NXP BAT86 Schematics

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BAT86

Schottky barrier single diode

25 July 2012 Product data sheet

1. Product profile

1.1 General description

Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode is suitable for mounting on a 2 E (5.08 mm) pitch.

1.2 Features and benefits

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Low forward voltage Guard ring protected Hermetically-sealed leaded glass package

1.3 Applications

Ultra high-speed switching

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Voltage clamping

•

Protection circuits

•

Blocking diodes

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1.4 Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

F(AV)

average forward current

reverse voltage - - 50 V

forward voltage IF = 10 mA; T

δ = 0.5 ; f = 20 kHz; T

mounting, lead length = 4 mm

= 25 °C - - 450 mV

amb

≤ 50 °C; PCB

amb

- - 200 mA

2. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode

DO-34 (SOD68)

[1] The marking band indicates the cathode.

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NXP Semiconductors

BAT86

Schottky barrier single diode

3. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

BAT86 DO-34 hermetically sealed glass package; axial leaded; 2 leads SOD68

4. Marking

Table 4. Marking codes

Type number Marking code

BAT86 marking band

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

F(AV)

reverse voltage - 50 V

forward current - 200 mA

average forward current δ = 0.5 ; f = 20 kHz; T

≤ 50 °C; PCB

amb

- 200 mA

mounting, lead length = 4 mm

FRM

FSM

repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 500 mA

non-repetitive peak forward

tp ≤ 10 ms; T

= 25 °C - 5 A

j(init)

current

amb

stg

junction temperature - 125 °C

ambient temperature -65 125 °C

storage temperature -65 150 °C

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

thermal resistance from junction to ambient

in free air [1] - - 320 K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

Product data sheet 25 July 2012 2 / 8

NXP Semiconductors

1.20.80.40

VF(V)

(mA)

- 1

mld357

(1) (2) (3)

mgc686

(nA)

- 1

500 10 20 30 40

VR(V)

(1)

(2)

(3)

BAT86

Schottky barrier single diode

7. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

forward voltage

IF = 0.1 mA; T

IF = 1 mA; T

IF = 10 mA; T

IF = 30 mA; T

IF = 100 mA; T

reverse current VR = 40 V; T

tp = 300 µs; δ = 0.02

= 25 °C - - 300 mV

amb

= 25 °C - - 380 mV

amb

= 25 °C - - 450 mV

amb

= 25 °C - - 600 mV

amb

= 25 °C - - 900 mV

amb

= 25 °C; pulsed;

amb

- - 5 µA

(1) T

(2) T

(3) T

diode capacitance f = 1 MHz; T

reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 Ω;

= 1 mA; T

R(meas)

= 125 °C

amb

= 85 °C

amb

= 25 °C

amb

Fig. 1. Forward current as a function of forward

voltage; typical values

= 25 °C; VR = 1 V - - 8 pF

amb

- - 4 ns

= 25 °C

amb

(1) T

(2) T

(3) T

= 85 °C

amb

= 25 °C

amb

= −40 °C

amb

Fig. 2. Reverse current as a function of reverse

voltage; typical values

Product data sheet 25 July 2012 3 / 8

NXP Semiconductors

mgc687

0 50

(pF)

10 20 30 40

VR(V)

100

150

200

250

0 50 100 150

F(AV)

(mA)

amb

(°C)

mra540

(1)

+ I

output signal

10 %

90 %

input signal

V = VR+ IF× R

RS= 50 Ω

D.U.T.

Ri= 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

BAT86

Schottky barrier single diode

= 25 °C; f = 1 MHz

amb

Fig. 3. Diode capacitance as a function of reverse

voltage; typical values

8. Test information

(1) IR = 1 mA

Fig. 5. Reverse recovery time test circuit and waveforms

FR4 PCB, standard footprint

Fig. 4. Average forward current as a function of

ambient temperature; derating curve

Product data sheet 25 July 2012 4 / 8

NXP Semiconductors

97-06-09Dimensions in mm

3.04 max

25.4 min

0.55 max

1.6

max

9. Package outline

Fig. 6. DO-34 (SOD68)

BAT86

Schottky barrier single diode

10. Revision history

Table 8. Revision history

Data sheet ID Release date Data sheet status Change notice Supersedes

BAT86 v.3 20120725 Product data sheet - BAT86 v.2

Modifications:

BAT86 v.2 20000525 Product specification - BAT86 v.1

BAT86 v.1 19960320 Product specification - -

The format of this document has been redesigned to comply with the new identity guidelines

•

of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate.

•

Section "Marking" added

•

Package outline drawing replaced by minimized package ouline drawing

•

Section "Test information" added

•

Product data sheet 25 July 2012 5 / 8

NXP Semiconductors

11. Legal information

11.1 Data sheet status

Document status [1][2]

Objective [short] data sheet

Preliminary [short] data sheet

Product [short] data sheet

[1] Please consult the most recently issued document before initiating or

completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

Product status [3]

Development This document contains data from

Qualification This document contains data from the

Production This document contains the product

Definition

the objective specification for product development.

preliminary specification.

specification.

BAT86

Schottky barrier single diode

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

11.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the

Product data sheet 25 July 2012 6 / 8

NXP Semiconductors

grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

BAT86

Schottky barrier single diode

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

Product data sheet 25 July 2012 7 / 8

NXP Semiconductors

12. Contents

1 Product profile ....................................................... 1

1.1 General description .............................................. 1

1.2 Features and benefits ........................................... 1

1.3 Applications .......................................................... 1

1.4 Quick reference data ............................................ 1

2 Pinning information ............................................... 1

3 Ordering information ............................................. 2

4 Marking ................................................................... 2

5 Limiting values .......................................................2

6 Thermal characteristics .........................................2

7 Characteristics ....................................................... 3

8 Test information ..................................................... 4

9 Package outline ..................................................... 5

10 Revision history .....................................................5

11 Legal information ................................................... 6

11.1 Data sheet status ................................................. 6

11.2 Definitions .............................................................6

11.3 Disclaimers ........................................................... 6

11.4 Trademarks .......................................................... 7

BAT86

Schottky barrier single diode

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 July 2012

Product data sheet 25 July 2012 8 / 8

NXP BAT86 Schematics

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Test information

9. Package outline

10. Revision history

11. Legal information