NXP BAT54AW, BAT54CW, BAT54SW, BAT54W Schematic [ru]

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SOT323

006aaa436

n.c.

BAT54W series

Schottky barrier diodes

Rev. 3 — 20 November 2012 Product data sheet

1. Product profile

1.1 General description

Planar Schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

 Low forward voltage  Low capacitance  AEC-Q101 qualified

1.3 Applications

 Ultra high-speed switching  Voltage clamping  Line termination  Reverse polarity protection

1.4 Quick reference data

Table 1. Quick reference data

=25C unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp 300 s; 0.02.

2. Pinning information

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

BAT54W

1 anode 2 not connected 3 cathode

reverse voltage - - 30 V forward voltage IF=100mA reverse current VR=25V

[1]

--800mV

[1]

--2A

NXP Semiconductors

006aaa439

006aaa437

BAT54W series

Schottky barrier diodes

Table 2. Pinning

…continued

Pin Description Simplified outline Graphic symbol

BAT54AW

1 cathode (diode 1) 2 cathode (diode 2) 3 common anode

BAT54CW

1 anode (diode 1) 2 anode (diode 2) 3 common cathode

006aac984

BAT54S W

1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),

anode (diode 2)

3. Ordering information

Table 3. Ordering information

Type number Package

BAT54W series SC-70 plastic surface-mounted package; 3 leads SOT323

4. Marking

Table 4. Marking codes

Type number Marking code

BAT54W L4* BAT54AW 42* BAT54CW 43* BAT54SW 44*

[1] * = placeholder for manufacturing site code.

Name Description Version

[1]

Product data sheet Rev. 3 — 20 November 2012 2 of 11

NXP Semiconductors

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

FRM

FSM

Per device; one diode loaded

tot

amb

stg

[1] Tj=25C before surge. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

BAT54W series

Schottky barrier diodes

reverse voltage - 30 V forward current - 200 mA repetitive peak forward

current non-repetitive peak

forward current

total power dissipation T junction temperature - 150 C ambient temperature 55 +150 C storage temperature 65 +150 C

tp 1s; 0.5 300 mA

square wave; t

<10ms

 25 C

amb

[1]

-600mA

[2]

-200mW

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device; one diode loaded

th(j-a)

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

thermal resistance from junction to ambient

in free air

[1]

- - 625 K/W

Product data sheet Rev. 3 — 20 November 2012 3 of 11

NXP Semiconductors

006aac829

VF (V)

0.0 1.20.80.4

(mA)

-1

(1)

(2)

(2) (3)

(3)



959













$











7. Characteristics

Table 7. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp 300 s; 0.02. [2] When switched from I

BAT54W series

Schottky barrier diodes

=25C unless otherwise specified.

forward voltage

IF= 0.1 mA - - 240 mV

= 1 mA - - 320 mV

= 10 mA - - 400 mV

= 30 mA - - 500 mV

= 100 mA - - 800 mV

reverse current VR=25V diode capacitance f = 1 MHz; VR=1V --10pF reverse recovery time

= 10 mA to IR=10mA; RL= 100 ; measured at IR=1mA.

[1]

--2A

[2]

--5ns

(1) T (2) T (3) T

amb amb amb

= 125 C =85C =25C

Fig 1. Forward current as a function of forward

voltage; typical values

(1) T (2) T (3) T

amb amb amb

= 125 C =85C =25C

Fig 2. Reverse current as a function of reverse

voltage; typical values

Product data sheet Rev. 3 — 20 November 2012 4 of 11

NXP Semiconductors

006aac891

VR (V)

0302010

(pF)

(1)

+ I

output signal

10 %

90 %

input signal

V = V

R + IF × RS

RS = 50

D.U.T.

= 50

SAMPLING

OSCILLOSCOPE

mga881

BAT54W series

Schottky barrier diodes

f=1MHz; T

amb

=25C

Fig 3. Diode capacitance as a function of reverse voltage; typical values

8. Test information

(1) IR=1mA

Fig 4. Reverse recovery time test circuit and waveforms

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.

Product data sheet Rev. 3 — 20 November 2012 5 of 11

NXP Semiconductors

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0

1.35

1.15

1.3

0.4

0.3

0.25

0.10

9. Package outline

Fig 5. Package outline SOT323 (SC-70)

BAT54W series

Schottky barrier diodes

10. Packing information

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

BAT54W series SOT323 4 mm pitch, 8 mm tape and reel -115 -135

[1] For further information and the availability of packing methods, see Section 14.

[1]

3000 10000

Product data sheet Rev. 3 — 20 November 2012 6 of 11

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot323_fr

2.65

2.35

0.6

(3×)

0.5

(3×)

0.55 (3×)

1.325

1.85

1.3

Dimensions in mm

sot323_fw

3.65 2.1

1.425 (3×)

4.6

(2×)

2.575

1.8

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

11. Soldering

Fig 6. Reflow soldering footprint SOT323 (SC-70)

BAT54W series

Schottky barrier diodes

Fig 7. Wave soldering footprint SOT323 (SC-70)

Product data sheet Rev. 3 — 20 November 2012 7 of 11

NXP Semiconductors

BAT54W series

Schottky barrier diodes

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAT54W_SER v.3 20121120 Product data sheet - BAT54W v.2 Modifications:

BAT54W v.2 19960319 Product specification - BAT54W v.1

• The format of this document has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Section1: updated

• Section4: updated

• Table 5: updated ambient temperature T

maximum value to 150 C

amb

• Figure 1 to 4: updated

• Section 8 “Test information”: added

• Figure 5: replaced by minimized package outline drawing

• Section 10 “Packing information”: added

• Section 11 “Soldering”: added

• Section 13 “Legal information”: updated

Product data sheet Rev. 3 — 20 November 2012 8 of 11

NXP Semiconductors

BAT54W series

Schottky barrier diodes

13. Legal information

13.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have change d since this d ocument was p ublished and may dif fe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclu sion and/ or use is at the cust omer's own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

, unless otherwise

Product data sheet Rev. 3 — 20 November 2012 9 of 11

NXP Semiconductors

BAT54W series

Schottky barrier diodes

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open f or accept ance or the grant , conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteri stics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 3 — 20 November 2012 10 of 11

NXP Semiconductors

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Packing information . . . . . . . . . . . . . . . . . . . . . 6

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Contact information. . . . . . . . . . . . . . . . . . . . . 10

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

BAT54W series

Schottky barrier diodes

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 November 2012

Document identifier: BAT54W_SER

NXP BAT54AW, BAT54CW, BAT54SW, BAT54W Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Test information

8.1 Quality information

9. Package outline

10. Packing information

11. Soldering

12. Revision history

13. Legal information

13.1 Data sheet status

13.2 Definitions

13.3 Disclaimers

13.4 Trademarks

14. Contact information

15. Contents