NTE NTE5409, NTE5408, NTE5410 Datasheet

NTE5408 thru NTE5410
Silicon Controlled Rectifier (SCR)
3 Amp Sensitive Gate
Description:
The NTE5408 through NTE5410 sensitive gate SCRs are designed to be driven directly with IC and MOS devices. These SCRs feature proprietary, void–free glass–passivated chips and are hermeti­cally sealed in TO5 type packages. These 4A devices are available in voltages up to 600V and with a gate current of 200µA.
Absolute Maximum Ratings:
Repetitive Peak Reverse Voltage (TC = +100°C), V
RRM
NTE5408 200V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NTE5409 400V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NTE5410 600V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Repetitive Peak Off–State Voltage (T
C
= +100°C), V
DRXM
NTE5408 200V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NTE5409 400V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NTE5410 600V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RMS On–State Current (T
C
= +75°C, Conduction Angle of 180°), I
T(RMS)
4A. . . . . . . . . . . . . . . . . . .
Peak Surge (Non–Repetitive) On–State Current (One Cycle at 50 or 60Hz), I
TSM
40A. . . . . . . . . . .
Peak Gate–Trigger Current (3µs Max), I
GTM
1A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak Gate–Power Dissipation (I
GT
I
GTM
for 3µs Max), P
GM
20W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Average Gate Power Dissipation, P
G(AV)
200mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range, T
opr
–40° to +100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature Range, T
stg
–40° to +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Thermal Resistance, Junction–to–Case, R
thJC
+5°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics: (TC = +25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Peak Off–State Current
I
RRM
V
RRM
= Max, V
DRXM
= Max,
0.75 mA
I
DRXM
TC = +100°C, RGK = 1k
0.75 mA
Maximum On–State Voltage V
TM
IT = 10A (Peak) 2.2 V
DC Holding Current I
HOLD
RGK = 1000 5 mA
DC Gate–Trigger Current I
GT
VD = 6VDC, RL = 100 200 µA
DC Gate–Trigger Voltage V
GT
VD = 6VDC, RL = 100 0.8 V
Gate Controlled Turn–On Time t
gt
IG x 3
GT
1.2 µs I2t for Fusing Reference I2t For SCR Protection 2.6 A2sec Critical Rate of Applied
Forward Voltage
dv/dt
(critical)
RGK = 1kΩ, TC = +100°C 5 V/µs
.250
(6.35)
Max
.500
(12.7)
Min
.352 (8.95) Dia Max
.325 (8.13) Dia Max
45°
.031 (.793)
Cathode
Gate Anode
.019 (0.5)
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