OKI MR27C1602B Technical data

OKI Semiconductor
FEDR27C1602B-01-03
Issue Date: Jun. 17, 2003
MR27C1602B
1,048,576–Word × 16–Bit or 2,097,152–Word × 8–Bit One Time PROM
The MR27C1602B is a 16 Mbit electrically One Time Programmable Read-Only Memory that can be electrically switched between 1,048,576-word × 16-bit and 2,097,152-word × 8-bit by the state of the BYTE# pin. The MR27C1602B supports high speed asynchronous read operation using a single 5.0V power supply.

FEATURES

· 1,048,576-word × 16-bit/2,097,152-word × 8-bit electrically switch able configuration
· +5.0 V power supply
· Access time 90 nS MAX
· Operating current 70 mA MAX
· Standby current 50 µA MAX
· Input/Output TTL compatible
· Tri-state output
· Packages: 42-pin plastic DIP (DIP42-P-600-2.54) (MR27C1602BRA) 44-pin plastic SOP (SOP44-P-600-1.27-K (MR27C1602BMA)
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OKI Semiconductor

PIN CONFIGURATION (TOP VIEW)

Pin name Functions
D15/A–1 Data output/Address input A0 to A19 Address input D0 to D14 Data output
CE# Chip enable OE# Output enable
BYTE#/VPP Mode switch/Program power supply voltage
VCC Power supply voltage VSS GND
NC Non connection
NC A18 A17
A7 A6 A5 A4 A3 A2 A1 A0
CE#
V
SS
OE#
D0 D8 D1 D9 D2
D10
D3
D11
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22
44-pin SOP
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
NC
19 8 9 10 11 12 13 14 15
16 BYTE#/V V
SS
D15/A–1 D7 D14 D6 D13 D5 D12 D4 V
CC
MR27C1602B (OTP)
A18
1
A17
2 3
A7
4
A6
5
A5
6
A4
7
A3
8
A2
9
A1
10
A0
11
CE#
PP
12
V
SS
13
OE#
14
D0
15
D8
16
D1
17
D9
18
D2
19
D10
20
D3
21
D11
42-pin DIP
42 41 40 39 38 37 36 35 34 33
BYTE#/V
32
VSS
31
D15/A–1
30
D7
29
D14
28
D6
27
D13
26
D5
25
D12
24
D4
23
V
22
19 8 9 10 11 12 13 14 15 16
CC
PP
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OKI Semiconductor
MR27C1602B (OTP)

BLOCK DIAGRAM

A
1
× 8/× 16 Switch
CE# BYTE#/V
OE#
PP
CE PGM OE
A1 A2 A3 A4 A5 A6 A7 A8
A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19
Memory Cell Matrix
Row Decoder
Address Buffer
Column Decoder
1,048,576 × 16-Bit or 2,097,152 × 8-Bit
Multiplexer
Output Buffer
D0 D2 D4 D6 D8 D10 D12 D14
D1 D3 D5 D7 D9 D11 D13 D15
In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin.

FUNCTION TABLE

Mode CE# OE# BYTE#/VPP VCC D0 to D7 D8 to D14 D15/A–1 Read (16-Bit) L L H D Read (8-Bit) L L L D
Output disable L H
Standby H Program L H DIN
Program inhibit H H Hi–Z Program verify H L
H
L
H
L
9.75 V 4.0 V
5.0 V
: Don’t Care (H or L)
Hi–Z L/H
OUT
Hi–Z
Hi–Z
D
OUT
OUT
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MR27C1602B (OTP)

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Value Unit Operating temperature under bias Ta 0 to 70 °C Storage temperature Tstg Input voltage VI –0.5 to VCC+0.5 V Output voltage VO –0.5 to VCC+0.5 V Power supply voltage VCC –0.5 to 7 V Program power supply voltage VPP Power dissipation per package PD — 1.0 W
relative to V
SS
–55 to 125 °C
–0.5 to 11.5 V

RECOMMENDED OPERATING CONDITIONS

(Ta = 0 to 70°C)
Parameter Symbol Condition Min. Typ. Max. Unit VCC power supply voltage VCC 4.5 5.5 V VPP power supply voltage VPP –0.5 VCC+0.5 V Input “H” level VIH 2.2 VCC+0.5 V Input “L” level VIL
Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
V
= 4.5 to 5.5 V
CC
–0.5∗∗ — 0.8 V
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MR27C1602B (OTP)

ELECTRICAL CHARACTERISTICS

DC Characteristics

(VCC = 5.0 V ± 0.5 V, Ta = 0 to 70°C)
parameter Symbol Condition Min. Typ. Max. Unit Input leakage current ILI V Output leakage current ILO V
I
CE# = VCC — — 50 µA VCC power supply current
CCSC
(Standby) V
power supply current
CC
(Read)
I
CE# = VIH — — 1 mΑ
CCST
I
CCA
VPP power supply current IPP V Input “H” level VIH — 2.2 VCC+0.5 V Input “L” level VIL — –0.5∗∗ — 0.8 V Output “H” level VOH I Output “L” level VOL I
Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.

AC Characteristics

Parameter Symbol Condition Min. Max. Unit Address cycle time tC — 90 — ns Address access time t
CE# = OE# = VIL — 90 ns
ACC
CE access time tCE OE# = VIL — 90 ns OE access time tOE CE# = VIL — 45 ns
t
OE# = VIL 0 30 ns
Output disable time
CHZ
CE# = VIL 0 25 ns
t
OHZ
Output hold time tOH CE# = OE# = VIL 0 — ns
Measurement conditions Input signal level--------------------------------0 V/3 V Input timing reference level ------------------0.8 V/2.0 V Output load---------------------------------------1TTL gate + 100 pF Output timing reference level----------------0.8 V/2.0 V
= 0 to VCC — — 10 µA
I
= 0 to VCC — — 10 µA
O
CE# = V
, OE# = V
IL
tc = 90 ns
= VCC — — 10 µA
PP
= –400 µA 2.4 — — V
OH
= 2.1 mA 0.4 V
OL
IH
— — 70 mA
(VCC = 5.0 V ± 0.5 V, Ta = 0 to 70°C)
2.08 V
Output
800
100 pF (Including scope and jig)
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TIMING CHART (READ CYCLE)

16-Bit Read Mode (BYTE# = V
A0 to A19
CE#
OE#
t
D0 to D15
Hi-Z
8-Bit Read Mode (BYTE# = VIL)
A–1 to A19
CE#
MR27C1602B (OTP)
)
IH
t
t
t
t
t
t
t
Valid Data
t
t
t
t
Valid Data
Hi-Z
t
t
t
OE#
D0 to D7
D8 to D14
Hi-Z
t
t
t
Valid Data
t
Hi-Z
Valid Data
t
Hi-Z
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MR27C1602B (OTP)

ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION)

DC Characteristics

(Ta = 25°C ± 5°C)
Parameter Symbol Condition Min. Typ. Max. Unit Input leakage current ILI V VPP power supply current (Program) I
CE# = VIL — — 50 mA
PP2
VCC power supply current ICC — — 70 mA Input “H” level VIH — VCC+1.0 — VCC+0.5 V Input “L” level VIL — –0.5 0.6 V Output “H” level VOH IOH = –400 µA 2.4 — — V Output “L” level VOL I Program voltage VPP — 9.5 9.75 10.0 V VCC power supply voltage (Program) VCC — 3.9 4.0 4.1 V VCC power supply voltage (Verify-1) V VCC power supply voltage (Verify-2) V VCC power supply voltage (Verify-3) V
— 5.9 6.0 6.1 V
CV1
— 4.4 4.5 4.6 V
CV2
— 5.4 5.5 5.6 V
CV3
Voltage is relative to VSS.

AC Characteristics

(VCC = 4.0 V ± 0.1 V, BYTE#/VPP = 9.75 V ± 0.25 V, Ta = 25°C ± 5°C)
Parameter Symbol Condition Min. Typ. Max. Unit Address set-up time tAS — 100 — — ns OE set-up time t
OES
Data set-up time tDS — 100 — — ns Address hold time tAH — 2 — — µs Data hold time tDH — 100 — — ns Output float delay time from OE t V
voltage set-up time tVS — 2 — — µs
PP
OHZ
Program pulse width tPW — 9 10 11 µs Data valid from OE t Address hold from OE high t
OE
AOH

Pin Check Function

Pin Check Function is to check contact between each device-pin and each socket-lead with EPR OM programm er. Setting up address as following condition call the preprogrammed codes on device outputs.
(VCC = 4.0 V ± 0.1 V, CE# = VIL, OE# = VIL, BYTE#/VPP = VIH, Ta = 25°C ± 5°C)
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 DATA
1 0 1 0 1 0 1 0 1 VH 0 1 0 1 0 1 0 1 0 VH
Other conditions FFFF
: VH = 8 V ± 0.25 V
= VCC+0.5 V 10 µA
I
= 2.1 mA 0.45 V
OL
— 2 — — µs
— 0 — 25 ns
— — — 50 ns
— 0 — — ns
1 0 1 0 1 0 1 1 0 0 FF00
0 1 0 1 0 1 0 0 1 1 00FF
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Consecutive Programming Waveforms

A0 to A19
t
AS
CE#
OE#
D0 to D15
tVS
t
DS
BYTE#/Vpp

Consecutive Program Verify Waveforms

A0 to A19
t
PW
Din
MR27C1602B (OTP)
t
AH
High
tDH
Din
CE#
OE#
D0 to D15
BYTE#/Vpp
t
ACC
High
tOE
t
Dout
AHO
t
OHZ
Dout
9.75 V
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MR27C1602B (OTP)

Program and Program Verify Cycle Waveforms

A0 to A19
t
AS
t
AHO
CE#
OE#
D0 to D15
t
OHZ
tDS
t
PW
Din
t
tDH
OES
t
OE
Dout
t
OHZ
BYTE#/Vpp
9.75 V

Pin Capacitance

(VCC = 5.0 V, Ta = 25°C, f = 1 MHz)
Parameter Symbol Condition Min. Typ. Max. Unit
Input C
BYTE#/VPP C
Output C
8(10)
IN1 IN2
V
OUT
= 0 V
V
I
= 0 V 10(12)
O
— — 120
( ) : DIP only
pF
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Programming/Verify Flow Chart

Programming
Bad Insertion
NG
Start
Pin Check
PASS
X=0
Address = First Location
= 4.0 V
V
CC
V
= 9.75 V
PP
Verif
Start
Pin Check
PASS
Address = First Location
VCC=4.5V/VPP =4.5V(V
Verify(All Address)
PASS
V
=5.5V/VPP=5.5V(V
CC
MR27C1602B (OTP)
NG
CV2
CV3
Bad Insertion
)
NG
)
Increment Address
NO
YES
Device Failed
X=X+1
X=2
Program 10 µs
NO
Last Address?
Address = First Location
VCC = 6V/VPP =6V(V
NG
Verify(All Address)
V
=4.5V/VPP =4.5V(V
CC
NG
Verify(All Address)
Device Passed
YES
PASS
PASS
CV1
)
CV2
Verify(All Address)
NG
PASS
Device Passed
Device Failed
)
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PACKAGE DIMENSIONS

SOP44-P-600-1.27-K
Mirror finish
MR27C1602B (OTP)
(Unit: mm)
Package material Epoxy resin Lead frame material 42 alloy
5
Pin treatment Package weight (g) 2.10 TYP. Rev. No./Last Revised 4/Dec. 5, 1996
Solder plating (≥5µm)
Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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DIP42-P-600-2.54
5
MR27C1602B (OTP)
(Unit: mm)
Package material Epoxy resin Lead frame material 42 alloy Pin treatment Package weight (g) 6.20 TYP. Rev. No./Last Revised 2/Dec. 11, 1996
Solder plating (≥5µm)
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REVISION HISTORY

Edition
Page
Current Edition
Description
Document
No.
FEDR27V1602B-01-01 Dec, 2001 Final edition 1
FEDR27V1602B-01-03 Jun. 17, 2003 Change over-bar fonts.
Date
Previous
MR27C1602B (OTP)
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MR27C1602B (OTP)
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date.
2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action an d performance of the product. When pl anning to use the pro duct, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, expos ure to parameters beyo nd the specified maximum ratings or operation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection wit h the use of the product and/or the i nformation and drawi ngs contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof.
6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the leg ality of export of these products and will take appropriate and necessary steps at their own expense for these.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2003 Oki Electric Industry Co., Lt d.
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