NXP 74AHC1G126GF, 74AHC1G126GM, 74AHC1G126GV, 74AHC1G126GW, 74AHCT1G126GF Schematic [ru]

...

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Rev. 8 — 23 August 2012 Product data sheet

1. General description

74AHC1G126 and 74AHCT1G126 are high-speed Si-gate CMOS devices. They provide one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input pin (OE). A LOW at pin OE causes the output to assume a high-impedance OFF-state.

The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features and benefits

 Symmetrical output impedance  High noise immunity  Low power dissipation  Balanced propagation delays  Multiple package options  ESD protection:

 HBM JESD22-A114F: exceeds 2000 V  MM JESD22-A115-A: exceeds 200 V  CDM JESD22-C101E: exceeds 1000 V

 Specifie d from 40 C to +125 C

3. Ordering information

Table 1. Ordering information

Type number Package

74AHC1G126GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package; 5 leads; 74AHCT1G126GW 74AHC1G126GV 40 C to +125 C SC-74A plastic surface-mounted package; 5 leads SOT753 74AHCT1G126GV 74AHC1G126GM 40 C to +125 C XSON6 plastic extremely thin small outline package; no 74AHCT1G126GM 74AHC1G126GF 40 C to +125 C XSON6 plastic extremely thin small outline package; 74AHCT1G126GF

Temperature range Name Description Version

SOT353-1

body width 1.25 mm

SOT886

leads; 6 terminals; body 1  1.45  0.5 mm

SOT891

no leads; 6 terminals; body 1  1  0.5 mm

NXP Semiconductors

mna125

mna126

mna127

74AHC1G126

74AHCT1G126

OE V

GND Y

001aaf096

74AHC1G126

74AHCT1G126

001aak257

GND

n.c.

Transparent top view

74AHC1G126

74AHCT1G126

001aak258

GND

n.c.

Transparent top view

4. Marking

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Table 2. Marking codes

Type number Marking

[1]

74AHC1G126GW AN 74AHCT1G126GW CN 74AHC1G126GV A26 74AHCT1G126GV C26 74AHC1G126GM AN 74AHCT1G126GM CN 74AHC1G126GF AN 74AHCT1G126GF CN

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5. Functional diagram

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram

6. Pinning information

6.1 Pinning

Fig 4. Pin configuration

SOT353-1 and SOT753

Fig 5. Pin configuration SOT886 Fig 6. Pin configuration SOT 891

Product data sheet Rev. 8 — 23 August 2012 2 of 17

NXP Semiconductors

74AHC1G126; 74AHCT1G126

6.2 Pin description

Table 3. Pin description

Symbol Pin Description

OE 1 1 output enable input A 2 2 data input A GND 3 3 ground (0 V) Y 4 4 data output Y n.c. - 5 not connected V

SOT353-1/SOT753 SOT886/SOT891

5 6 supply voltage

7. Functional description

Bus buffer/line driver; 3-state

Table 4. Function table

H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state

Input Output OE A Y

HLL HHH LXZ

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

V V I

GND

T P

CC I

stg tot

supply voltage 0.5 +7.0 V input voltage 0.5 +7.0 V input clamping current VI < 0.5 V output clamping current VO < 0.5 V or VO>VCC+0.5V output current 0.5 V < VO <VCC+0.5V - 25 mA supply current - 75 mA ground current 75 - mA storage temperature 65 +150 C total power dissipation T

[1]

20 - mA

[1]

- 20 mA

= 40 C to +125 C

amb

[2]

- 250 mW

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For TSSOP5 and SC-74A packages: above 87.5 C the value of P

For XSON6 packages: above 118 C the value of P

Product data sheet Rev. 8 — 23 August 2012 3 of 17

derates linearly with 7.8 mW/K.

tot

derates linearly with 4.0 mW/K.

tot

NXP Semiconductors

74AHC1G126; 74AHCT1G126

9. Recommended operating conditions

Bus buffer/line driver; 3-state

Table 6. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 74AHC1G126 74AHCT1G126 Unit

Min Typ Max Min Typ Max

amb

t/V input transition rise

supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V input voltage 0 - 5.5 0 - 5.5 V output voltage 0 - V

0- VCCV

ambient temperature 40 +25 +125 40 +25 +125 C

= 3.3 V  0.3 V - - 100 - - - ns/V

and fall rate

= 5.0 V  0.5 V - - 20 - - 20 ns/V

10. Static characteristics

Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

74AHC1G126

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

LOW-level output voltage

OFF-state output current

input leakage current

supply current VI=VCCor GND; IO = 0 A;

Min Typ Max Min Max Min Max

= 2.0 V 1.5 - - 1.5 - 1.5 - V

= 3.0 V 2.1 - - 2.1 - 2.1 - V

= 5.5 V 3.85 - - 3.85 - 3.85 - V

= 2.0 V - - 0.5 - 0.5 - 0.5 V

= 3.0 V - - 0.9 - 0.9 - 0.9 V

= 5.5 V - - 1.65 - 1.65 - 1.65 V

VI= VIH or V

IO= 50 A; VCC= 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

= 50 A; VCC= 3.0 V 2.9 3.0 - 2.9 - 2.9 - V

= 50 A; VCC= 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

= 4.0 mA; VCC= 3.0 V 2.58 - - 2.48 - 2.40 - V

= 8.0 mA; VCC= 4.5 V 3.94 - - 3.8 - 3.70 - V

VI= VIH or V

IO= 50 A; VCC= 2.0 V - 0 0.1 - 0.1 - 0.1 V

= 50 A; VCC= 3.0 V - 0 0.1 - 0.1 - 0.1 V

= 50 A; VCC= 4.5 V - 0 0.1 - 0.1 - 0.1 V

= 4.0 mA; VCC= 3.0 V - - 0.36 - 0.44 - 0.55 V

= 8.0 mA; VCC= 4.5 V - - 0.36 - 0.44 - 0.55 V

VI= VIH or VIL; VO = VCC or GND; V

=5.5V

VI= 5.5 V or GND;

=0Vto5.5V

--0.25 - 2.5 - 10 A

- - 0.1 - 1.0 - 2.0 A

- - 2.0 - 20 - 40 A

VCC=5.5 V

Product data sheet Rev. 8 — 23 August 2012 4 of 17

NXP Semiconductors

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Table 7. Static characteristics

…continued

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

Min Typ Max Min Max Min Max

input

- 3 10 - 10 - 10 pF

capacitance

74AHCT1G126

HIGH-level

= 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V

input voltage

LOW-level

= 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V

input voltage

I

HIGH-level output voltage

LOW-level output voltage

OFF-state output current

input leakage current

VI= VIH or VIL; VCC= 4.5 V

= 50 A 4.4 4.5 - 4.4 - 4.4 - V

= 8.0 mA 3.94 - - 3.8 - 3.70 - V

VI= VIH or VIL; VCC= 4.5 V

= 50 A - 0 0.1 - 0.1 - 0.1 V

= 8.0 mA - - 0.36 - 0.44 - 0.55 V

VI= VIH or VIL; VO = VCC or GND; VCC=5.5V

VI= 5.5 V or GND; VCC=0Vto5.5V

supply current VI=VCCor GND; IO = 0 A;

=5.5 V

additional supply current

per input pin; VI=VCC 2.1 V; other inputs at V

or GND;

--0.25 - 2.5 - 10 A

- - 0.1 - 1.0 - 2.0 A

- - 2.0 - 20 - 40 A

- - 1.35 - 1.5 - 1.5 mA

IO=0 A; VCC= 4.5 V to 5.5 V

input

- 3 10 - 10 - 10 pF

capacitance

11. Dynamic characteristics

Table 8. Dynamic characteristics

GND = 0 V; For test circuit see Figure 9

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

74AHC1G126

propagation delay

Product data sheet Rev. 8 — 23 August 2012 5 of 17

Min Typ Max Min Max Min Max

AtoY; see Figure 7

VCC = 3.0 V to 3.6 V

[1] [2]

CL= 15 pF - 4.4 8.0 1.0 9.5 1.0 10.0 ns

= 50 pF - 6.3 11.5 1.0 13.0 1.0 14.5 ns

= 4.5 V to 5.5 V

[3]

CL= 15 pF - 3.4 5.5 1.0 6.5 1.0 7.0 ns

= 50 pF - 4.7 7.5 1.0 8.5 1.0 9.5 ns

NXP Semiconductors

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Table 8. Dynamic characteristics

…continued

GND = 0 V; For test circuit see Figure 9.

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

Min Typ Max Min Max Min Max

enable time OE to Y; see Figure 8

VCC = 3.0 V to 3.6 V

[1] [2]

CL= 15 pF - 4.9 8.0 1.0 9.5 1.0 10.0 ns

= 50 pF - 7.0 11.5 1.0 13.0 1.0 14.5 ns

= 4.5 V to 5.5 V

[3]

CL= 15 pF - 3.6 5.6 1.0 6.3 1.0 7.0 ns

= 50 pF - 5.4 8.0 1.0 9.0 1.0 9.5 ns

dis

disable time OE to Y; see Figure 8

VCC = 3.0 V to 3.6 V

[1] [2]

CL= 15 pF - 6.3 9.7 1.0 11.5 1.0 12.5 ns

= 50 pF - 9.0 13.2 1.0 15.0 1.0 16.5 ns

= 4.5 V to 5.5 V

[3]

CL= 15 pF - 4.3 6.8 1.0 8.0 1.0 8.5 ns

= 50 pF - 6.1 8.8 1.0 10.0 1.0 11.0 ns

power dissipation capacitance

per buffer; CL=50pF;f=1 MHz; VI=GNDtoV

[4]

-9- - - - -pF

74AHCT1G126

propagation delay

AtoY; see Figure 7

VCC = 4.5 V to 5.5 V

[1] [3]

CL= 15 pF - 3.4 5.5 1.0 6.5 1.0 7.0 ns

= 50 pF - 4.7 7.5 1.0 8.5 1.0 9.5 ns

enable time OE to Y; see Figure 8

VCC = 4.5 V to 5.5 V

[1] [3]

CL= 15 pF - 3.4 5.6 1.0 6.3 1.0 6.5 ns

= 50 pF - 4.8 8.0 1.0 9.0 1.0 9.0 ns

dis

disable time OE to Y; see Figure 8

VCC = 4.5 V to 5.5 V

[1] [3]

CL= 15 pF 4.0 6.8 1.0 8.0 1.0 8.5 ns

= 50 pF 5.7 8.8 1.0 10.0 1.0 11.5 ns

Product data sheet Rev. 8 — 23 August 2012 6 of 17

NXP Semiconductors

mna121

A input

Y output

PHL

PLH

GND

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Table 8. Dynamic characteristics

…continued

GND = 0 V; For test circuit see Figure 9.

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

Min Typ Max Min Max Min Max

[1] tpd is the same as t

power dissipation capacitance

is the same as t

dis

per buffer; CL=50pF;f=1 MHz; VI=GNDtoV

PLH PZL

PLZ

and t and t and t

PHL PZH PHZ

. .

[2] Typical values are measured at V [3] Typical values are measured at V [4] C

is used to determine the dynamic power dissipation PD(W).

D=CPD

= input frequency in MHz;

= output frequency in MHz;

= output load capacitance in pF;

= supply voltage in Volts.

 V

 fi+ (CL V

= 3.3 V.

= 5.0 V.

 fo)where:

[4]

-11- - - - -pF

12. Waveforms

Measurement points are given in Table 9.

Fig 7. Input (A) to output (Y) propagation delays

Product data sheet Rev. 8 — 23 August 2012 7 of 17

NXP Semiconductors

mna129

PLZ

PHZ

output

disabled

output enabled

VOH − 0.3 V

+ 0.3 V

output

enabled

output LOW-to-OFF OFF-to-LOW

output

HIGH-to-OFF OFF-to-HIGH

OE input

GND

PZL

PZH

Measurement points are given in Table 9.

Fig 8. enable and disable times

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Table 9. Measurement points

Type Input Output

74AHC1G126 0.5  V

74AHCT1G126 1.5 V GND to 3.0 V 0.5  V

Product data sheet Rev. 8 — 23 August 2012 8 of 17

GND to V

0.5  V

CC CC

NXP Semiconductors

10 %

90 %

0 V

negative

pulse

positive

pulse

0 V

90 %

10 %

001aad983

DUT

RLS1

open

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Test data is given in Table 10. Definitions test circuit:

= Termination resistance should be equal to output impedance Zo of the pulse generator.

= Load capacitance including jig and probe capacitance.

= Load resistance.

S1 = Test selection switch.

Fig 9. Test circuit for measuring switching times

Table 10. Test data

Type Input Load S1 position

74AHC1G126 V

74AHCT1G126 3 V  3 ns 15 pF, 50 pF 1 k open GND V

tr, t

PHL

, t

PLH

PZH

, t

 3 ns 15 pF, 50 pF 1 k open GND V

PHZ

PZL

CC CC

, t

PLZ

Product data sheet Rev. 8 — 23 August 2012 9 of 17

NXP Semiconductors

UNIT

max.

A2A3b

wyv

ceD

(1)E(1)

(1)

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

0.101.0

0.8

0.30

0.15

0.25

0.08

2.25

1.85

1.35

1.15

0.65

1.3

2.25

2.0

0.60

0.15

7° 0°

0.1 0.10.30.425

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.46

0.21

SOT353-1 MO-203 SC-88A

00-09-01 03-02-19

w M

0.15

(A3)

detail X

v M

1.5 3 mm0

scale

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm

SOT353-1

1.1

13. Package outline

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Fig 10. Package outline SOT353-1 (TSSOP5)

Product data sheet Rev. 8 — 23 August 2012 10 of 17

NXP Semiconductors

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

SOT753 SC-74A

wBM

detail X

v M

0 1 2 mm

scale

132

Plastic surface-mounted package; 5 leads SOT753

UNIT

HEL

Qywv

0.100

0.013

0.40

0.25

3.1

2.7

0.26

0.10

1.7

1.3

0.95

3.0

2.5

0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2

0.33

0.23

1.1

0.9

02-04-16 06-03-16

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Fig 11. Package outline SOT753 (SC-74A)

Product data sheet Rev. 8 — 23 August 2012 11 of 17

NXP Semiconductors

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886

(2)

terminal 1 index area

0 1 2 mm

scale

Dimensions (mm are the original dimensions)

Unit

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes. Outline

version

SOT886

(1)

max

0.5 0.04 1.50

nom

min

A1b

DEee

1.45

1.40

1.05

1.00

0.95

0.25

0.20

0.17

IEC JEDEC JEITA

0.6

MO-252

0.5

References

0.35

0.40

0.30

0.35

0.27

0.32

sot886_po

European projection

Issue date

04-07-22 12-01-05

Fig 12. Package outline SOT886 (XSON6)

Product data sheet Rev. 8 — 23 August 2012 12 of 17

NXP Semiconductors

terminal 1 index area

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

SOT891

05-04-06 07-05-15

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

0.20

0.12

1.05

0.95

0.35

0.27

max

b E

1.05

0.95

ee1L

0.40

0.32

0.350.55

max

0.5 0.04

6×

(1)

4×

(1)

Note

1. Can be visible in some manufacturing processes.

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Fig 13. Package outline SOT891 (XSON6)

Product data sheet Rev. 8 — 23 August 2012 13 of 17

NXP Semiconductors

14. Abbreviations

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Table 11. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic

15. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74AHC_AHCT1G126 v.8 20120823 Product data sheet - 74AHC_AHCT1G126 v.7 Modifications: 74AHC_AHCT1G126 v.7 20090617 Product data sheet - 74AHC_AHCT1G126 v.6 74AHC_AHCT1G126 v.6 20070525 Product data sheet - 74AHC_AHCT1G126 v.5 74AHC_AHCT1G126 v.5 20070514 Product data sheet - 74AHC_AHCT1G126 v.4 74AHC_AHCT1G126 v.4 20020606 Product specification - 74AHC_AHCT1G126 v.3 74AHC_AHCT1G126 v.3 20020215 Product specification - 74AHC_AHCT1G126 v.2 74AHC_AHCT1G126 v.2 20010406 Product specification - 74AHC1G_AHCT1G126 v.1 74AHC1G_AHCT1G126 v.1 19990920 Product specification - -

• Package outline drawing of SOT886 (Figure 12) modified.

Product data sheet Rev. 8 — 23 August 2012 14 of 17

NXP Semiconductors

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

16. Legal information

16.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed si nce this d ocument was p ublished and may dif fer in case of multiple devices. The latest product statu s

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the cust omer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is open for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

, unless otherwise

Product data sheet Rev. 8 — 23 August 2012 15 of 17

NXP Semiconductors

74AHC1G126; 74AHCT1G126

Bus buffer/line driver; 3-state

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neit her qua lif ied nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, custome r (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct claims result ing from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (t ranslated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

16.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 8 — 23 August 2012 16 of 17

NXP Semiconductors

74AHC1G126; 74AHCT1G126

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

9 Recommended operating conditions. . . . . . . . 4

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Contact information. . . . . . . . . . . . . . . . . . . . . 16

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Bus buffer/line driver; 3-state

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 23 August 2012

Document identifier: 74AHC_AHCT1G126

NXP 74AHC1G126GF, 74AHC1G126GM, 74AHC1G126GV, 74AHC1G126GW, 74AHCT1G126GF Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features and benefits

3. Ordering information

4. Marking

5. Functional diagram

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Functional description

8. Limiting values

9. Recommended operating conditions

10. Static characteristics

11. Dynamic characteristics

12. Waveforms

13. Package outline

14. Abbreviations

15. Revision history

16. Legal information

16.1 Data sheet status

16.2 Definitions

16.3 Disclaimers

16.4 Trademarks

17. Contact information

18. Contents