ON Semiconductor MC33269, NCV33269 Technical data

查询MC33269D-3.3供应商

MC33269, NCV33269

800 mA, Adjustable Output,
Low Dropout Voltage
Regulator

The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.

The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.

• 3.3 V, 5.0 V, 12 V and Adjustable Versions.

2.85 V version available as MC34268.

• Space Saving DPAK, SOP−8 and SOT−223 Power Packages

• 1.0 V Dropout

• Output Current in Excess of 800 mA

• Thermal Protection

• Short Circuit Protection

• Output Trimmed to 1.0% Tolerance

• Pb−Free Package is Available

DEVICE TYPE/NOMINAL OUTPUT VOLTAGE

MC33269D
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3

*NCV prefix is for automotive and other applications requiring site and change

control.

Adj
Adj
Adj
Adj

3.3 V

3.3 V

3.3 V

3.3 V

3.3 V

MC33269D−5.0
MC33269DT−5.0

MC33269T−5.0
MC33269D−12
MC33269DT−12
NCV33269DTRK−12*
MC33269T−12

5.0 V

5.0 V

5.0 V
12 V
12 V
12 V
12 V

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out
in

SO−8

D SUFFIX

CASE 751

NC

8
7

V

6

NC

5

(Top View)

(Top View)

out

1

123

8

1

Gnd/Adj

V

1

3

1

3

Heatsink surface (shown as terminal 4 in

case outline drawing) is connected to Pin 2.

out

V

in

1
2

3
4

(Top View)

DPAK
DT SUFFIX
CASE 369A

1. GND/Adj

2. V

3. V

SOT−223

ST SUFFIX

CASE 318E

TO−220AB

T SUFFIX

CASE 221A

23

 Semiconductor Components Industries, LLC, 2004

March, 2004 − Rev. 16

1. GND/Adj

2. V

1

2

3

Heatsink surface (shown as terminal 4 in

case outline drawing) is connected to Pin 2.

3. V

out
in

12 3

(Top View)

ORDERING INFORMATION

See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.

DEVICE MARKING INFORMATION

See general marking information in the device marking
section on page 9 of this data sheet.

1 Publication Order Number:

MC33269/D

MC33269, NCV33269

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Supply Input Voltage V
Power Dissipation

Case 369A (DPAK)

TA = 25°C P
Thermal Resistance, Junction−to−Ambient 
Thermal Resistance, Junction−to−Case 

Case 751 (SOP−8)

TA = 25°C P
Thermal Resistance, Junction−to−Ambient 
Thermal Resistance, Junction−to−Case 

Case 221A

TA = 25°C P
Thermal Resistance, Junction−to−Ambient 
Thermal Resistance, Junction−to−Case 

Case 318E

TA = 25°C P
Thermal Resistance, Junction−to−Ambient 
Thermal Resistance, Junction−to−Case 

Operating Die Junction Temperature Range T
Operating Ambient Temperature Range MC3326

NCV33269
Storage Temperature T
Electrostatic Discharge Sensitivity (ESD)

Human Body Model (HBM)
Machine Model (MM)

JA
JC

JA
JC

JA
JC

JA
JC

T

stg

ESD

in

D

20 V

Internally Limited W

92 °C/W

6.0 °C/W

D

Internally Limited W

160 °C/W

25 °C/W

D

Internally Limited W

65 °C/W

5.0 °C/W

D

Internally Limited W

156 °C/W

15 °C/W

J
A

−40 to +150 °C

−40 to +125

°C

−40 to +125

−55 to +150 °C
V

4000

400

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2

MC33269, NCV33269

ELECTRICAL CHARACTERISTICS (C

= 10 F, TA = 25°C, for min/max values TA = −40°C to +125°C, unless otherwise noted.)

O

Characteristic

Output Voltage (I

3.3 Suffix (V

5.0 Suffix (V
12 Suffix (V

= 10 mA, TA = 25°C)

out

= 5.3 V)

CC

= 7.0 V)

CC

= 14 V)

CC

Output Voltage (Line, Load and Temperature) (Note 1)

(1.25 V ≤ V
(1.35 V ≤ V

in
in

− V

− V

≤ 15 V, I

out

≤ 10 V, I

out

= 500 mA)

out

= 800 mA)

out

3.3 Suffix

5.0 Suffix
12 Suffix

Reference Voltage (I

= 10 mA, Vin − V

out

= 2.0 V, TA = 25°C)

out

for Adjustable Voltage
Reference Voltage (Line, Load and Temperature) (Note 1)

(1.25 V ≤ V
(1.35 V ≤ V

for Adjustable Voltage

in
in

− V

− V

≤ 15 V, I

out

≤ 10 V, I

out

= 500 mA)

out

= 800 mA)

out

Line Regulation

(I

= 10 mA, Vin = [V

out

Load Regulation (Vin = V

+ 1.5 V] to Vin = 20 V, TA = 25°C)

out

+ 3.0 V, I

out

= 10 mA to 800 mA, TA = 25°C) Reg

out

Dropout Voltage

(I

= 500 mA)

out

= 800 mA)

(I

out

Ripple Rejection

(10 V

, 120 Hz Sinewave; I

pp

Current Limit (Vin − V

= 10 V) I

out

= 500 mA)

out

Quiescent Current (Fixed Output)

(1.5 V ≤ V
(5 V ≤ V

out

≤ 12 V)

out

≤ 3.3 V)

Minimum Required Load Current

Fixed Output Voltage
Adjustable Voltage

Adjustment Pin Current I

1. The MC33269−12, Vin − V

is limited to 8.0 V maximum, because of the 20 V maximum rating applied to V

out

Symbol Min Typ Max Unit

V

O

V

O

V

ref

V

ref

Reg

load

Vin−V

line

out

3.27

4.95

11.88

3.23

4.9

11.76

3.3

5.0
12

3.3

5.0
12

3.33

5.05

12.12

3.37

5.1

12.24

1.235 1.25 1.265 V

1.225 1.25 1.275 V

− − 0.3 %

− − 0.5 %

−

−

1.1

1.0

1.25

1.35

RR 55 − − dB

Limit

I

Load

I

Adj

Q

800 − − mA

mA

−

−

5.5

−

20

8.0

mA

−

8.0

−

−

0

−

− − 120 A

in.

V

V

V

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3

MC33269, NCV33269

V

in

V

out

Trim Links

V

Adj Gnd

This device contains 38 active transistors.

Figure 1. Internal Schematic

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4

1.5

1.3

T

= −40°C

1.1

0.9

T

= 25°C

A

A

T

= 125°C

A

, DROPOUT VOLTAGE (V)

out

0.7

−V
in

V

0.5
0 200 400 600 800 1000

IO, OUTPUT LOAD CURRENT (mA)

MC33269, NCV33269

, OUTPUT∆

O

V

VOLTAGE DEVIATIONCURRENT

, OUTPUTI

O

20 ms/DIV

C

= 10 F

in

C

= 10 F Tantalum

O

Vin = VO + 3.0 V
Preload = 0.1 A

100
mV/Div

0.5 A

0 A

Figure 2. Dropout Voltage versus

1100

1060

1020

980

940

, OVERVOLTAGE INPUT THRESHOLD (%V )

900

−55

FB(OV) FB

V

70

60

−25 0 25 50 75 100 125

Output Load Current

T

, AMBIENT TEMPERATURE (°C)

A

Figure 4. Dropout Voltage

versus Temperature

VO = 3.3 V or 5.0 V

VO = 12 V

IO = 800 mA

Figure 3. Transient Load Regulation

1.6

1.4

1.2

1.0

0.8

T

= 25°C

A

MC33269D−XX
L = 25 mm Copper

0.6

OUTPUT CURRENT (A)

0.4

0.2

0

0

2.0 4.0 6.0 8.0 10 12 14 16

INPUT−OUTPUT VOLTAGE DIFFERENTIAL (V)

Figure 5. MC33269−XX Output DC Current versus

Input−Output Differential Voltage

70

60

50

Vin = VO + 3.0 V

40

IL = 800 mA
T

= 25°C

A

30

RR, RIPPLE REJECTION RATIO (dB)

20

0.1 1.0 10 100

f, FREQUENCY (kHz)

Figure 6. MC33269 Ripple Rejection

versus Frequency

50

40

30

RR, RIPPLE REJECTION RATIO (dB)

20

0.1

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5

Vin = 8.0 V
V

= 5.0 V

out

IL = 800 mA
C

= 22 F

Adj

T

= 25°C

A

f, FREQUENCY (kHz)

Figure 7. MC33269−ADJ Ripple Rejection

versus Frequency

100101.0

MC33269, NCV33269

170

150

P

D(max)

for T

= 50°C

A

130

JUNCTION−TO−AIR ( C/W)°

110

90

Graph represents symmetrical layout

2.0 oz.

L

Copper

70

3.0 mmL

50

R



30

JAθ

R , THERMAL RESISTANCE,

02030504010

JA

L, LENGTH OF COPPER (mm)

Figure 8. SOP−8 Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

280

240

200

160

Free Air
Mounted

Vertically

Minimum
Size Pad

3.2

2.8

2.4

2.0

1.6

1.2

0.8

0.4

100

Free Air

90

Mounted

P

D(max)

for T

= 50°C

A

Vertically

80

JUNCTION−TO−AIR ( C/W)°

70

Minimum
Size Pad

60

50

40

010203025155.0

JAθ

R , THERMAL RESISTANCE,

L, LENGTH OF COPPER (mm)

R



JA

Figure 9. DPAK Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

P

D(max)

for T

= 50°C

A

2.0 oz. Copper
L

L

2.50

1.25

0.83

0.63

2.0 oz. Copper
L

L

2.4

2.0

1.6

1.2

0.8

0.4

0

120

JAθ

JUNCTION-TO-AIR ( C/W)°

R , THERMAL RESISTANCE

80

40

010203025155.0

R



JA

L, LENGTH OF COPPER (mm)

Figure 10. SOT−223 Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

0.50

0.42

0.35

, MAXIMUM POWER DISSIPATION (W)

D

P

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6

MC33269, NCV33269

APPLICATIONS INFORMATION

Figures 11 through 15 are typical application circuits. The
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.

* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10 F with an
equivalent series resistance (ESR) of less than 10  but
greater than 0.2  over the anticipated operating
temperature range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.

** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the

V

in

**

C

in

An input capacitor is not necessary for stability, however
it will improve the overall performance.

MC33269−XX

GND

Figure 11. Typical Fixed Output Application

V

in

**

C

in

MC33269

Adj

I

 

out

1.25
R

S

Figure 13. Current Regulator

V

out

*

C

o

10 F

R

I

S

out

*

C

o

10 F

supply input filter with long wire lengths. This will reduce
the circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 F or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Applications

should be tested over all operating conditions to insure
stability.

Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170°C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used

as a substitute for proper heat−sinking.

R1

R2

Adj

V

out

*

C

o

10 F

R2



V

in

**

C

in

V

is optional, however it will improve the ripple rejection.

***C

Adj

The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.

  1.25

out

MC33269

Adj

C

Adj

***

R2





1 

I

R1

Figure 12. Typical Adjustable Output Application

V

in

**

C

in

**

C

The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.

MC33269−XX

GND

MC33269−XX

in

GND

V

out

C

o

10 F

*

Figure 14. Battery Backed−Up Power Supply

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V

in

**

C

in

R2 sets the maximum output voltage. Each transistor

reduces the output voltage when turned on.

MC33269

R1

Adj

R2

Figure 15. Digitally Controlled Voltage Regulator

7

V

out

*

C

o

10 F

MC33269, NCV33269

ORDERING INFORMATION

Device Package Shipping Information

MC33269D SO−8 98 Units / Rail
MC33269DR2 SO−8 2500 Units / Tape & Reel
MC33269DR2G SO−8 (Pb−Free) 2500 Units / Tape & Reel
MC33269DT DPAK 75 Units / Rail
MC33269DTG DPAK (Pb−Free) 75 Units / Rail
MC33269DTRK DPAK 2500 Units / Tape & Reel
MC33269DTRKG DPAK (Pb−Free) 2500 Units / Tape & Reel
MC33269T TO−220 50 Units / Rail
MC33269D−3.3 SO−8 98 Units / Rail
MC33269DR2−3.3 SO−8 2500 Units / Tape & Reel
MC33269DR2−3.3G SO−8 (Pb−Free) 2500 Units / Tape & Reel
MC33269DT−3.3 DPAK 75 Units / Rail
MC33269DT−3.3G DPAK (Pb−Free) 75 Units / Rail
MC33269DTRK−3.3 DPAK 2500 Units / Tape & Reel
MC33269DTRK−3.3G DPAK (Pb−Free) 2500 Units / Tape & Reel
MC33269ST−3.3T3 SOT−223 4000 Units / Tape & Reel
MC33269ST−3.3T3G SOT−223 (Pb−Free) 4000 Units / Tape & Reel
MC33269T−3.3 TO−220 50 Units / Rail
MC33269D−5.0 SO−8 98 Units / Rail
MC33269DR2−5.0 SO−8 2500 Units / Tape & Reel
MC33269DT−5.0 DPAK 75 Units / Rail
MC33269DTRK−5.0 DPAK 2500 Units / Tape & Reel
MC33269DTRK−5.0G DPAK (Pb−Free) 2500 Units / Tape & Reel
MC33269T−5.0 TO−220 50 Units / Rail
MC33269D−12 SO−8 98 Units / Rail
MC33269DR2−12 SO−8 2500 Units / Tape & Reel
MC33269DT−12 DPAK 75 Units / Rail
MC33269DTRK−12 DPAK 2500 Units / Tape & Reel
MC33269DTRK−12G DPAK (Pb−Free) 2500 Units / Tape & Reel
MC33269T−12 TO−220 50 Units / Rail
NCV33269DTRK* DPAK 2500 Units / Tape & Reel
NCV33269DTRK−3.3* DPAK 2500 Units / Tape & Reel

NCV33269DTRK−12* DPAK 250 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NCV prefix is for automotive and other applications requiring site and control changes.

†

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8

MC33269, NCV33269

MARKING DIAGRAMS

SO−8

D SUFFIX

CASE 751

8

8

8

8

269AJ

ALYWW

123

269AJ
ALYW

1

69−12

ALYWW

123

69−12
ALYW

1

DPAK

DT SUFFIX

CASE 369A

269−3

ALYWW

123

TO−220AB

T SUFFIX

CASE 221A

269−3
ALYW

1

269−5

ALYWW

123

269−5
ALYW

1

SOT−223

ST SUFFIX

CASE 318E

ALYW

2693

123

MC

33269T

AWLYWW

23 1

1

MC

33269T−12

AWLYWW

23 1

A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week

33269T−3.3

AWLYWW

MC

33269T−5.0

AWLYWW

23 1

MC

23

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9

−Y−

−Z−

MC33269, NCV33269

PACKAGE DIMENSIONS

SO−8

D SUFFIX

CASE 751−07

ISSUE AA

−X−

B

H

A

58

1

4

G

D

0.25 (0.010) Z

M

S

Y

0.25 (0.010)

C

SEATING
PLANE

SXS

M

0.10 (0.004)

M

Y

K

N

X 45



M

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.

MILLIMETERS

DIMAMIN MAX MIN MAX

4.80 5.00 0.189 0.197

B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010

J

J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050

M 0 8 0 8



N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244

INCHES

SOLDERING FOOTPRINT*

1.52

0.060

7.0

0.275

0.6

0.024

4.0

0.155

1.270

0.050

SCALE 6:1



inches

mm



Figure 16. SO−8

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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10

MC33269, NCV33269

DPAK

DT SUFFIX

CASE 369A−13

ISSUE AB

NOTES:

SEATING

−T−

PLANE

B

V

S

R

4

A

123

K

F

L

D

2 PL

G

0.13 (0.005) T

C

E

Z

U

J

H

M

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 0.235 0.250 5.97 6.35
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.027 0.035 0.69 0.88
E 0.033 0.040 0.84 1.01
F 0.037 0.047 0.94 1.19
G 0.180 BSC 4.58 BSC
H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.090 BSC 2.29 BSC
R 0.175 0.215 4.45 5.46
S 0.020 0.050 0.51 1.27
U 0.020 −−− 0.51 −−−
V 0.030 0.050 0.77 1.27
Z 0.138 −−− 3.51 −−−

MILLIMETERSINCHES

SOLDERING FOOTPRINT*

6.20

0.244

2.58

0.101

5.80

0.228

3.0

0.118

0.063

1.6

SCALE 3:1

6.172

0.243



inches

mm



Figure 17. DPAK

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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11

0.08 (0003)

S

L

H

A

F

4

123

G

MC33269, NCV33269

PACKAGE DIMENSIONS

SOT−223

ST SUFFIX

CASE 318E−04

ISSUE K

B

D

C

M

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

INCHES

DIMAMIN MAX MIN MAX

0.249 0.263 6.30 6.70

B 0.130 0.145 3.30 3.70
C 0.060 0.068 1.50 1.75
D 0.024 0.035 0.60 0.89
F 0.115 0.126 2.90 3.20
G 0.087 0.094 2.20 2.40
H 0.0008 0.0040 0.020 0.100

J

J 0.009 0.014 0.24 0.35
K 0.060 0.078 1.50 2.00
L 0.033 0.041 0.85 1.05

M 0 10 0 10



S 0.264 0.287 6.70 7.30

MILLIMETERS

K

3.8

0.15

2.0

0.079

2.3

0.091

2.3

0.091

6.3

0.248

2.0

0.079

mm



1.5

0.059

SCALE 6:1

inches



Figure 18. SOT−223

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

12

MC33269, NCV33269

TO−220AB

T SUFFIX

CASE 221A−09

ISSUE AA

SEATING

−T−

PLANE

B

4

Q

123

F

T

A

U

C

S

H

K

Z

L

V

R

J

G

D

N

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.

DIM MIN MAX MIN MAX

A 0.570 0.620 14.48 15.75
B 0.380 0.405 9.66 10.28
C 0.160 0.190 4.07 4.82
D 0.025 0.035 0.64 0.88
F 0.142 0.147 3.61 3.73
G 0.095 0.105 2.42 2.66
H 0.110 0.155 2.80 3.93
J 0.018 0.025 0.46 0.64
K 0.500 0.562 12.70 14.27
L 0.045 0.060 1.15 1.52
N 0.190 0.210 4.83 5.33
Q 0.100 0.120 2.54 3.04
R 0.080 0.110 2.04 2.79
S 0.045 0.055 1.15 1.39
T 0.235 0.255 5.97 6.47
U 0.000 0.050 0.00 1.27
V 0.045 −−− 1.15 −−−
Z −−− 0.080 −−− 2.04

MILLIMETERSINCHES

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MC33269, NCV33269

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