NXP PDTC115EE, PDTC115EEF, PDTC115EK, PDTC115EM, PDTC115ES Schematic [ru]

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DATA SH EET
DISCRETE SEMICONDUCTORS
PDTC115E series
NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
Product data sheet Supersedes data of 2004 Apr 06
2004 Aug 06
NXP Semiconductors Product data sheet
NPN resistor-equipped transistors;
PDTC115E series
R1 = 100 kΩ, R2 = 100 kΩ

FEATURES

Built-in bias resistors
Simplified circuit design
Reduction of component count
Reduced pick and place costs.

APPLICATIONS

General purpose switching and amplification
Inverter and interface circuits
Circuit driver.

PRODUCT OVERVIEW

PACKAGE
T YPE NUMBER
PHILIPS EIAJ
PDTC115EE SOT416 SC-75 46 PDTA115EE PDTC115EEF SOT490 SC-89 49 PDTA115EEF PDTC115EK SOT346 SC-59 56 PDTA115EK PDTC115EM SOT883 SC-101 DV PDTA115EM PDTC115ES SOT54 (TO-92) SC-43 TC115E PDTA115ES PDTC115ET SOT23 *44 PDTC115EU SOT323 SC-70 *15

QUICK REFERENCE DATA

SYMBOL PARAMETER TYP. MAX. UNIT
V
CEO
I
O
R1 bias resistor 100 R2 bias resistor 100

DESCRIPTION

NPN resistor equipped transistor (see “Simplified outline, symbol and pinning” for package details).
collector-emitter voltage
output current (DC) 20 mA
MARKING CODE PNP COMPLEMENT
(1) (1)
50 V
PDTA115ET PDTA115EU
Note
1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China.
2004 Aug 06 2
NXP Semiconductors Product data sheet
MAM364
NPN resistor-equipped transistors;
PDTC115E series
R1 = 100 kΩ, R2 = 100 kΩ

SIMPLIFIED OUTLINE, SYMBOL AND PINNING

T YPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL
PDTC115ES 1 base
handbook, halfpage
1 2 3
R1
1
R2
2
3
PDTC115EE 1 base PDTC115EEF 2 emitter PDTC115EK 3 collector
handbook, halfpage
PDTC115ET PDTC115EU
1
Top view
3
2
R1
1
R2
MDB269
3
2
PINNING
PIN DESCRIPTION
2 collector 3 emitter
PDTC115EM 1 base
2 emitter
handbook, halfpage
2
1
bottom view
3
MHC506
R1
1
R2
3
2
3 collector
2004 Aug 06 3
NXP Semiconductors Product data sheet
NPN resistor-equipped transistors;
PDTC115E series
R1 = 100 kΩ, R2 = 100 kΩ

ORDERING INFORMATION

TYPE NUMBER
NAME DESCRIPTION VERSION
PDTC115EE plastic surface mounted package; 3 leads SOT416 PDTC115EEF plastic surface mounted package; 3 leads SOT490 PDTC115EK plastic surface mounted package; 3 leads SOT346 PDTC115EM leadless ultra small plastic package; 3 solder lands; body
× 0.6 × 0.5 mm
1.0 PDTC115ES plastic single-ended leaded (through hole) package; 3 leads SOT54 PDTC115ET plastic surface mounted package; 3 leads SOT23 PDTC115EU plastic surface mounted package; 3 leads SOT323

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V V
CBO CEO EBO I
collector-base voltage open emitter 50 V collector-emitter voltage open base 50 V emitter-base voltage open collector 10 V input voltage
positive +40 V
negative 10 V I I P
O CM
tot
output current (DC) 20 mA peak collector current 100 mA total power dissipation T
amb
25 °C SOT54 note 1 500 mW SOT23 note 1 250 mW SOT346 note 1 250 mW SOT323 note 1 200 mW SOT416 note 1 150 mW SOT883 notes 2 and 3 250 mW SOT490 notes 1 and 2 250 mW
T T T
stg j amb
storage temperature −65 +150 °C junction temperature 150 °C operating ambient
temperature
PACKAGE
SOT883
65 +150 °C
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.
2004 Aug 06 4
NXP Semiconductors Product data sheet
NPN resistor-equipped transistors;
PDTC115E series
R1 = 100 kΩ, R2 = 100 kΩ

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.

CHARACTERISTICS

T
= 25 °C unless otherwise specified.
amb
thermal resistance from junction to ambient in free air
SOT54 note 1 250 K/W SOT23 note 1 500 K/W SOT346 note 1 500 K/W SOT323 note 1 625 K/W SOT416 note 1 833 K/W SOT833 notes 2 and 3 500 K/W SOT490 notes 1 and 2 500 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
I
CEO
collector-base cut-off curren t VCB = 50 V; IE = 0 A 100 nA collector-emitter cut-off current VCE = 30 V; IB = 0 A 1 μA
VCE = 30 V; IB = 0 A; Tj = 150 °C 50 μA
I
EBO
h V V V
FE
CEsat i(off) i(on)
emitter-base cut-off current VEB = 5 V; IC = 0 A 50 μA DC current gain VCE = 5 V; IC = 5 mA 80 collector-emitter saturation voltage IC = 5 mA; IB = 0.25 mA 150 mV input-off voltage IC = 100 μA; VCE = 5 V 1.1 0.5 V input-on voltage IC = 1 mA; VCE = 0.3 V 3 1.5 V
R1 input resistor 70 100 130 kΩ
R2
------- ­R1
C
c
resistor ratio 0.8 1 1.2
collector capacitance IE = ie = 0 A; VCB = 10 V;
= 1 MHz
f
2.5 pF
2004 Aug 06 5
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