NXP BAT54AW, BAT54CW, BAT54SW, BAT54W Schematic [ru]

SOT323
12
3
006aaa436
1
3
2
n.c.
BAT54W series
Schottky barrier diodes
Rev. 3 — 20 November 2012 Product data sheet

1. Product profile

1.1 General description

Planar Schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

Low forward voltageLow capacitanceAEC-Q101 qualified

1.3 Applications

Ultra high-speed switching Voltage clampingLine termination Reverse polarity protection

1.4 Quick reference data

Table 1. Quick reference data
T
=25C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
R
V
F
I
R
[1] Pulse test: tp 300 s; 0.02.

2. Pinning information

Table 2. Pinning
Pin Description Simplified outline Graphic symbol
BAT54W
1 anode 2 not connected 3 cathode
reverse voltage - - 30 V forward voltage IF=100mA reverse current VR=25V
[1]
--800mV
[1]
--2A
NXP Semiconductors
12
3
006aaa439
12
3
12
3
12
3
006aaa437
12
3
BAT54W series
Schottky barrier diodes
Table 2. Pinning
…continued
Pin Description Simplified outline Graphic symbol
BAT54AW
1 cathode (diode 1) 2 cathode (diode 2) 3 common anode
BAT54CW
1 anode (diode 1) 2 anode (diode 2) 3 common cathode
12
3
006aac984
BAT54S W
1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),
anode (diode 2)

3. Ordering information

Table 3. Ordering information
Type number Package
BAT54W series SC-70 plastic surface-mounted package; 3 leads SOT323

4. Marking

Table 4. Marking codes
Type number Marking code
BAT54W L4* BAT54AW 42* BAT54CW 43* BAT54SW 44*
[1] * = placeholder for manufacturing site code.
Name Description Version
[1]
BAT54W_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 20 November 2012 2 of 11
NXP Semiconductors

5. Limiting values

Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
V
R
I
F
I
FRM
I
FSM
Per device; one diode loaded
P
tot
T
j
T
amb
T
stg
[1] Tj=25C before surge. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
BAT54W series
Schottky barrier diodes
reverse voltage - 30 V forward current - 200 mA repetitive peak forward
current non-repetitive peak
forward current
total power dissipation T junction temperature - 150 C ambient temperature 55 +150 C storage temperature 65 +150 C
tp 1s; 0.5 300 mA
square wave; t
<10ms
p
25 C
amb
[1]
-600mA
[2]
-200mW

6. Thermal characteristics

Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device; one diode loaded
R
th(j-a)
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
thermal resistance from junction to ambient
in free air
[1]
- - 625 K/W
BAT54W_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 20 November 2012 3 of 11
NXP Semiconductors
006aac829
VF (V)
0.0 1.20.80.4
1
10
10
2
10
3
I
F
(mA)
10
-1
(1)
(1)
(2)
(2) (3)
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7. Characteristics

Table 7. Characteristics
T
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
F
I
R
C
d
t
rr
[1] Pulse test: tp 300 s; 0.02. [2] When switched from I
BAT54W series
Schottky barrier diodes
=25C unless otherwise specified.
forward voltage
IF= 0.1 mA - - 240 mV
= 1 mA - - 320 mV
I
F
= 10 mA - - 400 mV
I
F
= 30 mA - - 500 mV
I
F
= 100 mA - - 800 mV
I
F
reverse current VR=25V diode capacitance f = 1 MHz; VR=1V --10pF reverse recovery time
= 10 mA to IR=10mA; RL= 100 ; measured at IR=1mA.
F
[1]
[1]
--2A
[2]
--5ns
(1) T (2) T (3) T
amb amb amb
= 125 C =85C =25C
Fig 1. Forward current as a function of forward
voltage; typical values
(1) T (2) T (3) T
amb amb amb
= 125 C =85C =25C
Fig 2. Reverse current as a function of reverse
voltage; typical values
BAT54W_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 20 November 2012 4 of 11
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