full. New messages cannot be stored until some of the currently stored messages are

deleted.

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OPERATING INSTRUCTIONS

3.12Security Codes

Code Type Number of Digits Description

Personal Identification Number (PIN) 4 to 8 Controls SIM security. Supplied by the service provider. PIN 2 4 to 8 Controls memory security. Supplied by the service provider. PIN/PIN 2 Unblocking Key (PUK/PUK 2) 8 Used to unblock PIN and PIN 2. A PIN or PIN 2 will become blocked if the

wrong PIN or PIN 2 is entered three times. When the blocked PIN or PIN 2 is unblocked, a new PIN or PIN 2 must be entered. If the wrong PUK or

PUK 2 is entered 10 times, the cursorr SIM will be unusable. Supplied by the service provider. Password 4 Controls the call bar function. If the wrong password is entered three

times, this service will be revoked. Supplied by the service provider. Lock Code 4 Controls telephone security. Factory set to “0000”.

3.13SIM Personalisation

3.13.1Introduction

SIM personalisation will limit the use of the telephone to a single SIM, a SIM supplied by one Network/Sub-network/Service Provider or a SIM purchased by a company (corporation). If a personalised GD30/GD50 contains a SIM that is from a different source it will display the message “SIM ERROR” when switched on. This personalisation of GD30/GD50 is sometimes referred to as SIM lock or SIM latch.

3.13.2Testing

To test a personalised GD30/GD50, when the user has not supplied the SIM, a SIM configured for test purposes (e.g. test SIM or soft SIM) should be used. The mobile will recognise that the SIM is for testing purposes only and operate as normal.

3.13.3Personalisation Function

Personalisation is activated during manufacture and then enabled at a later stage. Enabling/disabling is available by entering a special key sequence immediately after power on. Once the enable/disable menu is shown it is possible to select the type of personalisation. When personalisation is enabled it is only possible to disable it if the mobile contains an illegal SIM and the sixteen digit Control Key (CK) is known. When enabled the CK is withheld from the user and cannot be read, for security reasons.

There are two special key sequences to enter the enable/disable menu:

Key sequence Notes

7 4 6 B B Can only disable personalisation. 5 2 8 2 4 B B Can both enable and disable personalisation.

3.13.4Disabling Procedure

1. F 7 4 6 B B or 5 2 8 2 4 B B.

2. F e to point at:

“SIM” for SIM Personalisation ”Network” for Network Personalisation “Subnetwork” for Subnetwork Personalisation ”SP” for Service Provider Personalisation or ”Corporate” for Company Personalisation.

3. F B.

4. F the 16 digit Control Key.

5. F B.

6. F the 16 digit Control Key.

7. F B.

The display will confirm which type of Personalisation has been disabled.

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OPERATING INSTRUCTIONS

3.13.5Enabling Procedure

1. 5 2 8 2 4 B B.

2. F e to point at

3. F B.

4. F the 16 digit Control Key.

5. F B.

6. F the 16 digit Control Key.

7. F B.

The display will confirm which type of Personalisation has been enabled.

3.14GSM Services Supported by PC Card

Bearer Service Number

21 Asynchronous 300 bps Asynch 300 bps UDI or modem T or NT 22 Asynchronous 1.2 kbps Asynch 1.2 kbps UDI or modem T or NT 23 Asynchronous 1200/75 bps Asynch 1200/75 bps UDI or modem T or NT 24 Asynchronous 2.4 kbps Asynch 2.4 kbps UDI or modem T or NT 25 Asynchronous 4.8 kbps Asynch 4.8 kbps UDI or modem T or NT 26 Asynchronous 9.6 kbps Asynch 9.6 kbps UDI or modem T or NT 41 Dedicated PAD Access 300 bps Asynch 300 bps UDI T or NT 42 Dedicated PAD Access 1.2 kbps Asynch 1.2 kbps UDI T or NT 44 Dedicated PAD Access 2.4 kbps Asynch 2.4 kbps UDI T or NT 45 Dedicated PAD Access 4.8 kbps Asynch 4.8 kbps UDI T or NT 46 Dedicated PAD Access 9.6 kbps Asynch 9.6 kbps UDI T or NT

Bearer Service Rate Access Structure Access Rate

Information Transfer

3.15GSM Network Codes and Names

Country Access Code Network Operator

Albania +355 AMC 276 01 Andorra +376 STA -Mobiland 213 03 Armenia +374 Armentel 283 01 Australia +61 TELECOM Australia 505 01

OPTUS Communications Pty Ltd. 505 02 Vodafone PTY 505 03

Austria +43 Mobilkom Austria 232 01

max.mobil 232 03 Azerbaijan +994 Azercell 400 01 Bahrain +973 Batelco 426 01 Bangladesh +880 Grameen Phone Ltd 470 01 Belgium +32 Belgacom Mobile 206 01

Mobistar 206 10 Bosnia & Herzegovina +387

+068

Bulgaria +359 Citron 284 01 Brunei Darussalam +673 DSTCom 528 11

Cambodia +855 CamGSM 456 01 Cameroon +237 PTT Cameroon Cellnet 624 01

Cronet 218 01

PTT Bosnia 218 19

Jabatan Telekom 528 01

Error Correction Options

Network Code

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OPERATING INSTRUCTIONS

Country Access Code Network Operator

China +86 Guangdong MCC 460 00

China United Telecommuni-cations Corporation 460 01

Liaoning PPTA 460 02 Croatia +385 HR Cronet 219 01 Cyprus +357 Cyprus Telecommunication Authority 280 01 Czech Republic +42 Eurotel Praha 230 02

Radio Mobil 230 01 Germany +49 DeTeMobil GmbH 262 01

Mannesmann Mobilfunk 262 02 Denmark +45 TELE Danmark Mobile 238 01

Sonofon 238 02

Telia 238 20

Mobilix 238 30 Egypt +20 Arento 602 01 Estonia +372 Eesti Mobiiltelefon 248 01

Radiolinja Eesti AS 248 02

Q GSM 248 03 Ethiopia +251 ETA 636 01 Fiji +679 Vodafone 542 01 Finland +358 Sonera 244 91

Finnet 244 09

OY Radiolinja AB 244 05

Telia 244 03

Alands Mobiltelefon 244 05 France +33 France Telecom 208 01

SFR 208 10

Bouygues Telekom 208 20 French Polynesia +689 Tikiphone 547 20 French West Indies +590 Ameris 340 01 Georgia +995 Geocell 282 01

Magticom 282 02 Germany +49 D1, T-Mobil 262 01

D2, Mannesmann 262 02

E-Plus Mobilfunk 262 03 Ghana +233 ScanCom 620 01 Gibralta +350 GibTel 266 01 Greece +30 Cosmote 202 01

Panafon S.A 202 05

STET HELLAS 202 10 Guinea +224 Sotelgui 611 02 Hungary +36 Westel 900 GSM RT 216 30

Pannon GSM RT 216 01 Hong Kong +852 Hong Kong Telecom CSL Ltd. 454 00

Hutchison Telephone Co. Ltd. 454 04

SmarTone Mobile Communications Ltd. 454 06

P Plus Comm 454 22

New World PCS 454 10

Mandarin Comm 454 16

Pacific Link 454 18

Peoples Telephone 454 12 Hungary +36 Pannon GSM 216 01

Westel 900 216 30 Iceland +354 Post & Simi 274 01

Icelandic Mobile Phone 274 02

Network Code

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OPERATING INSTRUCTIONS

Country Access Code Network Operator

India +91 Bharti Cellular Limited 404 10

BPL Mobile 404 21 Skycell 404 40 Airtel 404 10 Essar 404 11 Maxtouch 404 20 Command 404 30 Mobilenet 404 31 RPG MAA 404 41 Modi Telstra 404 14 Sterling Cellular 404 11 BPL USWest 404 27 TATA 404 07 Escotel 404 12 Aircel Digilink 404 15

Indonesia +62 PT Telekomunikasi Indonesia 510 10

PT. Satelit Palapa Indonesia 510 01

PT Excelcomindo Pratama 510 11 Iran (Islamic Republic of) +98 T.C.I 432 11 Ireland +353 Telecom Ireland 272 01

Digifone 272 02

Meteor 272 03 Italy +39 Omnitel Pronto Italia 222 10

Telecom Italia Mobile 222 01 Ivory Coast +225 Comstar 612 01

Ivoiris 612 03

Loteny Telecom 612 05 Jordan +962 JMTS 416 01 Kuwait +965 MTCNet 419 02 Luxembourg +352 P & T Luxembourg 270 01 Laos

(People’s Democratic Republic) Latvia +371 Latvian Mobile Telephone Co.Ltd. 247 01 Lebanon +961 Libancell 415 03

Lesotho +266 Vodacom 651 01 Liechtenstein +4175 Natel-D 228 01 Lithuania +370 Bite GSM 246 02

Luxembourg +352 P&T LUXGSM 270 01

Macau +853 C.T.M. 455 01 Macedonia +389 PTT Makedonija 294 01 Madagascar +261 Sacel 646 03

Malawi +265 TNL 650 01 Malaysia +60 Celcom 502 19

Malta +356 Telecell 278 01 Mauritius +230 Mauritius Telecom Ltd. 617 01 Monaco +377 France Telecom 208 01

Morocco +212 ONPT Morocco 604 01 Mozambique +258 Telecom de Mocambique 634 01

+856 Lao Shinawatra 457 01

Cellis 415 01

Omnitel 246 01

Millicom Lux SA 270 77

Madacom 646 01

Maxis 502 12

My BSB 502 02

MRTEL 502 13

Adam 502 17

Mutiara Telecom 502 16

SFR 208 10

Network Code

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OPERATING INSTRUCTIONS

Country Access Code Network Operator

Myanmar +95 HPT 219 01 Namibia +264 MTC 649 01 Netherlands +31 LIBERTEL 204 04

PTT Telecom 204 08 New Caledonia +687 Mobilis 546 01 New Zealand +64 Bell South 530 01 Norway +47 Telenor Mobil AS 242 01

NetCom GSM A/S 242 02 Oman +968 General Telecoms 422 02 Pakistan +92 Mobilink 410 01 Papua New Guinea +675 Pacific 310 01 Philippines +63 Globe Telecom GMCR Inc 515 02

IslaCom 515 01 Poland +48 Plus GSM 260 01

ERA GSM 260 02

IDEA Centertel 260 03 Portugal +351 Telecomunicaçoes Moveis Nacionais (TMN) 268 06

TELECEL 268 01

Optimus 268 03 Qatar +974 Q-Net 427 01 Reunion +262 SRR 647 10 Romania +40 MobiFon 226 01

MobilRom 226 10 Russian Federation +701 Mobile Telesystems 250 01

North-West GSM 250 02

KB Impuls San Marino +378 Omnitel 222 10

Telecom Italia Mobile 222 01 Saudi Arabia +966 Al Jawal 420 01

EAE 420 07 Senegal +221 Sonatel 608 01 Seychelles +248 SEZ SEYCEL 633 01 Singapore +65 Singapore Telecom 525 01

MobileOne 525 03 Slovak Republic +42 Eurotel 231 02

Globtel 231 01 Slovenia +386 Mobitel 293 41 South Africa +27 Vodacom 655 01

MTN 655 10 Spain +34 Movistar 214 07

AIRTEL Spain 214 01 Sri Lanka +94 MTN Networks (PVT) Sri Lanka 413 02 Sudan +249 Mobitel 634 01 Sweden +46 Telia Mobitel 240 01

Comviq GSM AB 240 07

Europolitan AB 240 08 Switzerland +41 Swisscom 900 228 01

Swisscom 1800 228 01 Syria +963 Mobile Syria 417 09 Taiwan +886 LDTA 466 92 Tanazania (United Republic of) +255 Tritel 640 01 Thailand +66 TH AIS GSM 520 01

Total Access Comms 520 18 Tunisia +216 Tunisian PTT 605 02 Turkey +90 Turkcell 286 01

Telsim 286 02 Uganda +256 Celtel Cellular 641 01

Network Code

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OPERATING INSTRUCTIONS

Country Access Code Network Operator

Ukraine +380 Mobile comms 255 01

United Arab Emirates +971 UAE ETISALAT-G1 424 01

United Kingdom +44 Vodafone 234 15

(Guernsey) Guernsey Telecoms 234 55 (Jersey) Jersey Telecoms 234 50 (Isle of Man) Manx Telecom 234 58 Uzbekistan +7 Daewoo GSM 434 04

Vietnam +84 MTSC 452 01

Yugoslavia +381 Mobile Telekom 220 01

Zimbabwe +263 NET ONE 648 01

3.16Glossary of Terms

DTMF Dual Tone Multiple Frequency tones. The numeric keys 0 to 9, and * and # will generate different

GSM Global System for Mobile communications. The name given to the advanced digital technology that the

Home country The country in which the home network operates. Home network The GSM network on which subscription details are held. Hot Key Dial Hot Key Dial allows quick access to numbers stored in the Phonebook of Service Dial Number list. The

Lock code Used for security of the telephone. Factory set to “0000”. Message Centre Where messages are sent before they are forwarded onto their destination. The Message Centre

Network operator The organisation responsible for operating a GSM network. Each country will have at least one

Password Used for the control of the call bar function. Supplied by the service provider. PIN Personal Identification Number used for SIM security. Supplied by the service provider. PIN2 Personal Identification Number used for the control of Fixed Dial Memory and call charge metering.

PUK/ PUK2 PIN/PIN2 Unblocking Key. Used to unblock the PIN/PIN2. Supplied by the service provider. Registration The act of locking on to a GSM network. This is usually performed automatically by the telephone. Roaming The ability to use the telephone on networks other than the Home network. Service Dial

Numbers Service provider The organisation responsible for providing access to the GSM network. SIM Subscriber Identification Module. A small smart-card which stores unique subscriber and user-entered

Supplementary service

Wild numbers Spaces in a stored telephone number. When the telephone number is recalled pressing a numeric key

DTMF tones when pressed during conversation. These are used to access voice mail, paging and computerised home banking.

telephone uses.

source of the Hot Key Dial may be defined by the user or preprogrammed by the Service Provide. It is most likely to be preprogrammed to the Service Dial Numbers by the Service Provider.

telephone number may be programmed into the SIM or supplied by the service provider.

network operator.

Supplied by the service provider.

Service Dial Numbers are predefined numbers that allow the user to access a set of special services provided by the Service Provider. For example billing information or access to Voice Mail.

information such as Phone Book, Fixed Dial Memory and short messages. Supplied by the service provider.

Network-controlled GSM functions supported by the telephone. Supplementary services may only be available on a subscription bases.

will fill in a space. This can be used to restrict dialling to a specific area.

Network Code

Golden Telecom 255 05

UAE ETISALAT-G2 424 02

Cellnet 234 10

Coscom 434 05 Buztel 434 01

DGPT 452 02

Pro Monte 220 02

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DISASSEMBLY / REASSEMBLY INSTRUCTIONS

4 DISASSEMBLY / REASSEMBLY INSTRUCTIONS

4.1 General

This section provides disassembly and reassembly procedures for the main components of GD30 and GD50 telephones. These procedures MUST be performed by qualified service personnel, at an authorized service centre. The following warnings and precautions MUST be observed during ALL disassembly/reassembly operations:

WARNING

The equipment described in this manual contains polarised capacitors utilising liquid electrolyte. These devices are entirely safe provided that neither a short-circuit nor a reverse polarity connection is made across the capacitor terminals. FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN HANDLING THESE DEVICES.

Caution

The equipment described in this manual contains electrostatic sensitive devices (ESDs). Damage can occur to these devices if the appropriate handling procedure is not adhered to.

4.1.1 ESD Handling Precautions

A working area where ESDs may be safely handled without undue risk of damage from electrostatic discharge, must be available. The area must be equipped as follows:

Working Surfaces – All working surfaces must have a dissipative bench mat, SAFE for use with live equipment, connected via a 1M2 resistor (usually built into the lead) to a common ground point.

Wrist Strap – A quick release skin contact device with a flexible cord, which has a built in safety resistor of between 5k2 and 1M2 shall be used. The flexible cord must be attached to a dissipative earth point.

Containers – All containers and storage must be of the conductive type.

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DISASSEMBLY / REASSEMBLY INSTRUCTIONS

4.2 Disassembly

4.2.1 Case Removal

1. Remove the battery from the back of the telephone. Remove the four case screws located inside the battery compartment.

Figure 4.1: Screw removal

2. Remove the cover from the case by pulling from the connector end of the telephone. Care must be taken when separating the case from the cover as the retaining clips may be very stiff – if necessary, re-attach the battery to provide extra support for the case.

Figure 4.2: Case Disassembly

3. Remove the two screws securing the PCB assembly to the case. Lift the PCB assembly away from the case.

Figure 4.3: PCB Assembly Removal

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DISASSEMBLY / REASSEMBLY INSTRUCTIONS

4.2.2 Changing the Backup Battery

Remove the case as previously described. The backup battery is held in a retainer on the Main PCB. Observe polarity when replacing the battery.

Figure 4.4: Battery Polarity

4.2.3 Access to Printed Circuit Boards

1. Remove the case as previously described. While applying slight pressure to the side retaining clips, lift the Main PCB away from the chassis.

Figure 4.5: Main PCB removal

2. While applying slight pressure to the side retaining clips, lift the Keypad PCB away from the chassis.

Figure 4.6: Keypad PCB removal

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DISASSEMBLY / REASSEMBLY INSTRUCTIONS

3. Gently bend the four Display Assembly lugs to allow removal from the Keypad PCB.

Figure 4.7: Display Assembly removal

4.2.4 Case-Mounted Components

1. Remove the keypad by peeling it away from the case front.

Figure 4.8: Removing the keypad

2. Remove the rubber boot which contains the microphone. When refitting, ensure contacts are oriented such that they make contact with the corresponding printed circuit pads on the Main PCB..

Figure 4.9: Microphone assembly removal

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DISASSEMBLY / REASSEMBLY INSTRUCTIONS

3. Unclip the speaker holder and lift out the speaker. Note that the retainer clip should be released gently from one side to

ensure that damage does not occur to the retainer barbs..

Figure 4.10: Speaker removal

4. The Vibrate motor may be removed by gently applying pressure under the spindle/counterweight.

Figure 4.11: Vibrate motor removal

4.3 Reassembly

Care must be taken when reinstalling the back onto the telephone case. Ensure that the LCD module is oriented correctly, i.e. the ribbon connector is facing the top of the telephone. Also ensure that the securing screws are not over-tightened as this may affect the operation of the keypad.

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DISASSEMBLY / REASSEMBLY INSTRUCTIONS

This page is left intentionally blank.

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5 TECHNICAL SPECIFICATIONS

5.1 Tx Characteristics

All data is applicable to GSM900 and GSM1800 except where stated.

5.1.1 Frequency error

±0.1ppm max., relative to base station frequency.

5.1.2 Modulation phase error

RMS: ≤5° Peak: ≤20°

5.1.3 Output RF Spectrum due to Modulation

Offset from Centre Frequency (kHz) Maximum Level Relative to the Carrier (dB)

±100 ±200 ±250 ±600 to 1800

+0.5

-30

-33

-60

TECHNICAL SPECIFICATIONS

5.1.4 Output RF Spectrum due to Switching Transients

Offset from Centre Frequency (kHz) Maximum Level (dBm)

GSM 900 GSM 1800

±400 -19 -22 ±600 -21 -24 ±1200 -21 -24 ±1800 -24 -27

Measurement conditions for output RF spectrum measurements: Frequency Span: 0 Hz Measurement Bandwidth: 30 kHz Video Bandwidth: 100 kHz Peak Hold

5.1.5 Spurious Emissions at the Antenna Connector

Frequency Range Frequency Offset Filter Bandwidth

30 to 50 MHz - 10 kHz 30 kHz -36 -36 50 to 500 MHz - 100 kHz 300 kHz -36 -36 500 MHz to 1GHz 0 to 1MHz 100 kHz 300 kHz -36 -36 1 GHz to 4GHz

Excl. relevant TX band: P-GSM: 890 to 915 MHz; DCS: 1710 to 1785 MHz

Relevent TX band: P-GSM: 890 to 915 MHz; DCS: 1710 to 1785 MHz

0 to 10 MHz

≥ 10 MHz ≥ 20 MHz

(offset from edge of relevant TX band)

1.8 to 6.0 MHz (offset from carrier)

100 kHz 300 kHz 1 MHz

30 kHz 100 kHz -30 -30

Approximate Video

Bandwidth

300 kHz 1 MHz 3 MHz

Limits (dBm)

GSM 900 GSM 1800

-30

-36

Measurement conditions: Peak Hold, Modulated Carrier

a. Measurement averaged over a burst and then averaged again over 50 bursts. b. In each of the bands 925-960 MHz and 1805-1880 MHz up to 5 spurious measurements can fail these limits, in which

case the limit ≤ -36dBm shall apply.

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TECHNICAL SPECIFICATIONS

5.1.6 Output Level, Dynamic Operation

GSM 900

GSM 1800

Power Control

Level

PL5 32.4 +0.3, -0.6 +0.3, -0.6 PL6 30.7 ±0.5 ±0.5 PL7 29 ±0.5 ±0.5 PL8 27 ±0.5 ±0.5 PL9 25 ±0.5 ±0.5 PL10 23 ±0.5 ±0.5 PL11 21 ±0.5 ±0.5 PL12 19 ±0.5 ±0.5 PL13 17 ±0.5 ±0.5 PL14 15 ±0.5 ±0.5 PL15 13 ±0.5 ±0.5 PL16 11 ±0.5 ±0.5 PL17 9 ±0.5 ±0.5 PL18 7 ±0.5 ±0.5 PL19 5 ±0.5 ±0.5

Power Control

Level

PL0 29.3 +0.4, −0.5 +0.4, −0.5 PL1 27.7 ±0.5 ±0.5 PL2 26 ±0.5 ±0.5 PL3 24 ±0.5 ±0.5 PL4 22 ±0.5 ±0.5 PL5 20 ±0.5 ±0.5 PL6 18 ±0.5 ±0.5 PL7 16 ±0.5 ±0.5 PL8 14 ±0.5 ±0.5 PL9 12 ±0.5 ±0.5 PL10 10 ±0.5 ±0.5 PL11 8 ±0.5 ±0.5 PL12 6 ±0.5 ±0.5 PL13 4 ±0.5 ±0.5 PL14 2 ±0.5 ±0.5 PL15 0 ±0.5 ±0.5

Transmitter Output Power

(dBm)

Transmitter Output Power

(dBm)

Tolerance for Conditions (dB)

Normal Extreme

Tolerance for Conditions (dB)

Normal Extreme

5.1.7 Residual Peak Power

≤70 dBc (BW = 300 kHz)

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TECHNICAL SPECIFICATIONS

5.2 Rx Characteristics

5.2.1 Sensitivity

GSM 900 Full rate speech

The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions.

Channels

TCH/FS FER 6.742*α 8900 0.122*α 164000 class Ib (RBER) 0.42/α 1,000,000 0.41/α 20,000,000 class II (RBER) 8.33 120,000 7.5 24000 9.333 60000 2.439 8200

Propagation Conditions

TUhigh

Test limit error rate

Minimum

no. of

samples

Propagation Conditions RAPropagation Conditions

Test limit error rate

Minimum

no. of

samples

Test limit error rate

Minimum

no. of

samples

Static Conditions

Test limit error rate

Minimum

no. of

samples

The reference sensitivity level is <-102dBm.

NOTE:

1 ≤ α ≤ 1.6. The value of a can be different for each channel condition but must remain the same for FER and class Ib RBER measurements for the same channel condition.

GSM 900 Half rate speech

Channels

TCH/HS (FER) 4.598 13050 TCH/HS class Ib (BFI=0) 0.404 148500 TCH/HS class II (BFI=0) 7.725 25500 8500 20000 7600 20000 TCH/HS (UFR) 6.250 9600 TCH/HSL class Ib ((BFI or UFI)=0) 0.269 227000

Propagation Conditions

TUhigh

Test limit

error rate

Minimum

no. of

samples

Propagation Conditions RAPropagation Conditions

Test limit error rate

Minimum

no. of

samples

Test limit error rate

Minimum

no. of

samples

GSM 1800 Full rate speech

Channels

TCH/FS FER 4.478*α 13400 0.122*α 164000 class Ib (RBER) 0.32/α 1,500,000 0.41/α 20,000,000 class II (RBER) 8.333 60,000 7.5 24000 9.333 30000 2.439 8200

Propagation Conditions

TUhigh

Test limit error rate

Minimum

no. of

samples

The reference sensitivity level is <-102 dBm.

NOTE:

1 ≤ α ≤ 1.6. The value of a can be different for each channel condition but must remain the same for FER and class Ib RBER measurements for the same channel condition.

MCUK991001C8 Section 5 Issue 1 Service Manual – 27 – Revision 0

Propagation Conditions RAPropagation Conditions

Test limit error rate

Minimum

no. of

samples

Test limit error rate

Minimum

no. of

samples

Static Conditions

Test limit error rate

Minimum

no. of

samples

Page 34

TECHNICAL SPECIFICATIONS

GSM 1800 Half rate speech

Channels

TCH/HS (FER) 4.706 12750 TCH/HS class Ib (BFI=0) 0.426 141000 TCH/HS class II (BFI=0) 7.725 25500 8735 20000 7600 20000 TCH/HS (UFR) 6.383 9400 TCH/HSL class Ib ((BFI or UFI)=0) 0.291 206000

Propagation Conditions

TUhigh

Test limit error rate

Minimum

no. of

samples

Propagation Conditions RAPropagation Conditions

Test limit error rate

Minimum

no. of

samples

Test limit error rate

Blocking:

Frequency Small MS level in dBµVemf()

GSM 900 GSM 1800

FR ±600 kHz to FR ±800 kHz 70 70 FR ±800 kHz to FR ±1.6 MHz 70 70 FR ±1.6 MHz to FR ±3 MHz 80 80 915 MHz to FR -3 MHz 90 FR ±3 MHz to FR 980 MHz 90 FR ±600 kHz to FR ±800 kHz - 87 1785 MHz to FR - 3 MHz - 87 835 MHz to <915 MHz 113 >980 MHz to 1000 MHz 113 100 kHz to <835 MHz 90 >1000 MHz to 12.75 GHz 90 100 kHz to 1705 MHz - 113 >1705 MHz to<1785 MHz - 101 >1920 MHz to 1980 MHz - 101 >1980 MHz to 12.75 GHz - 90

Minimum

no. of

samples

Measurement Conditions: Wanted carrier is 3dB above reference sensitivity. Interferer is CW

Spurious response exceptions: 6 exceptions are permitted IN band 915 - 980MHz 24 exceptions are permitted OUTSIDE band 915 - 980MHz.

Intermodulation Characteristics:

Interferer Level (f1 & f2) dBm Interferer Frequencies (f1 & f2)

-49 Wanted frequency = 2f1 - f2, and |f1 - f2| = 800 kHz

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TEST AND MEASUREMENT

6 TEST AND MEASUREMENT

6.1 Introduction

This section provides information on testing GD30 and GD50 telephones. The layout is as follows:

1. Section6.2 External testing: describes equipment requirements and general set up procedure.

2. Section 6.3 Complete Unit Test Setup: describes how the items of test equipment are used together and general set up

procedure.

3. Section6.4 Channel box test commands: provides detailed explanation of the different commands available using the test equipment and channel-box software.

4. Section6.5 Adjustment mode: describes adjustments available on the GD30/GD50 handheld unit.

5. Section6.6 Lock code: describes the procedure to check or reset the lock code using the Channel box software.

6.2 External Testing

The GD30/GD50 unit can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section provides a description of the equipment required to perform those tasks.

Testing and adjustment of the handheld unit can be performed with the outer case in place and the cradle connected. For indepth fault finding the unit should first be disassembled, as detailed in Section4, and then the PCB Repair Jig used to connect the PCBs together externally as they would be found in normal use. Fault tracing can then be performed on the PCBs using suitable test equipment, such as spectrum analysers and oscilloscopes.

The unit must now be tested and calibrated for both frequencies (900MHz and 1800MHz) as well as for the two battery types.

6.2.1 Jigs and Tools

Test Equipment Descriptions

1. Interface box,

Part Number: IFB003/IFB004

The Interface box provides:

a. IFB003: Voltage regulation for +7.2V, +5.6V or 4.8V DC outputs. The +7.2V switch setting is used as a supply to Li-

Ion type batteries (compatible for other products), the 5.6V switch setting is used for PCB testing and the 4.8V switch setting is used for testing the complete unit

Interface Box IFB004 is a later version that provides +4.8V, +7.2V and +8.2V DC outputs. It also allows selection of external power via the Interface cable.

b. RS 232 interface. Ensures that the Unit Under Test is supplied with the correct signal levels and format..

Figure 6.1: Interface Box IFB003 / IFB004

2. Personal Computer (PC)

The PC (IBM compatible) is used as a Unit Under Test controller. This in conjunction with the channel box software, allows all of the test facilities normally provided through the keypad of the Unit Under Test.

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TEST AND MEASUREMENT

3. Power Supply

Provides 12V DC supply to Interface Box IFB003 or IFB004.

4. Test Battery Part Number: JT00022

Provides 3.6V DC supply to Interface Box IFB003 or IFB004 to compensate for the current drain when the Unit Under Test is used at full transmit power.

Figure 6.2: Test Battery

5. PCB Repair Jig Part Number: JT00011

This unit provides the necessary connections between the Main and Key PCBs, and the connections between Main PCB and external test equipment.

Figure 6.3: PCB Repair Jig

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TEST AND MEASUREMENT

6. RF Adaptor

Part Number: JT00009

This unit provides an RF connection between the Unit Under Test and external test equipment. It has a lug on the back to allow both Adaptor and Unit Under Test to be suspended from a suitable rack or channel bracket, if required.

Figure 6.4: RF Adaptor

7. GSM Tester This unit acts as a base station providing all the necessary GSM signalling requirements and also provides GSM signal

measuring facilities.

8. Interface Cable

Part Number: JT00004

The interface cable allows connection between a computer and the Unit Under Test via IFB003. Connector is available separately, if required, under part number DHS31-P18S-HL-BD.

Figure 6.5: Interface Cable

9. Battery Calibration Voltage Control Unit (BCVCU)

Part Number: JT00010

This unit provides three voltage levels (3V, 4.1V and 0V) to the Test Battery, and is used during battery calibration checks. It is powered from the Interface Box. .

Figure 6.6: Battery Calibration Voltage Control Unit (BCVCU)

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TEST AND MEASUREMENT

10. Channel Box Software

This is the test software for the telephone unit and should be installed onto the personal computer to be used for testing.

6.3 Complete Unit Test Setup

Figure 6.7: Complete unit test setup

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6.3.1 External Testing Setup Procedure

IMPORTANT NOTE

To allow accurate measurement of the complete unit the test equipment must be connected as shown (Figure6.6). The PCB Test Setup must be used to enable repair to PCBs. Once repair/replacement is complete, the assembled unit must be tested and calibrated with the jigs and tools connected as shown in Figure6.7.

Full Test Equipment Requirements For testing the handheld unit the following equipment is required:

1. Interface box

2. 12V power supply

3. Personal computer (IBM compatible) with RS232 interface

4. RS232 interface cable (9 pin straight through connection)

5. GSM test station

6. RF Adaptor

7. Interface cable – JT00004

The channel box software (supplied on floppy disk) should be installed onto the main drive of the personal computer. The RF cable is connected to the GSM test station via a suitable adapter. The 12V supply is connected to the rear socket of

the Interface box. Two modes are available for testing the handheld unit:

1. Test Mode. The Test Mode facility allows various sections of the handheld unit to be individually activated.

2. Normal Mode. The Normal Mode facility allows the handheld unit to be powered externally for call origination/receiving operations.

NOTE: A suitable test SIM card will be required which is compatible with the GSM test station.

Power On into Test Mode

1. Connect the test equipment into test mode configuration.

Figure 6.8: External test equipment setup

2. Ensure that the following settings are made: a. Interface box IFB003

Power: UP position IGN: DOWN position Mode UP position Voltage Dependent upon operation:

5.6V for PCB testing

4.8V for Nickel Metal Hydride battery

b. Power supply

+12V DC: OFF

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c. PC

Channel box software loaded and the screen indicating as shown:

Figure 6.9: PC Screen (SCRN10)

3. Press ENTER on the PC keyboard.

4. Switch on the +12V supply.

5. At the PC press F10.

6. At the Interface box switch the power to ON.

7. Steps 5 and 6 above must be carried out within 1 second or power ON will time-out. NOTE: The display will read:

GET STATION ADDRESS = _ _ INFO = _ _

The back light will be illuminated and all LEDs will be lit. Go to section 7.4 (Channel Box Test Commands) for further testing information.

Power On in Normal Mode

1. Connect together the test equipment.

Figure 6.10: External test equipment setup

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2. Ensure that the following settings are made: a. Interface box IFB003

Power: UP position IGN: DOWN position MODE: UP position

b. Power supply

+12V DC: OFF

c. PC

Channel box software loaded and the screen indicating as shown:

Figure 6.11: PC Screen (SCRN9)

3. On the PC press ENTER.

4. Switch on the 12V supply.

5. At the PC press F10.

6. At the Interface box switch the POWER to ON.

Entering Call Mode from Test Mode

TEST AND MEASUREMENT

Ensure that a charged battery is attached to the telephone. The screen of the PC will resemble the one shown:

Figure 6.12: PC Screen (SCRN11)

1. At the PC change the SOFT SIM field to read <ENB>. Press ENTER.

2. At the PC change the TEST field to read <TERM>. Press ENTER.

The UUT will power down and up again. If the UUT is connected to a GSM test set, after a delay of approximately 5seconds the UUT will register service.

3. To return to test mode, set SOFT SIM field to <DIS> and set TEST field to <Test>. Press ENTER.

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6.4 Channel Box Test Commands

The following table outlines the commands available using the channel-box software. After the handheld unit has been switched on (section 7.3), use the up/down scroll keys on the personal computer keyboard to

select the channel-box command. Use the left/right scroll keys to display the required indication and press the ENTER key to select the displayed function.

CHANNEL BOX COMMAND INDICATION FUNCTION

TEST MODE <TERM>

INITIALIZE <INIT> When RETURN is pressed this will reset the

CHANGE CH GSM <xxx> Sets up predefined channel settings for GSM

CHANGE CH DCS <xxx> Sets up predefined channel settings for DCS

POWER LEVEL <xxx> Allows a specified power level to be set at the

TX DATA

RSSI (DBM) <xxx> Provides an RSSI reading on the User specified

SET AGC 1 SET AGC 2 SET AGC 3

SP LOOP BACK <START>

PATH CONT

VOL. BUZZ <xx> Sets buzzer volume between values

VOL. SIDE <xx> Sets 4 side tone volume levels between

VOL. MIC <xx> Sets 8 MIC volume levels between

VOL. SP1 <xx> Sets speaker pre-amp volume levels VOL. SP2 <xx> Sets speaker volume levels GET KEY CODE <ENABLE><DISABLE> Displays the value of a key pressed on the

CONTROL OUT <LED R>

CHECK LCD1 <P1>

<ReST>

<STOP>

<P2>

Terminates test mode. Restarts test mode

default channel settings.

frequencies.

UUT. Sets TX Modulation to

Normal burst DATA all 0s Normal burst DATA all 1s Normal burst DATA all random Access burst DATA random

channel. Allows changes to AGC levels on LOW,

MIDDLE, HIGH channels.

Provides an audio path for use with the GSM test station Sets audio loop-back from TX audio to RX audio without processing by the CODEC

Sets audio paths: MIC off speaker off MIC external speaker internal MIC external speaker external MIC internal speaker internal MIC internal speaker external

0 to 3 (Min to Max)

0dB and -18dB

26dB and 40dB

keypad Switches on Incoming LED

Switches on Backlight LEDs Switches charge sequence on LCD Switches on Charging LED Switches on handsfree mode Switches off all above Switches on all above

Provides 50% visual display of check pattern on the UUT LCD Provides 50% visual display of check pattern on the UUT LCD

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CHANNEL BOX COMMAND INDICATION FUNCTION

SET ER.DISP <ENABLE>

SOFT SIM <ENABLE> <DISABLE> With ENABLE set and TEST MODE <TERM>

TEST MODE <TERM> With SOFT SIM <ENABLED> the UUT will be

SIM STATUS <SHOW> Checks and displays the SIM status CHECK SUM <SHOW> Displays the software checksum

Unit error codes will be displayed on the UUT display Unit error codes will not be displayed on the UUT display

the UUT is removed from test mode and can be placed into call mode

removed from test mode and can be placed into a call

6.5 Adjustment Mode

NOTE: See Section6.2.1 for a list of the equipment and setup procedures required to perform the following adjustment

and calibration procedures.

The following procedures MUST be performed after replacement or repair of one or both of the PCBs in the handheld unit. Failure to do so may result in incorrect operation of the telephone.

The following adjustments MUST be made on BOARD PAIRS. There are three distinct calibration procedures to adjust RF performance. These procedures are:

1. Ramping gain (Section6.5.1)

2. RSSI (Section6.5.2)

3. I and Q values (Section6.5.3)

The adjustment data selected during calibration is stored in the telephone EEPROM.

Figure 6.13: Test software screen

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6.5.1 Ramping Gain

The carrier power must be measured and calibrated for each power level at channel 62.

GSM900

GSM1800

Power Level

PL5 32.4 +0.3, -0.6 214 7.0 PL6 30.7 ±0.5 200 5.0 PL7 29 ±0.5 190 4.5 PL8 27 ±0.5 181 4.0 PL9 25 ±0.5 173 5.0 PL10 23 ±0.5 163 5.0 PL11 21 ±0.5 153 4.5 PL12 19 ±0.5 144 3.5 PL13 17 ±0.5 137 3.5 PL14 15 ±0.5 130 2.5 PL15 13 ±0.5 125 2.5 PL16 11 ±0.5 120 3.0 PL17 9 ±0.5 114 3.5 PL18 7 ±0.5 107 3.5 PL19 5 ±0.5 100 3.5

Power Level

PL0 29.3 +0.4, -0.5 194 5.0 PL1 27.7 ±0.5 184 4.0 PL2 26 ±0.5 176 4.0 PL3 24 ±0.5 168 4.5 PL4 22 ±0.5 159 4.0 PL5 20 ±0.5 151 3.5 PL6 18 ±0.5 144 3.5 PL7 16 ±0.5 137 3.5 PL8 14 ±0.5 130 2.5 PL9 12 ±0.5 125 3.0 PL10 10 ±0.5 119 2.5 PL11 8 ±0.5 114 2.5 PL12 6 ±0.5 109 3.0 PL13 4 ±0.5 103 3.0 PL14 2 ±0.5 97 2.5 PL15 0 ±0.5 92 2.5

Peak Power

(dBm)

Peak Power

(dBm)

Tolerance

(dBm)

Tolerance

(dBm)

Initial

Calibration

Value

Initial

Calibration

Value

Change per

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Calibration of output power on each power level

NOTE: To ensure that the telephone operates within set SAR margins, Panasonic recommends that a power meter

capable of measurement to an accuracy of ±0.2dBm (Hewlett Packard HP8990 or equivalent) is used when calibrating power levels. Use of a less accurate power meter may result in the phone failing to meet SAR standards.

To calibrate the ramping gain, first switch the unit into Test Mode (Section6.3). This procedure must be followed for all power levels PL5 to PL19, for low, middle and high channels for GSM 900. GSM 1800

shall be calibrated for all power levels PL0 to PL15 for top middle and bottom channels.

1. Set the Channel box controls to Channel62 at Power Level14, normal burst modulated with random data as follows: a. Press the down arrow until CHANGE CH<62> is highlighted and then press ENTER. b. Press the down arrow until PL<14> is highlighted. Press the move left arrow until <14> appears in the highlighted field.

Press ENTER.

c. Press the down arrow until TX DATA <OFF> is highlighted.

Press the move arrow until <NRL R> appears in the highlighted field. Press ENTER.

Figure 6.14: Tx data field

2. At the GSM test unit measure the Peak Power.

3. If the measured power is in the range of the target power (see previous table), then proceed to step 10.

4. At the Channel box press F7 to view the TRIM for the mid-channel.

Figure 6.15: Power level view 1

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5. Select VIEW TRIM PL MCH, and make a note of this value.

Figure 6.16: Power level view 2

6. Perform the following calculation and make a note of the result: New Trim value = Old Trim Value + (Required Power - Measured Power) x Change per dB

(step 5) (table) (step2) (table)

Make a note of the result.

7. At the Channel box press F6 to program the TRIM for the mid-channel.

Figure 6.17: Power level selection 1

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8. Select PROGRAM TRIM PL MCH GSM.

Figure 6.18: Power level selection 2

9. Highlight the PL14 field and press ENTER.

TEST AND MEASUREMENT

Figure 6.19: Power level selection 3

10. Enter the value calculated in step 6 into the data field and then press ENTER.

11. Press ESC.

12. At the GSM test unit re-measure the peak power.

13. Repeat steps2 to11 of this procedure for the remaining power levels, in the following order:

PL6, PL9 and PL19. Power Levels between PL9 and PL6. Power Levels between PL14 and PL9. Power Levels between PL19 and PL14.

14. Calibrate PL5 (limits ±0.2dB).

15. After calibrating at channel62, the carrier power must be measured and calibrated at LOW and HIGH channels as

described in steps2 to 14.

16. Repeat steps2 to 14 for the GSM1800 settings in the following order:

PL10 (limits±0.5dB). PL1, PL5 and PL15. Power levels between PL5 and PL1. Power levels between PL10and PL5.

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Power levels between PL15 and PL10. Power level PL0 (limits ±0.2dB).

Channel GSM900 GSM1800

Low/Bottom 10 544 Mid 62 699 High/Top 105 885

6.5.2 RSSI

This procedure describes the calibration of RSSI on the compensation channel (Mch = Ch 67). This process must be carried out for LOW/BOTTOM CHANNEL and HIGH/TOP CHANNEL. The following channel settings are used in this procedure:

1. Set up the test equipment as described in Section6.3 and switch the unit into test mode as described.

2. Apply a carrier frequency of +68KHz to the UUT (for Ch 67 = 948.400MHz) at an input level of -90dBm.

3. At the Channel box highlight the CHANGE CH<67> field and press ENTER.

4. Highlight the SET AGC 1 field and change the set value to 45dB and press ENTER.

5. Highlight the RSSI dBm <> field and press ENTER.

Figure 6.20: RSSI dB field

6. If the measured value is not -90 ±1 then make the following calculation:

RSSI offset value = [-(90+MEASURED RSSI VALUE)] x 2

= [-90-MEASURED RSSI VALUE] x 2,

for example [-(90+(-95))] x 2

= [-90-(-95)] x 2 = 10

Record the result.

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7. At the Channel box press F7 to view data.

Figure 6.21: RSSI reading 1

8. Select TRIM OTHER and make a note of the RSSI COMP GSM reading.

TEST AND MEASUREMENT

Figure 6.22: RSSI reading 2

9. Press ESC.

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10. At the Channel box press F6 to program data.

Figure 6.23: RSSI reading 3

11. Select TRIM RSSI and press ENTER.

12. Make the following calculation:

RSSI offset value (from step 8) + reading noted in step 6. Enter the result into RSSI COMP field for example: 10+ 5 = 15

Figure 6.24: RSSI reading 4

13. Press ENTER.

14. Press ESC.

15. Measure the RSSI level again by highlighting the RSSI dBm field and press ENTER.

16. Repeat steps 6 to 15 for both LOW/BOTTOM and HIGH/TOP channels.

Channel GSM900

Low/Bottom 37 Comp 67 High/Top 95

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17. Repeat steps 6 to 15 for GSM1800 on the channels listed below:.

Channel GSM1800

Bch 586 Lch 681 Mch 731 Hch 861 Tch 878

NOTE: The AGC1 setting for GSM1800 RSSI calibration should be 51dBm.

6.5.3 I and Q Values

NOTE: With the I, Qch adjustment procedures the transmitter must be set to Power Level 5 (this presents the worst case

of non-linearity) so care must be taken that the spectrum analyser used can accept a signal input of 33dBm. If not an appropriate attenuator must be used.

I, Q ch Offsets

Spectrum Analyser setup centre frequency = 902.4 MHz RBW = 10 kHz VBW = 10 kHz span = 1 MHz sweep time = 2 sec

1. Set the Channel box controls to channel 62 at power level 5, normal burst modulated with all 1’s.

a. Press the down arrow until CHANGE CH > is highlighted and then press ENTER. b. Press the down arrow until PL is highlighted. Press ENTER. c. Press the down arrow until TX DATA is highlighted. Press the move arrow until “NRL 1” appears in the highlighted field. d. Press ENTER.

Figure 6.25: Channel box setup

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2. On the spectrum analyser measure the carrier leakage ratio. Carrier leakage ratio is measured as the ratio of peak power

and the power at 68kHz below peak frequency.

Example:

peak power (902.468MHz) = 33dBm power at 135kHz below peak power = -9dBm carrier leakage ratio = 33dBm - (-9dBm) = 42dBm

Figure 6.26: Carrier leakage ratio

3. If carrier leakage ratio is greater than 30dBc then unit is OK. (offset calibration is complete).

4. If carrier leakage ratio less than 30dBc then go to ‘Ich Gain Caliibration’.

Ich check

1. At the Channel box check Ich offset data by selecting F7 then VIEW TRIM OTHER.

Figure 6.27: I, Q data field selection 1

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2. At the Channel box set Ich offset to 147, press F6 to program TRIM OTHER.

Figure 6.28: I,Q data field selection 2

3. Select Ich OFFSET

TEST AND MEASUREMENT

Figure 6.29: I,Q data field selection 3

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TEST AND MEASUREMENT

4. Enter 147 for Ich OFFSET and press ENTER.

Figure 6.30: I,Q data field selection 4

5. Using the Spectrum Analyser, measure the new carrier leakage ratio.

6. If the new carrier leakage ratio is greater than 30dBc then the unit is OK (offset calibration is complete).

7. If the original carrier leakage ration (see I,Q OFFSETS step 2) is greater than the new carrier leakage ratio go to I Dec

Calibration.

8. If the original carrier leakage ratio is less than the new carrier leakage ratio go to I Inc Calibration.

I Dec Calibration

1. Set Ich offset to 107 (see Ich Check step 2).

2. Using the spectrum analyser measure the new carrier leakage ratio.

3. If the carrier leakage ratio is greater than 30dBc then unit is OK (offset calibration is complete).

4. If not then repeat steps 1, 2 and 3 above for Ich offset values: 87, 67, 47, 27 and 7.

5. If the carrier leakage ratio is still not greater than 30dBc then go to Qch Check.

I Inc Calibration

1. Set Ich offset to 167 (see Ich check step 2).

2. Using the spectrum analyser measure the carrier leakage ratio.

3. If the carrier leakage ratio is greater than 30dBc then the unit is OK. (offset calibration is complete).

4. If not then repeat steps 1, 2 and 3 above for Ich offset values: 187, 207, 227, 247.

5. If the carrier leakage ratio is still not greater than 30dBc then go to Qch Check.

Qch Check

1. Set Ich offset to 127.

2. Set Qch offset to 147. a. At the Channel box press F6. b. Press move down arrow until QCH OFFSET appears in the field. Press ENTER. c. Enter 3 into the data field and press enter.

3. Measure the new carrier leakage ratio.

4. If the carrier leakage ratio is greater than 35dBc the unit is OK. (offset calibration is complete).

5. If the original carrier leakage ratio (see I, Q ch Offsets step 2) is greater than new carrier leakage ratio then go to Q Dec

Calibration.

6. If the original carrier leakage ratio is less than new carrier leakage ratio then go to Q Inc Calibration.

Q Dec Calibration

1. Set Qch offset to 107 (see Qch Check step 2).

2. Measure carrier leakage ratio.

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3. If the carrier leakage ratio is greater than 35dBc then unit is OK. (offset calibration is complete).

4. If not then repeat steps 1, 2 and 3 above for Qch offset values: 87, 67, 47, 27, 7.

5. If the carrier leakage ratio is still less than 35dBc then unit is a fail.

Q Inc Calibration

1. Set Qch offset to 167 (see Qch Check step 2).

2. Measure carrier leakage ratio.

3. If carrier leakage ratio is greater than 35dBc then unit is OK. (offset calibration is complete).

4. If carrier leakage ratio is less than 35dBc then repeat steps 1, 2 and 3 above for Qch offset values:187, 207, 227, 247.

5. If carrier leakage ratio is less than 35dBc then unit is a fail.

I, Qch Gain

IMPORTANT: I, Qch offset calibration should be done before this calibration. Spectrum Analyser Setup. centre frequency = 902.4MHz RBW = 10kHz VBW = 10kHz span = 1MHz sweep time = 2sec

1. Set the Channel box controls to channel 62 at power level 5, normal burst modulated with all 1’s.

ENTER.

2. Using the spectrum analyser measure the image leak ratio. Image leak ratio is the measured ratio of peak power and the

power at 135 kHz below peak frequency.

Example:

peak power (902.468 Mhz) = 33 dBm power at 135 kHz below peak power = -9 dBm image leak ratio = 33 dBm - (-9 dBm) = 42 dBm

Figure 6.31: Image leak ratio

3. If image leak ratio is greater than 30 dBc then unit is OK. (offset calibration is complete).

4. If image leak ratio is less than 30 dBc then go to Ich gain calibration.

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IQch Gain Calibration

1. Set IQch gain to -0.25 dB. a. On the Channel box press F6, and select TRIM OTHER. b. Press move left arrow until IQCH GAIN field is highlighted. Press ENTER. c. Enter 1 (for -0.25dB) into the data field. Press ENTER.

2. Measure the image leak ratio.

3. If image leak ratio is greater than 30dBc then unit is OK. (offset calibration is complete)

4. If image leak ratio is less than 30dBc then repeat steps 1, 2 and 3 above with IQch gain values: -0.50dB (enter‘2’), and

-0.75dB (enter‘3’).

5. If image leak ratio is still less than 30dBc then the unit is a fail.

6.5.4 Simple Receiver Test

The following procedure gives a method by which the Unit Under Test (UUT) can be placed into a condition allowing the service technician to probe the entire receive RF path. Input level and frequency can also be specified.

To perform the following procedure the UUT must first be placed into Test Mode. Perform the following steps:

1. At the Channel box highlight the CHG CH (GSM900 or GSM1800) field and set the required test channel. Press ENTER.

2. Highlight the SET AGC 1,2,3 field and enter the required gain value.

3. At the GSM test unit input an RF signal at the required frequency and level.

The unit has now been placed in a state which will allow the received signal path to be monitored.

6.5.5 Simple Transmitter Test

The following procedure gives a method by which the Unit Under Test (UUT) can be placed into a condition allowing the service technician to probe the entire transmit RF path. Input level and frequency can also be specified.

To perform the following procedure the UUT must first be placed into Test Mode. Perform the following steps:

1. At the Channel box highlight the CHG CH (GSM900 or GSM1800) field and set the required test channel.

2. Press ENTER.

3. Highlight the PL field and set the required test power level.

4. Press ENTER.

5. Highlight the TX_DATA field and select the required modulation type and data.

6. Press ENTER.

The UUT is now in the required state to allow probing of the transmit RF path.

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6.5.6 Battery Charging & Calibration

There are three procedures to calibrating the battery, voltage, temperature and charging calibration. A Battery Calibration Voltage Control Unit (BCVCU) is used to provide the necessary voltage levels for these checks. The BCVCU replaces the two regulated power supplies and 82Ohm resistor required to calibrate previous mobile phone products.

Preliminaries

1. Connect the mobile phone, test battery, BCVCU and Interface Box as shown in the diagram below.

Figure 6.32: Battery Calibration Test Connections

2. Set the Interface Box to output to 7.2V. Leave the power supply switched OFF and set the MODE or EXTPWR switch to

OFF.

Voltage Calibration

1. Set the BCVCU to 4.1V (centre position on switch) and set the 82Ohm switch to OFF.

2. Select and run the Channel Box software in ‘Test Mode’.

3. Press [F10] and power the phone on. "TEST SET TEST MODE" should be displayed in the phone display.

4. Press [F4] on the PC. Go to, and select: "VIEW ADC LINES".

5. Look at ADIN1 (BAT VOLT) reading. This reading is "BAT VOLT HIGH". If reading is outside the range 803 and 723, then

there is a fault and further investigation is required. Otherwise, record the value for later use.

6. Set the BCVCU output to 3.0V.

7. Press "[Y]" [enter] on the PC to re-read ADC Data.

8. Look at ADIN1 (BAT VOLT) reading again. This reading is "BAT VOLT LOW". If the reading is not within the range 518

and 598, then there is a fault and further investigation is required. Otherwise, record the value for later use.

9. Press [N] (in repeat yes/no box), then [enter].

10. Press [F6]. Go to, and select: "TRIM Other". Go to, and select: "BAT VOLT HIGH". Enter value from step5 above.

11. Press [F6]. Go to, and select: "TRIM Other" again. Go to, and select: "BAT VOLT LOW". Enter value from step8 above.

Set the BCVCU output to 4.1volts.

Temperature Calibration

1. Ensure that the BCVCU output is set to 4.1V.

2. If the ADC data is not already being displayed, press [F4], "VIEW ADC LINES", [enter].

3. Look at the value for ADIN3 (BAT TEMP). If the value is outside the range 390 and 428, then there is a fault and further

investigation is required. Otherwise, calculate the difference between the reading and the theoretical value of 409. Record this value for use below.

4. Press [N] (in repeat yes/no box), then [enter].

5. Press [F6]. Go to, and select: "TRIM Other" again.

6. Go to, and select: "BAT TEMP". Enter the value recorded in step3.

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Charging Calibration

NOTE: The charging calibration procedure requires an interface cable (part number JT00004), modified as shown in the

diagram below, to allow EXT_PWR to be fed via pin9 of the D-TYpe connector to the phone connector.

Figure 6.33: Modification to Interface Cable JT00004

1. Ensure that the BCVCU output is set to 4.1V output and the MODE or EXT_PWR switch set to ON. Set the 82Ohms

switch ON.

2. Press {shift}+[F4].

3. Go to, and select: "Set DAC Data". Type a value of 714, [enter].

4. Using arrows ↑↓, highlight "Control out". Use ←→ arrows to highlight and select "CRG ON". (“ACK” should be displayed

on the PC screen. If it is not displayed, then it may be necessary to re-power the telephone and start the Charging Calibration procedure again from step1.)

5. Disconnect VBAT by switching the BCVCU output to OFF.

6. Measure VBAT voltage at the test battery. If the voltage is inside the range 4.1V±5mV then go to step11 below.

Otherwise, calculate the difference thus:- (measured voltage - 4.1)/0.0057 = difference.

For example, for a measured voltage of 4.08V the difference will be: (4.08-4.1)/0.0057=-3.5

7. Press {shift}+[F4].

8. Go to, and select: "Set DAC Data". Enter the value calculated by subtracting the difference value recorded in step6 from

the DAC Data value (714). This value must be an integer.

As an example, the example from step6 would produce a value of:714-(-3.5)=717.5 or 718 .

9. Repeat steps6 to 8 until the measured voltage is 4.1V±5mV

10. If the final value for DAC Data is outside the range 614±814, then there is a fault and further investigation is required.

Otherwise store the value as described below.

11. Press [F6]; Go to, and select:- "Trim Other";

12. Go to, and select:- "DAC Reference"; Enter the final DAC data value from step10.

13. Press {shift}+[F4].

14. Go to, and select:- "Set DAC Data".

15. Enter:- (value stored in step12) - 200.

16. Press [F4].

17. Go to, and select:- View ADC lines.

18. Read value for ADIN1 ("BAT VOLT").

19. If ["BAT VOLT HIGH" (from Voltage Calibration, step5) - value read above], is inside the range 255-171, then go to

step20 (below) to store value. Otherwise there is a fault and further investigation is required.

20. Press [N] (in repeat yes/no box), then [enter]. Press [F6]; Highlight and select "Trim Other".

21. Highlight and select "DAC Step".

22. Enter value obtained in step19.

23. Press {shift}+[F4].

24. Select: "Set DAC Data".

25. Re-enter original value from step10 (i.e. present value +200).

26. Press [F4].

27. Highlight, and select:- "View ADC Lines".

28. Read ADIN5 (CRG CURRENT) value and record it as "Total current".

29. On the BCVCU, set the 82Ohm switch to OFF.

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30. Press [Y], [enter] to read ADC value again, and record it as "Phone current".

31. Calculate the Charge current ("Total current" - "Phone current"). If this outside the range 37 and 49, then there is a fault

and further investigation is required. Otherwise, calculate the offset thus:- "Charging current" - 43.

32. Press [N] (in repeat yes/no box), then [enter]. Press [F6]

33. Go to, and select:- "TRIM other".

34. Go to, and select:- "Complete offset". Enter the offset value calculated in step31.

35. Press [F9], wait for the prompt “Saving EV Trim Data” to disappear, turn OFF power supplies and remove the telephone.

6.6 Lock Code

NOTE: See Section 6.2.1 for a list of the equipment and setup procedures required to perform the following adjustment

and calibration procedures. To perform the following procedures the UUT must be placed into Test Mode.

6.6.1 Check current lock code

1. At the Channel box press F4 and highlight VIEW LOCK CONDITION. Press ENTER.

Figure 6.34: View lock code 1

2. The display will show the current lock status and lock code for the Unit Under Test.

Figure 6.35: View lock code 2

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Page 60

TEST AND MEASUREMENT

6.6.2 Change current lock code

1. At the Channel box press SHIFT and F4 and highlight PROG LOCK CONDITION. Press ENTER.

2. Press ENTER to unlock the Unit Under Test. The current lock code will be used.

Figure 6.36: Change program lock code

3. Enter “0000” to reset and lock the Unit Under Test to the factory default lock code “0000”.

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7 CIRCUIT DIAGRAMS

7.1 Main PCB: Top Level Diagram

CIRCUIT DIAGRAMS

BASEBAND

(Figure 7.2)

(Figure 7.3)

10164-1

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CIRCUIT DIAGRAMS

7.2 Main PCB: Baseband Overview

PSU

(Figure 7.4)

PROCESSOR

Figure 7.5

AUDIO

(Figure 7.6)

10165-1

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7.3 Main PCB: RF Overview

CIRCUIT DIAGRAMS

PSU &

SYNTHESIZER

(Figure 7.9)

RECEIVER &

Tx MODULATOR

(Figure 7.7)

TRANSMITTER

(Figure 7.8)

10166-1

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CIRCUIT DIAGRAMS

7.4 Main PCB: PSU

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7.5 Main PCB: Processor

CIRCUIT DIAGRAMS

MCUK991001C8 Section 7 Issue 1 Service Manual – 59 – Revision 0

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CIRCUIT DIAGRAMS

7.6 Main PCB: Audio

SEE NOTES

GD50 BUILD ONLY

FOR GD50 BUILD:

1. R601: CHANGE OF VALUE.

2. CAPACITOR C601 FITTED INSTEAD OF R608.

3. CAPACITOR C602 FITTED INSTEAD OF R609.

4. COMPONENTS SHOWN WITHIN BOX AREA (LEFT) ARE FITT

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7.7 Main PCB: Receiver and Tx Modulator

CIRCUIT DIAGRAMS

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CIRCUIT DIAGRAMS

7.8 Main PCB: Transmitter

N/F

N/F = NOT FITTED

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7.9 Main PCB: PSU and Synthesizer

CIRCUIT DIAGRAMS

MCUK991001C8 Section 7 Issue 1 Service Manual – 63 – Revision 0

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CIRCUIT DIAGRAMS

7.10Keypad PCB

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8 LAYOUT DIAGRAMS

N/F

8.1 Main PCB

LAYOUT DIAGRAMS

FED

N/F

1 2 3 4

10171-1

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LAYOUT DIAGRAMS

8.2 Keypad PCB

FEDCBA

1 2 3 4

10172-1

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Page 73

9 REPLACEMENT PARTS LIST

9.1 Case Parts and Sub-Assemblies

9.1.1 GD30 Case Parts

Figure 9.1: GD30 Case Parts

Ref Part Number Description

M103 2EA551AA LCD PANEL, STD

PANASONIC M106 2BA517BAAA KEYPAD M108 6RA507A CAP M109 G5MDS002C PATENT LABEL M114 4GA545A ANTENNA NUT M115 4GA543A ANTENNA TERMINAL M116

M117 M118 M119

M122 2AA502A BATTERY HOOK M123 4N70042A BATTERY SPRING M127 2RA506AACA RECEIVER RETAINER 002 HH76009A RECEIVER 005 9ZA652A MICROPHONE ASSEMBLY 012 AN76031A ANTENNA 013 BD76013A VIBRATE MOTOR ASSEMBLY

3Z70054B

" " "

SCREW, M1.6 x 6mm

"" "" ""

Ref Part Number Description

GD30CVR01B

GD30CVR01K

GD30CVR01S

consists of: M101 1GA532AA** GD30 COVER, COLOURED M104 6HA623A RECEIVER CUSHION M105 2QA543A INDICATOR M110 6HA617A LCD CUSHION

B GD30CAS01 Case Assembly (Service)

consists of: M102 1HA519B GD30/GD50 CASE BACK M126 6HA661A BUZZER CUSHION M129 6HA567A CUSHION (EXT. ANT. CONN.)

GD30 Cover (Service) Blue GD30 Cover (Service) Black GD30 Cover (Service) Silver

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REPLACEMENT PARTS LIST

9.1.2 GD50 Case Parts

Figure 9.2: GD50 Case Parts

Ref Part Number Description

M103 2EA563AA LCD PANEL, STD

PANASONIC M106 2BA518AA KEYPAD M108 6RA507A CAP M109 G5MDS002C PATENT LABEL M114 4GA545A ANTENNA NUT M115 4GA543A ANTENNA TERMINAL M116

M117 M118 M119

M122 2AA502A BATTERY HOOK M123 4N70042A BATTERY SPRING M127 2RA516B RECEIVER RETAINER 002 HH76002A RECEIVER 005 9ZA652A MICROPHONE ASSEMBLY 012 AN76031A ANTENNA 013 BD76013A VIBRATE MOTOR ASSEMBLY

6FA513A

" " "

SCREW, M1.6 x 6mm

"" "" ""

Ref Part Number Description

GD50CVR01B GD50CVR01K

GD50CVR01N GD50CVR01Y

consists of: M101 1GA539AA** GD50 COVER, COLOURED M104 6HA654A RECEIVER CUSHION M105 2QA555A INDICATOR M110 6HA617A LCD CUSHION

B GD30CAS01 Case Assembly (Service)

consists of: M102 1HA519B GD30/GD50 CASE BACK M126 6HA622A BUZZER CUSHION M129 6HA567A CUSHION (EXT. ANT. CONN.)

GD50 Cover (Service) Blue GD50 Cover (Service) Black GD50 Cover (Service) Green GD50 Cover (Service) Grey

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9.1.3 GD30 and GD50 Sub-Assemblies

Figure 9.3: GD30/GD50 Sub-Assemblies

Ref Part Number Description

M113 2FA525A CHASSIS M120

M121

001 EB-QB03D30UK LCD MODULE

includes: 006

007

3Z70054B (GD30) 6FA513A (GD50)

A GD30KPCB01 Keypad PCB Assembly

K1MZ14A00001 LCD CONNECTOR

SCREW M1.6 x 6mm

Ref Part Number Description

B (see Sect. 7.2.2) Main PCB Assembly

includes: 003 HB76004B BUZZER 004 JS8A00005 SIM HOLDER 010 JA76020B I/O CONNECTOR 011 PY76011B RF CONNECTOR 014 PY76018A MAIN PCB-TO-KEYBOARD

PCB CONNECTOR 015 JJ76002A BATTERY CONTACT 016 018 ML616S BACKUP BATTERY 019 K3ZZ00200009 HOLDER, BACKUP BATTERY

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Issue 1 Section MCUK991001C8

Revision 0 – 70 – Service Manual

9.2 Printed Circuit Boards (PCBs)

9.2.2 Main PCB: Common Items

REPLACEMENT PARTS LIST

9.2.1 Main PCB: Variants

Model: EB-GD30 & EB-GD50 Name: Main PCB (Variants)

Ref.

003 GD30BRD001 GD50BRD001 MAIN PCB STANDARD PROGRAM 003 GD30BRD002 GD50BRD002 MAIN PCB BINARING PROGRAM 003 GD30BRD003 GD50BRD003 MAIN PCB CELCOM PROGRAM 003 GD30BRD004 GD50BRD004 MAIN PCB AIRTEL PROGRAM 003 GD30BRD005 GD50BRD005 MAIN PCB EUROTEL PROGRAM

003 GD30BRD006 GD50BRD006 MAIN PCB MOVISTAR PROGRAM 003 GD30BRD007 GD50BRD007 MAIN PCB S.F.R PROGRAM 003 GD30BRD008 GD50BRD008 MAIN PCB WESTEL PROGRAM 003 GD30BRD009 GD50BRD009 MAIN PCB HUTCHISON PROGRAM 003 GD30BRD010 GD50BRD010 MAIN PCB PLUS GSM PROGRAM

003 GD30BRD011 GD50BRD011 MAIN PCB TURKCELL PROGRAM 003 GD30BRD012 GD50BRD012 MAIN PCB FRANCETEL PROGRAM 003 GD30BRD013 GD50BRD013 MAIN PCB FT FTMS PROGRAM 003 GD30BRD014 GD50BRD014 MAIN PCB TELESTET PROGRAM 003 GD30BRD015 GD50BRD015 MAIN PCB ACTIVA PROGRAM

003 GD30BRD016 GD50BRD016 MAIN PCB TMN PROGRAM 003 GD30BRD017 GD50BRD017 MAIN PCB PANNON PROGRAM 003 GD30BRD018 GD50BRD018 MAIN PCB VODACOM PROGRAM 003 GD30BRD019 GD50BRD019 MAIN PCB NETCOM PROGRAM 003 GD30BRD020 GD50BRD020 MAIN PCB K.P.N PROGRAM

003 GD30BRD021 GD50BRD021 MAIN PCB MOBILCOM PROGRAM 003 GD30BRD022 GD50BRD022 MAIN PCB TELSTRA PROGRAM 003 GD30BRD023 GD50BRD023 MAIN PCB E.R.A PROGRAM 003 GD30BRD024 GD50BRD024 MAIN PCB PAYT VODAFONE PROGRAM 003 GD30BRD025 GD50BRD025 MAIN PCB CHINESE ENABLED PROGRAM

GD30 GD50

Part Number

Description

Model: EB-GD30 & EB-GD50 Name: Main PCB (Common Items) Ref. Part Number Description Grid

C101 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F2 C102 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2 C103 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F2 C104 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD E2 C105 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F2

C106 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD F2 C107 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD F1 C108 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2 C109 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2 C110 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E2

C111 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2 C112 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD F1 C113 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F2 C114 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F2 C115 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F1

C116 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 F1 C117 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 F2 C118 ECUE1H331KBQ CAP CER 330pF 10% 50V X7R SMD C119 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E2 C120 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E2

C122 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD E2 C123 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 C2 C124 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 C2 C125 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 C2 C127 ECUE1H040CCQ CAP CER 4pF +/-0.25pF 50V NP0 C2

C128 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 D4 C129 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C130 ECUE1H030CCQ CAP CER 3pF +/-0.25pF 50V NP0 D4 C131 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 C4 C132 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 C4

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Model: EB-GD30 & EB-GD50 Name: Main PCB (Common Items) Ref. Part Number Description Grid

C133 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 C4 C135 ECUE1E271KBQ CAP CER 270pF 10% 25V X7R SMD C4 C136 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 C137 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 D2 C138 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 D2

C139 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 D2 C140 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 C4 C141 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 D4 C142 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 C401 ECJ1VB1C104K CAP CER 100nF 10% 16V X7R SMD D1

C402 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD D1 C403 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 E2 C404 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD D1 C405 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD D1 C407 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 D1

C408 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD D1 C409 F3E0J1060006 CAP TANT 10uF 20% 6.3V SMD CAS B3 C410 F3E0J1060006 CAP TANT 10uF 20% 6.3V SMD CAS B3 C411 F3F1A1060002 CAP TANT 10uF 20% 10V SMD CASE E1 C412 YTAJB336M006 CAP TANT 33uF 20% 6V3 SMD CASE E1

C413 YTAJB336M006 CAP TANT 33uF 20% 6V3 SMD CASE E1 C414 ECST1CZ474R CAP TANT 0.47uF 20% 16V SMD CA E1 C415 F3E0J1060006 CAP TANT 10uF 20% 6.3V SMD CAS E1 C416 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F1 C417 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD F1

C508 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD B4 C509 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD C4 C510 F3E0J1060006 CAP TANT 10uF 20% 6.3V SMD CAS C3 C511 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD C3 C512 F3E0J1060006 CAP TANT 10uF 20% 6.3V SMD CAS B4

C513 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD B4 C514 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD C3 C515 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C516 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C517 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2

C518 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD E2 C519 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C520 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C521 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E1 C522 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD D2

C523 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E1 C524 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C525 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C526 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E2 C527 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD B3

C528 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E1 C529 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD B4 C530 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD C3 C531 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD C3 C532 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD

REPLACEMENT PARTS LIST

C501 ECJ1VB1C104K CAP CER 100nF 10% 16V X7R SMD E1 C502 ECJ1VB1C104K CAP CER 100nF 10% 16V X7R SMD F1 C503 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E2 C505 ECST1CZ474R CAP TANT 0.47uF 20% 16V SMD CA E2 C506 F3F1A1060002 CAP TANT 10uF 20% 10V SMD CASE F1

C507 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD E1

C533 ECJ1VB1C104K CAP CER 100nF 10% 16V X7R SMD F1 C603 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C2 C604 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C2 C605 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C2 C606 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C2

C607 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C2

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Model: EB-GD30 & EB-GD50 Name: Main PCB (Common Items) Ref. Part Number Description Grid

REPLACEMENT PARTS LIST

C608 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C2 C618 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS F2 C619 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD F2 C620 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C621 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 A4

C622 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E2 C623 YCCIX024K333 CAP CER 33nF 10% 10V X5R SMD 1 E2 C624 YCCIX024K333 CAP CER 33nF 10% 10V X5R SMD 1 E2 C625 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2 C626 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2

C627 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F2 C628 YCCIX027K223 CAP CER 22nF 10% 16V X7R SMD 1 F2 C700 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C701 ECUE1H391KBQ CAP CER 390pF 10% 50V X7R SMD B1 C702 ECUE1H471KBQ CAP CER 470pF 10% 50V X7R SMD E3

C703 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C704 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C705 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C706 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 B1 C707 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 E3

C708 ECUE1H010CCQ CAP CER 1pF +/-0.25pF 50V NP0 E3 C709 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B1 C710 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 B1 C711 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B1 C712 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 B1

C723 ECUE1H040CCQ CAP CER 4pF +/-0.25pF 50V NP0 E3 C724 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 A1 C725 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B1 C728 ECUE1H0R5CCQ CAP CER 0.5pF +/-0.25pF 50V NP B1 C729 ECUE1H030CCQ CAP CER 3pF +/-0.25pF 50V NP0 B1

C733 ECUE1H080DCQ CAP CER 8pF +/-0.5pF 50V NP0 S B1 C734 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 B1 C735 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C736 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 F3 C737 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 F3

C738 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 B1 C739 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 B1 C740 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C743 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 B1 C744 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1

C745 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 B1 C748 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 B1 C749 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 E4 C750 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F3 C751 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 E4

C752 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 A1 C753 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD B2 C754 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B1 C755 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 B1 C760 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F3

C715 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 B1 C716 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 B1 C717 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B1 C718 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B1 C721 ECUE1H010CCQ CAP CER 1pF +/-0.25pF 50V NP0 B1

C722 ECUE1H040CCQ CAP CER 4pF +/-0.25pF 50V NP0 E3

C761 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 A1 C762 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 A1 C763 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F3 C764 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B2 C766 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 F3

C767 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 A1

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Model: EB-GD30 & EB-GD50 Name: Main PCB (Common Items) Ref. Part Number Description Grid

C768 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD E4 C769 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 E4 C770 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E4 C771 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 A1 C772 ECUE1H390JCQ CAP CER 39pF 5% 50V NP0 SMD 10 B2

C773 ECUE1H181JCQ CAP CER 180pF 5% 50V X7R SMD 1 B2 C774 ECUE1H181JCQ CAP CER 180pF 5% 50V X7R SMD 1 B2 C775 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 B2 C778 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B2 C779 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E4

C780 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E4 C781 ECUE1H471KBQ CAP CER 470pF 10% 50V X7R SMD B1 C782 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 E3 C783 ECJ1VB1E273K CAP CER 27nF 10% 25V X7R SMD 1 B2 C784 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 E3

C785 ECUE1H010CCQ CAP CER 1pF +/-0.25pF 50V NP0 B1 C786 ECUE1H471KBQ CAP CER 470pF 10% 50V X7R SMD E3 C787 ECUE1H090DCQ CAP CER 9pF +/-0.5pF 50V NP0 S B1 C788 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD E4 C789 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 E4

C801 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 F4 C802 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 F4 C803 ECUE1H151JCQ CAP CER 150pF 5% 50V NP0 SMD 1 F3 C804 ECUE1H151JCQ CAP CER 150pF 5% 50V NP0 SMD 1 F4 C805 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 F3

C815 F3F1A1060002 CAP TANT 10uF 20% 10V SMD CASE B2 C816 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 A1 C820 F3F1A1060002 CAP TANT 10uF 20% 10V SMD CASE A1 C821 ECUE1H120JCQ CAP CER 12pF 5% 50V NP0 SMD 10 A1 C822 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 A2

C823 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 A2 C824 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E4 C825 ECUE1H030CCQ CAP CER 3pF +/-0.25pF 50V NP0 B2 C826 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B2 C827 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 E4

C832 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 E4 C833 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 E4 C834 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F3 C835 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 B2 C900 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1

C901 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS C2 C902 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C903 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C904 F3F1C475A004 CAP TANT 4.7uF 20% 16V SMD CAS C2 C906 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1

C907 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 C1 C908 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 B2 C909 ECUE1H030CCQ CAP CER 3pF +/-0.25pF 50V NP0 C1 C910 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 C1 C911 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS C1

REPLACEMENT PARTS LIST

C806 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 F3 C807 ECUE1H2R7CCQ CAP CER 2.7pF +/-0.25pF 50V NP F3 C808 ECUE1H030CCQ CAP CER 3pF +/-0.25pF 50V NP0 F3 C809 ECUE1H820JCQ CAP CER 82pF 5% 50V NP0 SMD 10 F4 C811 ECUE1H820JCQ CAP CER 82pF 5% 50V NP0 SMD 10 F4

C814 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B2

C912 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B1 C913 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1 C914 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 C1 C915 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1 C916 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1

C917 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 C1

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REPLACEMENT PARTS LIST

C918 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 C1 C919 F3F1C475A004 CAP TANT 4.7uF 20% 16V SMD CAS C1 C920 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 D4 C921 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS C1 C922 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 C1

C923 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 C1 C924 F3F1C475A004 CAP TANT 4.7uF 20% 16V SMD CAS C1 C925 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1 C926 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1 C928 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 D4

C929 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C2 C930 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS D4 C931 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD D4 C932 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C933 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 D4

C934 ECUE1H030CCQ CAP CER 3pF +/-0.25pF 50V NP0 D4 C935 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 B2 C936 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS B2 C937 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B2 C938 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 B2

C939 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 B2 C940 F3F1C475A004 CAP TANT 4.7uF 20% 16V SMD CAS B2 C941 ECUE1C103KBQ CAP CER 10nF 10% 16V X7R SMD 1 B2 C942 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 B2 C944 ECUE1H121JCQ CAP CER 120pF 5% 50V NP0 SMD 1 D4

C951 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 C2 C952 ECJ1VB1H103K CAP CER 10nF 10% 50V X7R SMD 1 C2 C953 F1H1C4730003 CAP CER 47nF 10% 16V X7R SMD 1 C2 C954 ECUE1H221JCQ CAP CER 220pF 5% 50V NP0 SMD 1 C2 C955 ECUE1H391KBQ CAP CER 390pF 10% 50V X7R SMD C2

C956 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 C2 C957 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS C2 C959 F1G1A104A012 CAP CER 100nF 10% 10V X5R SMD C2 C960 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS C2 C961 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C2

C962 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1 C964 ECHU1C333JB5 CAP FILM 33nF 5% 16V SMD 3216 C2 C965 ECUE1H681KBQ CAP CER 680pF 10% 50V X7R SMD C2 C966 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 F4 C967 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 F4

C968 ECUE1H101JCQ CAP CER 100pF 5% 50V NP0 SMD 1 F4 C969 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E4 C970 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E3 C971 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 C1 C972 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 E3

C973 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 D4 C974 ECUE1H060DCQ CAP CER 6pF +/-0.5pF 50V NP0 S E4 C975 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C976 ECUE1H020CCQ CAP CER 2pF +/-0.25pF 50V NP0 C1 C977 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 D4

C945 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C946 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C947 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D4 C948 ECUE1C682KBQ CAP CER 6.8nF 10% 16V X7R SMD C2 C949 ECUE1H121JCQ CAP CER 120pF 5% 50V NP0 SMD 1 C2

C950 ECUE1E332KBQ CAP CER 3.3nF 10% 25V X7R SMD C2

C978 ECUE1H120JCQ CAP CER 12pF 5% 50V NP0 SMD 10 E3 C979 ECUE1H102KBQ CAP CER 1nF 10% 50V X7R SMD 10 E3 C980 ECUE1H120JCQ CAP CER 12pF 5% 50V NP0 SMD 10 E3

D101 B0KB00000010 SUPPRESSOR ESD 4 ELEMENTS SMD A3 D102 B0KB00000010 SUPPRESSOR ESD 4 ELEMENTS SMD A4 D103 B0KB00000010 SUPPRESSOR ESD 4 ELEMENTS SMD A3

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D104 B0KB00000010 SUPPRESSOR ESD 4 ELEMENTS SMD A3 D105 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 F2 D106 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 F1 D107 B0KB00000010 SUPPRESSOR ESD 4 ELEMENTS SMD F2 D108 MA2Z07700L DIODE MA77 100mA SMD S-MINI 2 C4

D401 B0ADEJ000010 DIODE ARRAY QUAD SW SMD UMD6 F1 D402 MA2S111TX DIODE MA2S111 80V 100mA SMD SS F1 D403 MA2S111TX DIODE MA2S111 80V 100mA SMD SS F1 D404 B0JCMC000004 DIODE SHOTTKY 20V 1A SMD SC-59 E1 D405 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 D1

D406 MA2S111TX DIODE MA2S111 80V 100mA SMD SS F1 D501 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 F1 D502 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 B4 D503 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 B4 D504 B0JCDD000001 DIODE RB521S-30 SCHOTTKY 30V 2 B4

D601 MAZS0470GL DIODE MAZS0470G ZENER 4.7V SMD A4 D602 MAZS0470GL DIODE MAZS0470G ZENER 4.7V SMD A4 D900 MA2S111TX DIODE MA2S111 80V 100mA SMD SS C1 D901 MAZS0620ML DIODE ZENER 6V2 SMD SS-MINI 2P D4 D902 MAZS0620ML DIODE ZENER 6V2 SMD SS-MINI 2P E3

D903 MAZS0620ML DIODE ZENER 6V2 SMD SS-MINI 2P D3

E800 B9Z000000019 COUPLER 1.747GHz SMD 2012 6PIN A1 E801 B9Z000000018 COUPLER 897.5 MHz SMD 2012 6PI A1

FL700 EFCH225MDQP1 FILTER IF SAW 225MHz SMD 7.2x5 E3 FL701 J0E1417B0001 FILTER LC 1412.5MHz SMD 2012 C1 FL702 EFCH9418MTY2 FILTER SAW RX GSM/PCN SMD 3.8x A1 FL703 EFCH9418MTY2 FILTER SAW RX GSM/PCN SMD 3.8x B1

J100 JA76020B CONNECTOR SKT I/O 18 WAY SMD F1 J101 K3ZZ00200009 HOLDER FOR BATTERY CELL D4 J900 JJ76002A CONNECTOR BATTERY 2 WAY SMD E3 J901 JJ76002A CONNECTOR BATTERY 2 WAY SMD E4

L101 G1CR47J00006 INDUCTOR 470nH 5% SMD 2012 C4 L102 G1CR47J00006 INDUCTOR 470nH 5% SMD 2012 C4 L103 G1C82NJ00010 INDUCTOR 82nH 5% SMD 1005 C4 L104 G1C10NJ00008 INDUCTOR 10nH 5% SMD 1005 C4 L106 ELJRF47NJF2 INDUCTOR 47nH 5% SMD 1005 C4

L501 G1A101C00002 INDUCTOR 100uH 30% 1.73 OHM 0. E1 L601 G1C82NJ00008 INDUCTOR 82nH 5% SMD 1608 D2 L602 G1C82NJ00008 INDUCTOR 82nH 5% SMD 1608 D2 L700 G1CR10J00010 INDUCTOR 100nH 5% SMD 1005 B2 L701 G1CR10J00010 INDUCTOR 100nH 5% SMD 1005 B1

L702 G1CR12J00003 INDUCTOR 120nH 5% SMD 1608 E3 L703 G1C82NJ00009 INDUCTOR 82nH 5% SMD 1608 E3 L704 ELJRF18NJF2 INDUCTOR 18nH 5% SMD 1005 B2 L705 G1C4N7Z00004 INDUCTOR 4.7nH +/-0.3nH SMD 10 B1 L706 G1C2N7Z00007 INDUCTOR 2.7nH +/-0.3nH SMD 10 B2

L709 G1C68NJ00007 INDUCTOR 68nH 5% SMD 1608 E3 L711 ELJRF12NJF2 INDUCTOR 12nH 5% SMD 1005 B1 L713 G1CR10J00010 INDUCTOR 100nH 5% SMD 1005 E3 L715 ELJRF33NJF2 INDUCTOR 33nH 5% SMD 1005 B1 L716 ELJRF12NJF2 INDUCTOR 12nH 5% SMD 1005 B1

L717 ELJRF22NJF2 INDUCTOR 22nH 5% SMD 1005 B1 L718 ELJRF12NJF2 INDUCTOR 12nH 5% SMD 1005 B1 L720 G1C10NJ00008 INDUCTOR 10nH 5% SMD 1005 A1 L721 G1CR22J00006 INDUCTOR 220nH 5% SMD 1608 B2 L722 ELJRF18NJF2 INDUCTOR 18nH 5% SMD 1005 A1

L723 ELJRF39NJF2 INDUCTOR 39nH 5% SMD 1005 B2 L724 ELJRF39NJF2 INDUCTOR 39nH 5% SMD 1005 B2 L725 ELJRF18NJF2 INDUCTOR 18nH 5% SMD 1005 B1 L726 ELJRF6N8JF2 INDUCTOR 6.8nH 5% SMD 1005 B2 L727 ELJRF8N2JF2 INDUCTOR 8.2nH 5% SMD 1005 B2

L729 ELJRF2N2DF2 INDUCTOR 2.2nH +/-0.3nH SMD 10 A1

REPLACEMENT PARTS LIST

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Model: EB-GD30 & EB-GD50 Name: Main PCB (Common Items) Ref. Part Number Description Grid

REPLACEMENT PARTS LIST

L730 ELJRF8N2JF2 INDUCTOR 8.2nH 5% SMD 1005 E4 L731 ELJRF18NJF2 INDUCTOR 18nH 5% SMD 1005 F3 L732 G1C5N6Z00005 INDUCTOR 5.6nH +/-0.3nH SMD 10 F3 L733 ELJRF18NJF2 INDUCTOR 18nH 5% SMD 1005 B2 L734 ELJRF18NJF2 INDUCTOR 18nH 5% SMD 1005 B1

L800 G1C4N7Z00004 INDUCTOR 4.7nH +/-0.3nH SMD 10 F3 L801 G1C15NJ00008 INDUCTOR 15nH 5% SMD 1005 F3 L804 G1C5N6Z00005 INDUCTOR 5.6nH +/-0.3nH SMD 10 E4 L807 ELJRF22NJF2 INDUCTOR 22nH 5% SMD 1005 E4 L808 G1C15NJ00008 INDUCTOR 15nH 5% SMD 1005 B2

L809 G1C15NJ00008 INDUCTOR 15nH 5% SMD 1005 B2 L900 ELJRF6N8JF2 INDUCTOR 6.8nH 5% SMD 1005 C2 L901 ELJRF8N2JF2 INDUCTOR 8.2nH 5% SMD 1005 C2 L902 ELJRF22NJF2 INDUCTOR 22nH 5% SMD 1005 D4

LS900 HB76004B BUZZER GD90 F4

P100 PY76018A CONNECTOR BOARD TO BOARD 2x16 D1

Q101 B1GFCFEM0001 TRANSISTOR UMH10TN DUAL NPN WI F2 Q102 B1ABCB000024 TRANSISTOR 2SC4226 NPN SMD SOT C2 Q401 2SD2216TX TRANSISTOR 2SD2216TX NPN SMD S E1 Q402 B1DHCC000012 TRANSISTOR SI3441DV MOSFET -20 E1 Q403 B1GKGFBJ0001 TRANSISTOR IMD14 DUAL SMD SMT6 C1

Q900 2SD1511RSTX TRANSISTOR 2SD1511RSTX NPN HFE C1 Q901 B1GKCFNE0001 TRANSISTOR RN4905 DUAL NPN PNP

R101 ERJ2GEJ102X RES 1K OHM 5% 1/16W SMD 1005 F2 R102 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 F2 R103 ERJ2GEJ331X RES 330 OHM 5% 1/16W SMD 1005 F2 R104 EXB24V331JX RES NETWORK 330 OHMx2 5% 1/16W F2 R105 EXB24V331JX RES NETWORK 330 OHMx2 5% 1/16W F1

R106 ERJ2GEJ332X RES 3.3K OHM 5% 1/16W SMD 1005 F2 R107 ERJ3GEYF104V RES 100K OHM 1% 1/16W SMD 1608 F1 R108 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 E1 R109 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 F2 R110 ERJ2GEJ331X RES 330 OHM 5% 1/16W SMD 1005 F2

R111 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 R112 ERJ2GEJ472X RES 4.7K OHM 5% 1/16W SMD 1005 E1 R113 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 A4 R114 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 B2 R115 ERJ2GEJ472X RES 4.7K OHM 5% 1/16W SMD 1005 D2

R116 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 C4 R117 ERJ2GEJ101X RES 100 OHM 5% 1/16W SMD 1005 C4 R118 ERJ2GEJ682X RES 6.8K OHM 5% 1/16W SMD 1005 C4 R119 ERJ2GEJ221X RES 220 OHM 5% 1/16W SMD 1005 D2 R120 ERJ2GEJ681X RES 680 OHM 5% 1/16W SMD 1005 D2

Q404 B1GKGFBJ0001 TRANSISTOR IMD14 DUAL SMD SMT6 C1 Q405 B1CFJC000001 TRANSISTOR FDG6301N DUAL N-CH E1 Q406 B1ADPC000003 TRANSISTOR 2SB1424T100R PNP SM E1 Q501 B1GKCFLL0006 TRANSISTOR UMD2N DUAL SMD UMT6 F2 Q700 B1GKCFNE0001 TRANSISTOR RN4905 DUAL NPN PNP B1

Q701 B1GKCFNE0001 TRANSISTOR RN4905 DUAL NPN PNP B2 Q702 B1GKCFLL0006 TRANSISTOR UMD2N DUAL SMD UMT6 F3 Q703 B1GFCFEM0001 TRANSISTOR UMH10TN DUAL NPN WI Q800 B1GKCFNE0001 TRANSISTOR RN4905 DUAL NPN PNP E4 Q801 XP0431200L TRANSISTOR XP4312 DUAL NPN PNP A2

R121 ERJ2GEJ223X RES 22K OHM 5% 1/16W SMD 1005 C2 R122 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 C4 R123 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D4 R124 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D4 R125 EXB24V331JX RES NETWORK 330 OHMx2 5% 1/16W F2

R126 EXB24V331JX RES NETWORK 330 OHMx2 5% 1/16W F1 R401 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 D1 R403 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 B3 R404 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 F1

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R405 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 E1 R406 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 D1 R407 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 D1 R408 ERJ2GEJ473X RES 47K OHM 5% 1/16W SMD 1005 E1 R409 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 E1

R410 ERJ2GEJ123X RES 12K OHM 5% 1/16W SMD 1005 E1 R411 D1BDR1500001 RESISTOR 0.15 OHM 1% 1/4W SMD D1 R412 ERJ6GEYJ330V RES 33 OHM 5% 1/10W SMD 2012 D1 R413 ERJ2GEJ153X RES 15K OHM 5% 1/16W SMD 1005 D1 R414 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D1

R415 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D1 R416 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D1 R417 ERJ6GEYJ270V RES 27 OHM 5% 1/10W SMD 2012 C1 R418 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D1 R419 ERJ6GEYJ560V RES 56 OHM 5% 1/10W SMD 2012 C1

R420 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 E1 R421 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 E1 R502 ERJ2GEJ470X RES 47 OHM 5% 1/16W SMD 1005 E1 R503 ERJ2GEJ222X RES 2.2K OHM 5% 1/16W SMD 1005 B4 R504 ERJ2GEJ472X RES 4.7K OHM 5% 1/16W SMD 1005 B4

R505 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 B4 R506 ERJ2GEJ223X RES 22K OHM 5% 1/16W SMD 1005 B4 R507 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 E1 R508 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 E2 R510 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 C3

R607 EXB24V331JX RES NETWORK 330 OHMx2 5% 1/16W F2 R701 ERJ2GEJ393X RES 39K OHM 5% 1/16W SMD 1005 B1 R702 ERJ2GEJ392X RES 3.9K OHM 5% 1/16W SMD 1005 B1 R703 ERJ2GEJ510X RES 51 OHM 5% 1/16W SMD 1005 B1 R705 ERJ2GEJ392X RES 3.9K OHM 5% 1/16W SMD 1005 B1

R706 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 B2 R707 ERJ2GEJ100X RES 10 OHM 5% 1/16W SMD 1005 B2 R708 ERJ2GEF223X RES 22K OHM 1% 1/16W SMD 1005 B2 R709 ERJ2GEJ4R7X RES 4.7 OHM 5% 1/16W SMD 1005 E4 R710 ERJ2GEF682X RES 6.8K OHM 1% 1/16W SMD 1005 B2

R711 ERJ2GEF682X RES 6.8K OHM 1% 1/16W SMD 1005 B2 R712 ERJ2GEF222X RES 2.2K OHM 1% 1/16W SMD 1005 B2 R713 ERJ2GEF222X RES 2.2K OHM 1% 1/16W SMD 1005 B2 R714 ERJ2GEF222X RES 2.2K OHM 1% 1/16W SMD 1005 B2 R715 ERJ2GEF222X RES 2.2K OHM 1% 1/16W SMD 1005 B2

R716 ERJ2GEJ391X RES 390 OHM 5% 1/16W SMD 1005 E4 R719 ERJ2GEJ100X RES 10 OHM 5% 1/16W SMD 1005 E3 R720 ERJ2GEJ471X RES 470 OHM 5% 1/16W SMD 1005 E3 R723 ERJ2GEJ470X RES 47 OHM 5% 1/16W SMD 1005 B2 R724 ERJ2GEJ122X RES 1.2K OHM 5% 1/16W SMD 1005 F3

R725 ERJ2GEJ122X RES 1.2K OHM 5% 1/16W SMD 1005 F3 R726 ERJ2GEJ122X RES 1.2K OHM 5% 1/16W SMD 1005 F3 R727 ERJ2GEJ122X RES 1.2K OHM 5% 1/16W SMD 1005 F3 R800 ERJ2GEJ820X RES 82 OHM 5% 1/16W SMD 1005 A1 R801 ERJ2GEJ101X RES 100 OHM 5% 1/16W SMD 1005 A1

REPLACEMENT PARTS LIST

R511 ERJ2GEJ102X RES 1K OHM 5% 1/16W SMD 1005 E1 R512 ERJ2GEJ102X RES 1K OHM 5% 1/16W SMD 1005 B4 R513 ERJ2GEJ102X RES 1K OHM 5% 1/16W SMD 1005 E2 R604 ERJ2GEJ223X RES 22K OHM 5% 1/16W SMD 1005 D2 R605 EXB24V331JX RES NETWORK 330 OHMx2 5% 1/16W F2

R606 EXB24V122JX RES NETWORK 1.2K OHMx2 5% 1/16 F2

R802 ERJ2GEJ510X RES 51 OHM 5% 1/16W SMD 1005 A1 R803 ERJ2GEJ820X RES 82 OHM 5% 1/16W SMD 1005 A1 R804 ERJ2GEJ223X RES 22K OHM 5% 1/16W SMD 1005 F3 R805 ERJ2GEJ123X RES 12K OHM 5% 1/16W SMD 1005 F3 R806 ERJ2GEJ750X RES 75 OHM 5% 1/16W SMD 1005 A1

R807 ERJ2GEJ101X RES 100 OHM 5% 1/16W SMD 1005 A1

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Issue 1 Section MCUK991001C8

Revision 0 – 78 – Service Manual

Model: EB-GD30 & EB-GD50 Name: Main PCB (Common Items) Ref. Part Number Description Grid

REPLACEMENT PARTS LIST

R808 ERJ2GEJ510X RES 51 OHM 5% 1/16W SMD 1005 A1 R809 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 F4 R810 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 F4 R811 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 R812 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 B2

R813 ERJ2GEJ750X RES 75 OHM 5% 1/16W SMD 1005 A1 R814 ERJ2GEJ223X RES 22K OHM 5% 1/16W SMD 1005 F4 R816 ERJ2GEJ150X RES 15 OHM 5% 1/16W SMD 1005 B2 R817 ERJ2GEJ391X RES 390 OHM 5% 1/16W SMD 1005 B2 R818 ERJ2GEJ391X RES 390 OHM 5% 1/16W SMD 1005 B2

R822 ERJ2GEJ223X RES 22K OHM 5% 1/16W SMD 1005 A2 R824 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 B2 R825 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 B2 R900 ERJ2GEJ182X RES 1.8K OHM 5% 1/16W SMD 1005 C1 R902 ERJ2GEJ103X RES 10K OHM 5% 1/16W SMD 1005 D4

R903 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 D4 R904 ERJ2GEJ751X RES 750 OHM 5% 1/16W SMD 1005 C2 R905 ERJ2GEJ332X RES 3.3K OHM 5% 1/16W SMD 1005 C2 R906 ERJ2GEJ220X RES 22 OHM 5% 1/16W SMD 1005 B1 R908 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 C2

R909 ERJ2GEJ4R7X RES 4.7 OHM 5% 1/16W SMD 1005 C2 R910 ERJ2GEJ150X RES 15 OHM 5% 1/16W SMD 1005 C2 R912 ERJ2GEJ152X RES 1.5K OHM 5% 1/16W SMD 1005 C2 R913 ERJ2GEJ272X RES 2.7K OHM 5% 1/16W SMD 1005 B2 R914 ERJ2GE0R00X RES JUMPER 0 OHM 1A SMD 1005 B2

U101 TX76001A TCVCXO 13MHz SMD 7.0x5.0x1.7 4 D2 U401 UY76051A IC BA3891KV CHARGE ASIC SMD QF D1 U402 C0DBAFC00007 IC R1111N181B REG 1.8V SMD SOT B3 U403 C0DBFGG00001 IC R5102V001A-E2 REG WDT SMD S E1 U404 C0EBD0000030 IC S-80824ANNP-EDM-T2 VOL DET D4

U501 UY76046A IC BH6107KV INTERFACE ASIC SMD E1 U503 UY76102A IC F731741B GEMINI 0.18u SMD 0 B4 U504 C1CB00000746 IC TCM4400E BB/RF VEGA 3E 0.4m E2 U505 YRS5C348A IC RS5C348A REAL TIME CLOCK SM C4 U700 GN01073B01MC LNA DUAL GSM/DCS SMD 0.65mm PI B1

U701 C1CB00000803 IC HD155123FEB RF BRIGHT 2 GSM B1 U702 UY76044A VCO TX SMD 9.3x7.2x2.0 E3 U800 C1CB00000711 IC DUAL BAND APC TSSOP20 F4 U801 C5CB00000023 PA PF08103B-02-TB DUAL GSM/DCS A2 U802 C1CB00000794 IC MGA-81563-1HA MMIC AMP SMD E4

U900 C0DBAFC00004 IC R1111N281B REG 2.8V SMD SOT D4 U901 C0DBZFC00006 IC ADP3307ART REG 2.75V 100mA C1 U902 C0DBAFC00004 IC R1111N281B REG 2.8V SMD SOT C1 U903 C0DBZFC00006 IC ADP3307ART REG 2.75V 100mA B2 U904 C1CB00000795 IC MB15F03SLPFV1-G-BND-ER DUAL D4

U905 UY76084A VCO IF DUAL 520/540MHz SMD 5.3 C2 U906 UY76043A VCO RF SMD 9.3x7.2x2.0 C2 X100 K1ZZ00001018 SIMLOCK 12V 10uA 6 PIN SMD DEV A4 Y501 H0J327200022 CRYSTAL 32.768KHz SMD 7.0x1.5x B4

R915 ERJ2GEJ331X RES 330 OHM 5% 1/16W SMD 1005 E3 R916 ERJ2GEJ331X RES 330 OHM 5% 1/16W SMD 1005 D4 R918 ERJ2GEJ100X RES 10 OHM 5% 1/16W SMD 1005 D4

S700 PY76011B CONNECTOR RF COAXIAL F3 S701 SY76003A DIPLEXER ANTENNA SWITCH GSM/DS F3

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9.2.3 Main PCB: GD30-Specific Items

9.2.5 Keypad PCB

Model: EB-GD30 Name: Main PCB (GD30-Specific Items) Ref. Part Number Description Grid

R601 EXB24V180JX RES NETWORK 18 OHMx2 5% 1/16W SMD 1010 D2 R608 ERJ6GEY0R00V RES JUMPER 0 OHM 2A SMD 2012 E2 R609 ERJ6GEY0R00V RES JUMPER 0 OHM 2A SMD 2012 E2

9.2.4 Main PCB: GD50-Specific Items

Model: EB-GD50 Name: Main PCB (GD50-Specific Items) Ref. Part Number Description Grid

C601 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS E2 C602 ECST0JZ106R CAP TANT 10uF 20% 6.3V SMD CAS E2 C609 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD D2 C610 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D2 C611 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 D2

C612 ECUE1H222KBQ CAP CER 2.2nF 10% 50V X7R SMD D2 C613 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 D1 C614 F1H1A4740005 CAP CER 470nF 10% 10V X5R SMD D1 C615 ECUE1H330JCQ CAP CER 33pF 5% 50V NP0 SMD 10 D1 C616 F3F1A1060002 CAP TANT 10uF 20% 10V SMD CASE D2

Model: EB-GD30 & EB-DG50 Name: Keypad PCB Ref. Part Number Description Grid

C001 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 A4 C002 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C4 C003 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C4 C004 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C4 C005 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C4

C006 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C3 C007 ECUE1H470JCQ CAP CER 47pF 5% 50V NP0 SMD 10 C4 C008 ECUE1H220JCQ CAP CER 22pF 5% 50V NP0 SMD 10 C4 C009 F1H0J1050013 CAP CER 1uF 10% 6.3V X5R SMD 1 C4 C010 F1H0J1050013 CAP CER 1uF 10% 6.3V X5R SMD 1 C3

C011 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C3 C012 F1J1A1050011 CAP CER 1uF 10% 10V X5R SMD 20 C3 C013 F1J1C6840003 CAP CER 680nF 10% 16V X7R SMD C3 C014 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C4 C015 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C4

C016 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C4 C017 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3 C018 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C4 C019 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3 C020 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3

C617 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 D2

L603 G1C82NJ00008 INDUCTOR 82nH 5% SMD 1608 D2 R601 EXB24V120JX RES NETWORK 12 OHMx2 5% 1/16W D2 R602 ERJ2GEJ562X CHIP RESISTOR 5K6 OHM +/-5% 1/ D2 R603 ERJ2GEJ104X RES 100K OHM 5% 1/16W SMD 1005 D2 U601 C0ABAA000030 IC LM4871M AUDIO PA 1.1W SMD S D2

C021 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3 C022 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3 C023 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3 C024 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 C3 C025 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 A4

C026 ECUE1H100DCQ CAP CER 10pF +/-0.5pF 50V NP0 A4

CN001 K1MZ14A00001 CONNECTOR LCD 14 WAY SMD C3 CN002 K1MZ14A00001 CONNECTOR LCD 14 WAY SMD C4

D002 B0KB00000010 SUPPRESSOR ESD 4 ELEMENTS SMD A4

REPLACEMENT PARTS LIST

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Issue 1 Section MCUK991001C8

Revision 0 – 80 – Service Manual

Model: EB-GD30 & EB-DG50 Name: Keypad PCB Ref. Part Number Description Grid D003 MA2S111TX DIODE MA2S111 80V 100mA SMD SS C4

9.3 Refurbishment Kits

9.3.1 GD30

REPLACEMENT PARTS LIST

DS001 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V F4 DS002 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V F3 DS003 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V E4 DS004 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V E3 DS005 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V D4

DS006 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V D3 DS007 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V D4 DS008 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V D3 DS009 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V C4 DS010 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V C4

DS011 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V C3 DS012 B3ABB0000066 DIODE LED GREEN 16-28mcd 2.2V C3 DS013 CL155URGDT 2 COLOUR LED 5V 25mA 3.2Lx2.7W A3

R001 EXB24V121JX RES NETWORK 120 OHMx2 5% 1/16W C3 R002 EXB24V151JX RES NETWORK 150 OHMx2 5% 1/16W C4 R003 EXB24V151JX RES NETWORK 150 OHMx2 5% 1/16W C3 R004 D0GB151JA002 RES 150 OHM 5% 1/10W SMD 1608 C3 R005 D0GB151JA002 RES 150 OHM 5% 1/10W SMD 1608 C3

R006 ERJ3EKF3003V RES 300K OHM 1% 1/16W SMD 1608 C4 R007 ERJ6ENF1204V RES 1.2M OHM 1% 1/10W SMD 2012 C4 R008 EXB24V151JX RES NETWORK 150 OHMx2 5% 1/16W C4 R009 EXB24V151JX RES NETWORK 150 OHMx2 5% 1/16W C4 R010 EXB24V121JX RES NETWORK 120 OHMx2 5% 1/16W C4

SHIELD GD30MDS030B GD30 RECEIVER SHIELD

Model: EB-GD30 Name: Jigs and Tools Ref. Part Number Description Notes

9R3000B REFURBISHMENT KIT, BLUE 9R3000K REFURBISHMENT KIT, BLACK 9R3000S REFURBISHMENT KIT, SILVER

9.3.2 GD50

Model: EB-GD50 Name: Jigs and Tools Ref. Part Number Description Notes

9RD500B REFURBISHMENT KIT, BLUE 9RD500K REFURBISHMENT KIT, BLACK 9RD500N REFURBISHMENT KIT, GREEN 9RD500Y REFURBISHMENT KIT, GREY

NOTE: Each refurbishment kit includes; Coloured Cover Assembly, Case Assembly,

Key Sheet, Memo Key, LCD Panel, PCB Screw (x2), Cover Screw (x4), RF Cap, Antenna and Patent Label.

9.4 Repair Jigs and Tools

Model: EB-GD30 Name: Jigs and Tools Ref. Part Number Description Notes

IFB004 INTERFACE BOX

JT00009 GD30/GD50 RF ADAPTOR JT00010 BATTERY CALIBRATION VOLT. CONTROL UNIT JT00011 GD30/GD50 PCB REPAIR JIG JT00022 TEST BATTERY JT00004 INTERFACE CABLE

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9.5 Printed Material

9.5.1 Document Packs

NOTE: Document Packs consist of language-specific User Guide, Quick Start and

Warranty Card where applicable.

Model: EB-GD30 & EB-GD50 Name: Documentation Ref.

GD30 GD50

GD30DPKAR GD50DPKAR ARABIC, ENGLISH GD30DPKCH GD50DPKCH FRENCH, GERMAN, ITALIAN, EUROPEAN

GD30DPKCZ GD50DPKCZ CZECH GD30DPKDN GD50DPKDN DUTCHTONE GD30DPKES GD50DPKES SPANISH

Part Number

Description

WARRANTY

Model: EB-GD30 & EB-GD50 Name: Documentation Ref.

GD30 GD50 GD30DPKSL GD50DPKSL SLOVENIAN GD30DPKSW GD50DPKSW SWEDISH, EUROPEAN WARRANTY GD30DPKTA GD50DPKTA TAIWAN, ENGLISH GD30DPKTL GD50DPKTL ITALIAN, EUROPEAN WARRANTY GD30DPKTU GD50DPKTU TURKISH, EUROPEAN WARRANTY

GD30DPKUK GD50DPKUK ENGLISH, EUROPEAN WARRANTY GD30DPKYU GD50DPKYU ENGLISH 7QA959AAAA 7QA959AABA BOX, PRINTED

Part Number

Description

9.5.2 Identification of Individual Instructions

GD30DPKEUA GD50DPKEUA DANISH, GERMAN, EUROPEAN WARRANTY GD30DPKEUB GD50DPKEUB FRENCH, GERMAN, EUROPEAN WARRANTY GD30DPKFN GD50DPKFN FINNISH, EUROPEAN WARRANTY GD30DPKFR GD50DPKFR FRENCH, EUROPEAN WARRANTY GD30DPKFT GD50DPKFT FRANCE TELECOM, EUROPEAN WARRANTY

GD30DPKGE GD50DPKGE GERMAN, EUROPEAN WARRANTY GD30DPKGR GD50DPKGR GREEK, ENGLISH, EUROPEAN WARRANTY GD30DPKHU GD50DPKHU HUNGARIAN GD30DPKKPN GD50DPKKPN DUTCH PTT/KPN GD30DPKKU GD50DPKKU ENGLISH, FRENCH, ARABIC

GD30DPKLE GD50DPKLE ENGLISH,FRENCH GD30DPKMT GD50DPKMT ITALIAN, ENGLISH, ITALIAN WARRANTY

CARD, EUROPEAN WARRANTY CARD GD30DPKNL GD50DPKNL DUTCH, EUROPEAN WARRANTY GD30DPKNW GD50DPKNW NORWEGIAN, EUROPEAN WARRANTY GD30DPKPL GD50DPKPL POLISH

GD30DPKPR GD50DPKPR PORTUGUESE, EUROPEAN WARRANTY GD30DPKPUK GD50DPKPUK PANASONIC UK GD30DPKRM GD50DPKRM ROMANIAN GD30DPKRU GD50DPKRU RUSSIAN GD30DPKSK GD50DPKSK SLOVAKIAN

On the rear cover of each manual there is a part number. The suffix to this number is the issue level of the manual. For Example, the part number for the English GD30 instruction is 7LB270A where the final ’A’ shows the manual is issue ’A’.

REPLACEMENT PARTS LIST

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REPLACEMENT PARTS LIST

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Issue 1 Section 9 MCUK991001C8 Revision 0 – 82 – Service Manual

Page 89

Page 90

Printed in UK

UK991002000PJ

Panasonic EB-GD30 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

WARNINGS AND CAUTIONS

1 INTRODUCTION

2 GENERAL DESCRIPTION

3 OPERATING INSTRUCTIONS

4 DISASSEMBLY / REASSEMBLY INSTRUCTIONS

5 TECHNICAL SPECIFICATIONS

6 TEST AND MEASUREMENT

7 CIRCUIT DIAGRAMS

8 LAYOUT DIAGRAMS

9 REPLACEMENT PARTS LIST