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TIP131, TIP132 (NPN),
TIP137 (PNP)
Preferred Devices
Darlington Complementary
Silicon Power Transistors
Designed for general−purpose amplifier and low−speed switching
applications.
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Features
• High DC Current Gain −
hFE= 2500 (Typ) @ I
= 4.0 Adc
C
• Collector−Emitter Sustaining Voltage − @ 30 mAdc
V
CEO(sus)
= 80 Vdc (Min) − TIP131
= 100 Vdc (Min) − TIP132, TIP137
• Low Collector−Emitter Saturation Voltage −
V
= 2.0 Vdc (Max) @ IC = 4.0 Adc
CE(sat)
= 3.0 Vdc (Max) @ IC = 6.0 Adc
• Monolithic Construction with Built−In Base−Emitter Shunt Resistors
• Pb−Free Packages are Available*
MAXIMUM RATINGS
TIP132
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current − Continuous
Peak
Base Current
Total Power Dissipation @ TC = 25_C
Total Power Dissipation @ TA = 25_C
Operating and Storage Junction,
Temperature Range
Symbol
V
CEO
V
CB
V
EB
I
C
I
B
P
D
P
D
TJ, T
stg
TIP131
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
ООООООООО
Thermal Resistance,
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Junction−to−Case
Junction−to−Ambient
Symbol
R
q
JC
Î
R
q
JA
ÎÎÎ
TIP137
80
80
–65 to + 150
100
100
5.0
8.0
12
300
70
2.0
Max
1.78
63.5
Unit
Vdc
Vdc
Vdc
Adc
mAdc
W
W
_C
Unit
_C/W
Î
_C/W
DARLINGTON 8 AMPERE
COMPLEMENTARY SILICON
POWER TRANSISTORS
80−100 VOLTS, 70 WATTS
MARKING
DIAGRAM
4
TO−220AB
CASE 221A
1
2
3
TIP13x = Device Code
x = 1, 2, or 7
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
STYLE 1
ORDERING INFORMATION
Device Package Shipping
TIP131 TO−220
TIP131G TO−220
TIP132 TO−220 50 Units/Rail
TIP132G TO−220
TIP137 TO−220 50 Units/Rail
TIP137G TO−220
(Pb−Free)
(Pb−Free)
(Pb−Free)
TIP13xG
AYWW
50 Units/Rail
50 Units/Rail
50 Units/Rail
50 Units/Rail
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 1
1 Publication Order Number:
Preferred devices are recommended choices for future use
and best overall value.
TIP131/D
TIP131, TIP132 (NPN), TIP137 (PNP)
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PNP
TIP137
COLLECTOR
NPN
TIP131
TIP132
BASE
≈ 8.0 k ≈ 120
BASE
≈ 8.0 k ≈ 120
EMITTER
Figure 1. Darlington Circuit Schematic
ELECTRICAL CHARACTERISTICS (T
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 1)
(IC = 30 mAdc, IB = 0) TIP131
ОООООООООООООООООООО
Collector Cutoff Current
ОООООООООООООООООООО
(VCE = 40 Vdc, IB = 0) TIP131
(VCE = 50 Vdc, IB = 0) TIP132, TIP137
ОООООООООООООООООООО
Collector Cutoff Current
(VCB = 80 Vdc, IE = 0) TIP131
ОООООООООООООООООООО
(VCB = 100 Vdc, IE = 0) TIP132, TIP137
Emitter Cutoff Current
ОООООООООООООООООООО
(VBE = 5.0 Vdc, IC = 0)
ON CHARACTERISTICS (Note 1)
DC Current Gain
(IC = 1.0 Adc, VCE = 4.0 Vdc)
ОООООООООООООООООООО
(IC = 4.0 Adc, VCE = 4.0 Vdc)
Collector−Emitter Saturation Voltage
ОООООООООООООООООООО
(IC = 4.0 Adc, IB = 16 mAdc)
(IC = 6.0 Adc, IB = 30 mAdc)
ОООООООООООООООООООО
Base−Emitter On Voltage
(IC = 4.0 Adc, VCE = 4.0 Vdc)
ОООООООООООООООООООО
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
= 25_C unless otherwise noted)
C
Characteristic
TIP132, TIP137
COLLECTOR
EMITTER
Symbol
V
CEO(sus)
ÎÎÎ
I
CEO
ÎÎÎ
ÎÎÎ
I
CBO
ÎÎÎ
I
EBO
ÎÎÎ
h
FE
ÎÎÎ
V
CE(sat)
ÎÎÎ
ÎÎÎ
V
BE(on)
ÎÎÎ
Min
80
Î
100
Î
−
Î
−
−
Î
−
−
Î
500
Î
1000
Î
−
−
Î
−
Î
Max
−
ÎÎ
−
ÎÎ
0.5
ÎÎ
0.5
0.2
ÎÎ
0.2
5.0
ÎÎ
−
ÎÎ
15000
ÎÎ
2.0
3.0
ÎÎ
2.5
ÎÎ
Unit
Vdc
Î
mAdc
Î
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mAdc
Î
mAdc
Î
−
Î
Vdc
Î
Î
Vdc
Î
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2
1.0
0.7
0.5
0.3
0.2
0.1
0.07
(NORMALIZED)
0.05
0.03
0.02
r(t), TRANSIENT THERMAL RESISTANCE
0.01
0.01
0.2
0.1
0.05
0.02
0.01
D = 0.5
0.02
TIP131, TIP132 (NPN), TIP137 (PNP)
T
T
C
A
80
4.0
60
3.0
T
C
40
2.0
T
20
1.0
, POWER DISSIPATION (WATTS)
D
P
0
0
0 20 40 60 80 100 120 160
Figure 2. Power Derating
SINGLE PULSE
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 k500
A
T, TEMPERATURE (°C)
Z
= r(t) R
q
JC(t)
R
= 1.78°C/W MAX
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
− TC = P
J(pk)
t, TIME (ms)
140
P
q
JC
1
Z
q
JC(t)
(pk)
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
2
Figure 3. Thermal Response
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3
TIP131, TIP132 (NPN), TIP137 (PNP)
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AA
SEATING
−T−
PLANE
B
4
Q
123
F
T
A
U
C
S
H
K
Z
L
V
R
J
G
D
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM MIN MAX MIN MAX
A 0.570 0.620 14.48 15.75
B 0.380 0.405 9.66 10.28
C 0.160 0.190 4.07 4.82
D 0.025 0.035 0.64 0.88
F 0.142 0.147 3.61 3.73
G 0.095 0.105 2.42 2.66
H 0.110 0.155 2.80 3.93
J 0.018 0.025 0.46 0.64
K 0.500 0.562 12.70 14.27
L 0.045 0.060 1.15 1.52
N 0.190 0.210 4.83 5.33
Q 0.100 0.120 2.54 3.04
R 0.080 0.110 2.04 2.79
S 0.045 0.055 1.15 1.39
T 0.235 0.255 5.97 6.47
U 0.000 0.050 0.00 1.27
V 0.045 −−− 1.15 −−−
Z −−− 0.080 −−− 2.04
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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TIP131/D
4
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