This device employs the Schottky Ba rri er principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification,
or as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the
system.
Features
• Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, T
• Small Compact Surface Mountable Package with J−Bend Leads
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Stress Protection
• Pb−Free Package is Available
= 25°C)
J
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
30 VOLTS
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 95 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Cathode Polarity Band
MAXIMUM RATINGS
RatingSymbolValueUnit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
TL = 120°C
TL = 110°C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Condit i ons
Halfwave, Single Phase, 60 Hz)
Operating Junction TemperatureT
THERMAL CHARACTERISTICS
RatingSymbolValueUnit
Thermal Resistance,
Junction−to−Lead (TL = 25°C)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
V
RRM
V
RWM
V
I
F(AV)
I
FSM
R
R
−65 to +125°C
J
q
JL
30V
A
1.0
2.0
40A
12°C/W
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
1BL3G
G
1BL3= Specific Device Code
A= Assembly Location
Y= Year
WW= Work Week
G= Pb−Free Package
(Note: Microdot may be in either location
ORDERING INFORMATION
DevicePackageShipping
MBRS130LT3SMB2500/Tape & Reel
MBRS130LT3GSMB
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Figure 1. Typical Forward VoltageFigure 2. Maximum Forward Voltage
100
10
1.0
0.1
0.01
R
0.001
0369121518212427 30
TJ = 100°C
25°C
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Leakage Current
1
CURRENT (A)
0.1
00.10.20.30.40.50.60.
, MAXIMUM INSTANTANEOUS FORWARD
F
I
, IREVERSE CURRENT (mA)
0.01
R
I
0.001
VF, MAXIMUM INSTANTANEOUS VOLTAGE (V)
100
10
1.0
0.1
0369121518212427 30
TJ = 100°C
25°C
TJ = 100°C
25°C
VR, REVERSE VOLTAGE (V)
Figure 4. Typical Maximum Reverse Leakage
Curent
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2
MBRS130LT3
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
, AVERAGE FORWARD CURRENT (A)
0
100105110115120125130
F(AV)
I
SQUARE WAVE
DC
TC, CASE TEMPERATURE (°C)
Figure 5. Current Derating (Case)
400
350
300
250
200
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
, AVERAGE POWER DISSIPATION (W)
0
00.20.40.60.811.21.4 1.6
F(AV)
P
I
, AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 6. Typical Power Dissipation
NOTE: TYPICAL CAPACITANCE
AT 0 V = 290 pF
SQUARE
DC
C, CAPACITANCE (pF)
150
100
50
0
0 4 8 12162024 2832
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Typical Capacitance
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3
MBRS130LT3
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE E
H
E
E
b
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIMAMINNOMMAXMIN
A10.050.100.150.002
b1.962.032.110.077
c0.150.230.300.006
D3.303.563.810.130
D
E4.064.324.570.160
H
E
L0.761.021.270.030
L1
MILLIMETERS
1.902.132.410.075
5.215.445.590.2050.2140.220
0.51 REF
INCHES
NOMMAX
0.0840.095
0.0040.006
0.0800.083
0.0090.012
0.1400.150
0.1700.180
0.0400.050
0.020 REF
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MBRS130LT3/D
4
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