Product data sheetRev. 8 — 18 November 2010 2 of 14
NXP Semiconductors
5. Limiting values
Table 6.Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterConditionsMinMaxUnit
Per diode
V
RRM
V
R
I
F
I
FRM
I
FSM
P
tot
Per device
T
j
T
amb
T
stg
[1] Single diode loaded.
[2] Double diode loaded.
[3] T
[4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
Product data sheetRev. 8 — 18 November 2010 3 of 14
NXP Semiconductors
6. Thermal characteristics
Table 7.Thermal characteristics
SymbolParameterConditionsMinTypMaxUnit
R
th(j-a)
R
th(j-sp)
[1] Single diode loaded.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Soldering points at pins 2, 3, 5 and 6.
thermal resistance from
junction to ambient
BAV99--500K/W
BAV99W--625K/W
thermal resistance from
junction to solder point
BAV99--360K/W
BAV99S
BAV99W--300K/W
in free air
BAV99 series
High-speed switching diodes
[1][2]
[3]
--260K/W
7. Characteristics
Table 8.Characteristics
T
amb
SymbolParameterConditionsMinTypMaxUnit
Per diode
V
F
I
R
C
d
t
rr
V
FR
[1] When switched from IF= 10 mA to IR=10mA; RL= 100 Ω; measured at IR=1mA.
[2] When switched from I
=25°C unless otherwise specified.
forward voltageIF= 1 mA--715mV
= 10 mA--855mV
I
F
=50mA--1V
I
F
=150mA--1.25V
I
F
reverse currentVR=25V--30nA
=80V--0.5μA
V
R
=25V; Tj=150°C --30μA
V
R
=80V; Tj=150°C --50μA
V
R
diode capacitancef = 1 MHz; VR=0V--1.5pF
reverse recovery time
forward recovery voltage