OKI MSM63184A-xxx, MSM63184A-xxxGS-K Datasheet
E2E0059-19-81
¡ Semiconductor MSM63184A
This version: Aug. 1999
¡ Semiconductor
MSM63184A
4-Bit Microcontroller with Built-in 640-Dot Matrix LCD Drivers, Operating at 0.9 V (Min.)
GENERAL DESCRIPTION
The MSM63184A is an enhanced version of the MSM63184B in which supply currents have been
improved.
The MSM63184A is a CMOS 4-bit microcontroller with built-in 640-dot matrix LCD drivers and
operates at 0.9 V (min.). The MSM63184A is suitable for applications such as games, toys,
watches, etc. which are provided with an LCD display.
The MSM63184A is an M6318x series mask ROM-version product of OLMS-63K family, which
employs Oki's original CPU core nX-4/250.
The MSM63P180 is the one-time-programmable ROM version of MSM63188A, having one-time
PROM (OTP) as internal program memory.
The MSM63P180 is used to evaluate the software development.
FEATURES
• Rich instruction set
439 instructions
Transfer, rotate, increment/decrement, arithmetic operations, comparison, logic operations,
mask operations, bit operations, ROM table reference, external memory transfer, stack
operations, flag operations, branch, conditional branch, call/return, control.
• Rich selection of addressing modes
Indirect addressing of four data memory types, with current bank register, extra bank
register, HL register and XY register.
Data memory bank internal direct addressing mode.
• Processing speed
Two clocks per machine cycle, with most instructions executed in one machine cycle.
Minimum instruction execution time : 61 ms (@ 32.768 kHz system clock)
1 ms (@ 2 MHz system clock)
• Clock generation circuit
Low-speed clock : 32.768 kHz crystal oscillator
High-speed clock : 2 MHz (Max.) RC or ceramic oscillator select
• Program memory space
8K words
Basic instruction length is 16 bits/1 word
• Data memory space
640 nibbles
• External data memory space
Expandable beyond 64 Kbytes by using I/O port.
1/29
¡ Semiconductor MSM63184A
• Stack level
Call stack level : 8 levels
Register stack level : 16 levels
• I/O ports
Input ports: Selectable as input with pull-up resistance/input with pull-down resistance/
high-impedance input
Output ports: Selectable as P-channel open drain output/N-channel open drain output/
CMOS output/high-impedance output
Input-output ports: Selectable as input with pull-up resistance/input with pull-down
resistance/high-impedance input
Selectable as P-channel open drain output/N-channel open drain
output/CMOS output/high-impedance output
Can be interfaced with external peripherals that use a different power supply than this device
uses.
Number of ports:
Input port : 2 ports ¥ 4 bits
Output port : 4 ports ¥ 4 bits
Input-output port : 5 ports ¥ 4 bits
• Buzzer function
Buzzer output : 0.946 to 5.461 kHz (adjustable in 15 steps)
Buzzer output modes : Intermittent sound 1, 2; simple sound; continu-
ous sound
• LCD driver
Number of segments : 640 Max. (40 SEG ¥ 16 COM)
1/1 to 1/16 duty
1/4 or 1/5 bias (regulator built-in)
Selectable as all-on mode/all-off mode/power down mode/normal display mode
Adjustable contrast
• Reset function
Reset through RESET pin
Power-on reset
Reset by low-speed oscillation halt
• Battery check
Low-voltage supply check
Criterion voltage : Can be selected as 1.05 ±0.10 V, 1.30 ±0.15 V,
2.20 ±0.20 V or 2.80 ±0.30 V
• Power supply backup
Backup circuit (voltage multiplier) enables operation at 0.9 V minimum
2/29
¡ Semiconductor MSM63184A
• Timers and counter
Watchdog timer ¥ 1
Overflows in 2 sec.
100 Hz timer ¥ 1
Measurable in steps of 1/100 sec.
15-bit time base counter ¥ 1
1, 2, 4, 8, 16, 32, 64, and 128 Hz signals can be read
• Shift register
Shift clock : 1x or 1/2x system clock; external clock
Data length : 8 bits
• Interrupt sources
External interrupt : 3
Internal interrupt : 7 (watchdog timer interrupt is a nonmask-
able interrupt)
• Operating voltage
When backup used : 0.9 to 2.7 V
(Low-speed clock operating)
1.2 to 2.7 V
(Operating frequency: 300 to 500 kHz)
1.5 to 2.7 V
(Operating frequency: 200 kHz to 1 MHz)
When backup not used : 1.8 to 5.5 V
(Operating frequency: 300 to 500 kHz)
2.2 to 5.5 V
(Operating frequency: 300 kHz to 1 MHz)
2.7 to 5.5 V
(Operating frequency: 200 kHz to 2 MHz)
• Package:
128-pin plastic QFP (QFP128-P-1420-0.50-K) : (Product name: MSM63184A-xxxGS-K)
Chip : (Product name: MSM63184A-xxx)
xxx indicates a code number.
Differences Between the MSM63184B and the MSM63184A
The MSM63184A has the following improved characteristics.
• Supply currents (I
• The V
voltage during a halt of high-speed clock oscillation
DDL
DD1
, I
DD2
, I
) in DC characteristics
DD3
3/29
¡ Semiconductor MSM63184A
BLOCK DIAGRAM
An asterisk (*) indicates the port secondary function. indicates that the power is supplied
to the circuits corresponding to the signal names inside from V
interface).
nX-4/250
L
TIMING
CONTROL
CBR
EBR
H
YX
RA
A
PC
ROM
8KW
(power supply for
DDI
STACK
CAL: 8-level
REG: 16-level
RESET
TST1
TST2
XT0
XT1
OSC0
OSC1
TBCCLK*
HSCLK*
SP
RSP
RST
TST
OSC
ALU
INSTRUCTION
DECODER
INT
4
INT
1
INT
1
CG
MIE
IR
RAM
640N
INT184
TBC
BLD
100HzTC
WDT
Z
BUS
CONTROL
DATA BUS
INT
1
INT
1
EXTMEM
SFT
BUZZER
INPUT
PORT
OUTPUT
PORT
D0-7*
A0-15*
RD*
WR*
SIN*
SOUT*
SCLK*
BD
BDB
P0.0-P0.3
P1.0-P1.3
P4.0-P4.3
P5.0-P5.3
P6.0-P6.3
P7.0-P7.3
V
V
V
V
V
V
V
DDH
V
DD
CB1
CB2
DD1
DD2
DD3
DD4
DD5
C1
C2
DDL
BACKUP
BIAS
LCLK*
FRAME*
INT
2
I/O
PORT
LCD
&
DSPR
P8.0-P8.3
P9.0-P9.3
PA.0-PA.3
PD.0-PD.3
PE.0-PE.3
COM1-16
SEG0-39
V
DDI
V
SS
4/29
¡ Semiconductor MSM63184A
PIN CONFIGURATION (TOP VIEW)
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
SEG38
SEG39
COM16
128
127
126
COM15
COM14
COM13
125
124
123
COM12
COM11
COM10
122
121
120
COM9
COM8
119
118
COM7
COM6
117
116
COM5
COM4
115
114
COM3
COM2
113
112
DDI
COM1
V
111
110
BDBBDP7.0
P7.1
109
108
107
106
P7.2
P7.3
105
104
(NC)
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
(NC)
P6.0
P6.1
P6.2
P6.3
P1.0
P1.1
P1.2
P1.3
PA.0
PA.1
PA.2
PA.3
P9.0
P9.1
P9.2
P9.3
P8.0
P8.1
P8.2
P8.3
PE.0
PE.1
PE.2
PE.3
PD.0
PD.1
PD.2
PD.3
P0.0
P0.1
P0.2
P0.3
P4.0
P4.1
P4.2
P4.3
P5.0
39404142434445464748495051525354555657585960616263
SS
DD1VDD2VDD3VDD4VDD5
V
(NC)
V
C1
C2
DDH
V
CB1
CB2
DD
V
(NC)
DDL
V
OSC1
OSC0
XT1
XT0
RESET
TST2
TST1
P5.3
P5.2
P5.1
128-Pin Plastic QFP
Note: Pins marked as (NC) are no-connection pins which are left open.
64
(NC)
5/29
¡ Semiconductor MSM63184A
PAD CONFIGURATION
Pad Layout
97 P6.0
96 P6.1
95 P6.2
94 P6.3
93 P1.0
92 P1.1
91 P1.2
90 P1.3
89 PA.0
88 PA.1
87 PA.2
86 PA.3
85 P9.0
84 P9.1
83 P9.2
82 P9.3
81 P8.0
80 P8.1
79 P8.2
78 P8.3
77 PE.0
76 PE.1
75 PE.2
74 PE.3
73 PD.0
72 PD.1
71 PD.2
70 PD.3
69 P0.0
68 P0.1
67 P0.2
66 P0.3
65 P4.0
64 P4.1
63 P4.2
62 P4.3
61 P5.0
P7.3 98
P7.2 99
P7.1 100
P7.0 101
BD 102
BDB 103
104
V
DDI
COM1 105
COM2 106
COM3 107
COM4 108
COM5 109
COM6 110
COM7 111
COM8 112
COM9 113
COM10 114
COM11 115
COM12 116
COM13 117
COM14 118
COM15 119
COM16 120
SEG39 121
SEG38 122
SEG37 123
SEG36 1
SEG35 2
SEG34 3
SEG33 4
SEG32 5
SEG31 6
SEG30 7
SEG29 8
SEG28 9
SEG27 10
SEG26 11
SEG25 12
SEG24 13
SEG23 14
SEG22 15
SEG21 16
SEG20 17
SEG19 18
SEG18 19
SEG17 20
SEG16 21
SEG15 22
SEG14 23
SEG13 24
SEG9 28
SEG12 25
SEG11 26
SEG10 27
SEG8 29
SEG7 30
SEG6 31
SEG5 32
SEG4 33
SEG3 34
SEG2 35
SEG1 36
60 P5.1
59 P5.2
58 P5.3
57 TST1
56 TST2
55 XT0
54 XT1
53 RESET
52 OSC0
51 OSC1
50 V
49 V
48 CB2
47 CB1
46 V
45 C2
44 C1
43 V
42 V
41 V
40 V
39 V
38 V
SEG0 37
DDL
DD
DDH
DD5
DD4
DD3
DD2
DD1
SS
Y
X
Chip Size : 5.35 mm ¥ 4.66 mm
Chip Thickness : 350 mm (typ.)
Coordinate Origin : Chip center
Pad Hole Size : 100 mm ¥ 100 mm
Pad Size : 110 mm ¥ 110 mm
Minimum Pad Pitch : 140 mm
Note: The chip substrate voltage is VSS.
6/29
¡ Semiconductor MSM63184A
Pad Coordinates
Pad No.
Pad
Name
X (µm) Y (µm)
1 SEG36 –2520 –2135
2 –2380
SEG35
3 –2240
SEG34
4 –2100
SEG33
5 –1960
SEG32
6 –1820
SEG31
7 –1680
SEG30
8 –1540
SEG29
9 –1400
SEG28
10 –1260
11 –1120
12 –980
13 –840
14 –700
15 –560
16 –420
17 –280
18 –140
19 0
20 140
21 280
22 420
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
23 SEG14 560
24 SEG13 700
25 SEG12 840
26 SEG11 980
27 SEG10 1120
28 SEG9 1260
29 SEG8 1400
30 SEG7 1540
31 SEG6 1680
32 SEG5 1820
33 SEG4 1960
34 SEG3 2100
35 SEG2 2240
36 SEG1 2380
38 V
39 V
40 V
41 V
SS
DD1
DD2
DD3
2530
2530
2530
2530
Pad No.
42
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530 2135
–2135 2530
–2135 2530
–2135 2530
–2135 2530
–2135 2530
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–2135
–1665
–1515
–1365
–1215
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
Pad
Name
V
V
X (µm) Y (µm)
DD4
DD5
2530 –1065
–915
C1 –765
C2 –615
V
DDH
–465
CB1 –315
CB2 –165
V
DD
V
DDL
–15
135
OSC1 285
OSC0 435
RESET 585
XT1 735
XT0 885
TST2 1030
TST1 1170
P5.3 1328
P5.2 1468
P5.1 1608
P5.0 2520
P4.3 2380
P4.2 2240
P4.1 2100
P4.0 1960
P0.3 1820
P0.2 1680
P0.1 1540
P0.0 1400
PD.3 1260
PD.2 1120
PD.1 980
PD.0 840
PE.3 700
PE.2 560
PE.1 420
PE.0 280
P8.3 140
P8.2 0
P8.1 –140
P8.0 –280
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
2135
P9.3 –420 2135
Pad No.
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
Pad
Name
X (µm) Y (µm)
P9.2 –560 2135
P9.1 –700
P9.0 –840
PA.3
PA.2
PA.1
PA.0
P1.3
P1.2
P1.1
P1.0
P6.3
P6.2
P6.1
P6.0
P7.3 1607
P7.2 1467
P7.1 1327
P7.0 1187
BD 1029
BDB 889
V
DDI
COM1 609
COM2 469
COM3 329
COM4 189
COM5 49
COM6 –91
COM7 –231
COM8 –371
COM9 –511
COM10
COM11
COM12
COM13
COM14
COM15
COM16
SEG38 –1771
SEG37 –1970
–980
–1120
–1260
–1400
–1540
–1680
–1820
–1960
–2100
–2240
–2380
–2520
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
–2530
2135
749
–651
–791
–931
–1071
–1211
–135137 SEG0 2520
–1491
–1631SEG39
7/29
¡ Semiconductor MSM63184A
PIN DESCRIPTIONS
The basic functions of each pin of the MSM63184A are described in Table 1.
A symbol with a slash (/) denotes a pin that has a secondary function.
Refer to Table 2 for secondary functions.
For type, "—" denotes a power supply pin, "I" an input pin, "O" an output pin, and "I/O" an inputoutput pin.
Table 1 Pin Descriptions (Basic Functions)
Function Symbol Pin Type
52 —
40 —
41
42
43 —
44
45
V
V
V
V
V
V
V
DD
SS
DD1
DD2
DD3
DD4
DD5
C1 46 —
Power
Supply
C2 47 —
V
V
V
DDI
DDL
DDH
110 —
53 —
48 —
CB1 49 —
CB2 50 —
XT0 58 I
XT1 57 O
Oscillation
OSC0 55 I
OSC1 54 O
TST1 60 I
Test
TST2 59 I
Reset RESET 56 I
Description
Positive power supply
Negative power supply
Power supply pins for LCD bias (internally generated).
Capacitors (0.1 mF) should be connected between these pins and
.
V
SS
Capacitor connection pins for LCD bias generation.
A capacitor (0.1 mF) should be connected between C1 and C2.
Positive power supply pin for external interface
(power supply for input, output, and input-output ports)
Positive power supply pin for internal logic (internally generated).
A capacitor (0.1 mF) should be connected between this pin and V
SS
Voltage multiplier pin for power supply backup (internally generated)
A capacitor (1.0 mF) should be connected between this pin and VSS.
Pins to connect a capacitor for voltage multiplier.
A capacitor (1.0 mF) should be connected between CB1 and CB2.
Low-speed clock oscillation pins.
A 32.768 kHz crystal should be connected between XT0 and XT1,
(5 to 25 pF) should be connected between XT0 and VSS.
and C
G
High-speed clock oscillation pins.
A ceramic resonator and capacitors (C
oscillation resistor (R
) should be connected to these pins.
OS
, CL1) or external
L0
Input pins for testing.
A pull-down resistor is internally connected to these pins.
The user cannot use these pins.
Reset input pin.
Setting this pin to "H" level puts this device into a reset state.
Then, setting this pin to "L" level starts executing an instruction
from address 0000H.
A pull-down resistor is internally connected to this pin.
.
Buzzer
BD 108 O
BDB 109 O
Buzzer output pin (non-inverted output)
Buzzer output pin (inverted output)
8/29
¡ Semiconductor MSM63184A
Table 1 Pin Descriptions (Basic Functions) (continued)
Function Symbol
P0.0/INT5
P0.1/INT5
P0.2/INT5
P0.3/INT5
P1.0/INT5
P1.1/INT5
P1.2/INT5
P1.3/INT5
P4.0/A0
P4.1/A1
P4.2/A2
Port
P4.3/A3
P5.0/A4
P5.1/A5
P5.2/A6
P5.3/A7
P6.0/A8
P6.1/A9
P6.2/A10
P6.3/A11
P7.0/A12
P7.1/A13
P7.2/A14
P7.3/A15
Pin
73
72
71
70
97
96
95
94
69
68
67
66
65
63
62
61
101
100
99
98
107
106
105
104
Type Description
4-bit input ports.
Pull-up resistor input, pull-down resistor input, or
I
high-impedance input is selectable for each bit.
I
4-bit output ports.
P-channel open drain output, N-channel open drain output,
O
CMOS output, or high-impedance output is selectable for each
bit.
O
O
O
9/29
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