NXP Semiconductors UM10815 User Manual
UM10815
NXP Smartphone Quick-Jack Solution quick start guide
Rev. 1 — 19 May 2014
User manual
Document information
Info
Content
Keywords
LPC8xx, LPC800, LPC812, Smartphone Qui ck-Jack Solution, HiJack,
MCU, Mobile phone, Headset, Audio, smartphone
Abstract
This quick start guide explains how to get up and running with the
Smartphone Quick-Jack Solution.
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* iOSアプリはサポート継続困難との理由により提供が終了しました。 *
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NXP Semiconductors
UM10815
NXP Smartphone Quick-Jack Solution quick start guide
UM10815
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
User manual
Rev. 1 — 19 May 2014
2 of 12
Contact information
For more information, please visit:
http://www.nxp.com
For sales office addresses, please send an em ai l to: salesaddresses@nxp.com
Revision history
Rev
Date
Description
1
20140519
Initial version.
NXP Semiconductors
UM10815
NXP Smartphone Quick-Jack Solution quick start guide
UM10815
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
User manual
Rev. 1 — 19 May 2014
3 of 12
1. Introduction
Inspired by the University of Michigan's Proje ct HiJack, the NXP Smartphone Quick-Jack
Solution repurposes the standard 3.5 mm st ereo audio jack found on most smartphones
into a self-powered data channel that makes c om m unication with these smartphones as
easy as plugging a headset jack into the audio port .
The Quick-Jack demo board integrates a joysti ck, temperature sensor, LEDs and an
expansion header. The app running on the smartphone is able to interface with these onboard peripherals via the Quick-Jack interface.
Quick-Jack’s main features:
• Demo board uses the low-power LPC812 microcontroller in TSSOP20 package
• Board is powered by either the smartphone or a small button battery
• SE98 I
2
C temperature sensor integrated on the demo board
• Control the four on-board LEDs from the smartphone
• Read input from on-board joystick
• Quick-Jack app available for iOS and Android smartphones
• Expansion header featuring most of the LPC800 G P IO pins
• Board features standard ARM SWD debug interface (10 pins, 1. 27 m m )
The Quick-Jack board can be ordered through a variety of distributors using order
number OM13069.
NXP Semiconductors
UM10815
NXP Smartphone Quick-Jack Solution quick start guide
UM10815
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
User manual
Rev. 1 — 19 May 2014
4 of 12
Fig 1. NXP Smartphone Quick-Jack Solution
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