Panasonic 2SD1261A, 2SD1261 Datasheet

Po wer Transistors
B
E
C
2SD1261, 2SD1261A
Silicon NPN triple diffusion planar type Darlington
For power amplification Complementary to 2SB938 and 2SB938A
Features
High foward current transfer ratio h
High-speed switching
N type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment.
Absolute Maximum Ratings (T
Parameter
Collector to base voltage Collector to emitter voltage
2SD1261 2SD1261A 2SD1261
2SD1261A Emitter to base voltage Peak collector current Collector current Collector power dissipation
TC=25°C Ta=25°C
Junction temperature Storage temperature
Electrical Characteristics (T
Parameter
Collector cutoff current Collector cutoff current Emitter cutoff current Collector to emitter voltage
Forward current transfer ratio
Base to emitter voltage
Collector to emitter saturation voltage
Transition frequency Turn-on time Storage time Fall time
*
h
Rank classification
FE2
Symbol
2SD1261 2SD1261A 2SD1261 2SD1261A
2SD1261 2SD1261A
V
V
V I
CP
I
C
P
C
T
j
T
stg
CBO
CEO
EBO
C
Symbol
I
CBO
I
CEO
I
EBO
V
CEO
h
FE1
*
h
FE2
V
BE
V
CE(sat)
f
T
t
on
t
stg
t
f
FE
=25˚C)
C
Ratings
60 80 60 80
5 8 4
40
1.3
150
–55 to +150
=25˚C)
VCB = 60V, IE = 0 VCB = 80V, IE = 0 VCE = 30V, IB = 0 VCE = 40V, IB = 0 VEB = 5V, IC = 0
IC = 30mA, IB = 0
VCE = 3V, IC = 0.5A VCE = 3V, IC = 3A VCE = 3V, IC = 3A IC = 3A, IB = 12mA IC = 5A, IB = 20mA VCE = 10V, IC = 0.5A, f = 1MHz
IC = 3A, IB1 = 12mA, IB2 = –12mA, VCC = 50V
Unit
V
V
V A A
W
˚C ˚C
Conditions
Internal Connection
10.0±0.310.5min.
10.0±0.3
4.4±0.5
2.0 1.5±0.1
2.0
1000 1000
8.5±0.2
6.0±0.5
5.08±0.5 213
8.5±0.2
6.0±0.3
5.08±0.5
123
min
60 80
1.5max.
0.8±0.1
2.54±0.3
0.8±0.1
2.54±0.3
+0
typ
0.5
–0.4
1.5
20
4 1
R0.5 R0.5
1.1 max.
1:Base 2:Collector 3:Emitter N Type Package (DS)
Rank R Q P
h
1000 to 2500 2000 to 5000
FE2
4000 to 10000
Unit: mm
3.4±0.3
1.0±0.1
1.1max.
0.5max.
1:Base 2:Collector 3:Emitter N Type Package
Unit: mm
3.4±0.3
1.0±0.1
–0.2
+0.4
3.0
4.4±0.5
0 to 0.4
max
200 200 500 500
2
10000
2.5 2 4
14.7±0.5
Unit
µA
µA
mA
V
V
V
MHz
µs µs µs
1
Po wer Transistors 2SD1261, 2SD1261A
PC—Ta IC—V
50
) W
(
(1)
40
C
30
20
10
(2)
Collector power dissipation P
(3)
0
0 16040 12080 14020 10060
Ambient temperature Ta (˚C
)
100
V
(
30
CE(sat)
10
3
TC=100˚C
1
–25˚C
0.3
0.1
0.03
0.01
Collector to emitter saturation voltage V
0.01 0.1 1 100.03 0.3 3
(1) TC=Ta (2) With a 50 × 50 × 2mm
Al heat sink
(3) Without heat sink
(P
=1.3W)
C
V
CE(sat)—IC
IC/IB=250
Collector current IC (A
)
25˚C
)
CE
10
8
) A
(
C
6
4
Collector current I
2
0
0108264
IB=4.0mA
T
3.5mA
3.0mA
Collector to emitter voltage VCE (V
hFE—I
C
5
10
FE
4
10
TC=100˚C
3
10
25˚C
–25˚C
2
10
Forward current transfer ratio h
10
0.01 0.1 1 100.03 0.3 3
Collector current IC (A
=25˚C
C
2.5mA
2.0mA
1.5mA
1.0mA
0.5mA
VCE=3V
IC—V
BE
10
8
) A
(
C
Collector current I
)
6
4
2
0
TC=100˚C
03.20.8 2.41.6
Base to emitter voltage VBE (V
Cob—V
10000
) pF
3000
(
ob
1000
300
100
30
10
3
Collector output capacitance C
1
0.1 1 10 1000.3 3 30
)
Collector to base voltage VCB (V
25˚C
CB
–25˚C
VCE=3V
IE=0 f=1MHz T
=25˚C
C
)
)
Area of safe operation (ASO) R
100
30
)
I
CP
10
A
(
I
C
C
3
1
0.3
0.1
Collector current I
0.03
0.01 1 10 100 10003 30 300
300ms
Non repetitive pulse
=25˚C
T
C
t=10ms
1ms
2SD1261
2SD1261A
Collector to emitter voltage VCE (V
)
3
10
)
2
10
˚C/W
( (t)
th
10
1
–1
10
Thermal resistance R
–2
10
–4
10
–3
10
2
—t
th(t)
(1) Without heat sink (2) With a 50 × 50 × 2mm Al heat sink
(1)
(2)
–1
–2
10
Time t (s
1010
110
10
)
3
2
4
10
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