ON Semiconductor NCP1200 Technical data

查询NCP1200P60供应商
NCP1200
PWM Current−Mode Controller for Low−Power Universal Off−Line Supplies
With an internal structure operating at a fixed 40 kHz, 60 kHz or 100 kHz, the controller drives low gate−charge switching devices like an IGBT or a MOSFET thus requiring a very small operating power. Due to current−mode control, the NCP1200 drastically simplifies the design of reliable and cheap offline converters with extremely low acoustic generation and inherent pulse−by−pulse control.
When the current setpoint falls below a given value, e.g. the output power demand diminishes, the IC automatically enters the skip cycle mode and provides excellent efficiency at light loads. Because this occurs at low peak current, no acoustic noise takes place.
Finally, the IC is self−supplied from the DC rail, eliminating the need of an auxiliary winding. This feature ensures operation in presence of low output voltage or shorts.
Features
No Auxiliary Winding Operation
Internal Output Short−Circuit Protection
Extremely Low No−Load Standby Power
Current−Mode with Skip−Cycle Capability
Internal Leading Edge Blanking
250 mA Peak Current Source/Sink Capability
Internally Fixed Frequency at 40 kHz, 60 kHz and 100 kHz
Direct Optocoupler Connection
Built−in Frequency Jittering for Lower EMI
SPICE Models Available for TRANsient and AC Analysis
Internal Temperature Shutdown
Pb−Free Packages are Available
http://onsemi.com
SOIC−8
8
8
1
xxx = Device Code: 40, 60 or 100 y = Device Code:
A = Assembly Location L = Wafer Lot Y, YY = Year W, WW = Work Week
D SUFFIX CASE 751
1
PDIP−8
P SUFFIX
CASE 626
4 for 40 6 for 60 1 for 100
PIN CONNECTIONS
Adj
18
FB
2
3
CS
GND
4
(Top View)
MARKING
DIAGRAMS
8
200Dy ALYW
1
8
1200Pxxx
YYWW
1
HV
7
NC V
6
CC
Drv
5
AWL
T ypical Applications
AC−DC Adapters
Offline Battery Chargers
Auxiliary/Ancillary Power Supplies (USB, Appliances, TVs, etc.)
Semiconductor Components Industries, LLC, 2004
December, 2004 − Rev. 13
1 Publication Order Number:
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 14 of this data sheet.
NCP1200/D
NCP1200
Á
Á
Á
Á
Á
Á
Á
Á
C3
+
10 F 400 V
EMI
Filter
Universal Input
*Please refer to the application information section
PIN FUNCTION DESCRIPTION
Pin No.
ÁÁ
ÁÁ
1
2
3
4 5 6 7 8
Pin Name
Adj
ÁÁ
FB
CS
ÁÁ
GND
Drv
V
CC
NC HV
Function
Adjust the Skipping Peak Current
БББББББ
Sets the Peak Current Setpoint
Current Sense Input
БББББББ
The IC Ground Driving Pulses Supplies the IC No Connection Generates the VCC from the Line
*
HV
V
NC
CC
Drv
8 7 6 5
1
Adj
2
FB
3
CS GND
4
+
C5
10 F
R
sense
Figure 1. T ypical Application
This pin lets you adjust the level at which the cycle skipping process takes place.
БББББББББББББББББ
By connecting an Optocoupler to this pin, the peak current setpoint is ad­justed accordingly to the output power demand.
This pin senses the primary current and routes it to the internal comparator via an L.E.B.
БББББББББББББББББ
The driver’s output to an external MOSFET. This pin is connected to an external bulk capacitor of typically 10 F. This un−connected pin ensures adequate creepage distance. Connected to the high−voltage rail, this pin injects a constant current into
the V
bulk capacitor.
CC
1N5819
M1 MTD1N60E
Description
D2
+
Rf 470
D8 5 V1
C2 470 F/10 V
6.5 V @ 600 mA
http://onsemi.com
2
NCP1200
Á
Á
Á
Á
Adj
FB
Current
Sense
Ground
1
HV Current
8
HV
Source
75.5 k
1.4 V
2
Skip Cycle
Comparator
+
Internal
V
CC
UVLO
High and Low
Internal Regulator
7
NC
29 k
Q Flip−Flop
Set
3
250 ns
L.E.B.
40, 60 or 100 kHz
Clock
4
+
V
ref
5.2 V
60 k8 k
20 k
+
1 V
DCmax = 80%
Reset
Q
6
V
CC
5
Drv
±110 mA
Overload?
Fault Duration
Figure 2. Internal Circuit Architecture
MAXIMUM RATINGS
Rating
Power Supply Voltage Thermal Resistance Junction−to−Air, PDIP−8 version
Thermal Resistance Junction−to−Air, SOIC version
БББББББББББББББББББ
Maximum Junction Temperature Typical Temperature Shutdown
Storage Temperature Range ESD Capability, HBM Model (All Pins except VCC and HV) ESD Capability, Machine Model Maximum Voltage on Pin 8 (HV), pin 6 (VCC) Grounded Maximum Voltage on Pin 8 (HV), Pin 6 (VCC) Decoupled to Ground with 10 F Minimum Operating Voltage on Pin 8 (HV)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Symbol
V
CC
R
JA
R
JA
ÁÁÁ
T
Jmax
T
stg
Value
16
100 178
ÁÁÁÁ
150 140
−60 to +150
2.0 200 450 500
30
Units
V
°C/W
ÁÁ
°C
°C
kV
V V V V
http://onsemi.com
3
NCP1200
ELECTRICAL CHARACTERISTICS (For typical values T
V
= 11 V unless otherwise noted)
CC
Rating
= +25°C, for min/max values TJ = −25°C to +125°C, Max TJ = 150°C,
J
Pin Symbol Min Typ Max Unit
DYNAMIC SELF−SUPPLY (All Frequency Versions, Otherwise Noted)
VCC Increasing Level at Which the Current Source Turns−off 6 V VCC Decreasing Level at Which the Current Source Turns−on 6 V VCC Decreasing Level at Which the Latchoff Phase Ends 6 V Internal IC Consumption, No Output Load on Pin 5 6 I
CCOFF
CCON
CClatch
CC1
10.3 11.4 12.5 V
8.8 9.8 11 V
6.3 V
710 880 Note 1
Internal IC Consumption, 1 nF Output Load on Pin 5, FSW = 40 kHz 6 I
CC2
1.2 1.4 Note 2
Internal IC Consumption, 1 nF Output Load on Pin 5, FSW = 60 kHz 6 I
CC2
1.4 1.6 Note 2
Internal IC Consumption, 1 nF Output Load on Pin 5, FSW = 100 kHz 6 I
CC2
1.9 2.2 Note 2
Internal IC Consumption, Latchoff Phase 6 I
CC3
350 A
INTERNAL CURRENT SOURCE
High−voltage Current Source, VCC = 10 V 8 I High−voltage Current Source, VCC = 0 V 8 I
C1 C2
2.8 4.0 mA
4.9 mA
DRIVE OUTPUT
Output Voltage Rise−time @ CL = 1 nF, 10−90% of Output Signal Output Voltage Fall−time @ CL = 1 nF, 10−90% of Output Signal 5 T Source Resistance (drive = 0, Vgate = V
− 1 V) 5 R
CCHMAX
Sink Resistance (drive = 11 V, Vgate = 1 V) 5 R
5 T
OH OL
r
f
67 ns
28 ns
27 40 61
5 12 25
CURRENT COMPARATOR (Pin 5 Un−loaded)
Input Bias Current @ 1 V Input Level on Pin 3 3 I Maximum internal Current Setpoint 3 I Default Internal Current Setpoint for Skip Cycle Operation 3 I Propagation Delay from Current Detection to Gate OFF State 3 T Leading Edge Blanking Duration 3 T
IB
Limit
Lskip
DEL LEB
0.02 A
0.8 0.9 1.0 V
350 mV
100 160 ns
230 ns
INTERNAL OSCILLATOR (VCC = 11 V, Pin 5 Loaded by 1 k)
Oscillation Frequency, 40 kHz Version f Oscillation Frequency, 60 kHz Version f Oscillation Frequency, 100 kHz Version f Built−in Frequency Jittering, FSW = 40 kHz f Built−in Frequency Jittering, FSW = 60 kHz f Built−in Frequency Jittering, FSW = 100 kHz f
OSC OSC OSC
jitter jitter jitter
36 42 48 kHz 52 61 70 kHz 86 103 116 kHz
300 Hz/V
450 Hz/V
620 Hz/V
Maximum Duty Cycle Dmax 74 80 87 %
FEEDBACK SECTION (VCC = 11 V, Pin 5 Loaded by 1 k)
Internal Pullup Resistor 2 Rup 8.0 k Pin 3 to Current Setpoint Division Ratio Iratio 4.0
SKIP CYCLE GENERATION
Default skip mode level 1 Vskip 1.1 1.4 1.6 V Pin 1 internal output impedance 1 Zout 25 k
1. Max value @ TJ = −25°C.
2. Max value @ T
= 25°C, please see characterization curves.
J
A
mA
mA
mA
http://onsemi.com
4
NCP1200
60
50
40
30
20
LEAKAGE (A)
10
0
−25
9.85
9.80
9.75
9.70
(V)
9.65
CCON
V
9.60
9.55
9.50
9.45
−25 755025 100 1250
11.70
11.60
11.50
(V)
11.40
CCOFF
V
11.30
11.20
0 −25 755025 100 1250
TEMPERATURE (°C)
5025
75
100 125
11.10
Figure 3. HV Pin Leakage Current vs.
Temperature
100 kHz
60 kHz
40 kHz
TEMPERATURE (°C)
900
850
800
(A)
750
CC1
I
700
650
600
−25 755025 100 1250
100 kHz
60 kHz
40 kHz
TEMPERATURE (°C)
Figure 4. VCC OFF vs. Temperature
100 kHz
60 kHz
40 kHz
TEMPERATURE (°C)
2.10
1.90
1.70
(mA)
1.50
CC2
I
1.30
1.10
0.90
−25 755025 100 1250
Figure 5. VCC ON vs. Temperature
100 kHz
60 kHz
40 kHz
TEMPERATURE (°C)
Figure 7. I
vs. Temperature
CC2
110 104
98 92 86 80
(kHz)
74
SW
68
F
62 56 50 44 38
−25 755025 100 1250
http://onsemi.com
5
Figure 6. I
TEMPERATURE (°C)
vs. Temperature
CC1
100 kHz
60 kHz
40 kHz
Figure 8. Switching Frequency vs. T
J
NCP1200
6.50
6.45
6.40
(V)
6.35
CCLATCHOFF
6.30
V
6.25
6.20
−25
60
50
40
30
20
10
460 430 400 370 340
(A)
310
CC3
I
280 250 220
250
TEMPERATURE (°C)
50 75 100
125
190
TEMPERATURE (°C)
Figure 9. VCC Latchoff vs. Temperature Figure 10. I
1.00
Source
Sink
0.96
0.92
0.88
0.84
CURRENT SETPOINT (V)
50 75250 100−25 125
vs. Temperature
CC3
1.34
1.33
1.32
(V)
1.31
skip
V
1.30
1.29
1.28
0
TEMPERATURE (°C)
Figure 11. DRV Source/Sink Resistances
50 75250 100−25 125
TEMPERATURE (°C)
Figure 13. V
vs. Temperature
skip
0.80
TEMPERATURE (°C)
50 75250 100−25 12550 75250 100−25 125
Figure 12. Current Sense Limit vs. Temperature
86.0
84.0
82.0
80.0
78.0
DUTY−MAX (%)
76.0
74.0
TEMPERATURE (°C)
50 75250 100−25 125
Figure 14. Max Duty Cycle vs. T emperature
http://onsemi.com
6
Loading...
+ 11 hidden pages