NXP PDZ10B, PDZ11B, PDZ12B, PDZ13B, PDZ15B Schematic [ru]
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DATA SH EET
DISCRETE SEMICONDUCTORS
PDZ-B series
Voltage regulator diodes
Product data sheet
Supersedes data of 2002 Feb 18
2004 Mar 22
NXP Semiconductors Product data sheet
Top view
Voltage regulator diodes PDZ-B series
FEATURES
• Total power dissipation: max. 400 mW
• Small plastic package suitable for surface mounted
design
PINNING
PIN DESCRIPTION
1 cathode
2 anode
• Wide variety of voltage ranges: nominal 2.4 to 36 V
range)
(E24
• Tolerance approximately ±2%.
handbook, halfpage
12
APPLICATIONS
• General voltage regulation.
The marking bar indicates the cathode.
MAM387
DESCRIPTION
Fig.1 Simplified outline (SOD323; SC-76) and
Low-power general purpose voltage regulator diodes in a
symbol.
small plastic SMD SOD323 (SC-76) package.
MARKING
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
PDZ2.4B Z0 PDZ5.1B Z8 PDZ11B ZG PDZ24B ZQ
PDZ2.7B Z1 PDZ5.6B Z9 PDZ12B ZH PDZ27B ZR
PDZ3.0B Z2 PDZ6.2B ZA PDZ13B ZJ PDZ30B ZS
PDZ3.3B Z3 PDZ6.8B ZB PDZ15B ZK PDZ33B ZT
PDZ3.6B Z4 PDZ7.5B ZC PDZ16B ZL PDZ36B ZU
PDZ3.9B Z5 PDZ8.2B ZD PDZ18B ZM
PDZ4.3B Z6 PDZ9.1B ZE PDZ20B ZN
PDZ4.7B Z7 PDZ10B ZF PDZ22B ZP
MARKING
CODE
ORDERING INFORMATION
TYPE
NUMBER
PDZ2.4B to
NAME DESCRIPTION VERSION
− plastic surface mounted package; 2 leads SOD323
PACKAGE
PDZ36B
2004 Mar 22 2
NXP Semiconductors Product data sheet
Voltage regulator diodes PDZ-B series
LIMITING VALUES
In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
F
I
ZSM
P
tot
T
stg
T
j
Note
1. Device mounted on a printed-circuit board measuring 11 × 25 × 1.6 mm.
THERMAL CHARACTERISTICS
continuous forward current − 200 mA
non-repetitive peak reverse current tp = 100 μs; square wave;
T
= 25 °C prior to surge
amb
total power dissipation T
= 25 °C; note 1;
amb
− 400 mW
see Table 2
see Fig.2
storage temperature −65 +150 °C
junction temperature − 150 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th(j-s)
th(j-a)
thermal resistance from junction to soldering point 130 K/W
thermal resistance from junction to ambient note 1 340 K/W
Note
1. Device mounted on a printed-circuit board measuring 11 × 25 × 1.6 mm.
2004 Mar 22 3
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