NXP BC546A, BC546B, BC846A, BC846AT, BC846AW Schematic [ru]

BC846/BC546 series

65 V, 100 mA NPN general-purpose transistors

Rev. 07 — 17 November 2009 Product data sheet

1. Product profile

1.1 General description

NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number

BC846 SOT23 - TO-236AB BC856
BC846W SOT323 SC-70 - BC856W
BC846T SOT416 SC-75 - BC856T
BC546A
BC546B

[1]

Package PNP
NXP JEITA JEDEC

[2]
[2]

SOT54 SC-43A TO-92 BC556A
SOT54 SC-43A TO-92 BC556B

complement

[1] Valid for all available selection groups.
[2] Also available in SOT54A and SOT54 variant packages (see Section 2

).

1.2 Features

 General-purpose transistors
 SMD plastic packages
 Two different gain selections

1.3 Applications

 General-purpose switching and amplification

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V
I
h

CEO

C

FE

collector-emitter voltage open base - - 65 V
collector current - - 100 mA
DC current gain VCE=5V;

IC=2mA

group A 110 180 220

h

FE

group B 200 290 450

h

FE

110 - 450

NXP Semiconductors

4

1

7

6

8

6

7

6

2. Pinning information

Table 3. Pinning

Pin Description Simplified outline Symbol

SOT23; SOT323; SOT416

1base
2emitter
3 collector

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

3

3

1

SOT54

1emitter
2base
3 collector

SOT54A

1emitter
2base
3 collector

SOT54 variant

1emitter
2base
3 collector

12

006aaa14

1
2
3

001aab34

1
2

3

001aab34

1
2
3

001aab44

2

sym02

3

2

1

sym02

3

2

1

sym02

3

2

1

sym02

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 2 of 14

NXP Semiconductors

3. Ordering information

Table 4. Ordering information

Type number

BC846 - plastic surface mounted package; 3 leads SOT23
BC846W SC-70 plastic surface mounted package; 3 leads SOT323
BC846T SC-75 plastic surface mounted package; 3 leads SOT416
BC546A

BC546B

[1] Valid for all available selection groups.
[2] Also available in SOT54 and SOT54 variant packages (see Section 2

[2]

[2]

4. Marking

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

[1]

Package
Name Description Version

SC-43A plastic single-ended leaded (through hole) package;

3 leads

SC-43A plastic single-ended leaded (through hole) package;

3 leads

and Section 9).

SOT54

SOT54

Table 5. Marking codes

Type number Marking code

[1]

Ty pe number Marking code

BC846 1D* BC846T 1M
BC846A 1A* BC846AT 1A
BC846B 1B* BC846BT 1B
BC846W 1D* BC546A C546A
BC846AW 1A* BC546B C546B
BC846BW 1B* - -

[1] * = -: made in Hong Kong

* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China

[1]

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 3 of 14

NXP Semiconductors

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CBO

V

CEO

V

EBO

I

C

I

CM

I

BM

P

tot

T

j

T

amb

T

stg

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

collector-base voltage op en emitter - 80 V
collector-emitter voltage open base - 65 V
emitter-base voltage open collector - 6 V
collector current - 100 mA
peak collector current single pulse;

≤ 1ms

t

p

peak base current single pulse;

≤ 1ms

t

p

total power dissipation T

amb

≤ 25 °C
SOT23 - 250 mW
SOT323 - 200 mW
SOT416 - 150 mW
SOT54 - 500 mW

junction temperature - 150 °C
ambient temperature −65 +150 °C
storage temperature −65 +150 °C

-200mA

-200mA

[1]

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

R

th(j-a)

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

thermal resistance from
junction to ambient

SOT23 - - 500 K/W
SOT323 - - 625 K/W
SOT416 - - 833 K/W
SOT54 - - 250 K/W

in free air

[1]

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 4 of 14

NXP Semiconductors

7. Characteristics

Table 8. Characteristics

T

amb

Symbol Parameter Conditions Min Typ Max Unit

I

CBO

I

EBO

h

FE

V

CEsat

V

BEsat

V

BE

f

T

C

c

C

e

NF noise figure I

65 V, 100 mA NPN general-purpose transist ors

=25°C unless otherwise specified.

collector-base cut-off
current

emitter-base cut-off
current

DC current gain

group A VCE=5V; IC=10μA-180-

h

FE

group B VCE=5V; IC=10μA-290-

h

FE

DC current gain V

group A VCE=5V; IC= 2 mA 110 180 220

h

FE

group B VCE=5V; IC= 2 mA 200 290 450

h

FE

collector-emitter
saturation voltage

base-emitter
saturation voltage

base-emitter voltage IC=2mA; VCE=5V

transition frequency VCE=5V; IC=10mA;

collector capacitance VCB=10V; IE=ie=0A;

emitter capacitance VEB=0.5V; IC=ic=0A;

VCB=30V; IE=0A - - 15 nA

=30V; IE=0A;

V

CB

= 150 °C

T

j

VEB=5V; IE= 0 A - - 100 nA

=5V; IC= 2 mA 110 - 450

CE

IC=10mA; IB= 0.5 mA - 90 200 mV

= 100 mA; IB=5mA

I

C

IC=10mA; IB=0.5mA

= 100 mA; IB=5mA

I

C

=10mA; VCE=5V

I

C

f = 100 MHz

f=1MHz

f=1MHz

= 200 μA; VCE=5V;

C

=2kΩ; f = 1 kHz;

R

S

B=200Hz

BC846/BC546 series

--5μA

[1]

- 200 400 mV

[2]

-760-mV

[2]

-900-mV

[3]

580 660 700 mV

[3]

- - 770 mV
100 - - MHz

-23pF

-11- pF

- 2 10 dB

[1] Pulse test: tp≤ 300 μs; δ≤0.02.
[2] V
[3] V

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 5 of 14

decreases by approximately 1.7 mV/K with increasing temperature.

BEsat

decreases by approximately 2 mV/K with increasing temperature.

BE

NXP Semiconductors

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

400

h

FE

300

200

100

0

−1

10

(1)

(2)

(3)

11010210

mgt723

3

IC (mA)

VCE=5V

amb
amb
amb

= 150 °C
=25°C
= −55 °C

(1) T
(2) T
(3) T

Fig 1. Selection A: DC current gain as a function of

collector current; typical values

mgt724

3

IC (mA)

V

BE

(mV)

1200

1000

800

600

400

200

0
10

(1) T
(2) T
(3) T

−1

V

amb
amb
amb

CE

(1)

(2)

(3)

11010210

=5V

= −55 °C
=25°C
= 150 °C

Fig 2. Selection A: Base-emitter voltage as a function

of collector current; typical val ue s

mgt725

3

IC (mA)

V

CEsat

(mV)

3

10

2

10

10

−1

10

(1)

(2)

(3)

11010210

IC/IB=20

amb
amb
amb

= 150 °C
=25°C
= −55 °C

(1) T
(2) T
(3) T

Fig 3. Selection A: Collector-emitter saturation

voltage as a function of collector current;
typical values

mgt726

3

IC (mA)

V

(mV)

BEsat

1200

1000

800

600

400

200

0
10

(1) T
(2) T
(3) T

−1

I

C/IB

amb
amb
amb

(1)

(2)

(3)

11010210

=10

= −55 °C
=25°C
= 150 °C

Fig 4. Selection A: Base-emitter satu ration voltage

as a function of collector current; typical
values

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 6 of 14

NXP Semiconductors

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

600

h

FE

500

400

300

200

100

0

−1

10

11010210

(1)

(2)

(3)

mgt727

3

IC (mA)

VCE=5V

amb
amb
amb

= 150 °C
=25°C
= −55 °C

(1) T
(2) T
(3) T

Fig 5. Selection B: DC current gain as a function of

collector current; typical values

I

mgt728

(mA)

C

3

V

BE

(mV)

1200

1000

800

600

400

200

0

10

(1) T
(2) T
(3) T

−2

V

amb
amb
amb

CE

−1

10

=5V

= −55 °C
=25°C
= 150 °C

(1)

(2)

(3)

11010210

Fig 6. Selection B: Base-emitter voltage as a function

of collector current; typical val ue s

mgt729

3

IC (mA)

V

CEsat

(mV)

4

10

3

10

2

10

10

−1

10

(1)

(2)

(3)

11010210

IC/IB=20

amb
amb
amb

= 150 °C
=25°C
= −55 °C

(1) T
(2) T
(3) T

Fig 7. Selection B: Collector-emitter saturation

voltage as a function of collector current;
typical values

mgt730

3

IC (mA)

V

(mV)

BEsat

1200

1000

800

600

400

200

0
10

(1) T
(2) T
(3) T

−1

I

C/IB

amb
amb
amb

(1)

(2)

(3)

11010210

=10

= −55 °C
=25°C
= 150 °C

Fig 8. Selection B: Base-emitter satu ration voltage

as a function of collector current; typical
values

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 7 of 14

NXP Semiconductors

8. Package outline

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

2.5

2.1

3.0

2.8

3

0.45

0.15

1.4

1.2

12

0.48

1.9

0.38

1.1

0.9

0.15

0.09

2.2

1.8

0.4

0.3

0.45

0.15

3

2.2

1.35

2.0

1.15

12

1.3

04-11-04Dimensions in mm

Fig 9. Package outline SOT23 (TO-236AB) Fig 10. Package outline SOT323 (SC-70)

0.95

0.60

0.25

0.10

4.2

3.6

4.8

4.4

5.2

5.0

04-11-04Dimensions in mm

14.5

12.7

1.75

1.45

1.8

1.4

3

0.9

0.7

12

0.30

1

0.15

0.45

0.15

1.1

0.8

0.25

0.10

04-11-04Dimensions in mm

0.45

0.38

0.48

0.40

1
2
3

1.27

2.54

04-11-16Dimensions in mm

Fig 11. Package outline SOT416 (SC-75) Fig 12. Package outline SOT5 4 (SC-43A/TO-92)

0.45

0.38

1.27

0.48

0.40

1
2
3

1.27

2.54

05-01-10Dimensions in mm

4.2

3.6

4.8

4.4

5.2

5.0

3 max

14.5

12.7

0.45

0.38

0.48

0.40

1

2

3

5.08

2.54

04-06-28Dimensions in mm

4.2

3.6

4.8

4.4

5.2

5.0

2.5

max

14.5

12.7

Fig 13. Package outline SOT54A Fig 14. Package outline SOT54 variant

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 8 of 14

NXP Semiconductors

9. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number

BC846 SOT23 4 mm pitch, 8 mm tape and reel -215 - -235
BC846W SOT323 4 mm pitch, 8 mm tape and reel -115 - -135
BC846T SOT416 4 mm pitch, 8 mm tape and reel -115 - -135
BC546A SOT54 bulk, straight leads - -412 -

BC546B SOT54 bulk, straight leads - -412 -

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

[1]

[2]

Package Description Packing quantity

3000 5000 10000

SOT54A tape and reel, wide pitch - - -116

tape ammopack, wide pitch - - -126

SOT54 variant bulk, delta pinning - -112 -

SOT54A tape and reel, wide pitch - - -116

tape ammopack, wide pitch - - -126

SOT54 variant bulk, delta pinning - -112 -

[1] For further information and the availability of packing methods, see Section 13.
[2] Valid for all available selection groups.

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 9 of 14

NXP Semiconductors

10. Soldering

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

2.90

2.50

solder lands

3

12

0.50 (3x)

0.60 (3x)

0.60
(3x)

MSA439

3.00

0.85

1.30

0.85

1.00

3.30

Dimensions in mm

Fig 15. Reflow soldering footprint SOT23 (TO-236AB)

3.40

1.20 (2x)

21

4.00

1.20

3

4.60

2.70

solder resist

occupied area

solder paste

solder lands

solder resist

occupied area

preferred transport direction during soldering

2.80

4.50

MSA427

Dimensions in mm

Fig 16. Wave soldering footprint SOT23 (TO-236AB)

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 10 of 14

NXP Semiconductors

9

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

2.65

1.3250.75

1.30

2

0.60

0.852.35
(3×)

0.55
(3×)

3

1

2.40

msa429

Fig 17. Reflow soldering footprint SOT323 (SC-70)

4.60

4.00

1.15

2

2.103.65

preferred transport direction during soldering

3

1

0.50
(3×)

1.90

2.70

0.90
(2×)

solder lands

solder paste

solder resist

occupied area

Dimensions in mm

solder lands

solder resist

occupied area

Dimensions in mm

msa41

Fig 18. Wave soldering footprint SOT323 (SC-70)

2.2

0.6

1.1

0.7

2

0.6

(3x)

3

1

1.9

solder lands
solder resist

1.5

0.5

(3x)

msa438

solder pasteDimensions in mm

occupied area

2.0

0.85

Fig 19. Reflow soldering footprint SOT416 (SC-75)

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 11 of 14

NXP Semiconductors

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BC846_BC546_SER_7 20091117 Product data sheet - BC846_BC546_SER_6
Modifications:

BC846_BC546_SER_6 20060207 Product data sheet - BC846_BC847_

BC846_BC847_BC848_5 20040206 Product specification - BC846_BC847_

BC846T_847T_SERIES_320001115 Product specification - BC846T_847T_2

• This data sheet was changed to reflect the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technical
content.

• Table 3 “Pinning”: updated

• Figure 17 “Reflow soldering footprint SOT323 (SC-70)”: updated

• Figure 18 “Wave soldering footprint SOT323 (SC-70)”: updated

• Figure 19 “Reflow soldering footprint SOT416 (SC-75)”: updated

BC848_5 BC846T_847T_
SERIES_3
BC846W_BC847W_
BC848W_4
BC546_547_4

BC848_4

BC846W_BC847W_
BC848W_4

BC546_547_4 20041125 Product specification - BC546_547_3

20020204 Product specification - BC846W_847W_3

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 12 of 14

NXP Semiconductors

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

12. Legal information

12.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this docu ment may have changed si nce this d ocument was pub lished and may dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied u pon to co nt ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconduct ors does not give any repr esentatio ns or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.

Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell product s that is ope n for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteri stics sections of this
document, and as such is not complete, exhaustive or legally binding.

, including those pertaining to warranty,

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 07 — 17 November 2009 13 of 14

NXP Semiconductors

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Packing information . . . . . . . . . . . . . . . . . . . . . 9

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

13 Contact information. . . . . . . . . . . . . . . . . . . . . 13

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

BC846/BC546 series

65 V, 100 mA NPN general-purpose transist ors

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

Date of release: 17 November 2009

Document identifier: BC846_BC546_SER_7